CN216354087U

CN216354087U - Packaging hardware that DSP chip was used

Info

Publication number: CN216354087U
Application number: CN202122909926.0U
Authority: CN
Inventors: 马士强; 赵显明
Original assignee: Jiale Technology Co ltd
Current assignee: Xiamen Seebest Technology Co ltd
Priority date: 2021-11-25
Filing date: 2021-11-25
Publication date: 2022-04-19
Anticipated expiration: 2031-11-25

Abstract

The utility model provides a packaging device for a DSP chip, and belongs to the technical field of chip packaging. The prior art is inefficient. The conveyer belt, rubber coating packaging hardware and unloader all set up on the workstation, rubber coating packaging hardware is including dispensing platform and adhesive deposite device, adhesive deposite device is used for dispensing the encapsulation of bench chip rubber coating to the point, unloader is used for taking off the chip after the rubber coating encapsulation from dispensing the bench, dispensing the bench and setting up to the disc, dispensing bench is provided with a plurality of pieces of placing around the girth, place a top and seted up the standing groove, one side that the standing groove kept away from dispensing platform axle center all is provided with the feed inlet, dispensing platform bottom is connected with a drive arrangement, a drive arrangement is used for driving dispensing platform and rotates around self axle center, thereby make and place the piece and pass through the conveyer belt in proper order, adhesive deposite device and unloader, when placing the piece when the conveyer belt, the output of conveyer belt is aimed at to the feed inlet, the conveyer belt is used for carrying the chip to the standing groove. Has the advantages of high efficiency and the like.

Description

Packaging hardware that DSP chip was used

Technical Field

The utility model belongs to the technical field of chip packaging, and particularly relates to a packaging device for a DSP chip.

Background

The chip package is a casing for mounting semiconductor integrated circuit chip, and plays the role of placing, fixing, sealing, protecting chip and enhancing electrothermal property, and is also a bridge for communicating the internal world of chip with external circuit, the contact points on the chip are connected to the pins of the package casing by wires, and these pins are connected with other devices by wires on the printed board.

The gluing and packaging of the chip are important steps in the chip packaging step, and the chip needs to be manually placed on a gluing station when gluing is carried out in the conventional packaging device, so that the efficiency is low.

Disclosure of Invention

The present invention is directed to solving the above-mentioned problems of the prior art, and provides a packaging device for a DSP chip.

The purpose of the utility model can be realized by the following technical scheme: the packaging device for the DSP chip is characterized by comprising a workbench, a conveying belt, a gluing packaging device and a discharging device, wherein the conveying belt, the gluing packaging device and the discharging device are arranged on the workbench, the gluing packaging device comprises a dispensing table and a dispensing device, the dispensing device is used for gluing and packaging chips on the dispensing table, the discharging device is used for taking the chips subjected to gluing packaging off the dispensing table, the dispensing table is arranged into a disc shape, a plurality of placing blocks are arranged on the dispensing table around the circumference, a placing groove is formed in the top of each placing block, a feeding hole is formed in one side, away from the axis of the dispensing table, of each placing groove, a first driving device is connected to the bottom of the dispensing table and used for driving the dispensing table to rotate around the axis of the dispensing table, so that the placing blocks sequentially pass through the conveying belt, And when the placing block passes through the conveying belt, the feed inlet is aligned to the output end of the conveying belt, and the conveying belt is used for conveying the chips to the placing groove.

The working principle of the utility model is as follows: the working personnel place the chips on the conveying belt at intervals, then the conveying belt conveys the chips, the first driving device rotates to enable the feed inlet of one placing block to be aligned with the output end of the conveying belt, the chips enter the feed inlet from the conveying belt to reach the placing groove, then the first driving device works to drive the placing table to rotate, the first placing block provided with the chip comes to the dispensing device, the dispensing device performs glue coating and packaging on the first chip, meanwhile, the second placing block obtains the chips from the conveying belt, then the first driving device works again, the dispensing table rotates to enable the first placing block with the chips to come to the blanking device, the blanking device takes the chips out of the placing groove, meanwhile, the second placing block comes to the dispensing device, and the third placing block comes to the conveying belt, so that the circulation is repeated, and the production efficiency is greatly improved.

In the packaging device for the DSP chip, a guide device is arranged on the conveying belt, baffle plates are arranged on two sides of the conveying belt, the guide device comprises guide shifting pieces symmetrically arranged on the baffle plates, a guide channel is formed between the baffle plates and the guide shifting pieces, the guide shifting pieces comprise an inclined piece and a straight piece which are integrally arranged, one end of the inclined piece is connected onto the baffle plates through a rotating shaft, and one side of the straight piece is connected onto the baffle plates through a retaining spring.

In the packaging device for the DSP chip, the side walls of the placing groove, which are positioned at two sides of the feeding hole, are symmetrically provided with the limiting fixture blocks, the side walls of the two sides of the placing groove are provided with the movable grooves, the limiting fixture blocks are connected to the bottoms of the movable grooves through the reset springs, and one ends, which are far away from the reset springs, of the limiting fixture blocks are provided with the guide inclined planes.

In the above packaging device for a DSP chip, the dispensing device includes a lifting device, a dispensing head and a dispensing tube, the lifting device is used to drive the dispensing head to lift, the lifting device includes a mounting frame and a lead screw driving mechanism disposed on the mounting frame, the lead screw driving mechanism includes a first driving motor, a first lead screw and two first guide rods, the mounting frame includes a bottom plate and a top plate, two ends of the first lead screw and the two first guide rods are equally disposed on the bottom plate and the top plate, the first guide rods are symmetrically disposed on two sides of the first lead screw, the dispensing head is connected to the lead screw driving mechanism through a mounting plate, the mounting plate is provided with a first penetrating channel and two second penetrating channels through the top, a first lead screw nut is fixed inside the first penetrating channel, the mounting plate is sleeved on the first lead screw through a first lead screw nut, the second penetrating channel is used for allowing two first guide rods to penetrate through respectively, and the first driving motor is used for driving the first screw rod to rotate so as to drive the mounting plate to lift.

In the above-mentioned packaging apparatus for a DSP chip, the blanking apparatus includes a blanking frame, a second driving apparatus, and a chip adsorption apparatus, the blanking frame includes a first frame body and a second frame body, the second driving apparatus includes a second driving motor, a second lead screw, and a second guide rod, both ends of the second lead screw and the second guide rod are connected to the first frame body and the second frame body, respectively, the second driving motor is fixed to the first frame body, an output shaft of the second driving motor is connected to the second lead screw, the chip adsorption apparatus includes a moving plate, a chip suction nozzle, and an air pump, a third penetrating channel and a fourth penetrating channel are formed through one side of the moving plate, a second lead screw nut is fixed in the third penetrating channel, the second lead screw nut is sleeved on the second lead screw, the fourth penetrating channel is used for the second guide rod to penetrate, the chip suction nozzle is arranged at the bottom of the movable plate, the air pump is arranged at the top of the movable plate, the chip suction nozzle is connected with the air pump through a connecting pipe, the second driving motor is used for driving the second screw rod to rotate to drive the movable plate to move along the length direction of the second screw rod, and the movable plate is provided with an electric telescopic rod used for driving the chip suction nozzle to lift.

Compared with the prior art, the utility model has the advantage of high efficiency.

Drawings

Fig. 1 is a schematic structural view of the present invention.

FIG. 2 is an enlarged schematic view of part A of the present invention.

FIG. 3 is a schematic cross-sectional view of a placement block of the present invention.

Fig. 4 is a schematic sectional view of a part of the structure of the present invention.

In the figure, 1, a workbench; 2. a conveyor belt; 3. a gluing and packaging device; 4. a blanking device; 5. a glue dispensing table; 6. a dispensing device; 7. placing the blocks; 8. a placement groove; 9. a feed inlet; 10. a first driving device; 11. a guide device; 12. a baffle plate; 13. a guide shifting piece; 14. oblique sheets; 15. straightening; 16. a rotating shaft; 17. a retention spring; 18. a lifting device; 19. dispensing a glue head; 20. a rubber delivery pipe; 21. a mounting frame; 22. a screw rod driving mechanism; 23. a first drive motor; 24. a first lead screw; 25. a first guide bar; 26. a base plate; 27. a top plate; 28. a blanking frame; 29. a second driving device; 30. a chip adsorption device; 31. a first frame body; 32. a second frame body; 33. a second drive motor; 34. a second lead screw; 35. a second guide bar; 36. moving the plate; 37. a chip suction nozzle; 38. an air pump; 39. a connecting pipe; 40. a limiting clamping block; 41. a guide slope; 42. a return spring; 43. a movable groove; 44. mounting a plate; 45. an electric telescopic rod; 46. a protection block; 47. a chip; 48. a feeding station; 49. a first station; 50. and a second station.

Detailed Description

The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.

As shown in fig. 1-4, the packaging device for the DSP chip includes a workbench 1, a conveyor belt 2, a glue dispensing packaging device 3 and a discharging device, wherein the conveyor belt 2, the glue dispensing packaging device 3 and the discharging device are all disposed on the workbench 1, the glue dispensing packaging device 3 includes a glue dispensing table 5 and a glue dispensing device 6, the glue dispensing device 6 is used for glue dispensing and packaging the chip on the glue dispensing table 5, the discharging device is used for taking the chip after glue dispensing and packaging from the glue dispensing table 5, the glue dispensing table 5 is configured as a disc, a plurality of placing blocks 7 are disposed on the glue dispensing table 5 around the circumference, a placing groove 8 is disposed at the top of the placing blocks 7, a feeding port 9 is disposed on one side of the placing groove 8 away from the axis of the glue dispensing table 5, a first driving device 10 is connected to the bottom of the glue dispensing table 5, and the first driving device 10 is used for driving the glue dispensing table 5 to rotate around the axis, so that the placing blocks 7 sequentially pass through the conveyor belt 2, The dispensing device 6 and the blanking device, when the placing block 7 passes through the conveyer belt 2, the feed port 9 is aligned with the output end of the conveyer belt 2, and the conveyer belt 2 is used for conveying the chips into the placing groove 8; the first driving device 10 adopts a stepping motor, and can accurately control the rotating angle of the dispensing table 5.

In more detail, the conveying belt 2 is provided with a guide device 11, two sides of the conveying belt 2 are provided with baffle plates 12, the guide device 11 comprises a guide shifting piece 13 arranged on the baffle plates 12, a guide channel is formed between the baffle plates 12 and the guide shifting piece 13, the guide shifting piece 13 comprises an inclined piece 14 and a straight piece 15 which are integrally arranged, one end of the inclined piece 14 is connected to the baffle plates 12 through a rotating shaft 16, and one side of the straight piece 15 is connected to the baffle plates 12 through a retaining spring 17; in this embodiment, all be provided with the protection piece of protection pin on the four corners of DSP chip, if the chip is placing on conveyer belt 2 to be oblique, then at first the protection piece can contact the flight 14, then under the guide effect of flight 14 gradually change and come to between straight piece 15 and baffle 12, the chip keeps linear motion between straight piece 15 and baffle 12, and retaining spring 17 makes direction plectrum 13 have elasticity, can not harm the chip.

In more detail, the side walls of the placing groove 8 at the two sides of the feed port 9 are symmetrically provided with limiting fixture blocks 40, the side walls at the two sides of the placing groove 8 are both provided with movable grooves 43, the limiting fixture blocks 40 are connected to the bottoms of the movable grooves 43 through return springs 42, and one ends of the limiting fixture blocks 40 away from the return springs 42 are provided with guide inclined planes 41; in the standing groove 8 was come from conveyer belt 2 to the one end of chip, because the setting of direction inclined plane 41, the both sides of chip can squeeze spacing fixture block 40 back to in the movable groove 43, it is inboard until the chip other end reaches spacing fixture block 40, also be exactly spacing fixture block 40 towards one side of standing groove 8 lateral wall, spacing fixture block 40 just can pop out under reset spring 42's effect, it is fixed with the chip, reset spring 42's elasticity is suitable, when spacing fixture block 40 butt was on the chip pin, can not cause the damage to the pin.

In more detail, the dispensing device 6 includes a lifting device 18, a dispensing head 19 and a rubber delivery tube 20, the lifting device 18 is used for driving the dispensing head 19 to lift, the lifting device 18 includes an installation frame 21 and a lead screw driving mechanism 22 arranged on the installation frame 21, the lead screw driving mechanism 22 includes a first driving motor 23, a first lead screw 24 and two first guide rods 25, the installation frame 21 includes a bottom plate 26 and a top plate 27, two ends of the first lead screw 24 and the two first guide rods 25 are respectively arranged on the bottom plate 26 and the top plate 27, the first guide rods 25 are symmetrically arranged on two sides of the first lead screw 24, the dispensing head 19 is connected with the lead screw driving mechanism 22 through an installation plate 44, the installation plate 44 is provided with a first penetrating channel and two second penetrating channels from the top part, a first lead screw nut is fixed inside the first penetrating channel, the installation plate 44 is sleeved on the first lead screw 24 through the first lead screw nut, the second penetrating channel is used for allowing the two first guide rods 25 to respectively penetrate through, and the first driving motor 23 is used for driving the first screw rod 24 to rotate so as to drive the mounting plate 44 to lift; in this embodiment, each time the first driving device 10 works, the dispensing table 5 is driven to instantaneously rotate at the same interval, so that the placing block 7 reaches the position of the previous placing block 7, the placing block 7 has three stations, namely, a feeding station, a first station and a second station, the dispensing head 19 is located above the first station, the position of the feed port 9 of the placing block 7 aligned with the output end of the conveyor belt 2 in fig. 1 is the feeding station, after feeding, the first driving device 10 drives the dispensing table 5 to rotate so that the placing block 7 with the chip reaches the first station, the dispensing head 19 is located above the first station, the lifting device 18 drives the dispensing head 19 to descend to glue and package the chip on the placing block 7 at the first station, the dispensing head 19 is connected with an external glue feeding device through the glue feeding tube 20, the dispensing head 19 is stable during lifting by adopting a screw rod driving manner, so as to ensure the dispensing quality, since the lead screw driving mechanism 22 is a common mechanism, the first through channel, the second through channel, the first lead screw nut, and the like are not shown in the drawings.

In more detail, the blanking device comprises a blanking frame 28, a second driving device 29 and a chip adsorption device 30, the blanking frame 28 comprises a first frame body 31 and a second frame body 32, the second driving device 29 comprises a second driving motor 33, a second lead screw 34 and a second guide rod 35, two ends of the second lead screw 34 and the second guide rod 35 are respectively connected to the first frame body 31 and the second frame body 32, the second driving motor 33 is fixed on the first frame body 31, an output shaft of the second driving motor 33 is connected with the second lead screw 34, the chip adsorption device 30 comprises a moving plate 36, a chip suction nozzle 37 and a suction pump 38, a third penetrating channel and a fourth penetrating channel are arranged on one side of the moving plate 36 in a penetrating way, a second lead screw nut is fixed in the third penetrating channel, the second lead screw nut 34 is sleeved on the second lead screw 34, the fourth penetrating channel is used for the second guide rod 35 to penetrate, the chip suction nozzle 37 is arranged at the bottom of the moving plate 36, the air pump 38 is arranged at the top of the moving plate 36, the chip suction nozzle 37 is connected with the air pump 38 through a connecting pipe 39, the second driving motor 33 is used for driving the second screw rod 34 to rotate to drive the moving plate 36 to move along the length direction of the second screw rod 34, and the moving plate 36 is provided with an electric telescopic rod 45 used for driving the chip suction nozzle 37 to lift; can place the frame of depositing the chip in second lead screw 34 below, second driving motor 33 drive chip suction nozzle 37 moves along the length direction of second lead screw 34 and comes to the piece 7 top of placing of the second station that is located the point and glues platform 5, the chip is at first station rubber coating encapsulation back of accomplishing, first drive arrangement 10 work is once, the chip just can come the second station, then electric telescopic handle 45 drive chip suction nozzle 37 descends, aspiration pump 38 work, chip suction nozzle 37 is with the chip suction from standing groove 8, high efficiency, adopt the mode of suction nozzle absorption chip, can not harm the chip, and can be quick take out the chip from standing groove 8, same lead screw actuating mechanism 22 is common mechanism, second screw-nut, third wears to establish passageway and fourth and wears to establish passageway etc. and mark in the description figure.

The specific embodiments described herein are merely illustrative of the spirit of the utility model. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the utility model as defined in the appended claims.

Although a large number of terms are used here more, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.

Claims

1. A packaging device for DSP chips is characterized by comprising a workbench (1), a conveyer belt (2), a gluing packaging device (3) and a blanking device (4), wherein the conveyer belt (2), the gluing packaging device (3) and the blanking device (4) are all arranged on the workbench (1), the gluing packaging device (3) comprises a dispensing table (5) and a dispensing device (6), the dispensing device (6) is used for gluing and packaging chips on the dispensing table (5), the blanking device (4) is used for taking down the chips subjected to gluing packaging from the dispensing table (5), the dispensing table (5) is arranged in a disc shape, a plurality of placing blocks (7) are arranged on the dispensing table (5) around the circumference, a placing groove (8) is arranged at the top of each placing block (7), a feeding hole (9) is arranged on one side of each placing groove (8) far away from the axis of the dispensing table (5), the dispensing table is characterized in that a first driving device (10) is connected to the bottom of the dispensing table (5), the first driving device (10) is used for driving the dispensing table (5) to rotate around the axis of the dispensing table, so that the placing block (7) sequentially passes through the conveying belt (2), the dispensing device (6) and the blanking device (4), when the placing block (7) passes through the conveying belt (2), the feeding hole (9) is aligned with the output end of the conveying belt (2), and the conveying belt (2) is used for conveying chips to the inside of the placing groove (8).

2. The packaging device for the DSP chip according to claim 1, wherein a guiding device (11) is disposed on the conveyor belt (2), the baffles (12) are disposed on two sides of the conveyor belt (2), the guiding device (11) comprises guiding paddles (13) symmetrically disposed on the baffles (12), a guiding channel is formed between the baffles (12) and the guiding paddles (13), the guiding paddles (13) comprise an inclined plate (14) and a straight plate (15) integrally disposed, one end of the inclined plate (14) is connected to the baffles (12) through a rotating shaft (16), and one side of the straight plate (15) is connected to the baffles (12) through a retaining spring (17).

3. The packaging device for the DSP chip according to claim 1, wherein the side walls of the placing groove (8) at both sides of the feeding hole (9) are symmetrically provided with a limiting fixture block (40), the side walls at both sides of the placing groove (8) are both provided with a movable groove (43), the limiting fixture block (40) is connected to the bottom of the movable groove (43) through a return spring (42), and one end of the limiting fixture block (40) away from the return spring (42) is provided with a guide inclined plane (41).

4. The packaging device for the DSP chip according to claim 1, wherein the dispensing device (6) comprises a lifting device (18), a dispensing head (19) and a dispensing tube (20), the lifting device (18) is used for driving the dispensing head (19) to lift, the lifting device (18) comprises a mounting frame (21) and a lead screw driving mechanism (22) arranged on the mounting frame (21), the lead screw driving mechanism (22) comprises a first driving motor (23), a first lead screw (24) and two first guide rods (25), the mounting frame (21) comprises a bottom plate (26) and a top plate (27), two ends of the first lead screw (24) and the two first guide rods (25) are respectively arranged on the bottom plate (26) and the top plate (27), the first guide rods (25) are symmetrically arranged on two sides of the first lead screw (24), the dispensing head (19) is connected through a mounting plate (44) lead screw driving mechanism (22), the mounting plate (44) is provided with first passageway and two second from the top is worn to establish the passageway, first passageway inside is worn to establish and is fixed with first lead screw (24) nut, mounting plate (44) are established through first lead screw nut cover on first lead screw (24), the second is worn to establish the passageway and is used for supplying two first guide arms (25) to wear to establish respectively, first driving motor (23) are used for the drive thereby first lead screw (24) rotate and drive mounting plate (44) go up and down.

5. The packaging device for the DSP chip according to claim 1, wherein the blanking device (4) comprises a blanking frame (28), a second driving device (29) and a chip adsorption device (30), the blanking frame (28) comprises a first frame body (31) and a second frame body (32), the second driving device (29) comprises a second driving motor (33), a second lead screw (34) and a second guide rod (35), two ends of the second lead screw (34) and the second guide rod (35) are respectively connected to the first frame body (31) and the second frame body (32), the second driving motor (33) is fixed on the first frame body (31), an output shaft of the second driving motor (33) is connected to the second lead screw (34), the chip adsorption device (30) comprises a moving plate (36), a chip suction nozzle (37) and a suction pump (38), a third penetrating channel and a fourth penetrating channel are formed in one side of the moving plate (36) in a penetrating mode, a second lead screw (34) nut is fixedly arranged in the third penetrating channel, the second lead screw nut is sleeved on the second lead screw (34), the fourth penetrating channel is used for allowing a second guide rod (35) to penetrate, the chip suction nozzle (37) is arranged at the bottom of the moving plate (36), the air suction pump (38) is arranged at the top of the moving plate (36), the chip suction nozzle (37) is connected with the air suction pump (38) through a connecting pipe (39), the second driving motor (33) is used for driving the second lead screw (34) to rotate to drive the moving plate (36) to move along the length direction of the second lead screw (34), and an electric telescopic rod (45) used for driving the chip suction nozzle (37) to lift is arranged on the moving plate (36).