CN205319151U - Wearable equipment of intelligence - Google Patents

Abstract

The utility model discloses a wearable equipment of intelligence, including a system level packaging module, the system level packaging module includes a base plate, an element layer and an encapsulated layer, the element layer sets up the substrate surface, and including memory chip, main control chip and power management chip, the encapsulated layer covers the element layer. Have that small, light in weight, reliability are high, long service life's characteristics.

Description

A kind of intelligence wearable device

Technical field

The utility model relates to electronic circuit field, particularly relates to a kind of intelligence wearable device.

Background technology

In recent years, intelligence wearable device industry is very powerful and exceedingly arrogant, and Ge great hardware manufacturer releases respective product one after another. Intelligence wearable device be human sciences's technical development to today, the product combined by the hardware technology of low-power consumption, embedded software engineering, Precision Manufacturing Technology. Intelligence wearable device also must have the base attribute of wearable device, and that is exactly the comfortable property that user wears at ordinary times. It must be that volume is little, weight is light that the comfortable property that user wears just determines intelligence wearable device. This just requires that product size is little, and function is enough powerful simultaneously, and how realizing such target is the problem that all big enterprises are being thought deeply always.

Along with the development of semiconductor application technology, electronic devices and components integrated level is more and more higher, and package dimension is more and more less, and power consumption is more and more lower so that in the space that Intelligent worn device is narrow and small, integrated multiple application function becomes possibility. For jewelry and accessories series products, due to traditional jewelry accessories production technique be dewax, the explained hereafter such as cast, so the part that this series products is combined with electronic unit can cause and cannot assemble, it is easy to the product tolerance problem that waterproof problem and the technology such as dewaxing and cast can cause occurs. The open CN204652783U of Chinese utility model patent discloses a kind of intelligence and dresses function modularization standardization encapsulation structure, as shown in Figure 1, comprise PCB 2, rechargeable battery 5, charging PIN needle 6, package shell 7 and package cover plate 1, described PCB is welded with sensor 3 and LED pilot lamp 4; Described charging PIN needle is by the middle position of injection molding packaging at package shell, and is connected with rechargeable battery by wire. Said structure solves electronic devices and components and the problem of tradition jewelry accessories process and assemble, wearable device housing can be separated with Chip Packaging body portion, do not affect mutually it functional, and can solve charging and waterproof problem.

But the inner hardware of aforesaid device adopts board structure of circuit to realize, and namely arranges not congenerous module on a printed circuit as required, by welding attachments such as chip, sensor, other electronic components, then connects to form with power supply module etc. Owing to limiting by above-mentioned hardware volume and function, its volume and reliability do not reach the satisfied degree of users.

Practical novel content

Technical problem to be solved in the utility model is: provide the intelligent wearable device comprising system-in-package module that a kind of volume is little, reliability height, cost are low.

In order to solve the problems of the technologies described above, the technical solution adopted in the utility model is: a kind of intelligence wearable device, comprises a system-in-package module, and described system-in-package module comprises a substrate, element layer and an encapsulated layer; Described element layer is arranged on described substrate surface, and comprises storage chip, master control chip and power management chip; Described encapsulated layer covers described element layer.

The beneficial effects of the utility model are: compared with prior art, Intelligent worn device of the present utility model, adopt system-in-package module, having the advantages that volume is little, weight is light, cost is low, encapsulated layer can play wear-resisting simultaneously, protection against corrosion, anti-soda acid, antiultraviolet, water proof and dust proof etc. act on, it is to increase equipment dependability and work-ing life.

Accompanying drawing explanation

Fig. 1 is the wearable device encapsulation structural representation of prior art;

Fig. 2 is the package module diagrammatic cross-section of the wearable device of the utility model embodiment one

Fig. 3 is the package module facade element layer schematic diagram of the wearable device of the utility model embodiment one;

Fig. 4 is the package module schematic rear view of the wearable device of the utility model embodiment one;

Fig. 5 is the diagrammatic cross-section of the package module of the wearable device of the utility model embodiment two;

Fig. 6 is the front schematic view of the package module of the wearable device of the utility model embodiment two;

Label illustrates:

1, package cover plate; 2, PCB; 3, sensor; 4, LED pilot lamp; 5, rechargeable battery; 6, charging PIN needle; 7, package shell; 21, substrate; 22, element layer; 23, encapsulated layer; 24, solder joint; 25, window; 26, LED pilot lamp.

Embodiment

By technology contents of the present utility model being described in detail, is realized object and effect, below in conjunction with enforcement mode and coordinate accompanying drawing to be explained.

The direction term that the utility model is mentioned, such as " on ", D score, " top ", " end ", "front", "rear", "left", "right", " interior ", " outward ", " side ", " surrounding ", " central authorities ", " level ", " transverse direction ", " vertically ", " longitudinal direction ", " axis ", " radial direction ", " the superiors " or " orlop " etc., be only the direction with reference to annexed drawings. Therefore, it may also be useful to direction term be in order to illustrate and understand the utility model, and be not used to restriction the utility model.

The design of the utility model most critical is: utilize each module chip on system in package mode base plate for packaging or wafer, substantially reduces the volume of intelligence wearable device.

Please refer to Fig. 2, a kind of intelligence wearable device, comprises a system-in-package module, and described system-in-package module comprises a substrate, element layer and an encapsulated layer; Described element layer is arranged on described substrate surface, and comprises storage chip, master control chip and power management chip; Described encapsulated layer covers described element layer.

From foregoing description it will be seen that the beneficial effects of the utility model are: have the advantages that volume is little, weight is light, cost is low, simultaneously encapsulated layer can play the effects such as waterproof is anti-oxidation, it is to increase equipment dependability and work-ing life

Further, described element layer also comprises sensor chip.

Further, described encapsulated layer is provided with windows, described in window and run through whole encapsulated layer, described in window in be provided with LED pilot lamp.

Further, described element layer also comprises passive device.

Further, described element layer comprises multiple described storage chip.

Seen from the above description, the storage function of program and data can be provided.

Further, described sensor chip is acceleration sensor chip.

Seen from the above description, it is possible to record motion track, it is achieved the functions such as motion recording, sleep record, health records.

Further, described master control chip comprises bluetooth module.

Seen from the above description, it may be possible to provide wireless near field communication, it is achieved the connection of equipment and intelligent terminal.

Further, described substrate back is provided with pin solder joint.

Seen from the above description, pin solder joint is arranged on substrate back, it is possible to reduce equipment size further.

Further, described element layer comprises RF matching circuit.

Seen from the above description, it is possible to be connected with outside antenna.

Further, described substrate is BT resin, pottery, glass, silicon chip or other organic material substrates.

Seen from the above description, compared with the PCB of prior art, substrate thickness of the present utility model is little, and weight is light, and plasticity-is strong.

Embodiment one

Please refer to Fig. 2 and Fig. 3, the utility model embodiment one is a kind of intelligent wearable device based on system in package, system in package (SystemInaPackage, it is called for short SIP) it is by multiple functional chip or naked wafer wafer, comprising the functional chip such as treater, storer is integrated in an encapsulation, can the various different resources of chip of flexible utilization and packaging interconnection advantage to greatest extent, improve performance as much as possible, reduce costs. By adopting advanced SiP encapsulation technology, not only make whole small product size less, have wear-resisting, protection against corrosion, anti-soda acid, antiultraviolet, the advantages such as water proof and dust proof.

As shown in Figure 2, intelligence wearable device of the present utility model comprises system-in-package module, described system-in-package module comprises substrate 21, element layer 22 and encapsulated layer 23, described baseplate material is BT resin, pottery, glass, silicon chip or other organic materialss, preferably, it can be flexible base board, to strengthen substrate plasticity-, is conducive to adjusting physical dimension and the internal structure of wearable device; The material of encapsulated layer 23 can be then phenolic, polyester, epoxies or silicone resin, it is preferable that epoxide resin material. As shown in Figure 3, the element layer 22 on substrate 21 surface comprises other components and parts of storage chip, sensor chip, master control chip, power management chip and necessity. Storage chip, sensor chip, power management chip, other components and parts are all connected with master control chip by substrate circuit. Element layer 22 is adopted encapsulated layer 23 to encapsulate after connecting by each chip and other components and parts by substrate front side, and described encapsulated layer covers whole element layer. Described encapsulated layer preferably covers whole substrate surface, but also can covered substrate surface a part, as long as covering all chips and the device of element layer. The thickness of encapsulated layer 23 is equal to or greater than the thickest chip and other components and parts thickness, scantlings of the structure is reduced as far as possible while ensureing encapsulation performance, preferred package layer thickness is slightly larger than the thickest chip and other components and parts thickness, such as thicker than the thickest chip and components and parts 0.2-2 μm, it is preferable that 1 μm.

System-in-package structure of the present utility model adopts the plane 2D encapsulation of polycrystalline sheet, that is: above-mentioned each chip and other components and parts are the tiled arrangement shown in Fig. 3, and the position of concrete each chip can be determined according to circuit connection.Wherein, above-mentioned each chip and other components and parts are preferably chip or the device of independent setting, chip can be the chip encapsulated, it is mounted on substrate surface by SMT mode with other components and parts, it can also be naked wafer, it is connected with substrate by modes such as lead-in wire bonding or upside-down mounting welding, it is possible to reduce encapsulation scantlings of the structure further.

Described storage chip can be NORFlash chip, and storage chip can comprise two or more, to provide the storage function of program and data.

Described sensor chip is acceleration sensor chip, it is preferable to MEMS three-axis acceleration transducer chip, it is possible to record motion track, it is achieved the functions such as motion recording, sleep record, health records.

Described master control chip comprises bluetooth module, based on low-power consumption Bluetooth technology, it is provided that wireless near field communication function, it is achieved the connection of equipment and intelligent terminal.

Described power supply chip one end is connected with master control chip, and the other end connects power pins to realize and the connection of outside power supply. Described power supply chip can be rechargable power supplies.

Other components and parts described can comprise other active parts of the passive devices such as multiple quartz oscillator, electric capacity, inductance and multiple paster resistance and necessity, it is preferable that comprises two quartz oscillator.

Optionally, described element layer 22 also comprises RF matching circuit, it is possible to be connected with outside antenna. Antenna can be set according to the profile of wearable device and interface specification, to reach best matched performance.

It is illustrated in figure 4 the structural representation of the present embodiment substrate back, substrate back is provided with multiple pin solder joint 24, described pin solder joint is connected by each chip of the lead-in wire with substrate front side that run through substrate and device, to reduce package dimension further, described pin comprises power pins, switch pin, signal pins etc., except being connected with the chip and device of substrate front side, described solder joint 24 also connects outside power supply, switch, antenna etc. Peripherals such as keyswitch, antenna and battery etc. are connected with chip by these pins, and debugging interface can supply secondary development.

The present embodiment adopts system level package substrate; under the prerequisite ensureing circuit function; encapsulation volume and weight is substantially reduced relative to the PCB structure of prior art; simultaneously; there is the protection of encapsulated layer; water, oxygen can be avoided the impact of circuit, it is to increase the reliability of device and work-ing life.

Embodiment two

As shown in Figure 5, embodiment two of the present utility model adds LED pilot lamp 26, Fig. 5 on the basis of embodiment one and show diagrammatic cross-section, and Fig. 6 show front plan view, other chips not shown. After encapsulated layer 23 completes, the position of LED pilot lamp carries out laser cutting formed and window 25, described windowing 25 runs through whole encapsulated layer, expose substrate surface, installing LED pilot lamp 26, LED pilot lamp in windowing can be monochromatic lamp pearl as required, it is also possible to be red turquoise tri-coloured light pearl, the present embodiment preferred white LED, for system provides deixis. Described LED etc. are connected with master control chip by substrate circuit.

In sum, the utility model, by SIP encapsulation technology being applied in intelligence wearing product, plays its speciality and advantage so that whole small product size is little, have wear-resisting, protection against corrosion, anti-soda acid, antiultraviolet, the advantages such as water proof and dust proof, and then product have unique anti-adverse environment ability. Thus compare with the structural part product of similar function, there is use properties better, it may also be useful to the unrivaled advantages such as the life-span is naturally longer.

The foregoing is only embodiment of the present utility model; not thereby patent scope of the present utility model is limited; every equivalents utilizing the utility model specification sheets and accompanying drawing content to do; or directly or indirectly it is used in relevant technical field, all it is included in scope of patent protection of the present utility model with reason.

Claims (10)

1. an intelligent wearable device, it is characterised in that, comprise a system-in-package module, described system-in-package module comprises a substrate, element layer and an encapsulated layer; Described element layer is arranged on described substrate surface, and comprises storage chip, master control chip and power management chip; Described encapsulated layer covers described element layer.

2. intelligence wearable device according to claim 1, it is characterised in that, described element layer also comprises sensor chip.

3. intelligence wearable device according to claim 1, it is characterised in that, described encapsulated layer is provided with windows, described in window and run through whole encapsulated layer, described in window in be provided with LED pilot lamp.

4. intelligence wearable device according to claim 1, it is characterised in that, described element layer also comprises passive device.

5. intelligence wearable device according to claim 1, it is characterised in that, described element layer comprises multiple described storage chip.

6. intelligence wearable device according to claim 2, it is characterised in that, described sensor chip is acceleration sensor chip.

7. intelligence wearable device according to claim 1, it is characterised in that, described master control chip comprises bluetooth module.

8. intelligence wearable device according to claim 1, it is characterised in that, described substrate back is provided with pin solder joint.

9. intelligent wearable device according to the arbitrary item of claim 1-7, it is characterised in that, described element layer also comprises RF matching circuit.

10. intelligent wearable device according to the arbitrary item of claim 1-7, it is characterised in that, described substrate is BT resin, pottery, glass, silicon chip or other organic material substrates.