CN215248106U - Automatic chip testing equipment - Google Patents
Automatic chip testing equipment Download PDFInfo
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- CN215248106U CN215248106U CN202121558116.9U CN202121558116U CN215248106U CN 215248106 U CN215248106 U CN 215248106U CN 202121558116 U CN202121558116 U CN 202121558116U CN 215248106 U CN215248106 U CN 215248106U
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Abstract
The utility model discloses a chip automatic test equipment, include: the test machine comprises a test machine table, a test module and a control module, wherein a plurality of test modules are arranged on the test machine table in an array manner; the feeding and discharging mechanism is arranged on the side edge of the testing machine table and used for placing a material tray of the chip; one feeding and discharging end of the flying shuttle mechanism is arranged at the feeding and discharging mechanism, and the other feeding and discharging end of the flying shuttle mechanism is arranged at the testing module; the feeding and discharging machine head mechanism is arranged above the feeding and discharging mechanism; and the testing machine head mechanism is arranged above the testing machine table. The utility model discloses an automatic test has replaced artifical work, adopts two shuttle mechanisms that fly of carrying the material platform reciprocating motion in turn to satisfy the high efficiency's of board demand to improve the whole efficiency of board, not only fix a position accurately, can improve efficiency of software testing moreover greatly, support the advantage of multiunit chip material loading, unloading, test simultaneously.
Description
Technical Field
The utility model relates to a test equipment technical field has especially related to an automatic test equipment of chip.
Background
The functional test item refers to a process of carrying out corresponding condition reinforcing experiments on the condition of the production performance of the product by simulating various factors involved in the actual use conditions of the product.
Generally, electronic devices, whether original components, parts, components, complete machines, etc., require testing. The test is completed by manufacturers or top-grade electronic appliance detection technology companies, and the problems of the products are found through the test and are timely modified, so that the problems of the products reaching the hands of consumers are reduced as much as possible or the reliability of the products is improved.
The traditional chip test mainly comprises the steps that a single chip is manually placed on test equipment for testing, human eyes observe the test chip and correspondingly record a test result, the test chip is manually classified, placed on a tray and the like after the test is finished, the production efficiency is low, and the requirement for large-scale efficient production cannot be met.
In the prior art, a manipulator is adopted for feeding and discharging during chip testing, a feeding and discharging area and a testing area are separated and respectively taken and placed through the manipulator, the manipulator in the feeding and discharging area takes materials from a material tray to a flying shuttle to reciprocate, then the manipulator in the testing area takes materials from the flying shuttle to the testing area to perform testing, when the testing area tests chips, the manipulator in the testing area takes back the tested chips to place on the flying shuttle, then the flying shuttle moves to the feeding and discharging area, and then the chips are discharged through the manipulator, and a motor screw mechanism is generally adopted to convey the flying shuttle between the feeding and discharging area and the testing area in a reciprocating mode, so that only one flying shuttle can reciprocate, and the requirements of the whole machine for high speed and efficiency cannot be met.
In order to improve production efficiency, the prior art also has three-dimensional module control manipulator to get the blowing, then places and test on independent survey test panel, because the charging tray is inconsistent with the interval that survey test panel placed the chip, the material loading method that adopts at present utilizes suction nozzle absorption chip one by one to carry out material loading or unloading, though compare in the manual work, efficiency has improved not seldom, nevertheless has following defect: the feeding and discharging speeds are still slow, the efficiency is low, and when the chip is tested, the feeding manipulator waits for the feeding after taking materials, and the discharging manipulator waits for the test to finish taking materials, which is time-consuming.
Disclosure of Invention
Not enough to prior art exists, the utility model aims at providing a chip automatic test equipment has replaced artifical work through automatic test, adopts two shuttle mechanism alternate reciprocating motion that fly of carrying material platform to satisfy board high efficiency's demand to improve the whole efficiency of board, not only fix a position accurately, can improve efficiency of software testing moreover greatly, support the advantage of multiunit chip material loading simultaneously, unloading, test.
In order to achieve the above purpose, the utility model adopts the technical scheme that: an automatic chip test apparatus, comprising:
the testing machine comprises a testing machine table, wherein a plurality of testing modules are arranged on the testing machine table in an array mode, each testing module comprises a testing carrier, a testing heating assembly and a testing moving assembly, each testing carrier is used for placing and testing a chip to be tested, each testing heating assembly is arranged above each testing carrier, and each testing moving assembly drives each testing heating assembly to press and heat the chip on each testing carrier;
the feeding and discharging mechanism is arranged on the side edge of the testing machine table and used for placing a material tray of the chip;
one feeding and discharging end of the flying shuttle mechanism is arranged at the feeding and discharging mechanism, and the other feeding and discharging end of the flying shuttle mechanism is arranged at the testing module;
the feeding and discharging machine head mechanism is arranged above the feeding and discharging mechanism and used for picking and placing chips between the feeding and discharging mechanism and the flying shuttle mechanism;
the testing machine head mechanism is arranged above the testing machine table and used for picking and placing the chip between the testing carrier and the flying shuttle mechanism;
the shuttle flying mechanism comprises a bottom plate, a first sliding rail, a second sliding rail, a first guide plate, a second guide plate and a shuttle flying driving module, wherein the first sliding rail and the second sliding rail are arranged on the bottom plate in parallel; the first sliding rail is connected with a first support in a sliding mode, and a first material carrying platform is arranged at the upper portion of the first support; the first guide plate is provided with a first guide groove, and the first guide groove limits a moving path of the first material loading platform; a second support is connected to the second slide rail in a sliding manner, and a second material carrying table is arranged at the upper part of the second support; a second guide groove is formed in the second guide plate, and the second guide groove limits a moving path of the second material loading platform; the flying shuttle driving module is respectively connected with the first support and the second support and used for driving the first support and the second support to move relatively.
As a preferred scheme, the first bracket is connected with a lifting line rail through a bracket sliding block, and the first material loading platform is arranged at the top of the lifting line rail; the lateral wall of lift linear rail is connected with first guide way through setting up first gyro wheel, first guide way is the U-shaped.
Preferably, the second guide groove is a linear groove, and the side wall of the second bracket is connected with the second guide groove through a second roller.
As a preferable scheme, the flying shuttle driving module comprises a flying shuttle motor and a flying shuttle transmission belt, the flying shuttle transmission belt is arranged between the first sliding rail and the second sliding rail through two flying shuttle driven wheels, the flying shuttle transmission belt is respectively connected with the first support and the second support, and the flying shuttle motor is connected with one flying shuttle driven wheel through a flying shuttle driving wheel.
As a preferred scheme, the feeding and discharging machine head mechanism comprises at least two groups of feeding and discharging suction nozzle assemblies, a suction nozzle interval adjusting assembly and a feeding and discharging movement assembly, wherein the feeding and discharging suction nozzle assemblies are arranged on the suction nozzle interval adjusting assembly, the suction nozzle interval adjusting assembly is arranged on the feeding and discharging movement assembly, and then the feeding and discharging movement assembly drives the feeding and discharging suction nozzle assemblies to move in the X direction, the Y direction and the Z direction.
As a preferred scheme, the suction nozzle distance adjusting assembly comprises an adjusting fixing plate, an adjusting guide plate, an adjusting driving assembly and a transmission connecting piece, wherein a horizontal through hole is formed in the adjusting fixing plate in a penetrating manner, a horizontal linear guide rail is fixedly arranged on one side of the adjusting fixing plate, and a vertical linear guide rail is arranged on the other side of the adjusting fixing plate; the feeding and discharging suction nozzle assembly is arranged on the horizontal linear guide rail in a sliding manner; the adjusting guide plate is arranged on the vertical linear guide rail in a sliding manner; a plurality of fan-shaped dispersed adjusting guide grooves are formed in the adjusting guide plate, one end of the transmission connecting piece is fixedly connected with the feeding and discharging suction nozzle assembly, and the other end of the transmission connecting piece extends through the horizontal through hole and is arranged in the adjusting guide grooves; the adjusting and driving assembly drives the adjusting guide plate to move on the vertical linear guide rail, and then drives the feeding and discharging suction nozzle assembly to move on the horizontal linear guide rail through the transmission connecting piece.
As a preferred scheme, the testing machine head mechanism comprises at least two groups of testing nozzle assemblies and testing movement assemblies, wherein the testing nozzle assemblies are arranged on the testing movement assemblies, and then the testing movement assemblies drive the testing nozzle assemblies to move in the X direction, the Y direction and the Z direction.
As an optimal scheme, go up unloading mechanism includes at least one and goes up the unloading subassembly, go up the unloading subassembly including going up unloading material frame, going up the unloading lead screw, go up the unloading nut, go up the unloading motor and set up in the below position of going up unloading material frame, go up the unloading motor and be connected with the transmission of going up unloading nut through going up the unloading belt, go up in unloading lead screw cover locates the unloading nut, and the upper portion of going up the unloading lead screw runs through from the bottom of going up unloading material frame and sets up in going up unloading material frame.
As an optimal scheme, go up unloading subassembly department and be provided with and move the charging tray module, move the charging tray module and include hold-in range straight line module, move material lift cylinder, move the material clamping jaw, hold-in range straight line module drive moves the material clamping jaw and goes up unloading subassembly intervallic motion at least two, move material lift cylinder drive and move the material clamping jaw and do elevating movement on last unloading subassembly, it is used for going up unloading subassembly department clamp to get the charging tray to move the material clamping jaw.
As a preferred scheme, chip automatic test equipment still includes the rotatory module of chip, the rotatory module of chip includes rotary drive subassembly, rotary clamping jaw, rotary drive subassembly drive rotary clamping jaw is rotary motion, rotary clamping jaw department is provided with rotary sensor, and rotary clamping jaw is used for fixed chip.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the shuttle flying mechanisms of the two material loading platforms alternately reciprocate to meet the requirement of the machine platform on high speed and high efficiency, so that the overall efficiency of the machine platform is improved;
(2) the automatic test replaces manual labor, so that the positioning is accurate, the test efficiency can be greatly improved, and the advantages of simultaneously feeding, discharging and testing a plurality of groups of chips are supported;
(3) the feeding and discharging suction nozzle assembly realizes the increase or reduction adjustment of the distance in the horizontal direction, so that chips placed at different distances between the adsorption material tray and the material loading platform by the feeding and discharging suction nozzle assembly are supported, the simultaneous feeding or discharging of a plurality of chips is realized, the feeding and discharging efficiency is greatly improved, and the feeding and discharging suction nozzle assembly is provided with an independent suction nozzle cylinder to independently feed or discharge the chips;
(4) be provided with chip rotation module, when the orientation of the chip on the charging tray was inconsistent with the orientation of placing on the test carrier, can carry out the orientation adjustment through chip rotation module.
Drawings
Fig. 1 is an overall structure front view of the present invention;
fig. 2 is a top view of the overall structure of the present invention;
fig. 3 is a side view of the overall structure of the present invention;
FIG. 4 is a first schematic structural diagram of a shuttle flying mechanism according to the present invention;
FIG. 5 is a schematic structural diagram of a second shuttle flying mechanism according to the present invention;
FIG. 6 is a schematic structural diagram of a test module according to the present invention;
fig. 7 is a schematic structural view of the feeding and discharging head mechanism of the present invention;
fig. 8 is an enlarged view of fig. 7 at a in the present invention;
FIG. 9 is a schematic structural view of a nozzle spacing adjustment assembly of the present invention;
FIG. 10 is a schematic view of a test nozzle assembly according to the present invention;
fig. 11 is a schematic structural view of the feeding and discharging assembly of the present invention;
fig. 12 is a schematic structural view of the material transfer tray module of the present invention;
fig. 13 is a first schematic structural diagram of a chip rotation module according to the present invention;
fig. 14 is a second schematic structural view of the chip rotation module according to the present invention;
wherein: the device comprises a testing machine table 1, a testing module 2, a testing carrier 3, a testing heating component 4, a testing moving component 5, a loading and unloading mechanism 6, a flying shuttle mechanism 7, a loading and unloading machine head mechanism 8, a testing machine head mechanism 9, a bottom plate 10, a first slide rail 11, a second slide rail 12, a first guide plate 13, a second guide plate 14, a flying shuttle driving module 15, a first bracket 16, a first material carrying platform 17, a first guide groove 18, a second bracket 19, a second material carrying platform 20, a second guide groove 21, a bracket slide block 22, a lifting line rail 23, a flying shuttle motor 24, a flying shuttle driving belt 25, a flying shuttle driven wheel 26, a flying shuttle driving wheel 27, a flying shuttle 28, a testing main board 29, a testing plug board 30, a testing slot 31, a heating rod 32, a heating loading and unloading installation part 33, a testing linear module 34, a testing lifting cylinder 35, a heating sensor 36, a suction nozzle component 37, a suction nozzle interval adjusting component 38, a test main board 29, a testing main board, a testing machine head testing, A feeding and discharging motion assembly 39, an adjusting fixing plate 40, an adjusting guide plate 41, an adjusting drive assembly 42, a transmission connecting piece 43, a horizontal through hole 44, a horizontal linear guide rail 45, a vertical linear guide rail 46, an adjusting guide groove 47, a feeding and discharging sliding support 48, a feeding and discharging suction nozzle cylinder 49, a feeding and discharging suction nozzle 50, an X-direction moving module 51, a Y-direction moving module 52, a Z-direction moving module 53, an adjusting screw rod 54, an adjusting nut 55, an adjusting motor 56, an adjusting coupling 57, a testing suction nozzle assembly 58, a testing motion assembly 59, a testing suction nozzle lifting cylinder 60, a testing suction nozzle head 61, a suction nozzle head support 62, a testing suction nozzle mounting plate 63, a feeding and discharging assembly 64, a feeding and discharging material frame 65, a feeding and discharging screw rod 66, a feeding and discharging nut 67, a motor 68, a feeding and discharging belt 69, a separating and feeding and discharging assembly 70, a waiting material assembly feeding and discharging assembly 71, an empty material assembly 72, The device comprises an NG material loading and unloading assembly 73, a material moving tray module 74, a synchronous belt linear module 75, a material moving lifting cylinder 76, a material moving clamping jaw 77, a material moving plate 78, a material moving cylinder 79, a material moving clamping jaw 80, a chip rotating module 81, a rotating driving assembly 82, a rotating clamping jaw 83, a rotating sensor 84, a rotating driving motor 85, a rotating driving main wheel 86, a rotating driving guide wheel 87, a rotating driving driven wheel 88 and a rotating transmission belt 89.
Detailed Description
The invention will be further described with reference to specific embodiments. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Example (b):
as shown in fig. 1 to 6, an automatic chip testing apparatus includes:
the testing machine comprises a testing machine table 1, wherein a plurality of testing modules 2 are arranged on the testing machine table 1 in an array mode, each testing module 2 comprises a testing carrier 3, a testing heating component 4 and a testing moving component 5, each testing carrier 3 is used for placing and testing a chip to be tested, each testing heating component 4 is arranged above each testing carrier 3, and each testing moving component 5 drives each testing heating component 4 to press and heat the chip on each testing carrier 3;
the feeding and discharging mechanism 6 is arranged on the side edge of the testing machine table 1, and is used for placing a material tray of the chip;
one feeding and discharging end of the flying shuttle mechanism 7 is arranged at the feeding and discharging mechanism 6, and the other feeding and discharging end of the flying shuttle mechanism 7 is arranged at the testing module 2;
the feeding and discharging machine head mechanism 8 is arranged above the feeding and discharging mechanism 6, and is used for picking and placing chips between the feeding and discharging mechanism 6 and the flying shuttle mechanism 7;
the testing machine head mechanism 9 is arranged above the testing machine table 1, and is used for picking and placing chips between the testing carrier 3 and the flying shuttle mechanism 7;
the shuttle flying mechanism 7 comprises a bottom plate 10, a first slide rail 11, a second slide rail 12, a first guide plate 13, a second guide plate 14 and a shuttle flying driving module 15, wherein the first slide rail 11 and the second slide rail 12 are arranged on the bottom plate 10 in parallel; a first support 16 is connected to the first slide rail 11 in a sliding manner, and a first material loading platform 17 is arranged at the upper part of the first support 16; a first guide groove 18 is arranged on the first guide plate 13, and the first guide groove 18 defines a moving path of the first loading platform 17; a second support 19 is connected to the second slide rail 12 in a sliding manner, and a second material loading platform 20 is arranged at the upper part of the second support 19; a second guide groove 21 is formed in the second guide plate 14, and the second guide groove 21 defines a moving path of the second loading platform 20; the shuttle flying driving module 15 is respectively connected with the first bracket 16 and the second bracket 19, and is used for driving the first bracket 16 and the second bracket 19 to perform relative movement.
Preferably, the first bracket 16 is connected with a lifting line rail 23 through a bracket sliding block 22, and the first material loading platform 17 is arranged at the top of the lifting line rail 23; the side walls of the lifting wire rail 23 are connected to the first guide groove 18 by providing a first roller (not shown in the figures due to being mounted in a member), and the first guide groove 18 is U-shaped.
Further, when the first bracket 16 moves, the lifting line rail 23 is driven to move in the first guide groove 18, and the middle position of the first guide groove 18 is lower than the positions of the two ends, so that when the lifting line rail 23 moves along the first guide groove 18, the lifting line rail slides up and down along the first bracket 16, and the lifting function is realized.
More preferably, the second guide groove 21 is a linear groove, and the side wall of the second bracket 19 is connected to the second guide groove 21 by a second roller (not shown in the drawings due to being installed in a member).
Further, the linearity of the movement of the second support 19 is ensured by arranging the linear groove, and the movement path of the second support 19 is limited by arranging the second guide plate 14, so that the relative movement between the first loading platform 17 and the second loading platform 20 is facilitated.
Preferably, the shuttle driving module 15 includes a shuttle motor 24 and a shuttle driving belt 25, the shuttle driving belt 25 is disposed between the first slide rail 11 and the second slide rail 12 through two shuttle driven wheels 26, the shuttle driving belt 25 is respectively connected to the first bracket 16 and the second bracket 19, and the shuttle motor 24 is connected to one of the shuttle driven wheels 26 through a shuttle driving wheel 27.
Specifically, the flying shuttle driving module 15 drives the first material carrying platform 17 and the second material carrying platform 20 to move relatively, so that the first material carrying platform 17 and the second material carrying platform 20 alternately reciprocate, chips to be tested and tested can be rapidly and reciprocally conveyed to the loading and unloading mechanism 6 and the testing machine platform 1, and the overall detection efficiency is greatly improved; the first guide plate 13 limits the movement path of the first material carrying platform 17, so that the first material carrying platform 17 and the second material carrying platform 20 avoid each other when meeting in the middle, the first material carrying platform 17 and the second material carrying platform 20 reciprocate on the same straight line, the occupied space is small, and the structure of the flying shuttle mechanism 7 is more compact.
More specifically, the first material loading platform 17 and the second material loading platform 20 are fixed on two sides of the flying shuttle driving belt 25, and due to the moving characteristic of the flying shuttle driving belt 25, the first material loading platform 17 and the second material loading platform 20 can move relatively, so that the structure is simple and easy to realize.
Further, in order to improve the stability of the transmission efficiency, the shuttle follower 26 is connected to the shuttle follower 27 through the shuttle rotation rod 28, the shuttle follower 27 is connected to the output end of the shuttle motor 24 through the shuttle transmission belt 25, when the shuttle motor 24 is started, the shuttle follower 27 is driven to rotate, so as to drive the shuttle follower 26 to rotate, the shuttle transmission belt 25 rotates around the shuttle follower 26, and thus the first support 16 and the second support 19 are driven to reciprocate in a crossing manner.
Specifically, the test carrier 3 includes a test motherboard 29 and a test board 30, the test board 30 is disposed on the test motherboard 29, a plurality of test slots 31 for placing test chips are disposed on the test board 30, and test probes (not shown in the drawings due to being mounted in a component) are disposed in bottoms of the test slots 31.
More specifically, the test heating assembly 4 includes a heating rod 32 and a heating installation member 33, and the heating rod 32 is fixedly disposed on the heating installation member 33.
Further, the subassembly 5 is removed in the test includes test straight line module 34, test lift cylinder 35 sets up on test straight line module 34, and test straight line module 34 drive test lift cylinder 35 moves at the horizontal direction, test lift cylinder 35's push rod and heating installed part 33 fixed connection, test lift cylinder 35 drive heating rod 32 on the installed part 33 move at vertical direction.
Specifically, the test carrier 3 is further provided with a heating sensor 36 for sensing the position of the chip in the test slot 31.
Further, a chip to be tested is placed in the test slot 31, when the heating sensor 36 senses that the chip is in the test slot 31, the test straight line module 34 drives the heating rod 32 on the test lifting cylinder 35 to move to a position above the chip to be tested, and the test lifting cylinder 35 drives the heating rod 32 to move downwards to press the chip to be tested to be in close contact with the test probe, so that the chip is tested.
Preferably, as shown in fig. 7 to 9, the feeding and discharging head mechanism 8 includes at least two sets of feeding and discharging nozzle assemblies 37, nozzle spacing adjusting assemblies 38, and feeding and discharging moving assemblies 39, the feeding and discharging nozzle assemblies 37 are disposed on the nozzle spacing adjusting assemblies 38, the nozzle spacing adjusting assemblies 38 are disposed on the feeding and discharging moving assemblies 39, and then the feeding and discharging moving assemblies 39 drive the feeding and discharging nozzle assemblies 37 to move in the X direction, the Y direction, and the Z direction.
Preferably, the suction nozzle distance adjusting assembly 38 comprises an adjusting fixing plate 40, an adjusting guide plate 41, an adjusting driving assembly 42 and a transmission connecting piece 43, wherein a horizontal through hole 44 is formed in the adjusting fixing plate 40 in a penetrating manner, a horizontal linear guide rail 45 is fixedly arranged on one side of the adjusting fixing plate 40, and a vertical linear guide rail 46 is arranged on the other side of the adjusting fixing plate 40; the feeding and discharging suction nozzle assembly 37 is slidably arranged on the horizontal linear guide rail 45; the adjusting guide plate 41 is slidably arranged on the vertical linear guide rail 46; a plurality of fan-shaped dispersed adjusting guide grooves 47 are formed in the adjusting guide plate 41, one end of the transmission connecting piece 43 is fixedly connected with the feeding and discharging suction nozzle assembly 37, and the other end of the transmission connecting piece extends through the horizontal through hole 44 and is arranged in the adjusting guide grooves 47; the adjusting driving assembly 42 drives the adjusting guide plate 41 to move on the vertical linear guide rail 46, and then drives the feeding and discharging nozzle assembly 37 to move on the horizontal linear guide rail 45 through the transmission connecting piece 43.
Specifically, the feeding and discharging suction nozzle assembly 37 comprises a feeding and discharging sliding support 48, a feeding and discharging suction nozzle cylinder 49 and a feeding and discharging suction nozzle 50, the upper portion of the feeding and discharging sliding support 48 is slidably arranged on the horizontal linear guide rail 45, the lower portion of the feeding and discharging sliding support 48 is fixedly connected with the feeding and discharging suction nozzle cylinder 49, and the feeding and discharging suction nozzle 50 is connected with a push rod of the feeding and discharging suction nozzle cylinder 49.
Further, the feeding and discharging sliding bracket 48 is connected to the upper and lower 4 sets of horizontal linear guide rails 45, slides along the horizontal linear guide rails 45 to drive the feeding and discharging nozzle cylinder 49 at the lower part to move, and the transmission connecting piece 43 is connected to the feeding and discharging sliding bracket 48. Furthermore, in this embodiment, there are 4 sets of the feeding and discharging nozzle assemblies 37, and the 4 sets of the feeding and discharging nozzle assemblies 37 move in the horizontal direction at equal intervals, and since each set of the feeding and discharging nozzle assemblies 37 is separately provided with the feeding and discharging nozzle cylinder 49, the feeding and discharging nozzles 50 on each set of the feeding and discharging nozzle cylinder 49 are further driven to move up and down separately.
More specifically, the feeding and discharging movement assembly 39 includes an X-direction moving module 51, a Y-direction moving module 52, and a Z-direction moving module 53, the Y-direction moving module 52 is disposed on the X-direction moving module 51, the Z-direction moving module 53 is disposed on the Y-direction moving module 52, and the suction nozzle interval adjustment assembly 38 is disposed on the Z-direction moving module 53.
Specifically, the X-direction moving module 51 is a motor synchronous belt drive known in the art, and is not described herein any more; the Y-direction moving module 52 is a linear module transmission known in the art, and is not described in detail herein; the Z-direction moving module 53 is a motor screw transmission known in the art, and is not described in detail here.
More specifically, the adjusting fixing plate 40 of the nozzle pitch adjusting assembly 38 is disposed on the Z-direction moving module 53.
Further, the adjusting driving assembly 42 includes an adjusting screw 54, an adjusting nut 55, and an adjusting motor 56, the adjusting motor 56 is disposed on the adjusting fixing plate 40, the adjusting motor 56 is connected with the adjusting screw 54 through an adjusting coupling 57, the adjusting screw 54 is sleeved in the adjusting nut 55, and the adjusting nut 55 is fixedly connected to the adjusting guide plate 41. Furthermore, the adjusting motor 56 drives the adjusting guide plate 41 to move along the sliding direction of the vertical linear guide 46 when operating, the adjusting guide plate 41 is provided with fan-shaped dispersing adjusting guide slots 47, because the transmission connecting piece 43 fixedly connected with the feeding and discharging suction nozzle assembly 37 is arranged in the adjusting guide groove 47, the adjusting guide groove 47 is pressed against the transmission connecting piece 43 to drive the feeding and discharging suction nozzle assembly 37 to move, the feeding and discharging suction nozzle assembly 37 is arranged on the horizontal linear guide rail 45 and is limited to slide along the horizontal linear guide rail 45, the distance is increased or decreased and adjusted along the direction of the horizontal linear guide 45 under the driving of the adjusting guide plate 41, thereby support the chip that unloading suction nozzle subassembly 37 placed with different interval sizes in absorption charging tray and first year material platform 17, second year material platform 20, material loading or unloading when realizing a plurality of chips greatly promote unloading efficiency on going up.
Further, the horizontal linear guide rails 45 are linear rails, 4 groups of the horizontal linear guide rails are arranged in parallel in the horizontal direction, and the horizontal through holes 44 are formed among the 4 groups of the horizontal linear guide rails 45.
Preferably, the testing head mechanism 9 includes at least two sets of testing nozzle assemblies 58 and testing kinematic assemblies 59, the testing nozzle assemblies 58 are disposed on the testing kinematic assemblies 59, and the testing kinematic assemblies 59 drive the testing nozzle assemblies 58 to move in the X direction, the Y direction and the Z direction.
Specifically, the testing motion assembly 59 has the same structure as the loading and unloading motion assembly 39, and therefore, the description thereof is omitted.
More specifically, as shown in fig. 10, each group of the test nozzle assemblies 58 includes a test nozzle lifting cylinder 60, a test nozzle head 61, and a nozzle head support 62, the nozzle head support 62 is disposed on the test nozzle lifting cylinder 60, the test nozzle head 61 is disposed on the nozzle head support 62, and the test nozzle lifting cylinder 60 is connected to the test motion assembly 59 through a test nozzle mounting plate 63.
Preferably, as shown in fig. 11, the feeding and discharging mechanism 6 comprises at least one feeding and discharging assembly 64, the feeding and discharging assembly 64 comprises a feeding and discharging material frame 65, a feeding and discharging screw rod 66, a feeding and discharging nut 67 and a feeding and discharging motor 68, the feeding and discharging motor 68 is arranged at the position below the feeding and discharging material frame 65, the feeding and discharging motor 68 is in transmission connection with the feeding and discharging nut 67 through a feeding and discharging belt 69, the feeding and discharging screw rod 66 is sleeved in the feeding and discharging nut 67, and the upper portion of the feeding and discharging screw rod 66 is arranged in the feeding and discharging material frame 65 in a penetrating manner from the bottom of the feeding and discharging material frame 65.
Specifically, the feeding and discharging motor 68 drives the feeding and discharging nut 67 through the feeding and discharging belt 69, and then drives the feeding and discharging screw rod 66 to rotate, so that the material tray in the feeding and discharging material frame 65 is driven to move up and down.
More specifically, in this embodiment, the feeding and discharging assembly 64 has a plurality of groups, which are respectively a material dividing and feeding and discharging assembly 70, a material waiting and discharging assembly 71, an empty material feeding and discharging assembly 72, and an NG material feeding and discharging assembly 73, wherein the material disc of the material dividing and feeding and discharging assembly 70 is used for placing chips qualified in the test, the material disc of the material waiting and discharging assembly 71 is used for placing chips to be tested, the empty material feeding and discharging assembly 72 is used for recycling the empty material disc, and the NG material feeding and discharging assembly 73 is used for placing chips unqualified in the test.
Preferably, as shown in fig. 12, the feeding and discharging assembly 64 is provided with a material moving tray module 74, the material moving tray module 74 includes a synchronous belt linear module 75, a material moving lifting cylinder 76 and a material moving clamping jaw 77, the synchronous belt linear module 75 drives the material moving clamping jaw 77 to move between at least two feeding and discharging assemblies 64, the material moving lifting cylinder 76 drives the material moving clamping jaw 77 to move up and down on the feeding and discharging assembly 64, and the material moving clamping jaw 77 is used for the feeding and discharging assembly 64 to clamp the material tray.
Specifically, the material moving clamping jaw 77 comprises a material moving plate 78, a material moving cylinder 79 and a material moving claw 80, wherein the material moving cylinder 79 is fixedly arranged on the material moving plate 78, and the material moving claw 80 is arranged on a push rod of the material moving cylinder 79. Further, the material moving cylinders 79 are four, and the material moving claws 80 of every two material moving cylinders 79 form a group of clamping claw structures.
Preferably, as shown in fig. 13 to 14, the automatic chip testing equipment further includes a chip rotation module 81, the chip rotation module 81 includes a rotation driving assembly 82 and a rotation clamping jaw 83, the rotation driving assembly 82 drives the rotation clamping jaw 83 to rotate, a rotation sensor 84 is disposed at the rotation clamping jaw 83, and the rotation clamping jaw 83 is used for fixing a chip.
Specifically, the rotary driving assembly 82 includes a rotary driving motor 85, a rotary driving main wheel 86, a rotary driving guide wheel 87, and a rotary driving driven wheel 88, the rotary driving motor 85 is connected to the rotary driving main wheel 86, the rotary driving guide wheel 87, and the rotary driving driven wheel 88 are connected by a rotary transmission belt 89, and the rotary holding claw 83 is disposed on the rotary driving driven wheel 88.
More specifically, when the chip rotation module 81 is provided, when the direction of the chip on the tray is not consistent with the placing direction on the test carrier 3, the direction adjustment can be performed through the chip rotation module 81.
In the specific implementation, the loading and unloading machine head mechanism 8 takes materials from the material tray of the loading and unloading assembly 71 to be loaded, the first material loading platform 17 or the second material loading platform 20 of the flying shuttle mechanism 7 is placed, the flying shuttle mechanism 7 conveys chips to the testing module 2, the core sheet of the testing machine head mechanism 9 is placed in the testing module 2 for testing, the testing machine head mechanism 9 takes back the chips in the testing module 2 after the testing is finished, the first material loading platform 17 or the second material loading platform 20 of the flying shuttle mechanism 7 is placed, the flying shuttle mechanism 7 conveys the chips to the loading and unloading mechanism 6, if the taken-back chips are qualified, the chips are placed in the material tray of the separating and loading and unloading assembly 70, if the chips are unqualified, the chips are put into a material tray of the NG material loading and unloading assembly 73, the actions are repeated, when the chips on the tray of the waiting material loading and unloading assembly 71 are taken out, the tray moving module 74 clamps the empty tray and recovers the empty tray to the empty material loading and unloading assembly 72.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.
Claims (10)
1. An automatic chip test apparatus, comprising:
the testing machine comprises a testing machine table, wherein a plurality of testing modules are arranged on the testing machine table in an array mode, each testing module comprises a testing carrier, a testing heating assembly and a testing moving assembly, each testing carrier is used for placing and testing a chip to be tested, each testing heating assembly is arranged above each testing carrier, and each testing moving assembly drives each testing heating assembly to press and heat the chip on each testing carrier;
the feeding and discharging mechanism is arranged on the side edge of the testing machine table and used for placing a material tray of the chip;
one feeding and discharging end of the flying shuttle mechanism is arranged at the feeding and discharging mechanism, and the other feeding and discharging end of the flying shuttle mechanism is arranged at the testing module;
the feeding and discharging machine head mechanism is arranged above the feeding and discharging mechanism and used for picking and placing chips between the feeding and discharging mechanism and the flying shuttle mechanism;
the testing machine head mechanism is arranged above the testing machine table and used for picking and placing the chip between the testing carrier and the flying shuttle mechanism;
the shuttle flying mechanism comprises a bottom plate, a first sliding rail, a second sliding rail, a first guide plate, a second guide plate and a shuttle flying driving module, wherein the first sliding rail and the second sliding rail are arranged on the bottom plate in parallel; the first sliding rail is connected with a first support in a sliding mode, and a first material carrying platform is arranged at the upper portion of the first support; the first guide plate is provided with a first guide groove, and the first guide groove limits a moving path of the first material loading platform; a second support is connected to the second slide rail in a sliding manner, and a second material carrying platform is arranged at the upper part of the second support; a second guide groove is formed in the second guide plate, and the second guide groove limits a moving path of the second material loading platform; the flying shuttle driving module is respectively connected with the first support and the second support and used for driving the first support and the second support to move relatively.
2. The automatic chip test equipment of claim 1, wherein: the first support is connected with a lifting line rail through a support sliding block, and the first material carrying platform is arranged at the top of the lifting line rail; the lateral wall of lift linear rail is connected with first guide way through setting up first gyro wheel, first guide way is the U-shaped.
3. The automatic chip test equipment of claim 2, wherein: the second guide groove is a linear groove, and the side wall of the second support is connected with the second guide groove through a second roller.
4. The automatic chip test equipment of claim 3, wherein: the flying shuttle driving module comprises a flying shuttle motor and a flying shuttle driving belt, the flying shuttle driving belt is arranged between the first sliding rail and the second sliding rail through two flying shuttle driven wheels, the flying shuttle driving belt is respectively connected with the first support and the second support, and the flying shuttle motor is connected with one flying shuttle driven wheel through a flying shuttle driving wheel.
5. The automatic chip test equipment of claim 1, wherein: the feeding and discharging machine head mechanism comprises at least two groups of feeding and discharging suction nozzle assemblies, a suction nozzle interval adjusting assembly and a feeding and discharging movement assembly, wherein the feeding and discharging suction nozzle assemblies are arranged on the suction nozzle interval adjusting assembly, the suction nozzle interval adjusting assembly is arranged on the feeding and discharging movement assembly, and the feeding and discharging movement assembly drives the feeding and discharging suction nozzle assemblies to move in the X direction, the Y direction and the Z direction.
6. The automatic chip test equipment of claim 5, wherein: the suction nozzle distance adjusting assembly comprises an adjusting fixing plate, an adjusting guide plate, an adjusting driving assembly and a transmission connecting piece, wherein a horizontal through hole is formed in the adjusting fixing plate in a penetrating mode, a horizontal linear guide rail is fixedly arranged on one side of the adjusting fixing plate, and a vertical linear guide rail is arranged on the other side of the adjusting fixing plate; the feeding and discharging suction nozzle assembly is arranged on the horizontal linear guide rail in a sliding manner; the adjusting guide plate is arranged on the vertical linear guide rail in a sliding manner; a plurality of fan-shaped dispersed adjusting guide grooves are formed in the adjusting guide plate, one end of the transmission connecting piece is fixedly connected with the feeding and discharging suction nozzle assembly, and the other end of the transmission connecting piece extends through the horizontal through hole and is arranged in the adjusting guide grooves; the adjusting and driving assembly drives the adjusting guide plate to move on the vertical linear guide rail, and then drives the feeding and discharging suction nozzle assembly to move on the horizontal linear guide rail through the transmission connecting piece.
7. The automatic chip test equipment of claim 1, wherein: the testing machine head mechanism comprises at least two groups of testing suction nozzle assemblies and testing movement assemblies, wherein the testing suction nozzle assemblies are arranged on the testing movement assemblies, and then the testing movement assemblies drive the testing suction nozzle assemblies to move in the X direction, the Y direction and the Z direction.
8. The automatic chip test equipment of claim 1, wherein: go up unloading mechanism includes at least one and goes up the unloading subassembly, go up the unloading subassembly including going up unloading material frame, going up unloading lead screw, go up unloading nut, go up the unloading motor and set up in the below position of going up unloading material frame, go up the unloading motor and be connected with the transmission of last unloading nut through going up the unloading belt, go up in unloading lead screw cover locates the unloading nut, and the upper portion of going up the unloading lead screw runs through from the bottom of going up unloading material frame and sets up in going up unloading material frame.
9. The automatic chip test equipment of claim 8, wherein: go up unloading subassembly department and be provided with the material moving plate module, the material moving plate module includes hold-in range straight line module, moves material lift cylinder, moves the material clamping jaw, hold-in range straight line module drive moves the material clamping jaw and goes up unloading subassembly intervallic motion at least two, it moves material lift cylinder drive and moves the material clamping jaw and be elevating movement on last unloading subassembly, it is used for going up unloading subassembly department clamp to get the charging tray to move the material clamping jaw.
10. The automatic chip test equipment of claim 1, wherein: chip automatic test equipment still includes the rotatory module of chip, the rotatory module of chip includes rotary drive subassembly, rotatory clamping jaw, rotary motion is done to the rotatory clamping jaw of rotary drive subassembly drive, rotatory clamping jaw department is provided with rotary transducer, and rotatory clamping jaw is used for fixed chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121558116.9U CN215248106U (en) | 2021-07-09 | 2021-07-09 | Automatic chip testing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121558116.9U CN215248106U (en) | 2021-07-09 | 2021-07-09 | Automatic chip testing equipment |
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| CN215248106U true CN215248106U (en) | 2021-12-21 |
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| CN202121558116.9U Active CN215248106U (en) | 2021-07-09 | 2021-07-09 | Automatic chip testing equipment |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115156107A (en) * | 2022-06-29 | 2022-10-11 | 苏州乾鸣半导体设备有限公司 | Automatic chip testing and sorting machine |
| CN115385098A (en) * | 2022-10-28 | 2022-11-25 | 前海晶方云(深圳)测试设备有限公司 | Multi-shaft feeding and discharging mechanism and method |
| CN115656759A (en) * | 2022-10-24 | 2023-01-31 | 深圳市三一联光智能设备股份有限公司 | Semiconductor test braid all-in-one |
| CN115849005A (en) * | 2022-12-29 | 2023-03-28 | 苏州乾鸣半导体设备有限公司 | Synchronous feeding and discharging equipment |
| CN116381447A (en) * | 2022-12-26 | 2023-07-04 | 苏州乾鸣半导体设备有限公司 | Automatic chip testing machine |
| CN117538735A (en) * | 2024-01-09 | 2024-02-09 | 无锡昌鼎电子有限公司 | Linear high-temperature high-pressure testing machine |
| CN117583259A (en) * | 2023-12-14 | 2024-02-23 | 苏州乾鸣半导体设备有限公司 | Three-temperature test sorting equipment |
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2021
- 2021-07-09 CN CN202121558116.9U patent/CN215248106U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115156107A (en) * | 2022-06-29 | 2022-10-11 | 苏州乾鸣半导体设备有限公司 | Automatic chip testing and sorting machine |
| CN115656759A (en) * | 2022-10-24 | 2023-01-31 | 深圳市三一联光智能设备股份有限公司 | Semiconductor test braid all-in-one |
| CN115385098A (en) * | 2022-10-28 | 2022-11-25 | 前海晶方云(深圳)测试设备有限公司 | Multi-shaft feeding and discharging mechanism and method |
| CN116381447A (en) * | 2022-12-26 | 2023-07-04 | 苏州乾鸣半导体设备有限公司 | Automatic chip testing machine |
| CN115849005A (en) * | 2022-12-29 | 2023-03-28 | 苏州乾鸣半导体设备有限公司 | Synchronous feeding and discharging equipment |
| CN117583259A (en) * | 2023-12-14 | 2024-02-23 | 苏州乾鸣半导体设备有限公司 | Three-temperature test sorting equipment |
| CN117538735A (en) * | 2024-01-09 | 2024-02-09 | 无锡昌鼎电子有限公司 | Linear high-temperature high-pressure testing machine |
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