CN216121822U - Wireless charging circuit structure and charger - Google Patents

Abstract

The utility model provides a wireless charging circuit structure and a charger. The wireless charging circuit structure includes: the main board is in a fan-ring shape; the power conversion circuit and the driving circuit are arranged at one end of the mainboard; and the operational amplifier circuit is arranged at the other end of the mainboard. The wireless charging circuit structure is not only reduced in size, but also greatly reduced in cost.

Description

Wireless charging circuit structure and charger

Technical Field

The utility model relates to the technical field of charging, in particular to a wireless charging circuit structure and a charger.

Background

With the continuous update of consumer electronics, small-sized high power density chargers are becoming the development trend in the future. In the wireless mobile phone accessory market, under the condition that the transmission power and the number of electronic devices are not changed greatly, how to use a smaller PCB size to save the cost becomes the key of market competition.

In order to further reduce the volume and reduce the cost of wireless charging, the structure of the wireless charging at present needs to be improved.

SUMMERY OF THE UTILITY MODEL

According to the utility model, in order to solve the problems of overlarge wireless charging volume and low space utilization rate, the utility model provides a wireless charging circuit structure, which comprises:

the main board is in a fan-ring shape;

the power conversion circuit and the driving circuit are arranged at one end of the mainboard;

and the operational amplifier circuit is arranged at the other end of the mainboard.

Optionally, the main board is a two-layer board.

Optionally, the wireless charging circuit structure further includes:

and a demodulation and sampling circuit provided between the power conversion circuit and the operational amplifier circuit and provided inside the fan-ring shape.

Optionally, the wireless charging circuit structure further includes:

a main control circuit disposed outside the demodulation and sampling circuit in the fan-ring shape.

Optionally, the operational amplifier circuit is disposed inside the fan-ring shape.

Optionally, the wireless charging circuit structure further includes:

and the D2D circuit is arranged at one end where the operational amplifier circuit is arranged and is positioned outside the fan-shaped ring.

Optionally, the wireless charging circuit structure further includes:

and the slow start and crystal oscillator circuit is arranged at one end where the operational amplification circuit is positioned and is positioned at the outer side of the fan ring shape.

Optionally, the interval between the power conversion circuit and the driving circuit is 8mm or more.

The present application further provides a charger comprising the wireless charging circuit structure described above.

According to an embodiment of the present invention, the wireless charging circuit structure includes: the main board is in a fan-ring shape; the power conversion circuit and the driving circuit are arranged at one end of the mainboard; and the operational amplifier circuit is arranged at the other end of the mainboard.

Not only make mainboard size reduce in the wireless circuit structure that charges through the improvement, cost also greatly reduced.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent by describing in more detail embodiments of the present invention with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 is a schematic circuit diagram of a wireless charging circuit structure according to an embodiment of the present invention;

fig. 2 is a top view of a layout structure of a main board in a wireless charging structure according to another embodiment of the utility model.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the utility model.

In the following description, for purposes of explanation, specific details are set forth in order to provide a thorough understanding of the present invention. It is apparent that the practice of the utility model is not limited to the specific details set forth herein as are known to those of skill in the art. The following detailed description of the preferred embodiments of the utility model, however, the utility model is capable of other embodiments in addition to the detailed description and should not be construed as limited to the embodiments set forth herein.

It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model, as the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. When the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The terms "upper", "lower", "front", "rear", "left", "right" and the like as used herein are for purposes of illustration only and are not limiting.

Ordinal words such as "first" and "second" are referred to herein merely as labels, and do not have any other meaning, such as a particular order, etc. Also, for example, the term "first component" does not itself imply the presence of "second component", and the term "second component" does not itself imply the presence of "first component".

Specific embodiments of the present invention will now be described in more detail with reference to the accompanying drawings, which illustrate representative embodiments of the utility model and do not limit the utility model.

In order to solve the above problems, the present invention provides a wireless charging circuit structure, and the following describes in detail the wireless charging circuit structure according to an embodiment of the present invention with reference to the accompanying drawings.

First, a wireless charging circuit structure according to an embodiment of the present invention is described with reference to fig. 1, where fig. 1 is a block diagram of a main board in the wireless charging circuit structure according to an embodiment of the present invention.

As shown in fig. 1, the wireless charging circuit structure 100 at least includes:

a main plate 101, which is in a fan ring shape;

a power conversion circuit 106 and a drive circuit 102 provided at one end of the main board 101;

and an operational amplifier circuit 103 disposed at the other end of the main board.

Specifically, the wireless charging Circuit structure in the embodiment of the present invention includes each functional device and/or module, and each functional device and/or module is integrated on a motherboard, where in the embodiment of the present invention, the motherboard 101 may be a Printed Circuit Board (PCB) motherboard, a ceramic motherboard, a Pre-injection molding (Pre-mold) motherboard, or the like.

In one embodiment, the main Board 101 is a Printed Circuit Board (PCB) main Board. The PCB is manufactured by processing different components and various complex process technologies, and the like, wherein the PCB circuit board has a single-layer structure, a double-layer structure and a multi-layer structure, and different hierarchical structures have different manufacturing modes.

Alternatively, the printed circuit board is primarily comprised of pads, vias, mounting holes, wires, components, connectors, fills, electrical boundaries, and the like.

Further, common board Layer structures of printed circuit boards include three types, namely a Single Layer board (Single Layer PCB), a Double Layer board (Double Layer PCB) and a Multi Layer board (Multi Layer PCB), and specific structures thereof are as follows:

(1) Single-Sided Boards (Single-Sided Boards) are on the most basic PCB with parts concentrated on one side and wires concentrated on the other side (same side as the wires when the patch elements are present, and the package devices on the other side). Such a PCB is called a Single-sided (Single-sided) board because the conductors are present on only one side thereof. Since single panels have many stringent constraints on the design of the circuitry (since only one side, the wires cannot cross and must be routed around individual paths), only early circuits used such panels.

(2) Double-Sided Boards (Double-Sided Boards) are Boards that have wiring on both sides, but use wires on both sides and require appropriate electrical connections between the sides. The "bridge" between circuits is called a via (via). The via hole is a small hole filled or coated with metal on the PCB, and can be connected with the wires on both sides. Because the area of the double-sided board is twice larger than that of the single-sided board, the double-sided board solves the difficulty of wiring staggering (conducting to the other side through holes) in the single-sided board, and the double-sided board is more suitable for being used on a circuit which is more complex than the single-sided board.

(3) Multilayer board: Multi-Layer Boards (Multi-Layer Boards) to increase the area over which wiring can be routed, more single or double sided wiring Boards are used. A printed circuit board with two inner layers and two outer layers or two inner layers and two outer layers is made up through alternative arrangement of positioning system and insulating adhesive material, and interconnection of conducting patterns according to design requirement. The number of layers of the board does not represent that there are several independent wiring layers, and in special cases, empty layers are added to control the board thickness, and the number of layers is usually even and includes two outermost layers. Most motherboards are 4 to 8-layer structures, but technically, it is theoretically possible to make a PCB with nearly 100 layers.

The printed circuit board includes many types of working layers, such as a signal layer, a protective layer, a silk-screen layer, an internal layer, and so on, which are not described herein again.

In order to ensure the overall performance of the wireless charging circuit structure and further reduce the cost, in an embodiment of the present invention, the main board 101 is a multilayer board, in a specific embodiment, the main board 101 is a two-layer board, each layer is a double-sided board, the layers are insulated from each other, and the connection between the layers is usually achieved through a via hole.

For example, the main board 101 includes a first main board and a second main board, where the first main board and the second main board each include two surfaces disposed oppositely, and the first main board and the second main board are separated by an insulating layer, for example, by a material layer such as glass fiber, and are spaced and insulated from each other.

Further, the main board may be a Pre-injection molding (Pre-mold) main board, wherein the Pre-injection molding main board has an injection molding wire and a pin, the injection molding wire is embedded in a main body structure of the main board, and the pin is located on a surface of the main body structure of the main board, such as an inner surface and/or an outer surface, so as to electrically connect the main board with the laser diode chip, the driver chip, and the circuit board, respectively.

The preparation method of the Pre-injection (Pre-mold) mainboard can be formed by a conventional injection molding process, a planer tool digging process and a mold stamping forming process in sequence, and is not repeated herein.

The injection molding material of the Pre-injection molded (Pre-mold) main board may be a conventional material, such as a conductive thermoplastic material, and is not limited to a certain material, wherein the shape of the Pre-injection molded (Pre-mold) main board is defined by an injection molding frame, and is not limited to a certain material.

In one embodiment, the main board is placed inside the injection molding frame, and then the annular groove structure is formed on the main board by injection molding. Or arranging the injection molding lead and the pins in the injection molding frame, and then performing injection molding on the injection molding frame.

The shape of the main board 101 is a part of a circular ring, i.e. a fan ring, for example, the size of the single PCB sheet is about 35.7% of the size of the original complete circular ring, as shown in fig. 2, the left diagram is a schematic diagram of a main board structure when a four-layer board is adopted, the right diagram is an improved main board structure, the improved size is greatly reduced, the packaging space is saved, and the cost is further reduced.

In addition, under the condition that the transmission power and the number of devices are not changed greatly, how to use a smaller PCB size to save cost becomes a key of market competition, the PCB size needs to be reduced, in addition to the optimization of the device layout, the miniaturization of the device package is needed, and the miniaturized device package and the efficient device layout are utilized to reduce the PCB size.

In the embodiment of the utility model, in order to improve the density of the chip devices, the packaging size is reduced on the basis of standard device packaging within the allowable range of the production process, so that more devices can be accommodated in the same PCB size, and in a specific implementation mode, the packaging size of a single device is reduced by more than 10% compared with the original packaging size under the condition of the same production yield.

In one embodiment, the functional device is reduced by 10% -12% from the package size of a standard size functional device. Of course, the reduced size is not limited to the value range, and can be selected according to actual requirements under the condition of ensuring the same production yield.

After reducing mainboard size and functional device size, in order to realize that the effect of wireless charging circuit structure is not influenced, it is right territory structure in the wireless charging circuit structure, the setting of functional device has improved promptly, under the unable circumstances of changing of PCB frame, and limited space resource is fully utilized, and intensive just moves towards with power according to the signal and rationally arranges the device.

In an embodiment, the heat-generating source device in the wireless charging circuit structure is disposed at a first end of the fan ring, and the temperature-sensitive functional device is disposed at a second end of the fan ring. Specifically, the intervals of all heating source devices are more than 8mm, so that additional metal radiating fins are saved, and the temperature of all devices can be below 60 ℃ under the condition of normal temperature and 25 ℃ with full load. For example, the interval between the power conversion circuit 106 and the drive circuit 102 is 8mm or more.

In an embodiment of the utility model, the functional circuit includes:

the power transmitting circuit is arranged at one end of the mainboard, is used for generating a magnetic coupling electric field which can be received by a device to be charged, transmits energy to the device to be charged from the wireless charging circuit structure, and is arranged at one end of the fan ring; in one embodiment, the power and transmit circuitry includes the following components: 1. the QI specification for the transmitter coil allows the use of any coil type, such as A11, MP-A11, A28, MP-A2, etc. 2, full bridge circuit, composed of two sets of non-simultaneously conducting MOS. And 3, a resonant cavity circuit which is connected with LC in series to form resonance.

The driving circuit 102 is disposed at one end of the motherboard, as shown in fig. 1, the driving circuit 102 is configured to convert a digital control signal output by the main control circuit into an analog control signal that can be identified by the power transmitting circuit, and control the magnitude of the transmitting power of the power transmitting circuit; in one embodiment, the driving circuit 102 includes the following components: 1, a bleed and drive circuit 102 that controls the MOS drive signal strength to the power and transmit circuit; and 2, a moving point sampling circuit which can sample the midpoint voltage of the same bridge arm.

And a demodulation and sampling circuit 104 provided between the power conversion circuit 106 and the drive circuit 102 and the operational amplifier circuit 103 and inside the fan-ring shape. As shown in fig. 1, the demodulation and sampling circuit 104 is configured to decode a signal fed back to the wireless charging device by the power transmitting circuit, so that the signal is converted into a digital signal that can be recognized by the main control module; in one embodiment, the demodulation and sampling circuit 104 includes the following components: the circuit comprises a first-order RC filter circuit and a second-order RC filter circuit, and provides effective feedback signals for the MCU; 2, a current sampling circuit which is a series high-power resistor and allows the MCU to identify the current according to the voltage of the sampling resistor; and 3, a voltage sampling circuit which is a resistance voltage division network and gives the voltage signal to the MCU after weakening the voltage signal.

A master control circuit, the master control circuit, disposed outside the demodulation and sampling circuit 104 in the fan-ring shape. The main control circuit is configured to control the transmitting power of the power transmitting circuit through the driving circuit 102 according to the information fed back by the demodulating and sampling circuit 104 and the requirement of the device to be charged, and is arranged at the other end of the fan ring. In one embodiment, the circuit includes 1, an operational amplifier circuit 103, which is an 8-bit AD sampling circuit; and 2, a logic output circuit which is 16 IO ports arranged in the MCU and controls the operation logic of the whole system.

The operational amplifier circuit 103 is disposed at the other end of the main board. The operational amplifier circuit 103 is an analog amplifier circuit, and the signal amplification factor can be adjusted by a peripheral resistor.

The wireless charging circuit structure further comprises:

the D2D circuit 105 is disposed at one end where the operational amplifier circuit 103 is located, is located outside the fan-ring shape, and is used for converting an unstable input voltage into a stable voltage to supply power to the main control circuit; the D2D circuit 105 is a DC to DC circuit, and is a Buck type step-down power supply circuit.

And the slow start and crystal oscillator circuit is arranged at one end where the operational amplifier circuit 103 is positioned and is positioned at the outer side of the fan-shaped ring. The slow start is used for delaying the power supply time of the first power-on, so that the system is prevented from being interfered by voltage spikes caused by hot plugging, and the crystal oscillator circuit is used for providing stable PWM signals for the main control module. In one embodiment, the D2D, soft start, and crystal oscillator circuits include the following components: 1, a slow starting circuit which is a high-order control switch designed by utilizing the conduction characteristic of a PMOS (P-channel metal oxide semiconductor); and 2, a crystal oscillator circuit which is a passive crystal oscillator circuit and can try to meet the PWM signal required by the system time sequence.

Taking mobile phone charging as an example, the working principle of the wireless charging circuit structure of the utility model is explained: firstly, a user accesses the power supply of an adapter into a wireless charging system (generally 5V, if higher transmitting power is needed, a QC adapter is needed to be accessed) through a Micro USB, the D2D of the wireless charging system is started slowly, a crystal oscillator module starts to work to provide stable power supply and timing sequence PWM signals for a main control circuit, the main control circuit starts to work, the main control circuit firstly generates a detection signal and sends the detection signal to a power transmitting circuit through a driving circuit 102, whether a mobile phone is placed on a wireless charging circuit or not is detected, if the mobile phone is not placed on the wireless charging circuit structure, the detection signal is continuously transmitted, if the mobile phone is placed on the wireless charging circuit structure, the power transmitting circuit transmits the signal transmitted by the mobile phone to the main control circuit through a demodulation and sampling circuit 104, then the wireless charging circuit structure and the mobile phone start to communicate, the power size needed to be transmitted is negotiated mutually, and the circuit receives the information, the transmitting power of the power transmitting circuit is adjusted through the driving module, so that the mobile phone is charged.

According to an embodiment of the present invention, the wireless charging circuit structure includes: the main board is in a fan-ring shape; a power conversion circuit 106 and a driving circuit 102, which are disposed at one end of the motherboard; and an operational amplifier circuit 103 disposed at the other end of the main board. Not only make mainboard size reduce in the wireless circuit structure that charges through the improvement, cost also greatly reduced.

Example two

The present invention further provides a charger, the charger includes a wireless charging circuit structure 100, the wireless charging circuit structure 100 at least includes:

the main board is in a fan-ring shape;

a power conversion circuit 106 and a driving circuit 102, which are disposed at one end of the motherboard;

and an operational amplifier circuit 103 disposed at the other end of the main board.

In one embodiment, the charger includes at least a housing for forming a space to accommodate the wireless charging circuit structure 100.

Alternatively, the housing may be composed of an upper housing and a lower housing, and the outer shapes of the upper housing and the lower housing may be overlapped, the upper housing and the lower housing being engaged with each other to form a receiving space.

Optionally, the upper shell and the lower shell are made of the same material, so that the upper shell and the lower shell have the same shrinkage rate, and the upper shell and the lower shell are prevented from being completely clamped and sealed after being processed.

Alternatively, the plastic material generally selected for the housing is Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) copolymer and mixture, it should be noted that the material of the housing is not limited to one, and any housing material commonly used in the art can be applied to the embodiment of the present invention, and is not listed here.

Alternatively, the housing needs to have a certain strength to satisfy the ability of various drop, twist, and seat pressure tests without being damaged.

Illustratively, the thickness of the shell is 0.5-4mm, and for the shell of the injection molding plastic part, the wall thickness of the shell is related to factors such as the size, the structure, the plastic raw material, the position of a mold gate, the injection molding process and the like of the part, and the approximate range is 0.5-4 mm; the thin part is poor in strength and difficult to be injection molded; too thick, causes material waste, long forming period, easy shrinkage and poor surface quality.

For the charger structure, in case of using PC material, the wall thickness of the front surface of the housing is selected in the range of 1.0-1.6mm, and the currently commonly used thickness is 1.2mm (if the product is larger, 1.6mm should be selected, such as mobile phones).

Of course, besides the above components, the charger may also include other conventional structures such as a USB interface, and details thereof are not described herein.

According to the embodiment of the utility model, the mainboard of the wireless charging circuit structure in the charger adopts two layers of boards, compared with the large-size four-layer board, the overall size and the PCB cost of the two layers of boards are less than half of those of the four layers of boards, in addition, the packaging size is reduced on the basis of standard device packaging, so that more devices can be accommodated in the same PCB size, under the condition of the same production yield, the packaging size of a single device is reduced by more than 10% compared with the original packaging size, and the single PCB size is about 35.7% of the original complete circular ring size by using the reduced-size device packaging. Under the condition that the PCB frame cannot be changed, limited space resources are fully utilized, and devices are densely and reasonably arranged according to the signal trend and the power trend. Not only make mainboard size reduce in the wireless circuit structure that charges through the improvement, cost also greatly reduced.

The terms are used in the same sense as those commonly understood by those skilled in the art of the present invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. Terms such as "part," "member," and the like, when used herein, can refer to either a single part or a combination of parts. Terms such as "mounted," "disposed," and the like, as used herein, may refer to one component as being directly attached to another component or one component as being attached to another component through intervening components. Features described herein in one embodiment may be applied to another embodiment, either alone or in combination with other features, unless the feature is otherwise inapplicable or otherwise stated in the other embodiment.

The present invention has been illustrated by the above embodiments, but it should be understood that the above embodiments are for illustrative and descriptive purposes only and are not intended to limit the utility model to the scope of the described embodiments. Furthermore, it will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that many variations and modifications may be made in accordance with the teachings of the present invention, which variations and modifications are within the scope of the present invention as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (9)

1. The wireless charging path structure is characterized by comprising:

the main board is in a fan-ring shape;

the power conversion circuit and the driving circuit are arranged at one end of the mainboard;

and the operational amplifier circuit is arranged at the other end of the mainboard.

2. The wireless charging circuit structure of claim 1, wherein the main board is a two-layer board.

3. The wireless charging circuit structure of claim 1, further comprising:

and a demodulation and sampling circuit provided between the power conversion circuit and the operational amplifier circuit and provided inside the fan-ring shape.

4. The wireless charging circuit structure of claim 3, further comprising:

a main control circuit disposed outside the demodulation and sampling circuit in the fan-ring shape.

5. The wireless charging circuit structure according to claim 1, wherein the operational amplifier circuit is disposed inside the fan-ring shape.

6. The wireless charging circuit structure of claim 1, further comprising:

and the D2D circuit is arranged at one end where the operational amplifier circuit is arranged and is positioned outside the fan-shaped ring.

7. The wireless charging circuit structure of claim 1, further comprising:

and the slow start and crystal oscillator circuit is arranged at one end where the operational amplification circuit is positioned and is positioned at the outer side of the fan ring shape.

8. The wireless charging circuit structure according to claim 1, wherein a distance between the power conversion circuit and the driving circuit is 8mm or more.

9. A charger comprising the wireless charging circuit arrangement of one of claims 1 to 8.

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