CN201467613U - Combined radiator for electronic device with enclosed shell - Google Patents
Combined radiator for electronic device with enclosed shell Download PDFInfo
- Publication number
- CN201467613U CN201467613U CN200920109586XU CN200920109586U CN201467613U CN 201467613 U CN201467613 U CN 201467613U CN 200920109586X U CN200920109586X U CN 200920109586XU CN 200920109586 U CN200920109586 U CN 200920109586U CN 201467613 U CN201467613 U CN 201467613U
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- Prior art keywords
- heat
- conducting
- fixed support
- fan
- pcb
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- Expired - Lifetime
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Abstract
The utility model discloses a combined radiator with a fan, a heat-conducting tube and the like of an electronic device with an enclosed shell. The purpose of the utility model is to solve the contradiction that the electronic device with the enclosed shell requires both a high protection grade and good radiation. The main points of the technical scheme are as follows: the structure of the combined radiator comprises the fan, the shell with fins, a heat-conducting film, a PCB-fixing support, the heat-conducting tube and a chip heat-conducting plate. The heat-conducting tube is connected with the chip heat-conducting plate and the PCB-fixing support, the vertical cross section of the side plate of the PCB-fixing support is wedged, the wedged surface is tightly contacted with the inner wall of the shell, the inner side of the shell and the matching surface of the side plate of the PCB-fixing support are inclined planes with the same angle, and the compressible heat-conducting film is arranged between the contact surfaces to ensure that the PCB-fixing support can be tightly contacted with the inner wall of the shell; the sheet heat-dissipating structure is arranged on the outer side of the shell; and the fan is fixed on the ends of the fins, so that air passages are formed to dissipate the heat of the fins with the convected cool air. The utility model is applicable to the heat dissipation of electronic devices with enclosed shells.
Description
Technical field
The utility model relates to the combination heat dissipation technology field of electronic equipment, more particularly, relates to the combination heat abstractor of a kind of closed shell electronic equipment blower fan and heat pipe etc.
Background technology
Electronic equipments such as industrial, military exchange, server, rack are limited by adverse circumstances, often need housing to adopt closed structure; In the equipment operation, devices such as exchange chip, power module can produce heat, and the device interior ambient temperature is raise, and influence the useful life and the performance of electronic devices and components.Traditional implementation method is that the heat of chip is transmitted to the engine housing radiated rib by inner heat-transfer device and dispels the heat; Radiating effect is limited, and pcb board is changed, safeguards inconvenient.Chinese patent grant number CN2599502Y, January 14 2004 Granted publication day, the utility model name is called the airtight radiator of heat pipe-type, this granted patent discloses by improving the layout general layout of radiator, rely on the separate part effect to improve heat exchange, the radiating efficiency of airtight electrical control cubicles, its weak point is the maintainability that does not relate to by radiating element, can not control by the radiating effect of radiating element.
The utility model content
The purpose of this utility model is to overcome deficiency of the prior art, provides the combination heat abstractor of a kind of closed shell electronic equipment blower fan and heat pipe etc. and inside to be changed easy to maintenance by radiating element.
The technical solution of the utility model is that the combination construction for heat radiating device of this kind closed shell electronic equipment is made up of fan, flange-cooled housing, heat conducting film, PCB fixed support, heat pipe, chip heat-conducting plate.Heat pipe connects chip heat-conducting plate and PCB fixed support, and the PCB fixed support closely contacts with casing inner wall, between machine PCB fixed support and the casing inner wall contact-making surface compressible heat conducting film is arranged, and guarantees that the PCB fixed support closely contacts with casing inner wall; The housing shell side is the sheet radiator structure; The fin end is fixed with fan, forms the air channel, is the air-cooled heat loss through convection of fin.
The PCB fixed support is metal or other heat-conductings;
Flange-cooled housing is metal or other heat-conductings;
Heat pipe needs closely fixing at chip heat-conducting plate end and PCB fixed support end;
Heat pipe preferably adopts heat-conducting at the immobilization material of chip heat-conducting plate end and PCB fixed support end.
The fan speed Based Intelligent Control, the fan work situation is controlled by the casing internal circuit, the internal temperature height, rotating speed raises, and temperature is low, and rotating speed reduces.The fan control cable is connected with internal control circuit through the hull outside connector.
The radiating subassembly of internal mode blocking is made up of heat conducting film, PCB fixed support, heat pipe, chip heat-conducting plate, can plug on the guide rail in casing.
The beneficial effects of the utility model are: solved the closed shell electronic equipment and not only required high-protection level, but also required the contradiction of good heat radiating.Modular structure is not influencing under the radiating effect condition, and the functional module integral replacing is convenient.
Description of drawings
Fig. 1 makes up the construction for heat radiating device front view;
Fig. 2 makes up the construction for heat radiating device vertical view;
Fig. 3 can plug the radiating module vertical view;
Fig. 4 can plug the installation diagram of radiating module and complete machine.
Embodiment
The utility model will be further described below in conjunction with accompanying drawing.
Fig. 1 makes up the construction for heat radiating device front view, Fig. 2 makes up the construction for heat radiating device vertical view, has indicated the combination heat abstractor to be made up of fan 1, flange-cooled housing 2, heat conducting film 3, PCB fixed support 4, heat pipe 5, chip heat-conducting plate 6.More than 6 parts be divided into inside chip heat-conductive assembly part and outside heat abstractor part.Inside chip heat-conductive assembly part is made up of heat pipe 5, chip heat-conducting plate 6, PCB fixed support 4, heat conducting film 3, and heat pipe 5 is fixed with die terminals heat pipe fixed head 7, radiating end heat pipe fixed head 8 respectively on chip heat-conducting plate 6 and PCB fixed support 4.Outside heat abstractor part is made up of fan 1, flange-cooled housing 2.PCB fixed support 4, die terminals heat pipe fixed head 7, radiating end heat pipe fixed head 8, flange-cooled housing 2 are made by aluminum alloy materials.
Heat conduction path: the heat the during operation of PCB chip at first conducts to chip heat-conducting plate 6, conducts to aluminium alloy PCB fixed support 4 through heat pipe 5, die terminals heat pipe fixed head 7 (the auxiliary heat pipe that compresses) then, conducts to flange-cooled housing 2 through heat conducting film 3.PCB fixed support 4 side plate vertical cross-sections are shaped as wedge shape, lozenges closely contacts with casing inner wall, the casing inboard is the inclined-plane of equal angular with PCB fixed support 4 side plate mating surfaces, and compressible heat conducting film 3 (about 1MM is thick) is arranged between contact-making surface, guarantees that guide rail closely contacts with casing inner wall.The housing shell side is the sheet radiator structure, and the fin end is fixed with fan, forms the air channel, is the air-cooled heat loss through convection of fin.
Fig. 3 can plug the installation diagram that radiating module vertical view, Fig. 4 can plug radiating module and complete machine, indicated formations such as inside chip heat-conductive assembly part (forming) and PCB can plug radiating module by heat pipe 5, chip heat-conducting plate 6, PCB fixed support 4, heat conducting film 3, can in casing, plug on the guide rail, and by panel place locking, but when project installation, functional mapping, later maintenance integral replacing.Inside and outside radiator structure is independent of each other; Panel has hermetically-sealed construction, and after panel and casing were fixing, the housing degree of protection reached IP67.Internal heat dissipating device modularization is convenient to safeguard.
The above only is process of the present utility model and method embodiment; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and essence, being made, be equal to replacement, improvement etc., all should be included within the utility model protection range.
Claims (8)
1. the combination heat abstractor of a closed shell electronic equipment is characterized in that, is made up of fan (1), flange-cooled housing (2), heat conducting film (3), PCB fixed support (4), heat pipe (5), chip heat-conducting plate (6); Heat pipe (5) connects chip heat-conducting plate (6) and PCB fixed support (4), and PCB fixed support (4) closely contacts with casing inner wall, and compressible heat conducting film (3) is arranged between PCB fixed support (4) and the casing inner wall contact-making surface; The housing shell side is the sheet radiator structure; The fin end is fixed with fan.
2. combination heat abstractor according to claim 1 is characterized in that, PCB fixed support (4) is a heat-conducting.
3. combination heat abstractor according to claim 1 is characterized in that, flange-cooled housing (2) is a heat-conducting.
4. combination heat abstractor according to claim 1 is characterized in that, heat pipe (5) is closely fixing at chip heat-conducting plate (6) end and PCB fixed support (4) end.
5. combination heat abstractor according to claim 4 is characterized in that, heat pipe (5) adopts heat-conducting at the immobilization material of chip heat-conducting plate (6) end and PCB fixed support (4) end.
6. combination heat abstractor according to claim 1 is characterized in that, fan (1) speed Based Intelligent Control, and fan (1) working condition is controlled by the casing internal circuit, the internal temperature height, rotating speed raises, and temperature is low, and rotating speed reduces.
7. according to claim 1 or 6 described combination heat abstractors, it is characterized in that fan control cable (9) is connected with internal control circuit through the hull outside connector.
8. combination heat abstractor according to claim 1 is characterized in that, the radiating subassembly of internal mode blocking is made up of heat conducting film (3), PCB fixed support (4), heat pipe (5), chip heat-conducting plate (6), can plug on the guide rail in casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920109586XU CN201467613U (en) | 2009-07-02 | 2009-07-02 | Combined radiator for electronic device with enclosed shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920109586XU CN201467613U (en) | 2009-07-02 | 2009-07-02 | Combined radiator for electronic device with enclosed shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201467613U true CN201467613U (en) | 2010-05-12 |
Family
ID=42394957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920109586XU Expired - Lifetime CN201467613U (en) | 2009-07-02 | 2009-07-02 | Combined radiator for electronic device with enclosed shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201467613U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101600325B (en) * | 2009-07-02 | 2011-12-21 | 北京东土科技股份有限公司 | Combination heat sink of closed shell electronic equipment |
| CN102510703A (en) * | 2011-10-24 | 2012-06-20 | 国电南京自动化股份有限公司 | Power device |
| CN104363738A (en) * | 2010-08-09 | 2015-02-18 | 亚马逊科技公司 | Data center with fin modules |
| CN105934854A (en) * | 2013-08-16 | 2016-09-07 | 莫列斯有限公司 | Connector with thermal management |
| CN106949441A (en) * | 2017-04-17 | 2017-07-14 | 四川欧利普照明科技开发有限公司 | A kind of etch-proof LED radiator |
| CN109462968A (en) * | 2018-12-27 | 2019-03-12 | 深慧视(深圳)科技有限公司 | A kind of radiator of multi-surface heat-producing device |
| CN112997592A (en) * | 2018-09-10 | 2021-06-18 | Caci联邦股份有限公司 | Deployable hardened housing unit |
| CN115175537A (en) * | 2022-08-08 | 2022-10-11 | 中车南京浦镇车辆有限公司 | No fan heat pipe heat conduction device of 3U electronic equipment for railway locomotive |
-
2009
- 2009-07-02 CN CN200920109586XU patent/CN201467613U/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101600325B (en) * | 2009-07-02 | 2011-12-21 | 北京东土科技股份有限公司 | Combination heat sink of closed shell electronic equipment |
| CN104363738A (en) * | 2010-08-09 | 2015-02-18 | 亚马逊科技公司 | Data center with fin modules |
| CN102510703A (en) * | 2011-10-24 | 2012-06-20 | 国电南京自动化股份有限公司 | Power device |
| CN105934854A (en) * | 2013-08-16 | 2016-09-07 | 莫列斯有限公司 | Connector with thermal management |
| CN105934854B (en) * | 2013-08-16 | 2018-10-23 | 莫列斯有限公司 | Connector with heat management |
| US10367283B2 (en) | 2013-08-16 | 2019-07-30 | Molex, Llc | Connector with thermal management |
| CN106949441A (en) * | 2017-04-17 | 2017-07-14 | 四川欧利普照明科技开发有限公司 | A kind of etch-proof LED radiator |
| CN112997592A (en) * | 2018-09-10 | 2021-06-18 | Caci联邦股份有限公司 | Deployable hardened housing unit |
| US11659670B2 (en) | 2018-09-10 | 2023-05-23 | CACI, Inc.—Federal | Deployable hardened housing units |
| CN109462968A (en) * | 2018-12-27 | 2019-03-12 | 深慧视(深圳)科技有限公司 | A kind of radiator of multi-surface heat-producing device |
| CN115175537A (en) * | 2022-08-08 | 2022-10-11 | 中车南京浦镇车辆有限公司 | No fan heat pipe heat conduction device of 3U electronic equipment for railway locomotive |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100512 |