CN218417099U - Heat abstractor and frequency conversion all-in-one - Google Patents
Heat abstractor and frequency conversion all-in-one Download PDFInfo
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- CN218417099U CN218417099U CN202222407889.8U CN202222407889U CN218417099U CN 218417099 U CN218417099 U CN 218417099U CN 202222407889 U CN202222407889 U CN 202222407889U CN 218417099 U CN218417099 U CN 218417099U
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Abstract
The utility model discloses a heat dissipation device and a frequency conversion integrated machine, wherein, the heat dissipation device is applied to the frequency conversion integrated machine, the frequency conversion integrated machine comprises a first driving module and a second driving module, the power of the first driving module is larger than that of the second driving module, the heat dissipation device comprises a fan cover, a radiator and a temperature equalizing plate, the fan cover encloses and forms a heat dissipation air duct, the fan cover is provided with a mounting surface, the radiator is mounted on the mounting surface, and at least part of structure is arranged on the mounting surface to be positioned in the heat dissipation air duct, one side of the radiator, which deviates from the fan cover, is used for connecting a first driving module, one end of the temperature-equalizing plate is arranged on the mounting surface in a penetrating manner and is fixedly connected to at least part of the structure of the radiator, the other end of the temperature-equalizing plate is positioned outside the mounting surface in the projection of the mounting surface, and the temperature-equalizing plate is used for connecting a second driving module, so that the size of the fan cover can be correspondingly reduced, the size and the weight of the whole frequency conversion all-in-one machine can be reduced, and the mounting space of the fan cover in the inside of the frequency conversion all-in-one machine is reduced.
Description
Technical Field
The utility model relates to an electrical equipment technical field, in particular to heat abstractor and applied this heat abstractor's frequency conversion all-in-one.
Background
The inside of frequency conversion all-in-one is provided with a plurality of drive module, and a plurality of drive module all can generate heat at the operation in-process, consequently need realize dispelling the heat to a plurality of drive module. The existing heat dissipation device dissipates heat by arranging a heat radiator corresponding to a drive module, so that a plurality of heat radiators are required to be arranged when a plurality of drive modules exist, for example, a main heat radiator is arranged to dissipate heat of an IGBT module with high power, and an auxiliary heat radiator is arranged to dissipate heat of the IGBT module with low power. Therefore, in order to install a plurality of radiators, the fan housing needs to increase the size of the fan housing, which results in the increase of the size and weight of the whole frequency conversion all-in-one machine or the excessive occupation of the internal installation space of the frequency conversion all-in-one machine.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heat abstractor aims at dispelling the heat to first drive module and second drive module through setting up radiator and temperature-uniforming plate, and the temperature-uniforming plate only a tip need occupy the area of fan housing to the fan housing can reduce the size in its complete machine wind channel.
In order to achieve the above object, the utility model provides a heat abstractor is applied to frequency conversion all-in-one, frequency conversion all-in-one includes first drive module and second drive module, first drive module's power is greater than second drive module's power, heat abstractor includes fan housing, radiator and temperature-uniforming plate, the fan housing encloses to close and is formed with the heat dissipation wind channel, the fan housing has a mounting surface, the radiator install in mounting surface to at least part structure is worn to locate mounting surface is in the heat dissipation wind channel, the radiator deviates from one side of fan housing is used for connecting first drive module, and will first drive module's heat transfer extremely in the heat dissipation wind channel, a tip of temperature-uniforming plate is worn to locate mounting surface, and fixed connection in at least part structure of radiator, the other end is in mounting surface's projection is located outside the mounting surface, the temperature-uniforming plate is used for connecting second drive module, and will second drive module's heat passes through at least part structure transfer extremely in the heat dissipation wind channel.
Optionally, the heat sink includes a base plate and a heat dissipation fin, the base plate is mounted on the mounting surface, one side of the base plate is used for connecting the first driving module, one end of the heat dissipation fin is connected with the other side of the base plate, the other end of the heat dissipation fin penetrates through the mounting surface and is located in the heat dissipation air duct, and one end of the temperature equalization plate is fixedly connected to the surface of the heat dissipation fin.
Optionally, the base plate is provided with a through avoiding hole, and one end of the temperature-equalizing plate penetrates through the avoiding hole to be fixedly connected with the surface of the heat dissipation fin.
Optionally, the temperature equalization plate includes a plate main body and a connecting portion, the plate main body is used for connecting the second driving module, the connecting portion is bent and disposed at an end portion of the plate main body, and the connecting portion penetrates through the mounting surface and is fixedly connected to the surface of the heat dissipation fin.
Optionally, the plate main body extends along the direction that deviates from radiating fin, the extending direction of plate main body with the mounting surface is the contained angle setting, the plate main body with the distance of mounting surface is followed extending direction reduces gradually.
Optionally, the temperature equalization plate has a plurality of microchannels therein, the plate main body communicates with the inside of the connecting portion, the microchannels are disposed at intervals in the plate main body and the inside of the connecting portion in a direction perpendicular to the extending direction, and a cooling medium is disposed in each microchannel, and the cooling medium is configured to transfer heat of the second driving module to the heat dissipation fin.
Optionally, the connecting portion is welded and fixed to a surface of the heat dissipating fin.
Optionally, the mounting surface is provided with an opening, the heat dissipation fin passes through the opening and penetrates through the mounting surface, the heat dissipation device further comprises a sealing member annularly arranged on the periphery of the heat dissipation fin, and the sealing member is arranged between the base plate and the opening of the mounting surface in a sealing manner.
Optionally, the mounting surface has been seted up the opening, radiating fin passes through the opening is worn to locate the mounting surface, heat abstractor still includes the ring flange, the base plate passes through the ring flange connect in radiating fin's one end, the ring flange in opening department with mounting surface fixed connection.
In order to achieve the above object, the utility model also provides a frequency conversion all-in-one machine, including casing, first drive module, second drive module and heat abstractor, first drive module locates the inside of casing, second drive module locates the inside of casing, heat abstractor is as above heat abstractor, heat abstractor locates the inside of casing, the radiator connect in first drive module, the samming board connect in second drive module.
The utility model discloses technical scheme is through being provided with radiator and temperature-uniforming plate to make the radiator dispel the heat to first drive module, the temperature-uniforming plate is structural with the at least part of second drive module's heat transfer to radiator simultaneously, thereby the wind channel can discharge first drive module and second drive module's heat. So, the temperature-uniforming plate of this application only one end portion need occupy mounting surface's space, compares original mounting surface and need install a plurality of radiators, and the size of fan housing can correspondingly reduce to can reduce the size and the weight of frequency conversion all-in-one machine complete machine, perhaps under the complete machine size of frequency conversion all-in-one machine is unchangeable, the fan housing can reduce its installation space in frequency conversion all-in-one machine inside.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of an embodiment of the heat dissipation device of the present invention;
FIG. 2 is an exploded view of an embodiment of the heat sink and vapor chamber of the present invention;
FIG. 3 is a schematic view of the connection between the heat sink and the vapor chamber according to another embodiment of the present invention;
FIG. 4 is an exploded view of the heat sink and the vapor chamber shown in FIG. 3;
FIG. 5 is a schematic structural diagram of a temperature equalization plate of the heat dissipation device shown in FIG. 1;
fig. 6 is a schematic structural view of another embodiment of the heat dissipation device of the present invention;
fig. 7 is a schematic structural view of another embodiment of the heat dissipation device of the present invention.
The reference numbers illustrate:
| reference numerals | Name(s) | Reference numerals | Name(s) | |
| 100 | |
33 | Radiating |
|
| 10 | |
50 | |
|
| 10a | Heat |
51 | Plate |
|
| 11 | |
53 | Connecting |
|
| 30 | |
55 | Micro-channel | |
| 31 | |
70 | |
|
| | Avoiding hole | 90 | Flange plate |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, back, 8230; \8230;) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a heat abstractor 100.
In the embodiment of the present invention, as shown in fig. 1, the heat dissipation apparatus 100 is applied to a frequency conversion all-in-one machine, the frequency conversion all-in-one machine includes a first driving module (not shown in the figure) and a second driving module (not shown in the figure), the power of the first driving module is greater than the power of the second driving module, the heat dissipation apparatus 100 includes a fan housing 10, a heat sink 30 and a temperature-equalizing plate 50, the fan housing 10 encloses and forms a heat dissipation air duct 10a, the fan housing 10 has a mounting surface 11, the heat sink 30 is mounted on the mounting surface 11, and at least a part of the structure is disposed on the mounting surface 11 to be in the heat dissipation air duct 10a, one side of the heat sink 30 departing from the fan housing 10 is used for connecting the first driving module, and transmits the heat of the first driving module to the heat dissipation air duct 10a, one end of the temperature-equalizing plate 50 is disposed on the mounting surface 11, and is fixedly connected to at least a part of the structure of the heat sink 30, the other end of the mounting surface 11 is located outside the mounting surface 11, the temperature-equalizing plate 50 is used for connecting the second driving module, and transmits the heat of the heat dissipation air duct 10a through at least a part of the heat sink 30.
In this embodiment, it can be understood that the first driving module and the second driving module may be both IGBT (Insulated Gate Bipolar Transistor) modules, and the first driving module may be a high-power IGBT module, and the second driving module may be a low-power IGBT module, so that the heat sink 30 serves as a main heat dissipation component to dissipate heat from the first driving module, and the temperature equalization plate 50 serves as a sub heat dissipation component, and is fixedly connected to at least a part of the structure of the heat sink 30 through one end portion, so as to transfer heat from the second driving module to the first driving module, and dissipate heat through the first driving module. It should be noted that the number of the temperature equalizing plates 50 is not limited to one, and may be multiple, and the number of the temperature equalizing plates 50 may be selected according to the number of the driving modules, and is not limited in particular.
Specifically, the fan housing 10 includes a flat plate and two side plates respectively disposed on two opposite sides of the flat plate, the flat plate and the two side plates enclose the heat dissipation air duct 10a, and the mounting surface 11 is a surface of the flat plate facing away from the side plates, so that the heat sink 30 can be mounted on the flat plate through the mounting surface 11, and at least a portion of the structure of the heat sink can penetrate through the flat plate to be disposed in the heat dissipation air duct 10 a. In addition, the material of the fan housing 10 can be a metal plate material, and the metal plate material has the advantages of light weight, good rigidity, high precision and the like.
The technical scheme of the application is that the heat radiator 30 and the temperature-equalizing plate 50 are arranged to transfer the heat of the first driving module and the heat of the second driving module to the heat-dissipating air duct 10a for heat dissipation, and meanwhile, when one end of the temperature-equalizing plate 50 penetrates through the mounting surface 11 and the projection of the other end on the mounting surface 11 is located outside the mounting surface 11, that is, only one end of the temperature-equalizing plate 50 occupies the space of the mounting surface 11 of the air hood 10, so as to compare the two whole bodies of the main heat radiator 30 and the auxiliary heat radiator 30 of the existing scheme to be mounted on the air hood 10, the area of the required installation component of mounting surface 11 of this application fan housing 10 can reduce, thereby the size of fan housing 10 itself also can reduce, and then when the size of fan housing 10 reduces, can reduce the size and the weight of frequency conversion all-in-one machine, realize the lightness of whole machine, perhaps under the whole machine size of frequency conversion all-in-one machine is unchangeable, when the size of fan housing 10 diminishes, can save its space that occupies in the inside of frequency conversion all-in-one machine, thereby can utilize this space to place all the other components, make the overall arrangement of the inner space of frequency conversion all-in-one machine better rationalize. In addition, when only one heat sink 30 is provided, only one heat sink 30 needs to be subjected to high-protection operation, so that the operation procedures are reduced, and the hidden danger of insufficient protection caused by the existence of a plurality of heat sinks 30 is reduced.
In an embodiment of the present invention, as shown in fig. 2 to fig. 4, the heat sink 30 includes a base plate 31 and a heat dissipating fin 33, the base plate 31 is installed on the mounting surface 11, one side of the base plate is used for connecting the first driving module, one end of the heat dissipating fin 33 is connected to the other side of the base plate 31, the other end is inserted into the mounting surface 11 and is located in the heat dissipating air duct 10a, and an end of the temperature equalizing plate 50 is fixedly connected to the surface of the heat dissipating fin 33.
In this embodiment, with the arrangement of the heat dissipation fins 33, the heat dissipation area of the heat sink 30 can be increased to improve the heat dissipation efficiency of the first driving module and the second driving module, the heat dissipation fins 33 can be made of steel, steel-aluminum composite, copper-aluminum composite, or stainless steel, which is not limited specifically herein, and the substrate 31 and the heat dissipation fins 33 can be connected by welding or formed by drawing an integral profile. It can be understood that the surface of the one end of the temperature equalizing plate 50 and the heat dissipating fins 33 may be fixed by adhesive, welding or screwing, so that the temperature equalizing plate 50 can transfer the heat of the second driving module to the heat dissipating fins 33, and then discharge the heat through the heat dissipating air duct 10 a.
In an embodiment of the present invention, as shown in fig. 3 to fig. 4, the base plate 31 is provided with a through avoiding hole 31a, and an end of the temperature equalizing plate 50 penetrates through the avoiding hole 31a to fixedly connect to the surface of the heat dissipating fin 33.
In this embodiment, in order to realize the high protection operation on the heat sink 30, the surface area of the base plate 31 needs to be increased to provide an installation space to install the protection components such as the sealing component 70, and when the surface area of the base plate 31 is increased, one end portion of the temperature-uniforming plate 50 cannot be directly and fixedly connected with the heat dissipation fins 33, so that the present application provides the through avoidance holes 31a on the surface of the base plate 31, so that the one end portion of the temperature-uniforming plate 50 can pass through the avoidance holes 31a and then be fixedly connected to the surface of the heat dissipation fins 33, thereby facilitating the installation operation of the temperature-uniforming plate 50 and the heat dissipation fins 33.
In an embodiment of the present invention, as shown in fig. 2 to fig. 4, the temperature equalizing plate 50 includes a plate main body 51 and a connecting portion 53, the plate main body 51 is used for connecting the second driving module, the connecting portion 53 is bent and disposed at an end portion of the plate main body 51, and the connecting portion 53 is disposed through the mounting surface 11 and fixedly connected to the surface of the heat dissipating fin 33.
In the present embodiment, it can be understood that the plate main body 51 can realize connection with the second driving module, and transfer heat of the second driving module to the connecting portion 53, and further transfer heat to the heat dissipation fins 33 through the connecting portion 53. Wherein, connecting portion 53 is buckled and is located under the one end of board main part 51, can buckle and set up the machine-shaping that can be convenient for temperature-uniforming plate 50 down to can be formed with the chamfer under buckling, can avoid the staff to touch the junction between them and take place the scratch when the installation under the setting of chamfer.
In an embodiment of the present invention, as shown in fig. 3, the plate main body 51 is extended along a direction away from the heat dissipation fins 33, the extending direction of the plate main body 51 is disposed at an included angle with the mounting surface 11, and the distance between the plate main body 51 and the mounting surface 11 is gradually reduced along the extending direction.
In this embodiment, a phase change working medium is poured into the temperature equalizing plate 50, and the temperature equalizing plate 50 can change phase after absorbing the heat of the second heat dissipation module, the cooling medium changes from a liquid state to a gas state, thereby reaching the heat dissipation fins 33 through the inside, after reaching, the cooling medium can change from the gas state to the liquid state again under the heat dissipation cooling of the fans and the heat dissipation fins 33 in the heat dissipation air duct 10a, thereby when the frequency conversion all-in-one machine is vertically placed relative to the external surface, in order to realize the liquid backflow, therefore, the distance between the plate main body 51 and the mounting surface 11 is gradually reduced along the extending direction, the plate main body 51 is inclined relative to the mounting surface 11, so that the liquid medium in the inclined state can flow back through its own gravity, and thus the heat dissipation of the second drive module is realized by repeated circulation.
In an embodiment of the present invention, as shown in fig. 5, the temperature-uniforming plate 50 has a plurality of micro-channels 55 therein, the plate main body 51 is communicated with the inside of the connecting portion 53, the micro-channels 55 are spaced inside the plate main body 51 and the connecting portion 53 in a direction perpendicular to the extending direction, and a cooling medium is provided inside each micro-channel 55, and the cooling medium is used for transferring heat of the second driving module to the heat dissipation fins 33.
In this embodiment, it can be understood that the inside of each micro channel 55 may be filled with a cooling medium, the cooling medium is in a liquid state, the second driving module is in a gaseous state when operating, the heat of the second driving module is transferred to the heat dissipation fins 33 via the internal micro channels 55 to be cooled and condensed into a liquid state, the heat dissipation device 100 is in a wall-mounted structure, the included angle of the temperature equalization plate 50 is favorable for flowing back to the mounting surface of the second driving module, and thus the heat dissipation of the second driving module is realized through repeated circulation. Specifically, the number of micro channels 55 may be two, three, or four, and is not particularly limited herein, and the number of micro channels 55 may be selected according to the installation position of the actual screw hole.
In an embodiment of the present invention, the connecting portion 53 is welded and fixed on the surface of the heat dissipating fin 33.
In this embodiment, when the plate main body 51 of the vapor chamber 50 transfers the heat of the second driving module to the connecting portion 53, in order to improve the heat transfer effect between the connecting portion 53 and the heat dissipating fins 33, the connecting portion 53 can be fixedly connected to the heat dissipating fins 33 by soldering, and the heat conductivity between the connecting portion 53 and the heat dissipating fins 33 is improved by the good heat conductivity of metal.
In an embodiment of the present invention, as shown in fig. 6, the opening is opened on the mounting surface 11, the heat dissipation fins 33 penetrate through the opening on the mounting surface 11, the heat dissipation device 100 further includes a sealing element 70 annularly disposed on the periphery of the heat dissipation fins 33, and the sealing element 70 is disposed between the base plate 31 and the opening of the mounting surface 11 in a sealing manner.
In the present embodiment, it can be understood that, in order to realize a high protection design for the heat sink 30, by providing the sealing member 70, and sealing the sealing member 70 between the through opening of the substrate 31 and the mounting surface 11, it is possible to prevent external impurities from entering the substrate 31 through the gap, for example, prevent water or dust from flowing in through the gap. The sealing member 70 may be a sealing ring, a sealing strip or a sealing compound, and is not particularly limited herein.
In an embodiment of the present invention, as shown in fig. 7, the opening is opened on the mounting surface 11, the heat dissipation fin 33 is inserted into the mounting surface 11 through the opening, the heat dissipation device 100 further includes a flange 90, the substrate 31 is connected to one end of the heat dissipation fin 33 through the flange 90, and the flange 90 is fixedly connected to the mounting surface 11 at the opening.
In this embodiment, if the cross-sectional areas of the heat dissipation fins 33 and the base plate 31 are the same, when there is an opening, the base plate 31 cannot be connected to the wind shield 10, and therefore, by providing the flange 90, when the base plate 31 is fixedly connected to the flange 90, the base plate 31 is connected to the wind shield 10 through the flange 90 by screw connection with the sheet metal part through the flange 90, and by providing the flange 90, the stability of connection between the base plate 31 and the wind shield 10 can be improved, and the flange 90 also has a protection effect, for example, a certain sealing property.
Furthermore, the utility model discloses still provide a frequency conversion all-in-one (not shown in the figure), this frequency conversion all-in-one includes casing (not shown in the figure), first drive module, second drive module and heat abstractor 100, and the inside of casing is located to first drive module, and the inside of casing is located to second drive module, and heat abstractor 100 is as above heat abstractor 100, and heat abstractor 100 locates the inside of casing, and radiator 30 connects in first drive module, and samming board 50 connects in second drive module.
It should be noted that, the detailed structure of the heat dissipation device 100 can refer to the above-mentioned embodiment of the heat dissipation device 100, and is not described herein again; because the utility model discloses an above-mentioned heat abstractor 100 has been used in the frequency conversion all-in-one, consequently, the utility model discloses a heat abstractor 100's embodiment includes all technical scheme of the whole embodiments of above-mentioned heat abstractor 100, and the technological effect that reaches is also identical, and is no longer repeated herein.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a heat abstractor, is applied to the frequency conversion all-in-one, the frequency conversion all-in-one includes first drive module and second drive module, the power of first drive module is greater than the power of second drive module, its characterized in that, heat abstractor includes:
the fan cover is enclosed to form a heat dissipation air duct and is provided with an installation surface;
the radiator is arranged on the mounting surface, at least part of the radiator is arranged on the mounting surface in a penetrating mode so as to be located in the radiating air duct, and one side, away from the fan cover, of the radiator is used for being connected with the first driving module and transmitting heat of the first driving module into the radiating air duct; and
one end of the temperature equalizing plate penetrates through the mounting surface and is fixedly connected to at least part of the structure of the radiator, the projection of the other end of the temperature equalizing plate on the mounting surface is located outside the mounting surface, and the temperature equalizing plate is used for being connected with the second driving module and transmitting the heat of the second driving module into the heat dissipation air duct through at least part of the structure of the radiator.
2. The heat dissipating device of claim 1, wherein said heat sink comprises:
the substrate is arranged on the mounting surface, and one side of the substrate is used for connecting the first driving module; and
one end of each radiating fin is connected with the other side of the base plate, the other end of each radiating fin penetrates through the mounting surface and is located in the corresponding radiating air duct, and one end of each temperature equalizing plate is fixedly connected to the surface of each radiating fin.
3. The heat dissipation device as claimed in claim 2, wherein the base plate has an avoiding hole formed therethrough, and an end of the temperature equalizing plate is disposed through the avoiding hole to be fixedly connected to the surface of the heat dissipation fin.
4. The heat dissipating device according to claim 2, wherein the temperature equalizing plate comprises a plate main body and a connecting portion, the plate main body is used for connecting the second driving module, the connecting portion is bent and disposed at an end of the plate main body, and the connecting portion is disposed on the mounting surface and fixedly connected to the surface of the heat dissipating fin.
5. The heat dissipating device of claim 4, wherein said plate body extends in a direction away from said fins, said plate body extends at an angle to said mounting surface, and a distance between said plate body and said hood decreases along said extending direction.
6. The heat dissipating device according to claim 5, wherein the vapor chamber has a plurality of micro-channels therein, the plate body communicates with an interior of the connecting portion, and the micro-channels are spaced apart from each other in a direction perpendicular to the extending direction;
the interior of each micro-channel is provided with a cooling medium which is used for transferring the heat of the second driving module to the heat dissipation fins.
7. The heat dissipating device of claim 4, wherein said connecting portion is welded to a surface of said heat dissipating fin.
8. The heat dissipating device as claimed in any one of claims 2 to 7, wherein the mounting surface has openings, the heat dissipating fins are disposed through the openings and penetrate the mounting surface, and the heat dissipating device further comprises a sealing member disposed around the periphery of the heat dissipating fins, the sealing member being sealed between the substrate and the openings of the mounting surface.
9. The heat dissipating device of any one of claims 2 to 7, wherein the mounting surface has openings, the fins penetrate the mounting surface through the openings, the heat dissipating device further comprises a flange, the substrate is connected to one end of the fins through the flange, and the flange is fixedly connected to the mounting surface at the openings.
10. The utility model provides a frequency conversion all-in-one which characterized in that includes:
a housing;
the first driving module is arranged in the shell;
the second driving module is arranged in the shell; and
the heat dissipation device according to any one of claims 1 to 9, wherein the heat dissipation device is disposed inside the housing, the heat sink is connected to the first driving module, and the temperature-equalizing plate is connected to the second driving module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222407889.8U CN218417099U (en) | 2022-09-09 | 2022-09-09 | Heat abstractor and frequency conversion all-in-one |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222407889.8U CN218417099U (en) | 2022-09-09 | 2022-09-09 | Heat abstractor and frequency conversion all-in-one |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218417099U true CN218417099U (en) | 2023-01-31 |
Family
ID=85031641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222407889.8U Active CN218417099U (en) | 2022-09-09 | 2022-09-09 | Heat abstractor and frequency conversion all-in-one |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218417099U (en) |
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2022
- 2022-09-09 CN CN202222407889.8U patent/CN218417099U/en active Active
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