CN215871951U

CN215871951U - Circuit board assembly

Info

Publication number: CN215871951U
Application number: CN202120603070.1U
Authority: CN
Inventors: 金立奎; 王细心; 何为; 车世民
Original assignee: Zhuhai Founder Technology High Density Electronic Co Ltd; Peking University Founder Group Co Ltd
Current assignee: New Founder Holdings Development Co ltd; Zhuhai Founder Technology High Density Electronic Co Ltd
Priority date: 2021-03-24
Filing date: 2021-03-24
Publication date: 2022-02-18
Anticipated expiration: 2031-03-24

Abstract

The present application provides a circuit board assembly. The circuit board assembly comprises a circuit board and a circuit element, wherein the circuit board comprises a core board layer, a connecting layer, a circuit layer and a metal heat conducting piece; the connecting layers and the circuit layers are alternately distributed and laminated on the lateral side of the thickness direction of the core board layer, the circuit layers comprise surface layer circuit layers and inner layer circuit layers, the surface of the surface layer circuit layers, which is deviated from the core board layer, forms the board surface of the circuit board, and the circuit elements are attached to the board surface of the circuit board; be equipped with the mounting groove in the circuit board, the mounting groove is located between top layer circuit layer and the inlayer circuit layer, and the groove depth of mounting groove is along the thickness direction of circuit board, and the metal heat-conducting piece inlays and establishes in the mounting groove, and the metal heat-conducting piece is used for conducting the heat of the inside production of circuit board outside the circuit board. The circuit board assembly can meet the high-density design requirement and the heat dissipation requirement of the circuit board at the same time.

Description

Circuit board assembly

Technical Field

The application relates to the technical field of circuit boards, in particular to a circuit board assembly.

Background

At present, electronic products have entered the development stage of component miniaturization, high-density integration and three-dimensional integration and assembly, in the function design process of electronic products, more and more surface-mounted components are applied, the surface area of the whole functional assembly is basically and completely covered, due to the high-density design of component integration and assembly, most of heat generated by the components is transferred to Printed Circuit Boards (PCBs) in the use process of the electronic products, in order to solve the heat dissipation problem of the circuit boards and the components thereof, more and more circuit boards embed metal heat-conducting pieces at the positions of the circuit components, the heat of the components is directly transferred to the outside of the PCBs through the metal heat-conducting pieces, and the guarantee of function and reliability is provided for the long-time work of the PCBs.

The traditional PCB has two ways of embedding metal heat conducting pieces, one way is inner layer embedding, specifically, a core plate layer of a circuit board is formed firstly, then the core plate layer is punched, then the metal heat conducting pieces are placed, and finally other layers are laminated at two ends of the metal heat conducting pieces respectively; the other method is through-layer embedding, and specifically comprises the steps of firstly laminating layers of a circuit board, then punching the whole circuit board to penetrate through the circuit board, and then placing metal heat-conducting pieces in corresponding holes, wherein the two methods can realize the diversion of the heat in the circuit board and dissipate the heat of a circuit layer and a conducting structure in the circuit board to the surface layer of the circuit board, wherein the metal heat-conducting pieces are arranged in an embedded manner in the inner layer, and the metal heat-conducting pieces are far away from surface-mounted circuit elements; the method of arranging the metal heat conducting member in the through-layer embedded manner needs to empty a through-layer space having the same bottom area as the metal heat conducting member on the PCB.

Therefore, in the two methods for embedding the metal heat conducting member, the inner layer embedding type can cause that the heat inside the PCB is difficult to be conducted to the outside of the PCB; the through-layer embedding can greatly affect the high-density wiring and hole arrangement of the PCB, so that the two modes can not simultaneously meet the high-density design requirement and the heat dissipation requirement of the circuit board.

Disclosure of Invention

The embodiment of the application provides a circuit board assembly which can meet the high-density design requirement and the heat dissipation requirement of a circuit board at the same time.

The application provides a circuit board assembly, comprising a circuit board and a circuit element, wherein the circuit board comprises a core board layer, a connecting layer, a circuit layer and a metal heat-conducting piece; the connecting layers and the circuit layers are alternately distributed and laminated on the lateral side of the thickness direction of the core board layer, the circuit layers comprise surface layer circuit layers and inner layer circuit layers, the surface of the surface layer circuit layers, which is deviated from the core board layer, forms the board surface of the circuit board, and the circuit elements are attached to the board surface of the circuit board; be equipped with the mounting groove in the circuit board, the mounting groove is located between top layer circuit layer and the inlayer circuit layer, and the groove depth of mounting groove is along the thickness direction of circuit board, and the metal heat-conducting piece inlays and establishes in the mounting groove, and the metal heat-conducting piece is used for conducting the heat of the inside production of circuit board outside the circuit board.

Optionally, in the circuit board assembly provided by the present application, a groove bottom of the mounting groove extends to a surface of the inner layer circuit layer.

Optionally, in the circuit board assembly provided by the present application, the surfaces of the metal heat conducting member and the inner circuit layer are attached to each other.

Optionally, in the circuit board assembly provided in the present application, the core layer is laminated with the connection layer and the circuit layer alternately disposed on both sides in the thickness direction thereof, and the circuit layer includes a surface circuit layer and at least one inner circuit layer.

Optionally, in the circuit board assembly provided in the present application, the circuit layer includes a plurality of inner-layer circuit layers, the metal heat-conducting members are a plurality of, and the plurality of metal heat-conducting members are correspondingly attached to at least two different inner-layer circuit layers.

Optionally, in the circuit board assembly provided by the present application, each metal heat conduction member corresponds to a different inner layer circuit layer.

Optionally, in the circuit board assembly provided by the present application, the thickness of the connection layer and the thickness of the circuit layer are both smaller than the thickness of the core layer.

Optionally, in the circuit board assembly provided in the present application, the circuit board further includes a conducting structure, the conducting structure is disposed on the connection layer, and in the thickness direction of the circuit board, the internal regions of the circuit boards located on both sides of the connection layer are communicated with each other through the conducting structure.

Optionally, in the circuit board assembly provided by the present application, the via structure includes a via hole, and an axial direction of the via hole is consistent with a thickness direction of the circuit board.

Optionally, in the circuit board assembly provided by the present application, the connection layer is an insulating layer.

The circuit board assembly comprises a circuit board and a circuit element, wherein the circuit board comprises a core board layer, a connecting layer, a circuit layer and a metal heat conducting piece; the connecting layers and the circuit layers are alternately distributed and laminated on the lateral side of the thickness direction of the core board layer, the circuit layers comprise surface layer circuit layers and inner layer circuit layers, the surface of the surface layer circuit layers, which is deviated from the core board layer, forms the board surface of the circuit board, and the circuit elements are attached to the board surface of the circuit board; be equipped with the mounting groove in the circuit board, the mounting groove is located between top layer circuit layer and the inlayer circuit layer, and the groove depth of mounting groove is along the thickness direction of circuit board, and the metal heat-conducting piece inlays and establishes in the mounting groove, and the metal heat-conducting piece is used for conducting the heat of the inside production of circuit board outside the circuit board. Therefore, the circuit board assembly provided by the application can meet the high-density design requirement and the heat dissipation requirement of the circuit board at the same time.

The construction of the present application and other objects and advantages thereof will be more apparent from the following description of the preferred embodiments taken in conjunction with the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a first schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure;

fig. 2 is a schematic diagram of a circuit board assembly provided in an embodiment of the present application, the schematic diagram being along a board surface direction of a circuit board;

fig. 3 is a second structural schematic diagram of a circuit board assembly according to an embodiment of the present disclosure;

fig. 4 is a third schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure;

fig. 5 is a flowchart of a method for manufacturing a circuit board according to an embodiment of the present disclosure;

fig. 6 is a first state diagram of a circuit board provided in an embodiment of the present application during a manufacturing process;

fig. 7 is a second state diagram of the circuit board provided by the embodiment of the present application during the manufacturing process;

fig. 8 is a third state diagram of the circuit board provided in the embodiment of the present application during the manufacturing process;

fig. 9 is a flowchart illustrating a process of fabricating a layer structure and a conductive structure of a circuit board in a method of fabricating a circuit board according to an embodiment of the present disclosure;

fig. 10 is a flowchart of processing of a position of a buried metal heat-conducting member in the method for manufacturing a circuit board according to the embodiment of the present application;

fig. 11 is a flowchart illustrating placement of a metal heat conducting member in a method for manufacturing a circuit board according to an embodiment of the present disclosure.

Description of reference numerals:

1-a circuit board; 11-a core layer; 12-a tie layer; 13-a line layer; 131-surface circuit layer; 132-inner wiring layer; 14-a metal heat conducting member; 15-mounting grooves; 16-conducting structure; 2-glue resisting layer; 10-a circuit board assembly.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments.

All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It should be noted that, in the description of the present application, the terms "first" and "second" are used merely for convenience in describing different components, and are not to be construed as indicating or implying a sequential relationship, relative importance, or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

Therefore, in the two methods for embedding the metal heat conducting member, the inner layer embedding type can cause that the heat inside the PCB is difficult to be conducted to the outside of the PCB; since the overall thickness of the PCB is much greater than the thickness of the constituent layers, the through-layer embedding has a large influence on the high-density wiring and hole arrangement of the PCB, and thus, the two methods cannot simultaneously meet the high-density design requirement and the heat dissipation requirement of the circuit board.

Therefore, the embodiment of the application provides a circuit board assembly, so that the metal heat conducting piece is close to the surface of the circuit board, and the hole groove for embedding the metal heat conducting piece can be prevented from penetrating through the circuit board, and therefore, the high-density design requirement and the heat dissipation requirement of the circuit board can be met simultaneously.

The present application will be described in detail below with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a first schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure. Fig. 2 is a schematic diagram of a circuit board assembly provided in an embodiment of the present application, the schematic diagram being along a board surface direction of a circuit board.

As shown in fig. 1 and 2, the present application provides a circuit board assembly 10, which includes a circuit board 1 and circuit components, the circuit board 1 including a core layer 11, a connection layer 12, a wiring layer 13 and a metal heat-conducting member 14; the connecting layers 12 and the circuit layers 13 are alternately distributed and laminated on the lateral side of the thickness direction of the core board layer 11, the circuit layer 13 comprises a surface layer circuit layer 131 and an inner layer circuit layer 132, the surface layer of the surface layer circuit layer 131, which is deviated from the core board layer 11, forms the board surface of the circuit board 1, and the circuit element is attached to the board surface of the circuit board 1; be equipped with mounting groove 15 in the circuit board 1, mounting groove 15 is located between top layer circuit layer 131 and inlayer circuit layer 132, and the groove depth of mounting groove 15 is along the thickness direction of circuit board 1, and metal heat-conducting member 14 inlays and establishes in mounting groove 15, and metal heat-conducting member 14 is used for conducting the heat of the inside production of circuit board 1 outside circuit board 1.

It should be noted that the circuit layer 13 is an electrical layer in the circuit board 1, wherein the circuit layer 13 may include a conductive medium, such as a copper foil, and the conductive medium is not particularly limited. The surface circuit layer 131 is the circuit layer 13 on the surface of the circuit board 1, and the inner circuit layer 132 is the circuit layer 13 inside the circuit board 1.

In the circuit board assembly 10 provided in the embodiment of the present application, first, the metal heat conducting member 14 is embedded in the mounting groove 15, the mounting groove 15 is located between the surface circuit layer 131 and the inner circuit layer 132, and the circuit element is attached to the surface circuit layer 131 of the circuit board 1, so that the distance from the metal heat conducting member 14 to the circuit element is short, and the metal heat conducting member 14 can efficiently conduct heat generated inside the circuit board 1 to the outside of the circuit board 1; secondly, the mounting groove 15 corresponds the setting with the position of metal heat-conducting piece 14, has both reduced the fluting degree of difficulty of mounting groove 15, can prevent again that mounting groove 15 from running through circuit board 1, is difficult to satisfy circuit board 1's high density design requirement. Therefore, the circuit board assembly 10 provided in the embodiment of the present application can not only effectively dissipate heat generated inside the circuit board 1, but also ensure high density of the circuit board 1.

Further, the metal heat conduction member 14 may be a copper block because of its low cost and high thermal conductivity. It should be noted that, in some other practical embodiments, the metal heat-conducting member 14 may also be another metal member, and here, the specific type of the metal heat-conducting member 14 is not limited.

In a specific embodiment of the present embodiment, the metal heat conducting member 14 may be a quadrangular prism, and in other embodiments, the metal heat conducting member 14 may have other shapes, and the specific shape of the metal heat conducting member 14 is not limited herein.

The core layer 11 may be formed of glass fiber or paperboard, the connection layer 12 is an insulating layer, and the connection layer 12 is a polypropylene (PP) prepreg layer. Here, the specific composition structure of the core layer 11, the connection layer 12, and the wiring layer 13 is not limited.

In order to effectively dissipate the heat generated inside the circuit board 1 by the metal heat-conducting member 14, in the present embodiment, the bottom of the mounting groove 15 extends to the surface of the inner circuit layer 132. In this way, the heat generated by the inner circuit layer 132 can be directly transferred to the metal heat conduction member 14, so that the metal heat conduction member 14 can conduct the heat generated by the inner circuit layer 132 to the circuit board 1.

In order to further enhance the heat dissipation effect of the metal heat-conducting member 14, in the present embodiment, the surfaces of the metal heat-conducting member 14 and the inner circuit layer 132 are attached to each other. Thus, the first end of the reinforced metal heat conducting member 14 is attached to the inner circuit layer 132, and the second end of the reinforced metal heat conducting member 14 is attached to the surface circuit layer 131, so that the heat generated by the inner circuit layer 132 can be rapidly transferred to the metal heat conducting member 14, and the heat is transferred out through the metal heat conducting member 14.

In order to meet the use requirement of the circuit board 1, in the present embodiment, the core layer 11 is laminated with the connection layer 12 and the circuit layer 13 alternately arranged on both sides in the thickness direction thereof, and the circuit layer 13 includes a surface circuit layer 131 and at least one inner circuit layer 132.

Specifically, when the inner circuit layer 132 is a single layer, the metal heat conducting member 14 is located between the surface circuit layer 131 and the inner circuit layer 132, the mounting groove 15 is provided on the connecting layer 12 between the inner circuit layer 132 and the surface circuit layer 131, at this time, the mounting groove 15 may be multiple, the metal heat conducting member 14 may also be multiple, and the metal heat conducting member 14 and the mounting groove 15 are correspondingly disposed.

Fig. 3 is a second schematic structural diagram of a circuit board assembly according to an embodiment of the present application. Fig. 4 is a third schematic structural diagram of a circuit board assembly according to an embodiment of the present application.

As shown in fig. 3 and 4, the circuit layer 13 includes a plurality of inner circuit layers 132, a plurality of metal heat-conducting members 14 are provided, and the plurality of metal heat-conducting members 14 are correspondingly attached to at least two different inner circuit layers 132. In this way, by providing a plurality of metal heat-conductive members 14, the heat generated by the inner circuit layer 132 can be quickly conducted to the outside of the circuit board 1.

Specifically, each metal heat-conducting member 14 corresponds to a different inner wiring layer 132.

As an alternative embodiment, as shown in fig. 3, each inner circuit layer 132 has a corresponding metal heat-conducting member 14 attached thereto, and the number of the metal heat-conducting members 14 is equal to the number of the inner circuit layers 132.

As another alternative, as shown in fig. 4, in the inner circuit layers 132, only at least some of the inner circuit layers 132 may have corresponding metal heat-conducting members 14 attached thereto, and in this case, the number of the metal heat-conducting members 14 is smaller than the number of the inner circuit layers 132.

In other alternative embodiments, when the number of the metal heat-conducting members 14 is greater than the number of the inner circuit layers 132 (not shown), different metal heat-conducting members 14 may correspond to the same inner circuit layer 132.

In order to ensure the stability of the circuit board 1, in the present embodiment, the thickness of the connection layer 12 and the thickness of the circuit layer 13 are both smaller than the thickness of the core layer 11. Thus, the performance of the circuit board 1 can be prevented from being deteriorated due to the damage caused by the excessive pressure applied to the core layer 11.

In order to realize the conduction between different circuit layers 13 and ensure the normal use of the circuit board 1, in a specific embodiment, the circuit board 1 further includes a conduction structure 16, and the conduction structure 16 is disposed on the connection layer 12, and in the thickness direction of the circuit board 1, the internal areas of the circuit board 1 located at two sides of the connection layer 12 are communicated through the conduction structure 16.

Specifically, the core layer 11 and the inner layer circuit layer 132, the inner layer circuit layer 132 and the inner layer circuit layer 132, and the inner layer circuit layer 132 and the surface layer circuit layer 131 are all communicated through the communication structure 16.

In a specific embodiment of the present embodiment, the via structure 16 includes a via hole, and an axial direction of the via hole coincides with a thickness direction of the circuit board 1.

In a specific embodiment of this embodiment, the via hole may be a round hole or a tapered hole, and when the via hole is a tapered hole, a large end of the tapered hole faces the surface circuit layer 131, and a small end of the tapered hole faces the core layer 11. In other embodiments, the via hole may have other shapes, and the shape of the via hole is not particularly limited.

The circuit board assembly provided by the embodiment comprises a circuit board and a circuit element, wherein the circuit board comprises a core board layer, a connecting layer, a circuit layer and a metal heat conducting piece; the connecting layers and the circuit layers are alternately distributed and laminated on the lateral side of the thickness direction of the core board layer, the circuit layers comprise surface layer circuit layers and inner layer circuit layers, the surface of the surface layer circuit layers, which is deviated from the core board layer, forms the board surface of the circuit board, and the circuit elements are attached to the board surface of the circuit board; be equipped with the mounting groove in the circuit board, the mounting groove is located between top layer circuit layer and the inlayer circuit layer, and the groove depth of mounting groove is along the thickness direction of circuit board, and the metal heat-conducting piece inlays and establishes in the mounting groove, and the metal heat-conducting piece is used for conducting the heat of the inside production of circuit board outside the circuit board. Therefore, the circuit board assembly provided by the embodiment can simultaneously meet the high-density design requirement and the heat dissipation requirement of the circuit board.

Fig. 5 is a flowchart of a method for manufacturing a circuit board according to an embodiment of the present application. Fig. 6 is a first state diagram of a circuit board provided in the embodiment of the present application in a manufacturing process. Fig. 7 is a second state diagram of the circuit board provided in the embodiment of the present application in the manufacturing process. Fig. 8 is a third state diagram of a circuit board provided in the embodiment of the present application in a manufacturing process.

The embodiment also provides a manufacturing method of the circuit board. It should be noted that the circuit board manufactured by this method is the circuit board 1 provided in the above embodiment.

As shown in fig. 5, the method for manufacturing a circuit board according to the present embodiment includes:

s101, manufacturing an inner layer structure and a conducting structure of the circuit board.

As shown in fig. 6, the inner layer structure of the circuit board 1 includes a core layer 11, a connection layer 12, and an inner layer circuit layer 132, and the connection layer 12 and the inner layer circuit layer 132 are alternately arranged and laminated on the side of the thickness direction of the core layer 11.

And S102, machining the position where the metal heat-conducting piece is embedded.

As shown in fig. 7 and 8, the position of the buried metal heat-conducting member 14 is the position of the mounting groove 15.

S103, placing a metal heat conducting piece.

As shown in fig. 1, after the installation groove 15 is opened, the metal heat-conducting member 14 is placed in the installation groove 15.

S104: and (5) manufacturing and processing the surface circuit layer.

Specifically, after the metal heat-conducting member 14 is placed in the mounting groove 15, the surface layer circuit layer is sealed and pressed on the outermost layer.

Further, after the surface circuit layer is manufactured and processed, the method further comprises the following steps:

and S105, carrying out subsequent processing on the surface layer of the circuit board.

The subsequent processing includes processing the outer layer pattern of the circuit board 1 and solder mask, etc., and will not be explained herein.

Fig. 9 is a flowchart illustrating a process of manufacturing a layer structure and a conductive structure of a circuit board in a method of manufacturing a circuit board according to an embodiment of the present disclosure.

As shown in fig. 9, the manufacturing of the layer structure and the conducting structure of the circuit board includes:

s201, manufacturing inner layer pattern circuits on two end faces of the core board layer along the thickness direction of the core board layer.

Specifically, the core board is a copper-clad core board, and the inner-layer pattern circuit can be manufactured on two end faces of the core board layer along the thickness direction of the core board layer in an acid etching mode.

S202, checking the manufacturing quality of the core layer pattern circuit.

In some alternative embodiments, the core layer may be inspected by automatic optical scanning to ensure the quality of the pattern circuit on the core layer.

And S203, manufacturing an inner layer structure of the multilayer circuit board.

Specifically, the inner layer structure of the multilayer circuit board is manufactured by laminating a PP prepreg layer and a copper foil on the side of the core layer 11 in the thickness direction thereof, and the inner layer pattern circuit of the multilayer circuit board is manufactured. The PP prepreg layer is a connection layer 12, and the copper foil layer is an inner circuit layer 132.

And S204, manufacturing a conducting structure on the inner layer structure of the circuit board.

In a specific embodiment of the present embodiment, a drilling operation is performed on the connection layer 12 by means of mechanical drilling and milling, and then the electrical connection between the core layer 11 and the inner circuit layer 132 and between the inner circuit layer 132 and the inner circuit layer 132 is realized by means of electroplating copper plating and electroplating hole filling.

Fig. 10 is a flowchart of processing a position of a buried metal heat-conducting member in a method of manufacturing a circuit board according to an embodiment of the present application.

As shown in fig. 10, the processing of the position of the embedded metal heat-conducting member includes:

s301, determining the burying position of the metal heat conducting piece.

Here, the number of the metal heat-conducting members is not limited, and therefore, the position of the metal heat-conducting member to be buried is not determined. According to the actual situation.

And S302, pasting a glue resisting layer on the area of the connecting layer corresponding to the metal heat conducting member.

Specifically, one end of the metal heat conducting member 14 needs to be attached to the inner circuit layer 132, the connecting layer 12 is laminated on the inner circuit layer 132 attached to the metal heat conducting member 14, wherein the adhesive blocking layer 2 is adhered to the laminating surface of the connecting layer 12 and the inner circuit layer 132, and the adhesive blocking layer 2 corresponds to the metal heat conducting member 14.

Further, the glue in the glue blocking layer 2 is solder resist. Through setting up glue film 2, can prevent to make inlayer circuit layer 132 and metal heat-conducting member 14 can not effectively laminate through mechanical system to, can ensure that the circuit board 1 of making has good heat-sinking capability.

And S303, laminating the connecting layer and the inner layer circuit layer.

Specifically, the connecting layer 12 adhered with the glue resisting layer 2 and the inner circuit layer 132 positioned thereon are pressed on the inner circuit layer 132 to be attached to the metal heat conducting member 14, and the alternately distributed connecting layer 12 and the inner circuit layer 132 are continuously pressed until the last connecting layer 12 and the last surface circuit layer 131 are left.

As shown in fig. 11, the placement of the metal heat-conducting member includes:

and S401, forming a mounting groove.

Specifically, the hole opening operation is performed at the position corresponding to the glue blocking layer 2 in a laser cutting or deep milling mode, and the glue blocking layer 2 is torn off to form the mounting groove 15 capable of directly accommodating the metal heat conducting piece 14.

S402, forming holes in the outermost connecting layer.

Specifically, the circuit board with the installation groove 15 is subjected to brown oxidation treatment before lamination, and meanwhile, the connection layer 12 on the outermost layer is subjected to hole opening treatment in a laser cutting or deep milling mode to form a hole corresponding to the installation groove 15.

The browning treatment is performed to provide a strong bonding force between the core layer and the connection layer 12.

And S403, placing the metal heat-conducting piece into the circuit board, and completing outer layer pressing of the circuit board.

Specifically, the metal heat conducting member 14 is placed in the mounting groove 15, and the outermost connecting layer 12 and the surface circuit layer 131 are pressed on the outer side of the circuit board 1.

The method for manufacturing the circuit board provided by the embodiment comprises the following steps: manufacturing an inner layer structure and a conducting structure of the circuit board; processing the position of the embedded metal heat-conducting piece; placing the metal heat-conducting piece and manufacturing and processing the surface circuit layer. The circuit board manufactured by the manufacturing method of the circuit board provided by the embodiment has good heat dissipation capability and higher density.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly comprising a circuit board and a circuit component, the circuit board comprising a core layer, a connection layer, a wiring layer and a metallic heat-conducting member; the connecting layers and the circuit layers are alternately distributed and laminated on the lateral sides of the thickness direction of the core plate layer, the circuit layers comprise surface layer circuit layers and inner layer circuit layers, the surface layer of the surface layer circuit layers, which is deviated from the core plate layer, forms the surface of the circuit board, and the circuit element is attached to the surface of the circuit board;

the circuit board is internally provided with a mounting groove, the mounting groove is positioned between the surface layer circuit layer and the inner layer circuit layer, the depth of the mounting groove is along the thickness direction of the circuit board, the metal heat-conducting piece is embedded in the mounting groove, and the metal heat-conducting piece is used for conducting heat generated inside the circuit board to the outside of the circuit board.

2. The circuit board assembly of claim 1, wherein a groove bottom of the mounting groove extends to a surface of the inner wiring layer.

3. The circuit board assembly of claim 2, wherein the metal heat-conducting member and the inner circuit layer have surfaces that are attached to each other.

4. A circuit board assembly according to any one of claims 1 to 3, wherein the core layer is laminated with alternate connection layers and wiring layers on both sides in the thickness direction thereof, and the wiring layers include a surface wiring layer and at least one inner wiring layer.

5. The circuit board assembly of claim 4, wherein the circuit layer comprises a plurality of inner circuit layers, and the plurality of metal heat-conducting members are correspondingly attached to at least two different inner circuit layers.

6. The circuit board assembly of claim 5, wherein each of the metallic thermal conductors corresponds to a different one of the inner circuit layers.

7. A circuit board assembly according to claim 5 or 6, wherein the thickness of the connection layer and the thickness of the wiring layer are both less than the thickness of the core layer.

8. The circuit board assembly according to claim 5 or 6, wherein the circuit board further comprises a conducting structure, the conducting structure is disposed on the connection layer, and the inner regions of the circuit board located on both sides of the connection layer in the thickness direction of the circuit board are communicated with each other through the conducting structure.

9. The circuit board assembly according to claim 8, wherein the via structure comprises a via hole, an axial direction of the via hole being coincident with a thickness direction of the circuit board.

10. A circuit board assembly according to any of claims 1-3, wherein the connection layer is an insulating layer.