CN103840790A - Cold pressure welding ceramic package case and crystal oscillator using the same - Google Patents
Cold pressure welding ceramic package case and crystal oscillator using the same Download PDFInfo
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- CN103840790A CN103840790A CN201210483868.2A CN201210483868A CN103840790A CN 103840790 A CN103840790 A CN 103840790A CN 201210483868 A CN201210483868 A CN 201210483868A CN 103840790 A CN103840790 A CN 103840790A
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Abstract
The invention discloses a cold pressure welding ceramic package case comprising a ceramic base and a cover plate. The ceramic base comprises a ceramic substrate and a bimetallic ring which are fixed mutually, and an inner electrode and an outer electrode which are arranged inside and outside the ceramic substrate separately. The inner electrode and the outer electrode are in electrical conduction. The ceramic base and the cover plate are packaged and bonded together through the bimetallic ring of the ceramic base by adopting the cold pressure welding process. The cold pressure welding ceramic package case of the invention has the following main advantages that the thermal shock of traditional packaging methods, such as parallel seam welding, reflow welding, etc., on electronic chips can be effectively avoided, device chips can maintain precise electrical parameters, a single-layer ceramic substrate is used to replace a multilayer ceramic sheet co-firing structure, advantages of small size, light weight, simple structure and mature machining process can be realized, and the cold pressure welding ceramic package case can be widely applicable to the hermetic packaging of surface-mounted quartz crystal components and other electronic components having high electrical performance requirements.
Description
Technical field
The present invention relates to a kind of package casing and use the crystal oscillator of this shell.
Background technology
Due to the development of mobile phone, static digital camera, PC mainboard, notebook computer and video-game, the demand of crystal oscillator is estimated there will be to increase substantially.
As shown in Figure 1, traditional crystal oscillator comprises at least 2 layers of ceramic substrate 1,3, and with the fixing capping 9 of ceramic substrate, the top of inner side ceramic substrate 3 is provided with interior electrode 8, the below of outside ceramic substrate 1 is provided with external electrode 2, described interior electrode 8 and external electrode 2 mutual conduction.A quartz crystal 11 is fixed by tack coat 10 in the top of described interior electrode 8, and described quartz crystal 11 is arranged in the enclosure space being formed by ceramic substrate 3 and capping 9.In order to increase enclosure space, on the inner side ceramic substrate 3 of prior art, be also installed with on 4, the three layers of ceramic substrate 4 of the 3rd layer of ceramic substrate of one week and be also provided with metal layer 5, scolder 6 and becket 7.Capping 9 adopts parallel seam welding or the melting welding of Precious Metals-Gold ashbury metal with the encapsulation of becket 7.
But because the ceramic wafer of traditional quartz crystal oscillator pasted on surface ceramic packaging shell is to be burnt and form altogether by three layers of potsherd stack, the production cost of ceramic substrate is always high, manufacturing expense costliness, simultaneously three stackedly add common burning, when making, technical requirement is high, output is subject to the restriction of technology, equipment each side, and production efficiency and product yield reduce, and can not be satisfied with the growing market demand far away.The encapsulation of device generally adopts parallel seam welding or the weldering of Precious Metals-Gold ashbury metal in addition, and sealing apparatus and material are very expensive, and production cost is very high.Therefore find a kind of simple for structure, adopt comparatively cheap packaged type, can mass industrialized production ceramic packaging shell, replace existing product extremely urgent for the production of quartz crystal device.
Summary of the invention
The object of the invention is to provide a kind of cold welding ceramic packaging shell and uses the crystal oscillator of this shell.
Object of the present invention, will be achieved by the following technical programs:
A kind of cold welding ceramic packaging shell, comprise base of ceramic and cover plate, described base of ceramic comprises the ceramic substrate and the bimetallic ring that interfix, and is separately positioned on interior electrode and the external electrode in outside in described ceramic substrate, and described interior electrode and external electrode electrically conduct mutually; Described base of ceramic and cover plate rely on the bimetallic ring of described base of ceramic to adopt cold welding technique to be sealed together.
Preferably, on described ceramic substrate, be provided with through hole, described interior electrode is connected with external electrode by this through hole.
Preferably, the metal pipe cap that described cover plate is intermediate projections, the surrounding of described intermediate projections is sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, the sealing-in limit of described base of ceramic and metal pipe cap relies on cold welding technique to be sealed together.
Preferably, described cover plate is the planar metal cover plate parallel with described ceramic substrate, and described base of ceramic and plane metal cover board rely on cold welding technique to be sealed together.
Preferably, described cover plate is the metal cover board with locator protrusions, and described base of ceramic and metal cover board rely on cold welding technique to be sealed together.
Preferably, between described ceramic substrate and interior electrode, be also provided with supporting layer.
Preferably, described ceramic substrate top arranges the metallization ring with solderability function, for the reliable welding of ceramic substrate and bimetallic ring.
The present invention has also disclosed a kind of crystal oscillator that uses cold welding ceramic packaging shell, comprise base of ceramic and the cover plate that can interfix by cold welding, described base of ceramic comprises the ceramic substrate and the bimetallic ring that interfix, and being separately positioned on interior electrode and the external electrode in outside in described ceramic substrate, described interior electrode and external electrode electrically conduct mutually; The top of described interior electrode is installed with a quartz crystal, and described quartz crystal is arranged in the enclosure space being formed by ceramic substrate and cover plate, and described base of ceramic and cover plate rely on the bimetallic ring of described base of ceramic to adopt cold welding technique to be sealed together.
Preferably, the metal pipe cap that described cover plate is intermediate projections, the surrounding of described intermediate projections is sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, the sealing-in limit of described base of ceramic and metal pipe cap relies on cold welding technique to be sealed together.
Preferably, described cover plate is the planar metal cover plate parallel with described ceramic substrate, and described base of ceramic and plane metal cover board rely on cold welding technique to be sealed together.
Preferably, described cover plate is the metal cover board with locator protrusions, and described base of ceramic and metal cover board rely on cold welding technique to be sealed together.
Beneficial effect of the present invention is mainly reflected in: can effectively avoid the thermal shock to electronic chip of the traditional method for packing such as parallel seam welding, reflow welding, device chip can keep accurate electrical quantity, can adopt single-layer ceramic substrate or multi-layer ceramic chip co-sintering structure, volume is little, lightweight, simple in structure, processing technology maturation, can be widely used in surface attaching quartz crystal element that electric property has relatively high expectations and the level Hermetic Package of other electronic devices and components.
Brief description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is traditional quartz crystal oscillator pasted on surface ceramic packaging shell mechanism schematic diagram.
Fig. 2 is the structural representation of cold welding single-layer ceramic package casing pedestal of the present invention.
Fig. 3 is the structural representation of cold welding Multi-layer ceramic package package header of the present invention.
Fig. 4 is cold welding ceramic-packaged quartz crystal oscillator of the present invention (planar metal cover plate) structural representation.
Fig. 5 is cold welding ceramic-packaged quartz crystal oscillator of the present invention (metal pipe cap) structural representation.
Fig. 6 a is the first embodiment schematic diagram of external electrode of the present invention.
Fig. 6 b is the second embodiment schematic diagram of external electrode of the present invention.
Fig. 7 a is electrode and metal layer the first embodiment schematic diagram in the present invention.
Fig. 7 b is electrode and metal layer the second embodiment schematic diagram in the present invention.
Fig. 8 is the first embodiment schematic diagram of bimetallic ring of the present invention.
Fig. 9 is the second embodiment schematic diagram of bimetallic ring of the present invention.
Figure 10 is the second embodiment schematic diagram of metal cover board of the present invention.
Embodiment
Shown in Fig. 4 and Fig. 5, package casing of the present invention comprises the base of ceramic interfixing and the cover plate that are applicable to cold welding, described base of ceramic comprises ceramic substrate 41,51 and bimetallic ring 44,54, and is separately positioned on interior electrode 45,55 and the external electrode 49,59 in ceramic substrate 41,51 interior outsides.Described interior electrode 45,55 and external electrode 49,59 electrically conduct mutually by the through hole 47,57 arranging on ceramic substrate, the top of interior electrode 45,55 is provided with silver slurry 402,502, the effect of described silver slurry 402,502 is to make can set firmly better a quartz crystal 401,501 on it, described quartz crystal 401,501 is arranged in the enclosure space being formed by ceramic substrate 41,51 and cover plate, and described ceramic substrate 41,51 and cover plate rely on this bimetallic ring 44,54 of sealing of colding pressing to combine.
Described ceramic substrate 51 adopts individual layer (Fig. 2) aluminium oxide ceramics array substrate or multilayer (Fig. 3) Ceramic Array substrate and metal paste to burn and form altogether, be conducive to precise silk screen typography and mass industrialized production, production efficiency is high, can effectively reduce cost of manufacture.
Described ceramic substrate 41,51 tops are provided with the metallization ring 42,52 with solderability function; described metallization ring 42,52 adopts W slurry silk-screen printing technique at ceramic substrate surface printing metal layer figure; Ceramic Array substrate surface; then burn and form altogether in high temperature protection atmosphere furnace with Ceramic Array substrate; metal level and pottery interpenetrate to obtain the metal layer of high-bond, and nickel plating prevents from getting rusty on metal layer.
In conjunction with the base of ceramic shown in Fig. 2; between described metallization ring 22 and bimetallic ring 24, be provided with silver-copper brazing alloy ring 23; this scolder ring is as braze; together with it can firmly be welded on ceramic substrate 21 with bimetallic ring 24 in high temperature protection atmosphere soldering oven, form the gastight cavity of holding quartz crystal or other electronic chips.
Described bimetallic ring 54 is to adopt mechanical stamping processing and fabricating to form, and it is can cut down or the bimetallic material of iron-nickel alloy that the material of becket adopts the oxygen-free copper another side matching with the aluminium oxide ceramics coefficient of expansion.Can cut down one side for the welding of aluminium oxide ceramic substrate, oxygen-free copper one side for and soldering and sealing cover plate 51 or pipe cap 50 cold welding sealing-ins.Bimetallic ring cut down or iron-nickel alloy superficial layer and the ceramic substrate coefficient of expansion are close, both solved the reliable Welding Problems of becket and ceramic substrate, simultaneously compatible again oxygen-free copper surface and oxygen-free copper cover plate or the pipe cap welding process of colding pressing.
Between described ceramic substrate 21 and interior electrode 25, be also provided with supporting layer 26, specifically as shown in Fig. 2,4,5, supporting layer 56 adopts the silk screen printing of thick film high temperature dielectric paste and sintering process to make, supporting layer 56, for the height of padded quartz crystal 501, effectively makes quartz crystal 501 and ceramic substrate 52 maintain a certain distance and (is greater than 50 μ m).
Described interior electrode 55 and external electrode 59 are to fill W metal paste by the through hole 57 on ceramic substrate, realize electrical connection after sintering curing, and metal paste again can be by through hole shutoff simultaneously.
As shown in Figure 5, described cover plate is the metal pipe cap 50 of intermediate projections, the surrounding of described intermediate projections is sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, and the sealing-in limit of described base of ceramic and metal pipe cap 50 relies on these bimetallic ring 54 cold welding sealed knots to be combined.Or as shown in Figure 4, described cover plate is the planar metal cover plate 40 parallel with described ceramic substrate, described ceramic substrate 51 and metal cover board 40 rely on this bimetallic ring 54 to cold pressing and directly combine.Described metal cover board 40, metal pipe cap 50 adopt oxygen-free copper mechanical stamping to form, surface can nickel plating to prevent corrosion.
Owing to being easy to the physical characteristic of bonding between above-mentioned oxygen-free copper molecule, when encapsulation, by bimetallic ring 54 and metal pipe cap 59 or the metal cover board 4 of directly colding pressing, reach the object of sealing.Simplify quartz oscillator packaging technology, avoided the thermal shock to quartz wafer.
As shown in Fig. 6 a, 6b and Fig. 7 a, 7b, the square that is shaped as the both sides that are separately positioned on ceramic substrate 51 of described external electrode 55.Described interior electrode 59 be shaped as strip-like-shaped.External electrode and interior electrode adopt thick film conductor paste silk screen printing and sintering process to make metal layer at ceramic substrate outer surface, can be the metals such as W, Mo/Mn, Cu, Ni, nickel plating or gold on metal layer.Interior electrode and external electrode are realized electrical connection reliably by Ceramic Array via metalization in flakes.
Fig. 8, Fig. 9 have disclosed the shape of two kinds of bimetallic rings, and its flange can be separately positioned on upper and lower two positions of bimetallic ring.
Figure 10 has disclosed a kind of cover plate, it is the metal cover board with locator protrusions 101, this locator protrusions can snap onto the effect of playing the position of the described metal cover board in location in bimetallic ring, and described base of ceramic and metal cover board rely on cold welding technique to be sealed together.
This ceramic substrate can be widely used in the level Hermetic Package of surface attaching quartz crystal element and other electronic devices and components.For example, while making for surface mounting quartz crystal resonator (shown in Fig. 5), quartz wafer 501 is starched 502 by silver and is connected with interior electrode 55.Device adopts cold welding by the bimetallic ring 54 on ceramic substrate and metal cover board 40(Fig. 4) or metal pipe cap 50(Fig. 5) weld together, form and hold the airtight space of protecting quartz wafer.This surface mount pottery-cold welding packaging shell structure is simple, volume is little, lightweight, be convenient to mass industrialized production, meet electronic devices and components miniaturization and surface-pasted development trend.
Surface mount cold welding ceramic packaging shell of the present invention, has following features:
1. adopt pressure welding method to carry out the last encapsulation of electronic device, can effectively avoid the thermal shock to electronic chip of the traditional method for packing such as parallel seam welding, reflow welding, device chip can keep accurate electrical quantity.
2. the surface mount ceramic packaging shell of comparing traditional multi-layer ceramics co-sintering structure, volume is little, lightweight, simple in structure.Be applicable to industrialized mass.
3. adopt thick-film material to make supporting layer 56, effectively solve quartz wafer 501 by simple method and keep certain distance (to be greater than 50 μ problem m) with ceramic substrate 51.
The present invention still has numerous embodiments, and all employing equivalents or equivalent transformation and all technical schemes of forming, within all dropping on protection scope of the present invention.
Claims (11)
1. a cold welding ceramic packaging shell, comprise base of ceramic and cover plate, it is characterized in that: described base of ceramic comprises the ceramic substrate (51) and the bimetallic ring (54) that interfix, and being separately positioned on interior electrode (55) and the external electrode (59) in outside in described ceramic substrate (51), described interior electrode (55) and external electrode (59) electrically conduct mutually; Described base of ceramic and cover plate rely on the bimetallic ring (54) of described base of ceramic to adopt cold welding technique to be sealed together.
2. cold welding ceramic packaging shell according to claim 1, is characterized in that: on described ceramic substrate (51), be provided with through hole (57), described interior electrode (55) is connected with external electrode by this through hole (57).
3. arbitrary cold welding ceramic packaging shell according to claim 1 and 2, it is characterized in that: the metal pipe cap (50) that described cover plate is intermediate projections, the surrounding of described intermediate projections is sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, the sealing-in limit of described base of ceramic and metal pipe cap (50) relies on cold welding technique to be sealed together.
4. arbitrary cold welding ceramic packaging shell according to claim 1 and 2, it is characterized in that: described cover plate is the planar metal cover plate (40) parallel with described ceramic substrate (41), described base of ceramic and plane metal cover board (40) rely on cold welding technique to be sealed together.
5. arbitrary cold welding ceramic packaging shell according to claim 1 and 2, is characterized in that: described cover plate is for having the metal cover board of locator protrusions (101), and described base of ceramic and metal cover board rely on cold welding technique to be sealed together.
6. cold welding ceramic packaging shell according to claim 1, is characterized in that: between described ceramic substrate (51) and interior electrode (55), be also provided with supporting layer (56).
7. cold welding ceramic packaging shell according to claim 1, is characterized in that: described ceramic substrate (51) top arranges the metallization ring (52) with solderability function, the reliable welding for ceramic substrate (51) with bimetallic ring (54).
8. one kind uses the crystal oscillator of cold welding ceramic packaging shell, it is characterized in that: comprise base of ceramic and the cover plate that can interfix by cold welding, described base of ceramic comprises the ceramic substrate (51) and the bimetallic ring (54) that interfix, and being separately positioned on interior electrode (55) and the external electrode (59) in outside in described ceramic substrate (51), described interior electrode (55) and external electrode (59) electrically conduct mutually; The top of described interior electrode (55) is installed with a quartz crystal (501), described quartz crystal (501) is arranged in the enclosure space being formed by ceramic substrate (51) and cover plate, and described base of ceramic and cover plate rely on the bimetallic ring (54) of described base of ceramic to adopt cold welding technique to be sealed together.
9. crystal oscillator according to claim 8, it is characterized in that: the metal pipe cap (50) that described cover plate is intermediate projections, the surrounding of described intermediate projections is sealing-in limit, the sealing-in limit opposing parallel of described intermediate projections and surrounding, the sealing-in limit of described base of ceramic and metal pipe cap (50) relies on cold welding technique to be sealed together.
10. crystal oscillator according to claim 8, is characterized in that: described cover plate is the planar metal cover plate (40) parallel with described ceramic substrate (41), and described base of ceramic and plane metal cover board (40) rely on cold welding technique to be sealed together.
11. crystal oscillators according to claim 8, is characterized in that: described cover plate is the metal cover board with locator protrusions, and described base of ceramic and metal cover board rely on cold welding technique to be sealed together.
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106357234A (en) * | 2016-08-31 | 2017-01-25 | 成都晶宝时频技术股份有限公司 | Quartz crystal resonator and machining technology thereof |
CN106847714A (en) * | 2016-12-29 | 2017-06-13 | 潮州三环(集团)股份有限公司 | Encapsulating structure and preparation method thereof |
CN107634733A (en) * | 2017-09-27 | 2018-01-26 | 合肥晶威特电子有限责任公司 | A kind of quartz-crystal resonator and its processing method |
CN111742622A (en) * | 2018-03-02 | 2020-10-02 | 株式会社村田制作所 | Multilayer ceramic substrate and method for manufacturing multilayer ceramic substrate |
CN111933577A (en) * | 2020-07-15 | 2020-11-13 | 中国电子科技集团公司第二十九研究所 | Local large-area welding board-level interconnection integration method for airtight packaging unit |
CN112776122A (en) * | 2020-10-22 | 2021-05-11 | 中国电子科技集团公司第五十五研究所 | Coaxial double-sided blind cavity forming method based on multilayer ceramic process |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11317625A (en) * | 1999-03-08 | 1999-11-16 | Daishinku:Kk | Crystal oscillator module |
JP2004064217A (en) * | 2002-07-25 | 2004-02-26 | Nippon Dempa Kogyo Co Ltd | Case for piezoelectric element and crystal oscillator employing the same |
JP2004253865A (en) * | 2003-02-18 | 2004-09-09 | Citizen Watch Co Ltd | Structure for electronic device and manufacturing method of the electronic device |
CN1858997A (en) * | 2005-05-03 | 2006-11-08 | 三星电机株式会社 | Crystal oscillator |
CN1906848A (en) * | 2004-05-12 | 2007-01-31 | 株式会社大真空 | Package for piezoelectric oscillation element, and piezoelectric oscillator |
CN101132169A (en) * | 2007-09-19 | 2008-02-27 | 杨绍华 | Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof |
CN201130926Y (en) * | 2007-09-19 | 2008-10-08 | 杨绍华 | Ceramic packing piece for SMD crystal resonator |
CN201365231Y (en) * | 2009-03-10 | 2009-12-16 | 台晶(宁波)电子有限公司 | Metallic packaging crystal oscillator |
CN102638243A (en) * | 2012-05-07 | 2012-08-15 | 烟台森众电子科技有限公司 | SMD (Surface Mount Device) quartz crystal resonator base and processing method thereof |
CN203014757U (en) * | 2012-11-26 | 2013-06-19 | 苏州工业园区阳晨封装技术有限公司 | Cold pressure welding ceramic sealed housing and crystal oscillator employing same |
-
2012
- 2012-11-26 CN CN201210483868.2A patent/CN103840790A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11317625A (en) * | 1999-03-08 | 1999-11-16 | Daishinku:Kk | Crystal oscillator module |
JP2004064217A (en) * | 2002-07-25 | 2004-02-26 | Nippon Dempa Kogyo Co Ltd | Case for piezoelectric element and crystal oscillator employing the same |
JP2004253865A (en) * | 2003-02-18 | 2004-09-09 | Citizen Watch Co Ltd | Structure for electronic device and manufacturing method of the electronic device |
CN1906848A (en) * | 2004-05-12 | 2007-01-31 | 株式会社大真空 | Package for piezoelectric oscillation element, and piezoelectric oscillator |
CN1858997A (en) * | 2005-05-03 | 2006-11-08 | 三星电机株式会社 | Crystal oscillator |
CN101132169A (en) * | 2007-09-19 | 2008-02-27 | 杨绍华 | Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof |
CN201130926Y (en) * | 2007-09-19 | 2008-10-08 | 杨绍华 | Ceramic packing piece for SMD crystal resonator |
CN201365231Y (en) * | 2009-03-10 | 2009-12-16 | 台晶(宁波)电子有限公司 | Metallic packaging crystal oscillator |
CN102638243A (en) * | 2012-05-07 | 2012-08-15 | 烟台森众电子科技有限公司 | SMD (Surface Mount Device) quartz crystal resonator base and processing method thereof |
CN203014757U (en) * | 2012-11-26 | 2013-06-19 | 苏州工业园区阳晨封装技术有限公司 | Cold pressure welding ceramic sealed housing and crystal oscillator employing same |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106357234A (en) * | 2016-08-31 | 2017-01-25 | 成都晶宝时频技术股份有限公司 | Quartz crystal resonator and machining technology thereof |
CN106847714A (en) * | 2016-12-29 | 2017-06-13 | 潮州三环(集团)股份有限公司 | Encapsulating structure and preparation method thereof |
CN106847714B (en) * | 2016-12-29 | 2019-08-09 | 潮州三环(集团)股份有限公司 | Encapsulating structure and preparation method thereof |
CN107634733A (en) * | 2017-09-27 | 2018-01-26 | 合肥晶威特电子有限责任公司 | A kind of quartz-crystal resonator and its processing method |
CN111742622A (en) * | 2018-03-02 | 2020-10-02 | 株式会社村田制作所 | Multilayer ceramic substrate and method for manufacturing multilayer ceramic substrate |
CN111742622B (en) * | 2018-03-02 | 2023-09-29 | 株式会社村田制作所 | Multilayer ceramic substrate and method for manufacturing multilayer ceramic substrate |
CN111933577A (en) * | 2020-07-15 | 2020-11-13 | 中国电子科技集团公司第二十九研究所 | Local large-area welding board-level interconnection integration method for airtight packaging unit |
CN112776122A (en) * | 2020-10-22 | 2021-05-11 | 中国电子科技集团公司第五十五研究所 | Coaxial double-sided blind cavity forming method based on multilayer ceramic process |
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Application publication date: 20140604 |