CN215582263U - Packaging tube shell - Google Patents
Packaging tube shell Download PDFInfo
- Publication number
- CN215582263U CN215582263U CN202120789994.5U CN202120789994U CN215582263U CN 215582263 U CN215582263 U CN 215582263U CN 202120789994 U CN202120789994 U CN 202120789994U CN 215582263 U CN215582263 U CN 215582263U
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- CN
- China
- Prior art keywords
- substrate
- package
- fiber outlet
- lens
- frame body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000000835 fiber Substances 0.000 claims abstract description 22
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 13
- 229910000833 kovar Inorganic materials 0.000 claims description 12
- 238000005219 brazing Methods 0.000 claims description 4
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 238000003466 welding Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010344 co-firing Methods 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910001566 austenite Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Abstract
The embodiment of the application discloses a packaging tube shell, and the packaging tube shell comprises a substrate, a frame body, a fiber outlet tube, a lens and a lead. Wherein the substrate is made of ceramic; the frame body is arranged on the substrate and comprises a first side surface and a second side surface which are oppositely arranged; the fiber outlet pipe is arranged on the first side surface or the second side surface of the frame body; the lens is arranged on one side of the fiber outlet pipe close to the first side surface or the second side surface; the lead is arranged on one side, back to the frame body, of the substrate. This scheme is through adopting the material of pottery conduct base plate, can improve the thermal diffusivity of encapsulation tube, and then improves the reliability of encapsulation tube.
Description
Technical Field
The application relates to the technical field of electronic packaging, in particular to a packaging tube shell.
Background
With the development of electronic packaging technology towards miniaturization, high density, multifunction and high reliability, the power density of the packaging tube shell is increased, the heat dissipation problem is more and more serious, and the reliability of the packaging tube shell is seriously affected.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a packaging tube shell, and the reliability of the packaging tube shell can be improved.
The embodiment of the application provides a packaging tube shell which is characterized by comprising
The substrate is made of ceramic;
the frame body is arranged on the substrate and comprises a first side surface and a second side surface which are oppositely arranged;
the fiber outlet pipe is arranged on the first side surface or the second side surface of the frame body;
the lens is arranged on one side, close to the first side face or the second side face, of the fiber outlet pipe;
and the lead is arranged on one side of the substrate, which is back to the frame body.
In the package provided in the embodiment of the present application, the ceramic is a high temperature co-fired ceramic.
In the package tube provided by the embodiment of the application, the proportion of the black alumina in the high-temperature co-fired ceramic is 92%.
In the package case provided in the embodiment of the present application, the frame is made of kovar alloy.
In the package tube shell provided by the embodiment of the application, the fiber outlet tube is made of kovar alloy.
In the package case provided by the embodiment of the application, the material of the lead is kovar alloy.
In the package case provided by the embodiment of the application, the lead comprises a first part and a second part, the first part and the second part are connected, and the width of the first part is larger than that of the second part.
In the package provided by the embodiment of the application, the first portion is connected to the substrate.
In the package case provided by the embodiment of the application, the material of the lens is sapphire, and the transmittance of the lens is greater than or equal to 98%.
In the package tube shell provided by the embodiment of the application, the lead, the frame, the substrate and the fiber outlet tube are all subjected to one-time sintering by adopting silver-copper brazing.
In summary, the package provided by the embodiment of the present application includes a substrate, a frame, a fiber outlet tube, a lens, and a lead. Wherein the substrate is made of ceramic; the frame body is arranged on the substrate and comprises a first side surface and a second side surface which are oppositely arranged; the fiber outlet pipe is arranged on the first side surface or the second side surface of the frame body; the lens is arranged on one side of the fiber outlet pipe close to the first side surface or the second side surface; the lead is arranged on one side, back to the frame body, of the substrate. This scheme is through adopting the material of pottery conduct base plate, can improve the thermal diffusivity of encapsulation tube, and then improves the reliability of encapsulation tube.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a package provided in an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a lead provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In addition, the technical features mentioned in the different embodiments of the present application can be combined with each other as long as they do not conflict with each other.
The embodiment of the present application provides a package, which will be described in detail below.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a package according to an embodiment of the present disclosure. The package 100 may include a substrate 10, a frame 20, a fiber outlet tube 30, a lens 40, and leads 50.
The material of the substrate 10 may be ceramic. The frame 20 is provided on the substrate 10. The frame 20 includes a first side 21 and a second side 22 opposite to each other. The fiber outlet tube 30 is provided on the first side surface 21 or the second side surface 22 of the frame. The lens 40 is disposed on a side of the fiber outlet tube 30 close to the first side surface 21 or the second side surface 22. The lead 50 is disposed on a side of the substrate 10 facing away from the frame 20.
Specifically, the ceramic may be a High-Temperature Co-fired ceramic (HTCC). Wherein, the proportion of black alumina in the high-temperature co-fired ceramic is 92 percent.
The high-temperature co-fired ceramic of 92% black alumina has an expansion coefficient close to that of kovar alloy, and is suitable for welding with the kovar alloy. In addition, the high-temperature co-fired ceramic of 92% black alumina also has high mechanical strength, high dielectric constant, high thermal conductivity, low dielectric loss, low vapor pressure, air-tight requirement, good thermal stability and chemical stability, and the like, and can maintain excellent stability in harsh use environment of optical communication devices.
The HTCC is formed by stacking a plurality of sheet green compacts and co-firing the stacked green compacts in a high temperature furnace. Through holes can be designed on the green body, and then wiring and hole filling can be carried out by adopting screen printing metal paste. Therefore, a complex circuit can be designed in the ceramic substrate, and the conduction requirements of the pin and the internal bonding pad are met. Because ceramics and metals can not be directly welded, the surface of the ceramics needs to be metallized before co-firing, and finally welding is carried out through brazing solder and other metals.
In some embodiments, the material of the frame 20, the fiber outlet tube 30, and the lead 50 may be kovar.
The Kovar alloy has a specific expansion coefficient and can be matched and sealed with borosilicate glass; has higher Curie point temperature and low temperature structure stability, keeps stable austenite structure at low temperature and does not generate metallographic structure change. The kovar alloy has low thermal conductivity, high resistivity, and excellent welding performance, electroplating performance and cold processing performance.
Note that the coefficient of expansion of the kovar alloy is 6.0.
In some embodiments, lead 50 may be as shown in fig. 2, including a first portion 51 and a second portion 52. Wherein the first part 51 and the second part 52 are connected. The width of the first portion 51 is greater than the width of the second portion 52.
The first portion 51 is connected to the substrate 10. It is understood that since the width of the first portion 51 is greater than the width of the second portion 52, the connection of the first portion 51 to the substrate 10 may increase the contact area between the lead 50 and the substrate 10, thereby improving the firmness.
In some embodiments, the material of the lens 40 may be sapphire. Note that the lens 40 is a double-sided plating antireflection film. The lens 40 has a transmittance of greater than or equal to 98%.
In some embodiments, to ensure the security between the lens 40 and the fiber outlet tube 30, the edge of the lens 40 may be metallized to ensure the welding performance.
In the embodiment of the present application, the lead 30, the frame 20, the substrate 10 and the fiber outlet tube 40 are all sintered at one time by silver copper brazing.
The sintering temperature was 785 ℃. The thickness of the nickel plating after sintering is 2-8 μm. The gold plating thickness of the surface is more than 0.3 μm. The thickness of the plating layer can ensure the gold-tin welding performance.
In summary, the package 100 provided by the embodiment of the present application may include a substrate 10, a frame 20, a fiber outlet tube 30, a lens 40, and a lead 50. The material of the substrate 10 may be ceramic. The frame 20 is provided on the substrate 10. The frame 20 includes a first side 21 and a second side 22 opposite to each other. The fiber outlet tube 30 is provided on the first side surface 21 or the second side surface 22 of the frame. The lens 40 is disposed on a side of the fiber outlet tube 30 close to the first side surface 21 or the second side surface 22. The lead 50 is disposed on a side of the substrate 10 facing away from the frame 20. According to the scheme, the ceramic is used as the material of the substrate 10, so that the heat dissipation performance of the packaging tube shell 100 can be improved, and the reliability of the packaging tube shell 100 is further improved.
The package provided by the embodiment of the present application is described in detail above, and the principle and the implementation of the present application are explained in the present application by applying specific examples, and the description of the above embodiment is only used to help understand the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (9)
1. A package, comprising
The substrate is made of ceramic;
the frame body is arranged on the substrate and comprises a first side surface and a second side surface which are oppositely arranged;
the fiber outlet pipe is arranged on the first side surface or the second side surface of the frame body;
the lens is arranged on one side, close to the first side face or the second side face, of the fiber outlet pipe;
and the lead is arranged on one side of the substrate, which is back to the frame body.
2. The package of claim 1, wherein the ceramic is a high temperature co-fired ceramic.
3. A package as claimed in claim 1, characterized in that the material of the frame is kovar.
4. A package as claimed in claim 1, characterized in that the material of the fiber outlet tube is kovar.
5. A package as claimed in claim 1, characterized in that the material of the leads is kovar.
6. A package as in claim 1, wherein the leads include a first portion and a second portion, the first portion and the second portion being connected, the first portion having a width greater than a width of the second portion.
7. A package as claimed in claim 6, characterized in that the first part is connected to the substrate.
8. The package of claim 1, wherein the lens material is sapphire and the lens transmittance is greater than or equal to 98%.
9. The package of claim 1, wherein the leads, the frame, the substrate, and the pigtail tube are all sintered at one time using silver copper brazing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120789994.5U CN215582263U (en) | 2021-04-16 | 2021-04-16 | Packaging tube shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120789994.5U CN215582263U (en) | 2021-04-16 | 2021-04-16 | Packaging tube shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215582263U true CN215582263U (en) | 2022-01-18 |
Family
ID=79856509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120789994.5U Active CN215582263U (en) | 2021-04-16 | 2021-04-16 | Packaging tube shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215582263U (en) |
-
2021
- 2021-04-16 CN CN202120789994.5U patent/CN215582263U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Room 101, Unit 1, Building C, No. 6 Juliu Road, Zhukeng Community, Longtian Street, Pingshan District, Shenzhen City, Guangdong Province, China Patentee after: Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd. Address before: 518000 1-3 / F, C1 building, long industrial park, JuLongshan No.3 Road, big industrial zone, Longtian street, Pingshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HONGGANG MECHANISM & EQUIPMENT CO.,LTD. |