CN215342562U

CN215342562U - Cooling fan module, chip assembly structure and robot

Info

Publication number: CN215342562U
Application number: CN202120806614.4U
Authority: CN
Inventors: 陈焕昌; 梁剑龙; 何源; 陈祖发
Original assignee: Shenzhen Pudu Technology Co Ltd
Current assignee: Shenzhen Pudu Technology Co Ltd
Priority date: 2021-04-19
Filing date: 2021-04-19
Publication date: 2021-12-28
Anticipated expiration: 2031-04-19

Abstract

The utility model provides a cooling fan module, a chip assembly structure and a robot, which can be used for improving the cooling effect. For the radiating fan module, the radiating fan module comprises a first radiating fin, a wind shielding surrounding wall and a radiating fan; the wind shielding surrounding wall is fixedly connected to the first radiating fin, a fan mounting groove is formed between the wind shielding surrounding wall and the first radiating fin, and the radiating fan is located in the mounting groove and mounted on the first radiating fin.

Description

Cooling fan module, chip assembly structure and robot

Technical Field

The utility model relates to the technical field of cooling fan structures, in particular to a cooling fan module, a chip assembly structure and a robot.

Background

With the wider application of the robot and the worse market competition, the improvement of the performance of the robot to highlight the advantages of the robot becomes more and more important, the application of a high-precision chip follows, and the problem of chip heat dissipation is very important.

At present, a chip is cooled by a common cooling fan, the traditional cooling fan structure directly adopts a straight-line fan to cool, in the cooling process, the air brought by the fan flows and directly passes through the chip, or around the chip module, the cooling is not facilitated, the air flows, and dust and other impurities are easily brought to the chip module.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a cooling fan module, a chip assembly structure and a robot, and aims to solve the technical problems that in the traditional scheme, air flow brought by a cooling fan structure fan directly passes through a chip or the periphery of the chip module, heat dissipation is not facilitated, and dust and other impurities are easily brought.

In order to achieve the purpose, the utility model adopts the technical scheme that:

in a first aspect, a heat dissipation fan module is provided, which includes a first heat dissipation fin, a wind shielding enclosure wall and a heat dissipation fan;

the wind shielding surrounding wall is fixedly connected to the first radiating fin, a fan mounting groove is formed between the wind shielding surrounding wall and the first radiating fin, and the radiating fan is located in the mounting groove and mounted on the first radiating fin.

In one possible design, the fan blowing direction of the cooling fan set faces the first cooling fin.

In one possible implementation, there is a gap between the cooling fan set and the wind shielding enclosure wall, and the gap is arranged with a plurality of raised cooling blocks in contact with the first cooling fins.

In one possible design, the plurality of raised heat dissipation blocks are sheet-shaped and evenly arranged.

In one possible design, the joint between the two plate surfaces of the heat dissipation block and the first heat dissipation fin is of an arc-shaped structure.

In one possible embodiment, some of the plurality of raised heatsinks are also in contact with the wind shielding enclosure.

In one possible design, the first heat sink and the wind shielding enclosure wall are both made of aluminum.

In a possible design, a plurality of raised heat dissipation blocks are extended from the first heat dissipation plate, the plurality of heat dissipation blocks form a fan mounting seat, and the heat dissipation fan is fixedly mounted on the fan mounting seat.

In a second aspect, a chip mounting structure is provided for dissipating heat from a chip, and the chip mounting structure includes a chip module, an insulating heat sink, and the heat dissipation fan module of any design of the first aspect, wherein the chip is mounted on a motherboard of the chip module, the heat dissipation fan module is mounted on the motherboard via a first heat sink, the insulating heat sink is located between the first heat sink and the chip, and two sides of the insulating heat sink are respectively in contact with the first heat sink and the chip.

In a possible design, the chip assembly structure further comprises an upper cover and a lower cover, the upper cover comprises a through hole corresponding to the fan mounting groove, the upper cover and the lower cover can be disassembled and fixedly assembled, the inner portion of the upper cover and the inner portion of the lower cover form a containing cavity, the mainboard and the cooling fan module are located in the containing cavity, and the fan mounting groove is communicated with external gas through the through hole.

In one possible design, the upper shroud is sealed and connected in contact with the wind shielding enclosure wall and the through-hole is coaxial with the fan mounting groove.

In one possible design, the upper and lower housings are aluminum pieces.

In one possible design, a plurality of insulating heat sinks are arranged between the lower cover and the main board and are respectively contacted with the main board and the lower cover.

In one possible design, the insulating fins are all silicone fins.

In a third aspect, a robot is provided, comprising the chip mounting structure according to any one of the second aspect.

In one of the schemes provided by the utility model, the cooling fan module is provided, and comprises a first cooling fin, a wind shielding surrounding wall and a cooling fan; wherein the wind shielding surrounding wall is fixedly connected to the first heat sink, a fan mounting groove is formed between the wind shielding surrounding wall and the first heat sink, the heat sink fan is positioned in the mounting groove and mounted on the first heat sink, thus, through the heat radiation fan module, the fan can directly blow the surface of the first heat radiation fin or absorb air, the air flow takes away heat, the heat on the first heat radiation fin is greatly reduced, the heat generated by the operation of the chip directly or indirectly contacted with the first heat radiation chip is timely radiated outside, the temperature is better controlled, and because the first heat radiation fin and the wind shielding enclosure wall are assembled together, because of the shielding of the wind shielding enclosure wall, the flowing hot air brought by the fan can not directly enter the chip module from the periphery, and is also beneficial to the heat dissipation of the chip module, in addition, due to the action of the wind shielding surrounding wall, the flowing wind prevents impurities such as dust in the air from entering the chip module.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a schematic structural diagram of a cooling fan module;

FIG. 2 is an exploded view of the chip mounting structure;

fig. 3 is an overall schematic view of a chip mounting structure.

Wherein, in the figures, the respective reference numerals:

1-a heat dissipation fan module; 11-a first heat sink; 111-a mounting block; 12-wind shielding enclosure walls; 121-a first wind-shielding wall; 122-second wind-blocking wall; 123-a third wind-shield wall; 124-a fourth wind shielding wall; 13-a heat dissipation fan; 14-a heat sink;

2-a chip module; 3-an insulating heat sink between the first heat sink and the chip; 4-chip; 5, covering; 51-a through hole; 6-lower cover; 7-insulating heat sink between lower cover and the motherboard.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Referring to fig. 1 to fig. 3, a cooling fan module, a chip mounting structure and a robot according to an embodiment of the present invention will be described.

First, as shown in fig. 1, for a heat dissipation fan module 1 of the present invention, the heat dissipation fan module 1 includes a first heat sink 11, a wind shielding enclosure wall 12 and a heat dissipation fan 13; the wind shielding surrounding wall 12 is fixedly connected to the first heat sink 11, wherein, in an application scenario, the wind shielding surrounding wall 12 is hermetically connected to the first heat sink 11, a fan installation groove is formed between the wind shielding surrounding wall 12 and the first heat sink 12, and the heat sink fan 13 (not shown in the figure) is located in the installation groove and is installed on the first heat sink 11. Like this, through this radiator fan module 1, radiator fan 13 can blow directly first fin 11 surface or induced draft, the heat is taken away in the wind flow, very big reduction the heat on first fin 11, make the heat that produces with the chip operation of this first fin 11 direct or indirect contact in time disperse to the outside, make the temperature obtain better control, and because first fin 11 and leg 12 assembly that keeps out the wind are in the same place, owing to the sheltering from of leg 12 that keeps out the wind, the mobile wind that the fan brought can't enter into inside the chip module, also be favorable to the heat dissipation, in addition, the direct blow wind that the fan brought also can be owing to the effect of leg that keeps out the wind, can not drive in the air debris such as dust can not enter into the chip module.

In an embodiment, a plurality of protruding mounting blocks 111 are extended from the first heat sink, and are arranged at intervals, the plurality of mounting blocks 111 form a fan mounting seat, and the heat dissipation fan 13 is fixedly mounted on the fan mounting seat. In this embodiment, the mounting blocks 111 disposed in a plurality of protruding and spaced manner extend from the first heat sink and are protruding slightly from the first heat sink, so that the heat dissipation fan can be mounted on the fan mounting seat formed by the mounting blocks 111, the heat dissipation fan 13 cannot be directly mounted on the first heat sink 11, and the heat dissipation fan 13 is disposed on the mounting blocks with gaps, so that a better gap space can exist between the heat dissipation fan 13 and the first heat sink 11, thereby facilitating the flow of air flow and facilitating further heat dissipation. The mounting block 111 may be integrally formed with the first heat sink 11, or may be separately mounted and fixed to the first heat sink 11, which is not limited in particular.

The fan direction of the heat dissipation fan 13 may be a blowing wind direction back to the first heat dissipation fin 11, or a blowing direction toward the first heat dissipation fin 11, but the present invention is not limited thereto, and in an embodiment, the fan blowing direction of the heat dissipation fan 13 is toward the first heat dissipation fin 11, so that the heat dissipation fan 13 directly blows the first heat dissipation fin 11, the wind power is larger, the heat dissipation of the first heat dissipation fin 11 can be effectively accelerated, and the heat dissipation effect is favorably improved.

In one embodiment, there is a gap between the radiator fan 13 and the wind shielding enclosure wall 12, and the gap is arranged with a plurality of raised radiating blocks 14 in contact with the first radiating fins 11. In this embodiment, because there is the clearance between radiator fan 13 and the bulkhead 12 that keeps out the wind for form the wind channel between radiator fan 13 and the bulkhead 12 that keeps out the wind, when radiator fan 13 directly blows first fin 11, can form flowing wind, flowing wind can be sheltered from by the bulkhead 12 that keeps out the wind, thereby can't directly hide from the bulkhead 12 that keeps out the wind, in the short time, can flow in the clearance, because the clearance has arranged a plurality of bellied radiating block 14 with first fin 11 contact, radiating block 14 can accelerate to take away the heat of first fin 11.

In an embodiment, the first heat sink 11 and the wind shielding enclosure wall 12 are made of aluminum or other materials with good heat transfer effect, but not limited thereto, the aluminum has good heat transfer effect, and the heat dissipation effect can be improved.

In some embodiments, the plurality of raised heat dissipation blocks 14 are in a sheet shape and are uniformly arranged, and the specific arrangement is not limited. Illustratively, a plurality of raised heat dissipation blocks 14 extend from the first heat dissipation plate 11, and may be integrally formed with the first heat dissipation plate 11, or the two may be fixedly connected by assembling, and is not limited in particular.

In an embodiment, the joint between the two plate surfaces of the heat dissipation block 14 and the first heat dissipation fin 11 is an arc structure, and the arc design can effectively enhance the connection strength between the heat dissipation block 14 and the first heat dissipation fin 11, thereby effectively preventing the heat dissipation block 14 from being easily broken.

In one embodiment, of the plurality of raised heatsinks 14, portions of the heatsinks 14 are also in contact with the weather enclosure 12, which may, for example, in one embodiment, the wind shielding surrounding wall 12 includes a first wind shielding wall 121, a second wind shielding wall 122, a third wind shielding wall 123 and a fourth wind shielding wall 124, the first wind shielding wall 121, the second wind shielding wall 122, the third wind shielding wall 123 and the fourth wind shielding wall 124 are sequentially connected to form a square wind shielding surrounding wall 12, the heat dissipation block 14 between the first wind shielding wall 121 and the heat dissipation fan 13 is in contact with not only the first heat dissipation fin 11 but also the first wind shielding wall 121, the heat dissipation block 14 between the third wind shielding wall 123 and the heat dissipation fan 13 is in contact with not only the first heat dissipation fin 11 but also the third wind shielding wall 123, in this embodiment, since the wind shielding surrounding wall 12 is also made of an aluminum member or the like having a heat transfer effect, the heat radiation effect can be further improved by the heat radiation block 14 being in contact with the surrounding wall. With reference to the above embodiment, in one implementation, the mounting groove formed between the wind shielding enclosure wall 12 and the first heat sink 11 is a square groove, and the heat sink fan is located in the middle of the square groove.

In an embodiment, the wind shielding surrounding wall 12 and the first heat dissipating fin 11 may be integrally formed, so as to improve the heat transfer efficiency between the wind shielding surrounding wall 12 and the first heat dissipating fin 11, or the wind shielding surrounding wall 12, and the wind shielding surrounding wall 12 and the first heat dissipating fin 11 may be integrally locked by assembling, which is not limited herein. For example, the first wind shielding wall 121 and the third wind shielding wall 123 have bent portions, the first wind shielding wall 121 and the third wind shielding wall 123 are fixed and locked to the first heat sink 11 by a bolt method and the bent portions, and the second wind shielding wall 122 and the fourth wind shielding wall 124 are fixed and connected to the first wind shielding wall 121 and the third wind shielding wall 123 by a bolt method, respectively.

The heat dissipation fan module 1 provided by the present invention can be applied to various heat dissipation scenarios, including but not limited to ordinary chip heat dissipation, high-precision chip heat dissipation, or heat dissipation of other devices, when the heat dissipation fan module 1 is used, a heat-to-be-dissipated object needs to be directly or indirectly contacted with the first heat dissipation fin 11 of the heat dissipation fan module 1, and heat is taken away by the first heat dissipation fin 11 of the heat dissipation fan module. In the present invention, based on the above-mentioned heat dissipation fan module, a heat dissipation fan 13 module is correspondingly provided to effectively dissipate heat and prevent impurities such as dust from entering the chip module, which will be described in detail below.

As shown in fig. 2 and 3, a chip mounting structure includes a chip module 2, a non-conductive insulating heat sink 3, and a heat dissipation fan module 1 of any one of the foregoing, wherein a chip 4 is mounted on a main board of the chip module 2, a heat dissipation fan 13 module is mounted on the main board of the chip module 2 through a first heat sink 11, the insulating heat sink 3 is located between the first heat sink 11 and the chip 4, and two sides of the insulating heat sink 3 are in contact with the first heat sink 11 and the chip 4, respectively. The chip module 2 is a robot control board, the chip module 2 is provided with a chip 4, so that a specific robot function is realized, the chip module 2 can also comprise other components except a main board, the description is not specifically provided, and the chip module is not marked one by one in the drawing, and is not specifically limited. In an embodiment, the insulating heat sink 3 may be a flexible heat dissipation silicone sheet, which has a good heat transfer effect and is not limited specifically.

Like this, through this radiator fan module 1, radiator fan 13 can blow directly first fin 11 surface or induced draft, the heat is taken away in the wind flow, very big reduction the heat on first fin 11, make the heat that produces with the chip 4 operation of this first fin 11 direct or indirect contact in time disperse to the outside, make the temperature obtain better control, and because first fin 11 and the leg 12 assembly that keeps out the wind together, owing to the sheltering from of the leg 12 dress that keeps out the wind, the hot-blast unable direct entering chip module 2 that flows that the fan brought is inside, also be favorable to the heat dissipation, in addition, the direct blast that the fan brought also is owing to the effect of the leg 12 that keeps out the wind, make debris such as dust in the air can not enter into chip module 2.

In an embodiment, this chip assembly structure still includes upper shield 5 and lower cover 6, upper shield 5 includes the through-hole 51 that corresponds with the fan mounting groove, upper shield 5 and lower cover 6 can dismantle fixed mounting and inside formation and hold the chamber, the mainboard is located with radiator fan module 1 and holds the intracavity, can reduce debris such as outside dust effectively and get into the chip module 2 that holds the intracavity, and the fan mounting groove passes through-hole 51 and external gas intercommunication, like this, the wind that is sheltered from by the enclosure wall 12 that keeps out the wind can pass through-hole 51 and external gas contact, reach quick radiating action.

In an embodiment, the upper cover 5 and the lower cover 6 are made of aluminum or other materials with good heat transfer effect, but not limited thereto, so as to achieve heat transfer effect and further improve heat dissipation performance.

In one embodiment, the upper cowl 5 is sealingly and contactingly connected to the wind shielding surrounding wall 12, and the through-hole 51 is coaxial with the fan installation recess. Because the upper shield 5 possesses the heat conductivility, the upper shield 5 is sealed and contact with the leg 12 that keeps out the wind and is connected, can avoid wind to get into on the one hand and hold the intracavity, further effectively avoids debris such as dust to advance to hold the chamber, and on the other hand can realize heat transfer between leg 12 and the upper shield 5 that keeps out the wind for the heat of the leg 12 that keeps out the wind can transmit to upper shield 5, is favorable to further improving the radiating effect.

In an embodiment, a plurality of insulating heat sinks 7 are disposed between the lower cover 5 and the main board of the chip module 2, and respectively contact with the main board of the chip module 2 and the lower cover 6, for example, the insulating heat sinks 7 may be silica gel heat sinks, that is, flexible heat dissipation silica gel heat sinks, so as to improve the heat transfer effect, and the insulating heat sinks 7 are connected to the main board of the chip module 2 and the lower cover 6, so as to transfer heat to the lower cover 6, thereby further improving the heat transfer effect, and further improving the heat dissipation effect.

In the utility model, the lower cover 6 is connected with the chip module 2 through the insulating radiating fin 7 at the bottom, the heat of the chip module 2 can be transferred through the lower cover, the bottom of the radiating fan module 1 is contacted with the high-precision chip 4 through the insulating radiating fin 3, and the heat generated on the high-precision chip 4 can be transferred to the radiating fan module 2; the upper cover 5 and the lower cover 6 are assembled in a matched mode, meanwhile, the cooling fan module 2 is in contact with the upper cover 5, the heat of the high-precision chip 4 can be transmitted to the upper cover 5, and the heat generated by the high-precision chip 4 can be transmitted to the box body formed by the upper cover 5 and the lower cover 6.

Radiator fan 13 blows directly on first fin 11 surface, and the heat is taken away in the wind flow, very big reduction the heat on the first fin 11, the heat that makes 4 operation of high accuracy chips produce in time dispels the outside, and the temperature obtains better control, and because first fin 11 and the leg 12 lock that keeps out the wind become an organic whole, inside radiator fan 13's wind will can't enter into chip module 2, debris such as dust in the air can not enter into chip module 2.

The utility model also provides a robot comprising the chip assembly structure of any one of the preceding embodiments.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat radiation fan module is characterized in that the heat radiation fan module comprises a first heat radiation fin, a wind shielding surrounding wall and a heat radiation fan;

2. The heat dissipation fan module as claimed in claim 1, wherein a fan blowing direction of the heat dissipation fan is directed toward the first heat sink.

3. The heat dissipating fan module of claim 1 wherein a gap exists between the heat dissipating fan and the wind shielding enclosure wall, and the gap is configured with a plurality of raised heat dissipating bumps in contact with the first heat dissipating fins.

4. The heat dissipating fan module as claimed in claim 3, wherein the plurality of raised heat dissipating blocks are in the shape of a sheet and are uniformly arranged.

5. The heat dissipating fan module as claimed in claim 4, wherein the joint between the two plate surfaces of the heat dissipating block and the first heat dissipating fin has an arc-shaped structure.

6. The heat dissipating fan module of claim 3, wherein a portion of the plurality of raised heatslugs is also in contact with the wind shielding perimeter wall.

7. The heat dissipation fan module of any of claims 1-6, wherein the first heat sink and the wind shielding enclosure are both aluminum.

8. The heat dissipation fan module as recited in any one of claims 1-6, wherein the first heat sink has a plurality of raised and spaced mounting blocks extending therefrom, the mounting blocks forming a fan mount, the heat dissipation fan being fixedly mounted to the fan mount.

9. A chip mounting structure, comprising a chip module, an insulating heat sink, and the heat dissipation fan module as claimed in any one of claims 1 to 8, wherein the chip is mounted on a main board of the chip module, the heat dissipation fan module is mounted on the main board via the first heat sink, the insulating heat sink is located between the first heat sink and the chip, and two sides of the insulating heat sink are in contact with the first heat sink and the chip, respectively.

10. The chip mounting structure according to claim 9, further comprising an upper cover and a lower cover, wherein the upper cover includes a through hole corresponding to the fan mounting groove, the upper cover and the lower cover are detachably and fixedly mounted and form a containing cavity therein, the main board and the heat dissipation fan module are located in the containing cavity, and the fan mounting groove is communicated with outside air through the through hole.

11. The chip mounting structure according to claim 10, wherein said upper cover is hermetically sealed and contact-connected with said wind shielding surrounding wall, and said through hole is coaxial with said fan mounting groove.

12. The chip mounting structure according to claim 10, wherein a plurality of insulating heat sinks are provided between said lower case and said main board, and are in contact with said main board and said lower case, respectively.

13. A robot comprising a chip mounting structure according to any one of claims 9 to 12.