CN115734062A

CN115734062A - Camera module and connector PIN setting method thereof

Info

Publication number: CN115734062A
Application number: CN202110981490.8A
Authority: CN
Inventors: 姚施琴; 王琴; 付成丹; 杨娟; 耿佳骏
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2021-08-25
Filing date: 2021-08-25
Publication date: 2023-03-03

Abstract

The application discloses module of making a video recording and connector PIN foot setting method thereof, wherein the module of making a video recording includes: the lens component, the circuit board and the connector, wherein the upper section of the circuit board is attached to the lens component so as to electrically connect the lens component and the circuit board; the connector is attached to the lower section of the circuit board, the connector is electrically connected with the circuit board and the mainboard respectively through the pin area, and the pin area connected with the lens component is set by at least two protocols, so that the connector is compatible with the lens components with different communication modes. Therefore, the connector is preferably suitable for 4800 ten thousand high pixel large-current modules, and the exclusivity of the camera module is converted into the universality by the compatibility of the connector with two communication protocols of C-PHY and D-PHY, so that the normalized design of the camera module is realized; simultaneously, different pins of the connector are defined, so that the connector can be compatible with various focusing modes of the lens assembly, and the normalization processing of the camera module is realized.

Description

Camera module and connector PIN setting method thereof

Technical Field

The invention relates to the field of optical imaging, in particular to a camera module and a method for setting a connector PIN PIN of the camera module.

Background

With the rapid development of mobile devices, especially smart phones, people have higher and higher requirements on pixels of a camera module of the mobile device, and have higher and higher requirements on transmission speed, so that traditional parallel port (TTL) transmission is more and more challenged. There are two main methods for increasing the transmission speed of the conventional parallel port, one of which is to increase the output clock of the parallel port transmission, but this will make the EMC design of the system more and more difficult. Another approach is to increase the number of bits of the transmission line, but this does not meet the trend of miniaturization of the termination structure.

In 2003, an MIPI alliance, i.e., a mobile industry processor interface alliance, was established by companies such as ARM, noki, ST, TI, etc., in order to standardize interfaces inside a mobile phone, such as a camera, a display screen interface, a radio frequency/baseband interface, etc., thereby reducing complexity of mobile phone design and increasing design flexibility.

Different workgroups (workgroups) below the MIPI alliance define a series of standards for internal interfaces of mobile phones, such as Camera Interface CSI (Camera Serial Interface), display Interface DSI (Display Serial Interface), radio Interface DigRF (DigRF), microphone/speaker Interface SLIMbus (SLIMbus), and the like. The unified interface standard can be convenient for the cell-phone manufacturer to select different chips and modules from the market as required in a flexible way, and is more convenient and quicker when changing design and function.

The interfaces of the chip and the module basically adopt C-PHY or D-PHY communication protocols to transmit data, and the C-PHY and D-PHY communication protocols can increase the bandwidth to improve the transmission capacity and the data volume of signals. And chip and module when installing into the mobile device, all are connected through connector and the interior mainboard of mobile device basically, this just leads to the producer when designing chip and module, and the communication protocol of chip and module must be the same with the communication protocol of connector pin, and then has increased the design degree of difficulty of the module of making a video recording.

Disclosure of Invention

One of the objectives of the present invention is to provide a camera module and a PIN setting method for a connector thereof, in which at least two communication protocols are simultaneously adopted for defining PINs of the connector, so that the connector can be compatible with camera modules of multiple communication protocols, and exclusivity of the camera module is converted into universality, thereby reducing design difficulty of the camera module.

One of the objectives of the present invention is to provide a camera module and a PIN setting method for a connector thereof, which can improve the transmission speed of the camera module and reduce the power consumption of the camera module to a lower level by using a D-PHY or C-PHY communication protocol for a PIN area of the connector.

One of the objectives of the present invention is to provide a camera module and a PIN setting method for a connector thereof, which define different PINs of the connector so that the connector can be compatible with multiple focusing modes of the camera module at the same time, thereby implementing normalization processing of the camera module.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: a camera module, comprising:

a lens assembly;

the upper section of the circuit board is attached to the lens component so that the lens component is electrically connected with the circuit board;

the connector, the connector is attached in the hypomere of circuit board, the connector is provided with the pin district, the connector pass through the pin district respectively with circuit board and mainboard carry out electric connection, simultaneously with the lens subassembly is connected the pin district adopts two kinds of agreement settings at least, so that the connector can be compatible different communication mode the lens subassembly.

Preferably, the lens assembly includes a lens body and a photosensitive chip, the lens body is disposed on a photosensitive path of the photosensitive chip, the photosensitive chip is electrically connected to the pin area, and the connector is adapted to keep signal conduction between the lens body and the motherboard.

Preferably, the lens assembly further includes a driving device, the driving device is connected to the pin area, and the connector is adapted to keep signal conduction between the driving device and the main board, so that the driving device drives the lens body to focus.

Preferably, the pin area includes an actuator communication area, a chip signal connection area and a circuit pin area, the actuator communication area is connected to the driving device, the chip signal connection area is connected to the photosensitive chip, and the circuit pin area is connected to the circuit board and the motherboard respectively.

Preferably, the connector is rectangular, the pin area is divided into two symmetrical areas by taking a center line as a reference, the actuator communication area is positioned in one area, and the chip signal connection area is positioned in the other area; the pins of the actuator communication area are used for transmitting focusing signals of the driving device, and the pins of the chip signal connection area are used for transmitting chip communication signals of the photosensitive chip, so that the pins with the same function are located in the same area.

Preferably, the connector adopts an MIPI serial interface, so that a PIN interface of the chip signal connection area adopts a D-PHY communication protocol and a C-PHY communication protocol at the same time; meanwhile, the photosensitive chip adopts a D-PHY communication protocol or a C-PHY communication protocol.

Preferably, the chip signal connection area comprises at least two groups of interfaces adopting D-PHY communication protocols and at least one group of interfaces adopting C-PHY communication protocols.

Preferably, the at least two groups of D-PHY communication protocol interfaces include a group of clock channels and at least one group of data channels.

Preferably, the actuator communication area includes at least two sets of PIN interfaces to allow the connector to be compatible with different drive devices.

Preferably, the driving device is selected from at least one of an AF module and an OIS module.

Preferably, the lower section of the circuit board is provided with an extension section, and the connector is attached to the back surface of the extension section.

Preferably, the extension section is a flexible circuit board.

A method for setting a PIN of a connector is characterized by comprising the following steps:

s100: ten PIN interfaces are selected from the PIN area of the connector to form a chip signal connection area;

s200: defining the PIN interfaces selected in the S100, and obtaining five groups of D interfaces by taking two interfaces as a group and obtaining three groups of C interfaces by taking three interfaces as a group;

s300: D-PHY communication protocol is adopted for the D interface in S200, C-PHY communication protocol is adopted for the C interface, so that the D-PHY communication protocol and the C-PHY communication protocol share a PIN interface.

Preferably, the method further comprises the following steps:

s110: selecting nine PIN interfaces as an actuator communication area from the non-chip signal connection area of the connector in S100 again;

s210: the actuator communication zones selected in S110 are grouped, including an O-group interface of five PIN-PIN interfaces and an a-group interface of four PIN-PIN interfaces.

Preferably, the O-set interface is adapted to connect to a driving device in the OIS module; the A group interface is suitable for being connected with a driving device in the AF module.

Preferably, the PIN interface of the O group uses an SPI communication protocol.

Preferably, the connector comprises at least one connectionless PIN interface.

Drawings

FIG. 1 is a schematic side view of the camera module according to the present invention;

FIG. 2 is a schematic view of the rear view of the camera module according to the present invention;

FIG. 3 is a schematic view of the connector of the present invention;

FIG. 4 is an overall schematic view of the distribution of the PIN legs of the connector of the present invention;

FIG. 5 is a schematic diagram illustrating the distribution of PIN legs of the FF module using the D-PHY communication protocol according to an embodiment of the present invention;

FIG. 6 is a schematic diagram illustrating distribution of PIN legs of an AF module according to a D-PHY communication protocol according to an embodiment of the present invention;

FIG. 7 is a schematic diagram illustrating the distribution of PIN used by the OIS module according to the D-PHY protocol in an embodiment of the present invention;

FIG. 8 is a schematic diagram illustrating the distribution of PIN PINs of the FF module using the C-PHY communication protocol according to an embodiment of the present invention

FIG. 9 is a diagram illustrating distribution of PIN PINs of the AF module in accordance with the C-PHY protocol in an embodiment of the present invention

FIG. 10 is a schematic diagram illustrating the distribution of PIN for the OIS module using the C-PHY communication protocol according to an embodiment of the present invention

In the figure: lens assembly 100, lens body 110, photosensitive chip 120, driving device 130, bracket 140, circuit board 200, reinforcing plate 210, extension 220, connector 300, PIN interface 301, chip signal connection area 310, actuator communication area 320, and double-sided tape 4.

Detailed Description

The present application is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.

In the description of the present application, it should be noted that, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate orientations and positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present application.

It is noted that the terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

According to a first aspect of the present application, as shown in fig. 1 to 4, a camera module is provided, which includes a lens assembly 100, a circuit board 200 and a connector 300, wherein a reinforcing plate 210 is disposed on an upper section of the circuit board 200, and the lens assembly 100 is attached to a front surface of the reinforcing plate 210, so that the lens assembly 100 is electrically connected to the circuit board 200; meanwhile, the double-sided adhesive tape 4 is attached to the back of the upper section of the circuit board 200, so that the circuit board 200 is attached to the upper end face of the main board through the double-sided adhesive tape 4, thereby fixedly mounting the lens assembly 100 on the main board; connector 300 is attached in the hypomere back of circuit board 200, connector 300 is provided with the pin district, connector 300 passes through the pin district respectively with circuit board 200 and mainboard carry out electric connection, so that lens subassembly 100 passes through connector 300 carries out data communication with the mainboard, and with lens subassembly 100 is connected the pin district adopts two kinds of agreements to set up simultaneously at least, so that connector 300 can be compatible including different communication methods lens subassembly 100 to when the module design of making a video recording, through gathering together multiple communication mode, in order to realize the normalization design to the module of making a video recording, and then reduce the degree of difficulty of the module of making a video recording when designing.

In some embodiments, as shown in fig. 1 and fig. 2, an extension section 220 is disposed on a lower section of the circuit board 200, the extension section 220 is a flexible circuit board, the connector 300 is attached to a back surface of the extension section 220, and the attachment of the connector 300 can be facilitated through the flexible circuit board, so as to reduce the difficulty in mounting the camera module.

In some embodiments, as shown in fig. 1, the lens assembly 100 includes a lens body 110, a photosensitive chip 120 and a bracket 140, the bracket 140 is attached to the front surface of the circuit board 200, so that the lens body 110 is movably mounted at an end of the bracket 140, the photosensitive chip 120 is attached to the bottom of the bracket 140, the lens body 110 is located on a photosensitive path of the photosensitive chip 120, so as to receive the reflected light of the object to be measured by the photosensitive chip 120 after performing focus enhancement, and the photosensitive chip 120 is electrically connected to the pin area, and the connector 300 is adapted to maintain signal conduction between the photosensitive chip 120 and the motherboard, so that the photosensitive chip 120 converts the received optical signal into an electrical signal and then sends the electrical signal to the motherboard through the connector 300.

In some embodiments, as shown in fig. 1, the lens assembly 100 further includes a driving device 130, the driving device 130 is mounted outside the bracket 140, and the driving device 130 is connected to the lens body 110, and the driving device 130 is further electrically connected to the pin area, the connector 300 is adapted to maintain signal communication between the driving device 130 and a main board, so that the main board sends out a driving signal according to a received light signal, and the driving signal is sent to the driving device 130 through the connector 300, so as to drive the driving device to bring the lens body 110 into focus.

In some embodiments, as shown in fig. 3 and 4, the connector 300 is rectangular, the pin area includes an actuator communication area 320, a chip signal connection area 310 and a wire pin area, the actuator communication area 320 is used for connecting with the driving device 130, the chip signal connection area 310 is used for connecting with the photosensitive chip 120, the wire pin area is used for electrically connecting the connector 300 with a motherboard so as to supply power for normal operation of the connector 300 through the motherboard, the connector 300 divides the pins into two symmetrical areas with respect to the centerline (dashed line in fig. 3), the chip signal connection area 310 is located in one of the areas, the actuator communication area 320 is located in the other area, the pins of the actuator communication area 320 are used for transmitting the focus signal of the driving device 130, and the pins of the chip signal connection area 310 are used for transmitting the chip communication signal of the photosensitive chip 120, so that the pins of the same function are located in the same area, thereby the chip signal connection area 310 and the actuator communication area 320 are designed separately from each other so as to ensure that the chip signal connection area 310 and the actuator communication area 320 do not interfere with each other.

It can be understood that, when the driving device 130 is activated, the instantaneous current of the driving device 130 is large, and if the chip signal connection region 310 and the actuator communication region 320 are disposed on the same side, it is easy to interfere with signal transmission of the chip signal connection region 310 when the driving device 130 is activated, and further affect the shooting quality of the lens assembly 100, so it is more reasonable to design the chip signal connection region 310 and the actuator communication region 320 on two sides of the connector 300 respectively.

In some embodiments, as shown in fig. 4, the actuator communication area 320 includes a plurality of sets of PIN interfaces 301, so that the connector 300 can be compatible with the driving devices 130 of different driving modes, and further realizes a normalized design of a camera module; the PIN interface 301 of the chip signal connection area 310 at least simultaneously adopts the D-PHY communication protocol and the C-PHY communication protocol, so that the connector 300 can adapt to the photosensitive chip 120 adopting the D-PHY communication protocol or the C-PHY communication protocol, thereby ensuring that the connector 300 can realize a general design for signal communication of the photosensitive chip 120.

As shown in fig. 3, the connector 300 may adopt a common serial communication connector, and the specific model of the connector 300 is BK13C06-32DP/2-0.35V (865), which has thirty-six PIN interfaces, including thirty-two PIN interfaces 301 symmetrically distributed on the long sides of the connector 300 and four power PIN interfaces symmetrically distributed on the short sides of the connector 300. Thirty-two PIN interfaces 301 are specifically PIN 1 to PIN 32, and four power PIN interfaces are specifically two PINs G1 and two PINs G2.

It can be understood that the PIN interfaces 301 on the long sides of the connector 300 can maximally circulate 300mA of current, while the current of the digital core power supply of the existing camera module generally exceeds 600mA, and some of the current can even reach 1A, and meanwhile, the maximum current of the driving device 130 may also reach 1A in the process of movement, so that if the PIN interfaces 301 on the long sides of the two sides are adopted for the power PIN interface of the connector 300, more PIN interfaces 301 need to be occupied, and thus the power PIN needs to occupy more space, so that the size of the required connector 300 is lengthened; and the BK13C06-32DP/2-0.35V (865) type connector 300 that this application adopted, the fixed pad has the characteristics that conductivity and current-carrying capacity are big, can set up totally four power pin interfaces that are used for connecting the power respectively in its both sides minor face in order to satisfy the design demand to make the technical scheme of this application prefer and be applicable to 4800 ten thousand high pixel heavy current modules.

The driving device 130 may be selected from an AF module or an OIS module. It can be understood that the common camera module can be divided into an AF module, an OIS module and an FF module according to the focusing manner, wherein the AF module and the OIS module have an auto-focusing function, and the FF module fixes the focus module.

It can be understood that the CPHY and DPHY communication protocols are interfaces based on a camera in the MIPI, wherein the D-PHY communication protocol interface belongs to a current driving type and has an independent synchronous clock for synchronization, and a receiving end samples data according to the clock; the C-PHY communication protocol interface belongs to a voltage driving type and does not have a synchronous clock, so that the clock needs to be restored and embedded into data when the CPHY receives the data, and then the clock is adopted for data acquisition; the purpose of both communication protocol interfaces is to increase bandwidth.

The difference between the D-PHY communication protocol interface and the C-PHY communication protocol interface is that the physical layer has different structures, and the C-PHY communication protocol interface is a three-wire system seen from the line, and the data volume to be transmitted is larger; the D-PHY communication protocol interface is mainly formed by two lines which are in a group for communication, so that the signal transmission speed of the C-PHY communication protocol interface is faster than that of the D-PHY communication protocol interface; however, both the D-PHY and C-PHY communication protocol interfaces are widely used in the field of cameras.

In some embodiments, the chip signal connection area 310 includes at least two sets of interfaces using D-PHY communication protocol, where one set of interfaces is used for a clock channel of the D-PHY communication protocol, and the remaining set of interfaces is used for a data channel of the D-PHY communication protocol; the chip signal connection region 310 further includes at least one set of interfaces using C-PHY communication protocol, and the C-PHY communication protocol and the D-PHY communication protocol share an interface.

In order to ensure the transmission speed of the camera module, the interfaces of the D-PHY communication protocol in the application are preferably five groups, and the interfaces of the C-PHY communication protocol are preferably three groups; the five interfaces of the D-PHY communication protocol comprise a group of clock channel interfaces and four groups of data channel interfaces.

In order to further realize the normalized design of the camera module, the actuator communication area 320 of the present application includes at least two sets of PIN interfaces 301, where one set of PIN interfaces is used to connect the driving device 130 in the OIS module, and the other set of PIN interfaces is used to connect the driving device 130 in the AF module; since the FF module is a fixed focus module, when the camera module is an FF module, the power supply and the communication interface required by the FF module are selected from the PIN PINs of the actuator communication area 320.

According to a second aspect of the present application, as shown in fig. 4 to 10, there is provided a setting method of a PIN foot of a connector, comprising the steps of:

s100: among thirty-two PIN interfaces 301 of the connector 300, ten PIN interfaces 301 are selected to form a chip signal connection area 310;

s200: defining the PIN interfaces selected in the step S100, and taking every two interfaces as a group to obtain five groups of D interfaces, and taking every three interfaces as a group to obtain three groups of C interfaces;

s300: the D-PHY communication protocol is adopted for the D interface in S200, and the C-PHY communication protocol is adopted for the C interface, so that the PIN interface is shared by the D-PHY communication protocol and the C-PHY communication protocol, and thus, when the lens assembly 100 is designed and installed, the photosensitive chip 120 adopting the D-PHY communication protocol or the C-PHY communication protocol can be compatible at the same time, so as to reduce the difficulty in designing and installing the lens assembly 100.

In some embodiments, as shown in fig. 4, the method further comprises the following steps:

s110: in the PIN interfaces 301 after the chip signal connection area 310 of the connector 300 removed in S100, at least nine PIN interfaces 301 are selected again to obtain an actuator communication area 320;

s210: grouping the actuator communication areas 320 selected in S110 to obtain an O-group interface including five PIN interfaces and an a-group interface including four PIN interfaces; the O-set interface is used for connecting the driving device 130 in the OIS module, and the a-set interface is used for connecting the driving device 130 in the AF module, so that the actuator communication area 320 can be compatible with the focusing modes of the OIS module and the AF module at the same time, and further, the normalized design of the lens assembly 100 is realized, so as to reduce the installation difficulty of the lens assembly 100.

Wherein, an O group interface for being connected with the OIS module adopts SPI communication protocol, the SPI protocol also is a communication protocol commonly used, express high-speed synchronous serial port, a master equipment and one or more slave unit have usually, need three interface at least, compare traditional other OIS module interface communication protocol, the SPI communication protocol interface only needs to occupy less PIN foot interface 301 in order to be used for the transmission of control and data, great saving required PIN foot interface 301's quantity, simultaneously can be for PCB in module overall arrangement space saving.

In some embodiments, as shown in fig. 3 and fig. 5 to fig. 10, the chip signal connection area 310 is located in the left region of the connector 300, the left region of the connector 300 includes PINs 1 to 16 and two power PINs G1, the PIN interfaces 301 of PINs 4 to 12 and 14 are selected to form the chip signal connection area 310, and the chip signal connection area 310 is specifically labeled with symbols, wherein the PIN 4/6, the PIN 5/7, the PIN 8/10, the PIN 9/11 and the PIN 12/14 correspondingly form five groups of D interfaces for defining D-PHY communication protocols, each group of D-PHY communication protocol interfaces is respectively labeled as a clock channel interface of D-PHY communication protocol, and the remaining interfaces are labeled as data channel interfaces of D-PHY communication protocol, and each group of D-PHY communication protocol interfaces is labeled as a clock channel interface of D-PHY protocol, and each group of D-PHY communication protocol interfaces is labeled as a clock channel interface of D3P/D3N, D P/D2 5262 zxft 1P/D1P/N, D4P/D4N and CKP/CKN; meanwhile, a pin 4/a pin 6/a pin 8, a pin 5/a pin 7/a pin 9 and a pin 10/a pin 12/a pin 14 correspondingly form three groups of interfaces C for defining a C-PHY communication protocol, each group of interfaces C-PHY communication protocol is correspondingly marked as 0A/0B/0C, 2A/2B/2C and 1A/1B/1C, and the pin 11 is not connected in the C-PHY communication protocol and is marked as NC; thus, when the D-PHY and C-PHY communication protocols are defined in the chip signal connection region 310, as shown in FIG. 4, pins 4 to 12 and 14 are labeled D3P0A, D P2A, D3N0B, D2N2B, D P0C, D P2C, D N1A, D N/NC, CKP1B and CKN1C, respectively. By carrying out compatible setting of the D-PHY communication protocol and the C-PHY communication protocol on the PIN interface 301 of the chip signal connection area 310, the chip signal connection area 310 is changed from a special design to a general design; meanwhile, the same group of circuit pins in each communication protocol are arranged adjacently, so that the pins of each communication protocol are distributed concisely and reasonably to realize general design on the circuit, and the design difficulty of the camera module can be effectively reduced when the camera module is designed.

In some embodiments, as shown in fig. 3, 5 to 10, the actuator communication area 310 is located in a right area of the connector 300, the right area of the connector 300 includes pins 17 to 32 and two power supply pins G2, wherein the

pins

24, 26, 28 to 32 and two pins G2 are selected to constitute the actuator communication area 310, and the actuator communication area 310 of the connector 300 is specifically labeled with symbols, wherein the

pins

24, 26, 28 to 30 constitute an O-group interface for connecting the driver 130 in the OIS module, and each pin of the O-group interface is sequentially labeled as SPI _ CS, SPI _ CLK, SDA _ GND, DRV _ GND and DRV _ VDD because the O-group interface employs an SPI communication protocol, wherein SPI represents a protocol type, CS represents a chip select, CLK represents a serial communication clock, SDA represents serial communication data, DRV represents a driving pulse, GND represents an integrated circuit ground, and VDD represents a power supply voltage.

The pin 31, the pin 32 and the two pins G2 form an a-group interface for connecting the driving device 130 in the AF module, the driving device 130 in the AF module usually uses a voice coil motor, and the voice coil motor can convert electrical energy into mechanical energy to drive the lens body 110 to perform linear or limited swing angle motion, so as to realize focusing on the lens assembly 100, so the a-group interface includes two pairs of same interfaces to respectively realize linear and swing angle motion of the AF module; i.e., for each pin of the group a interface, labeled VCMGND, VCMVDD, and VCMVDD, in that order, where VCMGND represents the power supply ground and VCMVDD represents the power supply voltage.

Since the FF module is a fixed focus module, the chip signal land 310 of the connector 300 can meet the communication requirement of the FF module when the FF module is mounted, so that only the power supply pin needs to be selected from the pins of the connector 300 except the chip signal land 310 and the actuator communication land 320.

When the lens assembly 100 is designed, the focusing mode is determined, so that when the camera module adopts an OIS module, the A-group interface is not connected; when the camera module adopts an AF module, the O group interface is not connected; when the camera module adopts the FF module, the group a interface and the group O interface are not connected, so that the

pins

24, 26, 28 to 32 and the two pins G2 of the entire actuator communication area 320 are collectively labeled NC/SPI _ CS, NC/SPI _ CLK, NC/SPI _ SDA, DGND/DRV _ GND, NC/DRV _ VDD, VCMGND, VCMVDD and VCMVDD in this order. By uniformly and standardizing the definition marks on the actuator communication area 320, the focusing type of the PIN interface can be rapidly and accurately distinguished when the lens assembly 100 is installed, so that the connection of the driving device 130 in the lens assembly 100 is realized, and the subsequent maintenance of the lens assembly 100 is facilitated while the installation difficulty of the lens assembly 100 is reduced.

In some embodiments, the chip signal connection region 310 may also be located in the right region of the connector 300, and the actuator communication region 310 is located in the left region of the connector 300, and the symbol marks of the chip signal connection region 310 and the actuator communication region 320 are not changed, and only the positions of the pins need to be changed.

In some embodiments, as shown in fig. 4-10, other pins of the connector 300 are labeled as defined, where pin 1 is used to connect a digital I/O power supply, labeled as DOVDD; pin 2, pin 3, pin 13, and pin 16 are used to isolate the MIPI signal from other power supplies and signals, so ground is provided in the digital circuit, labeled DGND; the pin 15 is used for connecting a clock circuit and is marked as MCLK; pin 17 and pin 13 are used to isolate and protect clock MCLK to prevent crosstalk between clock MCLK and MIPI signals, so pin 17 also needs to be grounded, and is marked as DGND; the pins 21 are used for supplying power to the photosensitive chip 120, and whether connection is available or not can be selected according to the type of the photosensitive chip 120, and the pins are marked as NC/AVDD1.8V; the

pins

23 and 25 are used for supplying power to the lens assembly 100, and since the maximum instantaneous current of the high pixel module is above 400mA, in order to ensure the pin safety of the connector 300, two pins are required to supply power to the high pixel module, so the

pins

23 and 25 are both marked as AVDD2.8V.

It can be understood that the camera module of the present application coexists in six modules according to the difference of the communication interface protocols and the difference of the focusing manners, that is, the OIS module, the AF module, and the FF module using the D-PHY communication protocol and the OIS module, the AF module, and the FF module using the C-PHY communication protocol, and the PIN interface 301 of the connector 300 connected to each module is specifically defined as shown in fig. 5 to 10, and it can be seen from the figures that the PIN interface 301 without connection, that is, the PIN marked as NC, exists in the connector 300 corresponding to each module.

The foregoing has described the principles, principal features, and advantages of the application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, which are merely illustrative of the principles of the application, but that various changes and modifications may be made without departing from the spirit and scope of the application, and these changes and modifications are intended to be within the scope of the application as claimed. The scope of protection claimed by this application is defined by the following claims and their equivalents.

Claims

1. The utility model provides a module of making a video recording which characterized in that includes:

a lens assembly;

the upper section of the circuit board is attached to the lens component so that the lens component is electrically connected with the circuit board; and

2. The camera module of claim 1, wherein the lens assembly comprises a lens body and a photo chip, the lens body is disposed on a photo path of the photo chip, the photo chip is electrically connected to the pin area, and the connector is adapted to maintain signal continuity between the lens body and the motherboard.

3. The camera module of claim 2, wherein the lens assembly further comprises a driving device, the driving device is connected to the pin area, and the connector is adapted to keep a signal connection between the driving device and the motherboard, so that the driving device drives the lens body to focus.

4. The camera module according to claim 3, wherein the pin area comprises an actuator communication area and a chip signal connection area, the actuator communication area is connected with the driving device, and the chip signal connection area is connected with the photosensitive chip.

5. The camera module of claim 4, wherein the connector is rectangular, the pin area is divided into two symmetrical areas with respect to a center line, the actuator communication area is located in one of the areas, and the chip signal connection area is located in the other area; the pins of the actuator communication area are used for transmitting focusing signals of the driving device, and the pins of the chip signal connection area are used for transmitting chip communication signals of the photosensitive chip, so that the pins with the same function are located in the same area.

6. The camera module according to claim 5, wherein the connector employs an MIPI serial interface, such that a PIN interface of the chip signal connection area employs a D-PHY communication protocol and a C-PHY communication protocol at the same time; meanwhile, the photosensitive chip adopts a D-PHY communication protocol or a C-PHY communication protocol.

7. The camera module of claim 6, wherein the chip signal connection area comprises at least two sets of interfaces using D-PHY communication protocol, and at least one set of interfaces using C-PHY communication protocol.

8. The camera module of claim 7, wherein the at least two sets of D-PHY protocol interfaces include a set of clock lanes and at least one set of data lanes.

9. The camera module of claim 5, wherein the actuator communication zone includes at least two sets of PIN interfaces to enable the connector to be compatible with different drive devices.

10. The camera module of claim 9, wherein the driving means is selected from at least one of an AF module and an OIS module.

11. The camera module according to any one of claims 1 to 10, wherein an extension section is provided on a lower section of the circuit board, and the connector is attached to a back surface of the extension section.

12. The camera module of claim 11, wherein the extension segment is a flexible circuit board.

13. A PIN setting method comprising the connector of claim 12, comprising the steps of:

14. The connector PIN setting method of claim 13, further comprising the steps of:

15. The connector PIN setting method according to claim 14, wherein the O-group is adapted to connect to a driving device in an OIS module; the group A is suitable for being connected with a driving device in the AF module.

16. The method for setting PIN of connector according to claim 15, wherein the PIN interface of O group employs SPI communication protocol.

17. The camera module of claim 14, wherein the connector comprises at least one connectionless PIN interface.