CN107889356B - Soft and hard composite circuit board - Google Patents
Soft and hard composite circuit board Download PDFInfo
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- CN107889356B CN107889356B CN201610852493.0A CN201610852493A CN107889356B CN 107889356 B CN107889356 B CN 107889356B CN 201610852493 A CN201610852493 A CN 201610852493A CN 107889356 B CN107889356 B CN 107889356B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Abstract
The invention provides a soft and hard composite circuit board, which comprises a soft circuit board, wherein the soft circuit board comprises a core layer, a first covering layer, a second covering layer, a first combination layer, a second combination layer, a first dielectric layer, a second dielectric layer, a first superposition layer and a second superposition layer. The core layer includes a first core circuit layer and a second core circuit layer. The first cover layer covers a portion of the first core circuit layer, and the second cover layer covers a portion of the second core circuit layer. The first bonding layer covers a portion of the first cover layer and the second bonding layer covers a portion of the second cover layer. The first dielectric layer covers a portion of the first core circuit layer and a portion of the first cover layer, and the second dielectric layer covers a portion of the second core circuit layer and a portion of the second cover layer. The first superposed layer is arranged on the first bonding layer and the first dielectric layer, and the second superposed layer is arranged on the second bonding layer and the second dielectric layer. The scheme can improve the reliability of the multilayer flexible printed circuit board in thermal shock test and is not limited by the design of the non-opposite surface between the copper layer and the copper layer.
Description
Technical Field
The present invention relates to a soft and hard composite circuit board, and more particularly, to a soft and hard composite circuit board capable of improving thermal shock (thermal shock) reliability.
Background
The circuit board can be divided into a hard circuit board and a flexible circuit board according to the flexibility of the insulating layer. When the electronic component is soldered to the flexible printed circuit board, the flexible printed circuit board cannot provide sufficient structural strength. On the other hand, in the case of soldering electronic components, the rigid wiring board provides a good structural strength, but has poor flexibility, thereby limiting the application of the rigid wiring board.
The soft and hard composite circuit board is a circuit board formed by combining a soft circuit board and a hard circuit board, and has the flexibility of the soft circuit board and the structural strength of the hard circuit board. When the rigid-flex circuit board is manufactured by the conventional method, a bonding sheet (bonding sheet) is generally used to bond the entire board surface for the characteristic of the flexible board bending region. However, after multiple pressing, the processing conditions of high temperature and high pressure may cause the flexible board to delaminate between the bonded boards or cause abnormal reliability risk during thermal shock inspection. In addition, in the design of the multi-layer flexible printed circuit board, if the copper layer and the copper layer of the flexible printed circuit board are designed to be opposite, a short circuit may be caused, and therefore, the stacking is often limited by the design of the non-opposite surface between the copper layer and the copper layer, and further the cost of the flexible printed circuit board material is increased.
Based on the above, it is an urgent objective of the art to solve the problem of reliability risk of the multi-layer flexible printed circuit board in the thermal shock test and to improve the design constraint of the non-opposing surface between the copper layer and the copper layer.
Disclosure of Invention
The invention provides a soft and hard composite circuit board, which can improve the reliability of a multi-layer soft board in thermal shock test and ensure that the stacking is not limited by the design of an uncouplable surface between a copper layer and a copper layer.
The invention provides a soft and hard composite circuit board, which comprises a flexible circuit board. The flexible circuit board comprises a core layer, a first covering layer, a second covering layer, a first combination layer, a second combination layer, a first insulation layer, a second insulation layer, a first superposition layer and a second superposition layer. The core layer comprises a core dielectric layer with a first surface and a second surface, a first core circuit layer and a second core circuit layer, wherein the first core circuit layer and the second core circuit layer are respectively positioned on the first surface and the second surface. The first cover layer covers a portion of the first core circuit layer, and the second cover layer covers a portion of the second core circuit layer. The first bonding layer covers a portion of the first cover layer and the second bonding layer covers a portion of the second cover layer. The first insulating layer covers a part of the first core circuit layer and a part of the first covering layer, and the thickness of the first insulating layer is equal to that of the first covering layer and the first bonding layer. The second insulating layer covers a part of the second core circuit layer and a part of the second covering layer, and the thickness of the second insulating layer is equal to that of the second covering layer and the second bonding layer. The first superposed layer includes a first flexible board layer and a first circuit layer, and is disposed on the first combining layer and the first insulating layer. The second superposed layer comprises a second flexible board layer and a second circuit layer, and is configured on the second combining layer and the second insulating layer.
In an embodiment of the present invention, the first cover layer includes a first adhesive layer and a first polyimide layer from bottom to top, and the second cover layer includes a second adhesive layer and a second polyimide layer from bottom to top.
In an embodiment of the invention, the material of the first bonding layer and the second bonding layer includes pure glue material.
In an embodiment of the invention, the soft and hard composite circuit board further includes a first hard circuit board and a second hard circuit board. The first hard circuit board is provided with a first opening and is configured on the first superposition layer. The second hard circuit board is provided with a second opening and is configured on the second superposition layer. A first dielectric layer and a third covering layer are arranged between the first hard circuit board and the first superposition layer, and the first opening exposes part of the third covering layer. A second dielectric layer and a fourth covering layer are arranged between the second hard circuit board and the second superposition layer, and the second opening exposes part of the fourth covering layer.
In an embodiment of the invention, the first hard circuit board includes a plurality of first conductive layers, a plurality of first hard board insulating layers, and a plurality of first conductive through holes, and the first conductive through holes penetrate through the first conductive layers and the first hard board insulating layers to electrically connect the first conductive layers. The second hard circuit board comprises a plurality of second conducting layers, a plurality of second hard board insulating layers and a plurality of second conducting through holes, and the second conducting through holes penetrate through the second conducting layers and the second hard board insulating layers so as to enable the second conducting layers to be electrically connected.
In an embodiment of the invention, the soft and hard composite circuit board further includes a first solder mask layer and a second solder mask layer. The first solder mask layer is disposed on the first hard circuit board, and the second solder mask layer is disposed on the second hard circuit board.
In an embodiment of the invention, the soft-hard composite circuit board further includes a third conductive through hole. The third conductive through hole penetrates through the flexible circuit board, the first rigid circuit board, the second rigid circuit board, the first dielectric layer and the second dielectric layer to electrically connect the flexible circuit board, the first rigid circuit board and the second rigid circuit board.
The invention provides a soft and hard composite circuit board, which comprises a soft circuit board, a first hard circuit board and a second hard circuit board. The flexible circuit board comprises a core layer, a first covering layer, a second covering layer, a first combination layer, a second combination layer, a first insulation layer, a second insulation layer, a first superposition layer and a second superposition layer. The core layer comprises a core dielectric layer with a first surface and a second surface, a first core circuit layer and a second core circuit layer, wherein the first core circuit layer and the second core circuit layer are respectively positioned on the first surface and the second surface. The first cover layer covers a portion of the first core circuit layer, and the second cover layer covers a portion of the second core circuit layer. The first bonding layer covers a portion of the first cover layer and the second bonding layer covers a portion of the second cover layer. The first insulating layer covers a part of the first core circuit layer and a part of the first covering layer, and the thickness of the first insulating layer is equal to that of the first covering layer and the first bonding layer. The second insulating layer covers a part of the second core circuit layer and a part of the second covering layer, and the thickness of the second insulating layer is equal to that of the second covering layer and the second bonding layer. The first superposed layer includes a first flexible board layer and a first circuit layer, and is disposed on the first combining layer and the first insulating layer. The second superposed layer comprises a second flexible board layer and a second circuit layer, and is configured on the second combining layer and the second insulating layer. The first hard circuit board is provided with a first opening and is configured on the first superposition layer. The second hard circuit board is provided with a second opening and is configured on the second superposition layer. A first dielectric layer and a third covering layer are arranged between the first hard circuit board and the first superposition layer, and the first opening exposes part of the third covering layer. A second dielectric layer and a fourth covering layer are arranged between the second hard circuit board and the second superposition layer, and the second opening exposes part of the fourth covering layer.
In an embodiment of the present invention, the first cover layer includes a first adhesive layer and a first polyimide layer from bottom to top, and the second cover layer includes a second adhesive layer and a second polyimide layer from bottom to top.
In an embodiment of the invention, the material of the first bonding layer and the second bonding layer includes pure glue material.
In an embodiment of the invention, the first hard circuit board includes a plurality of first conductive layers, a plurality of first hard board insulating layers, and a plurality of first conductive through holes, and the first conductive through holes penetrate through the first conductive layers and the first hard board insulating layers to electrically connect the first conductive layers. The second hard circuit board comprises a plurality of second conducting layers, a plurality of second hard board insulating layers and a plurality of second conducting through holes, and the second conducting through holes penetrate through the second conducting layers and the second hard board insulating layers so as to enable the second conducting layers to be electrically connected.
In an embodiment of the invention, the soft and hard composite circuit board further includes a first solder mask layer and a second solder mask layer. The first solder mask layer is disposed on the first hard circuit board, and the second solder mask layer is disposed on the second hard circuit board.
In an embodiment of the invention, the soft-hard composite circuit board further includes a third conductive through hole. The third conductive through hole penetrates through the flexible circuit board, the first rigid circuit board, the second rigid circuit board, the first dielectric layer and the second dielectric layer to electrically connect the flexible circuit board, the first rigid circuit board and the second rigid circuit board.
Based on the above, the invention provides a flexible printed circuit board, in which, unlike the prior art in which the flexible printed circuit board is pressed together by using a complete bonding layer, the circuit layer is partially covered by using a covering layer, and then the bonding layer and the covering layer are partially attached to each other, so that a part of the covering layer is exposed. Meanwhile, a polypropylene insulating layer is disposed between the flexible boards in a region other than the bonding layer and the cover layer. That is, in the rigid-flex circuit board of the present invention, the polypropylene material is used between the flexible boards, and the flexible board bending region is combined with the bonding layer by using the partially attached cover layer, so that the reliability of the multilayer flexible board in thermal shock test can be improved, the stacking structure is not limited by the design of the non-opposing surface between the copper layer and the copper layer, even if the opposing surface between the copper layer and the copper layer is designed, the short circuit problem is not easily caused, and the cost of the flexible board material is reduced.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1A to fig. 1F are schematic cross-sectional views illustrating a manufacturing process of a rigid-flex circuit board according to an embodiment of the invention.
The reference numbers illustrate:
10: a soft and hard composite circuit board;
100: a flexible wiring board;
102: a core layer;
102A: a first surface;
102B: a second surface;
104: a core dielectric layer;
106: a first core circuit layer;
108: a second core circuit layer;
110: a first cover layer;
112: a first adhesive layer;
114: a first polyimide layer;
120: a second cover layer;
122: a second adhesive layer;
124: a second polyimide layer;
130: a first bonding layer;
140: a second bonding layer;
150: a first insulating layer;
160: a second insulating layer;
170: a first superimposed layer;
172: a first hose layer;
174: a first circuit layer;
180: a second superimposed layer;
182: a second flexible board layer;
184: a second circuit layer;
210: a third cover layer;
212: a third adhesive layer;
214: a third polyimide layer;
220: a fourth cover layer;
222: a fourth adhesive layer;
224: a fourth polyimide layer;
230: a first dielectric layer;
240: a second dielectric layer;
300: a first hard circuit board;
310: a first conductive layer;
320: a first hard plate insulating layer;
330: a first hard plate dielectric layer;
340. 342: a first conductive via;
400: a second hard wiring board;
410: a second conductive layer;
420: a second hard plate insulating layer;
430: a second hard plate dielectric layer;
440. 442: a second conductive via;
510: a first solder mask layer;
520: a second solder mask layer;
610: a third conductive via;
h1: a first opening;
h2: a second opening.
Detailed Description
Fig. 1A to fig. 1F are schematic cross-sectional views illustrating a manufacturing process of a rigid-flex circuit board according to an embodiment of the invention.
First, referring to fig. 1A, a core layer 102 is provided, wherein the core layer 102 includes a core dielectric layer 104 having a first surface 102A and a second surface 102B, a first core circuit layer 106, and a second core circuit layer 108. The first core circuit layer 106 and the second core circuit layer 108 are respectively disposed on the first surface 102A and the second surface 102B. More specifically, the first core circuit layer 106 and the second core circuit layer 108 are, for example, copper layers or copper alloy layers.
Next, referring to fig. 1B, a first capping layer 110 and a second capping layer 120 are formed. The first cover layer 110 covers a portion of the first core wiring layer 106, and the second cover layer 120 covers a portion of the second core wiring layer 108. In more detail, the first cover layer 110 may include a first adhesive layer 112 and a first polyimide layer 114 from bottom to top, and the second cover layer 120 may include a second adhesive layer 122 and a second polyimide layer 124 from bottom to top. In the present embodiment, a pre-process may be performed by using, for example, a cutting die or a cutting method to obtain the first cover layer 110 and the second cover layer 120 with desired dimensions, the dimensions of the first cover layer 110 and the second cover layer 120 may be adjusted according to actual operation requirements, and the dimension of the first cover layer 110 is, for example, equal to the dimension of the second cover layer 120.
Next, referring to fig. 1C, a first bonding layer 130 and a second bonding layer 140 are formed. The first bonding layer 130 covers a portion of the first cover layer 110, and the second bonding layer 140 covers a portion of the second cover layer 120. In more detail, the material of the first bonding layer 130 and the second bonding layer 140 may include pure glue material. As shown in fig. 1B and 1C, unlike the prior art in which the flexible boards are laminated together by using a complete bonding layer, the first cladding layer 110 and the second cladding layer 120 partially cover the first core circuit layer 106 and the second core circuit layer 108, respectively. Next, the first bonding layer 130 is partially attached to the first cover layer 110, and the second bonding layer 140 is partially attached to the second cover layer 120, so as to expose a portion of the first cover layer 110 and the second cover layer 120.
In the embodiment, the pre-treatment may be performed by, for example, a cutting die or a cutting method to obtain the first bonding layer 130 and the second bonding layer 140 with desired dimensions, and the dimensions of the first bonding layer 130 and the second bonding layer 140 may be adjusted according to actual operation requirements, wherein the widths of the first bonding layer 130 and the second bonding layer 140 are respectively smaller than the widths of the first covering layer 110 and the second covering layer 120, and the dimension of the first bonding layer 130 is, for example, equal to the dimension of the second bonding layer 140.
Then, referring to fig. 1D, a first insulating layer 150 and a second insulating layer 160 are formed. The first insulating layer 150 covers a portion of the first core circuit layer 106 and a portion of the first cover layer 110, and the thickness of the first insulating layer 150 is, for example, equal to the thickness of the first cover layer 110 and the first bonding layer 130. The second insulating layer 160 covers a portion of the second core circuit layer 108 and a portion of the second cover layer 120, and the thickness of the second insulating layer 160 is, for example, equal to the thickness of the second cover layer 120 and the second bonding layer 140. More specifically, the material of the first insulating layer 150 and the second insulating layer 160 is, for example, polypropylene. In the present embodiment, a pretreatment process may be performed by using a cutting die or a hollow method, for example, to obtain the first insulating layer 150 and the second insulating layer 160 having openings.
Next, with reference to fig. 1D, a first stack layer 170 is formed on the first bonding layer 130 and the first insulating layer 150, and a second stack layer 180 is formed on the second bonding layer 140 and the second insulating layer 160. The first overlay 170 may include a first flex layer 172 and a first circuit layer 174, and the second overlay 180 may include a second flex layer 182 and a second circuit layer 184. More specifically, the first circuit layer 174 and the second circuit layer 184 are, for example, copper layers. Thus, the flexible printed circuit 100 is manufactured.
Then, referring to fig. 1E, a third cladding layer 210 and a fourth cladding layer 220 are formed. The third cover layer 210 covers part of the first overlay 170 and the fourth cover layer 220 covers part of the second overlay 180. In more detail, the third cover layer 210 may include a third adhesive layer 212 and a third polyimide layer 214 in a bottom-up order, and the fourth cover layer 220 may include a fourth adhesive layer 222 and a fourth polyimide layer 224 in a bottom-up order.
In the embodiment, the pretreatment may be performed by using a cutting die or a cutting method, for example, to obtain the third and fourth cover layers 210 and 220 with the required size, and the size of the third and fourth cover layers 210 and 220 may be adjusted according to the actual operation requirement. More specifically, the size of the third cover layer 210 is, for example, the size of the fourth cover layer 220, and the sizes of the third cover layer 210 and the fourth cover layer 220 are, for example, the sizes of the first cover layer 110 and the second cover layer 120.
Referring to fig. 1F, the flexible printed circuit 100, the first rigid printed circuit 300 and the second rigid printed circuit 400 are pressed together, such that the third cover layer 210 and the first dielectric layer 230 are connected between the flexible printed circuit 100 and the first rigid printed circuit 300, and the fourth cover layer 220 and the second dielectric layer 240 are connected between the flexible printed circuit 100 and the second rigid printed circuit 400. The material of the first dielectric layer 230 and the second dielectric layer 240 is, for example, polypropylene. In this embodiment, the first rigid wiring board 300 has a first opening H1 to expose a portion of the third cover layer 210, and the second rigid wiring board 400 has a second opening H2 to expose a portion of the fourth cover layer 220.
In more detail, the first hard circuit board 300 may include a plurality of first conductive layers 310, a plurality of first hard insulating layers 320, a first hard dielectric layer 330, and a plurality of first conductive vias 340 and 342. The first conductive layers 310 and the first hard plate insulating layers 320 are alternately stacked, and the first conductive vias 340 and 342 penetrate the first conductive layers 310 and the first hard plate insulating layers 320, so as to electrically connect the first conductive layers 310. The second hard circuit board 400 may include a plurality of second conductive layers 410, a plurality of second hard insulating layers 420, a second hard dielectric layer 430, and a plurality of second conductive vias 440 and 442. The second conductive layers 410 and the second hard insulating layers 420 are alternately stacked, and the second conductive vias 440 and 442 penetrate the second conductive layers 410 and the second hard insulating layers 420, so as to electrically connect the second conductive layers 410. In the present embodiment, the material of the first hard plate insulating layer 320 and the second hard plate insulating layer 420 is, for example, polypropylene.
Meanwhile, a third conductive via 610 penetrating the flexible printed circuit 100, the first rigid printed circuit 300, the second rigid printed circuit 400, the first dielectric layer 230 and the second dielectric layer 240 may also be formed to electrically connect the flexible printed circuit 100, the first rigid printed circuit 300 and the second rigid printed circuit 400.
For example, a laser process may be used to form openings in the first conductive layer 310, the first hard plate insulating layer 320, the second conductive layer 410 and the second hard plate insulating layer 420, and then conductive materials may be filled into the openings to form the first conductive vias 340 and 342 and the second conductive vias 440 and 442. Similarly, a laser process may be used to form openings in the flexible printed circuit 100, the first rigid printed circuit 300, the second rigid printed circuit 400, the first dielectric layer 230, and the second dielectric layer 240, and then the openings are filled with a conductive material to form the third conductive via 610.
Next, referring to fig. 1F, a first solder mask layer 510 and a second solder mask layer 520 are formed on the first rigid circuit board 300 and the second rigid circuit board 400, respectively. The functions of the first solder mask layer 510 and the second solder mask layer 520 are, for example, to protect the circuit structures (such as the first conductive layer 310 and the second conductive layer 410) on the first rigid circuit board 300 and the second rigid circuit board 400 from being affected during soldering, and to prevent the circuit structures from being oxidized. In this way, the manufacture of the rigid-flex composite circuit board 10 can be completed.
The soft-hard composite circuit board of the present invention is described below with reference to fig. 1F. Referring to fig. 1F, the hard-soft composite circuit board 10 may include a flexible circuit board 100, a first hard circuit board 300, a second hard circuit board 400, a first solder mask layer 510, and a second solder mask layer 520. The first rigid circuit board 300 with the first opening H1 and the second rigid circuit board 400 with the second opening H2 are respectively disposed on the first stacked layer 170 and the second stacked layer 180 of the flexible circuit board 100. Moreover, a third cover layer 210 and a first dielectric layer 230 are disposed between the first rigid circuit board 300 and the first overlay layer 170, and a fourth cover layer 220 and a second dielectric layer 240 are disposed between the second rigid circuit board 400 and the second overlay layer 180.
As shown in fig. 1F, the flexible circuit board 100 may include a core layer 102, a first cover layer 110, a second cover layer 120, a first bonding layer 130, a second bonding layer 140, a first insulating layer 150, a second insulating layer 160, a first overlay layer 170, and a second overlay layer 180, wherein the core layer 102 may include a core dielectric layer 104, a first core circuit layer 106, and a second core circuit layer 108.
In more detail, the first cover layer 110 covers a portion of the first core circuit layer 106, and the second cover layer 120 covers a portion of the second core circuit layer 108. Also, the first bonding layer 130 covers a portion of the first cover layer 110, and the second bonding layer 140 covers a portion of the second cover layer 120. Unlike the prior art in which the flexible printed circuit board is laminated together using a complete bonding layer, the present invention partially covers the first core circuit layer 106 and the second core circuit layer 108 with the first cover layer 110 and the second cover layer 120, respectively, and then partially attaches the first bonding layer 130 and the second bonding layer 140 to the first cover layer 110 and the second cover layer 120, respectively. Meanwhile, the thickness of the first insulating layer 150 is, for example, equal to the thickness of the first cover layer 110 and the first bonding layer 130, and the thickness of the second insulating layer 160 is, for example, equal to the thickness of the second cover layer 120 and the second bonding layer 140.
In summary, the invention provides a flexible printed circuit board, in which a polypropylene material is used as an insulating layer between flexible boards, a locally attached covering layer and a bonding layer are used in a flexible board bending region, and the thickness of the insulating layer is equal to the thickness of the covering layer and the bonding layer. Therefore, the lamination of the soft board between the combination boards under the high-temperature and high-pressure process condition can be avoided, and the reliability of the multilayer soft board in the thermal shock test is improved. Meanwhile, the stacking structure is not limited by the design of the opposite surface between the copper layer and the copper layer, and even if the opposite surface between the copper layer and the copper layer is designed, the short circuit problem is not easy to cause, and the cost of the soft board material is reduced.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A soft-hard composite circuit board comprising:
a flexible wiring board, the flexible wiring board comprising:
a core layer including a core dielectric layer having a first surface and a second surface, a first core circuit layer and a second core circuit layer, the first core circuit layer and the second core circuit layer being respectively located on the first surface and the second surface;
a first cover layer contacting a portion of the first core circuit layer;
a second cover layer contacting a portion of the second core circuit layer;
a first bonding layer covering a portion of the first cover layer;
a second bonding layer covering a portion of the second cover layer;
a first insulating layer contacting a portion of the first core circuit layer and contacting a portion of the first cover layer, the first insulating layer having a thickness corresponding to thicknesses of the first cover layer and the first bonding layer;
a second insulating layer contacting a portion of the second core circuit layer and contacting a portion of the second clad layer, the second insulating layer having a thickness equivalent to the thickness of the second clad layer and the second bonding layer;
a first superposition layer including a first flexible board layer and a first circuit layer, configured on the first combination layer and the first insulation layer; and
a second build-up layer including a second flexible board layer and a second circuit layer disposed on the second bonding layer and the second insulating layer,
wherein the first insulating layer and the second insulating layer have openings, respectively, the first capping layer overlaps the opening of the first insulating layer with a portion corresponding to the first bonding layer, and the second capping layer overlaps the opening of the second insulating layer with a portion corresponding to the second bonding layer.
2. The rigid-flexible composite wiring board defined in claim 1, wherein the first cover layer comprises, in order from bottom to top, a first adhesive layer and a first polyimide layer, and the second cover layer comprises, in order from bottom to top, a second adhesive layer and a second polyimide layer.
3. The rigid-flexible composite wiring board defined in claim 1, wherein the material of the first and second bonding layers comprises a clear adhesive material.
4. The rigid-flexible composite wiring board defined in claim 1, further comprising:
the first hard circuit board is provided with a first opening and is configured on the first superposition layer; and
a second hard circuit board having a second opening disposed on the second overlay layer,
wherein a first dielectric layer and a third cover layer are disposed between the first hard circuit board and the first superposition layer, and the first opening exposes part of the third cover layer
A second dielectric layer and a fourth covering layer are arranged between the second hard circuit board and the second superposition layer, and the second opening exposes part of the fourth covering layer.
5. The rigid-flexible composite wiring board defined in claim 4, wherein
The first hard circuit board comprises a plurality of first conducting layers, a plurality of first hard board insulating layers and a plurality of first conducting through holes, wherein the first conducting through holes penetrate through the first conducting layers and the first hard board insulating layers so as to electrically connect the first conducting layers, and
the second hard circuit board comprises a plurality of second conducting layers, a plurality of second hard board insulating layers and a plurality of second conducting through holes, and the second conducting through holes penetrate through the second conducting layers and the second hard board insulating layers so as to enable the second conducting layers to be electrically connected.
6. The soft-hard composite wiring board according to claim 4 or 5, further comprising:
the first solder mask layer is configured on the first hard circuit board; and
and the second solder mask layer is configured on the second hard circuit board.
7. The rigid-flexible printed circuit board according to claim 4 or 5, further comprising a third conductive via penetrating through the flexible printed circuit, the first rigid printed circuit, the second rigid printed circuit, the first dielectric layer and the second dielectric layer to electrically connect the flexible printed circuit, the first rigid printed circuit and the second rigid printed circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610852493.0A CN107889356B (en) | 2016-09-27 | 2016-09-27 | Soft and hard composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610852493.0A CN107889356B (en) | 2016-09-27 | 2016-09-27 | Soft and hard composite circuit board |
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| CN107889356A CN107889356A (en) | 2018-04-06 |
| CN107889356B true CN107889356B (en) | 2020-09-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112087863A (en) * | 2019-06-13 | 2020-12-15 | 李蕙如 | Soft and hard composite board and its making method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004031682A (en) * | 2002-06-26 | 2004-01-29 | Sony Corp | Method of manufacturing printed wiring board |
| CN101640972A (en) * | 2008-07-28 | 2010-02-03 | 欣兴电子股份有限公司 | Circuit board structure |
| CN102164452A (en) * | 2010-02-23 | 2011-08-24 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
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2016
- 2016-09-27 CN CN201610852493.0A patent/CN107889356B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004031682A (en) * | 2002-06-26 | 2004-01-29 | Sony Corp | Method of manufacturing printed wiring board |
| CN101640972A (en) * | 2008-07-28 | 2010-02-03 | 欣兴电子股份有限公司 | Circuit board structure |
| CN102164452A (en) * | 2010-02-23 | 2011-08-24 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing the same |
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| CN107889356A (en) | 2018-04-06 |
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