CN215263804U - Chip array test equipment - Google Patents
Chip array test equipment Download PDFInfo
- Publication number
- CN215263804U CN215263804U CN202121558117.3U CN202121558117U CN215263804U CN 215263804 U CN215263804 U CN 215263804U CN 202121558117 U CN202121558117 U CN 202121558117U CN 215263804 U CN215263804 U CN 215263804U
- Authority
- CN
- China
- Prior art keywords
- test
- feeding
- module
- suction nozzle
- discharging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a chip array test equipment, include: the test platform is provided with a plurality of test modules in an array manner; the feeding and discharging module is arranged on the side edge of the test platform and used for placing a material tray of the chip; the aircraft nose module, the aircraft nose module sets up in test platform, the top position of going up the unloading module, including at least two sets of suction nozzle subassemblies, suction nozzle interval adjustment assembly, aircraft nose motion subassembly, the suction nozzle subassembly sets up on suction nozzle interval adjustment assembly, and suction nozzle interval adjustment assembly sets up on aircraft nose motion subassembly, and then aircraft nose motion subassembly is in X to, Y to, Z upwards drive suction nozzle subassembly motion. The utility model discloses an automatic test has replaced artifical work, not only fixes a position accurately, can improve efficiency of software testing moreover greatly, supports the advantage of multiunit chip material loading simultaneously, unloading, test simultaneously.
Description
Technical Field
The utility model relates to a chip detection area has especially related to a chip array test equipment.
Background
The functional test item refers to a process of carrying out corresponding condition reinforcing experiments on the condition of the production performance of the product by simulating various factors involved in the actual use conditions of the product.
Generally, electronic devices, whether original components, parts, components, complete machines, etc., require testing. The test is completed by manufacturers or top-grade electronic appliance detection technology companies, and the problems of the products are found through the test and are timely modified, so that the problems of the products reaching the hands of consumers are reduced as much as possible or the reliability of the products is improved.
The traditional chip test mainly comprises the steps that a single chip is manually placed on test equipment for testing, human eyes observe the test chip and correspondingly record a test result, the test chip is manually classified, placed on a tray and the like after the test is finished, the production efficiency is low, and the requirement for large-scale efficient production cannot be met. In order to improve the production efficiency, the manipulator is adopted to carry out feeding and discharging during chip testing, and then the chip is tested on an independent testing plate, because the distance between a material tray and the chip placed on the testing plate is inconsistent, the feeding method adopted at present is to utilize a suction nozzle to suck the chips one by one for feeding or discharging, although compared with the manual work, the efficiency is improved a lot, the feeding and discharging speed is slow, the efficiency is low, and in addition, when the chip is tested, the feeding manipulator waits for the feeding after taking the materials, and the discharging manipulator waits for the test to finish taking the materials, which is time-consuming.
Disclosure of Invention
Not enough to prior art exists, the utility model aims at providing a chip array test equipment has replaced artifical work through automatic test, and not only the location is accurate, can improve efficiency of software testing moreover greatly, supports the advantage of multiunit chip material loading simultaneously, unloading, test simultaneously.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a chip array test apparatus, comprising:
the test platform is provided with a plurality of test modules in an array mode, each test module comprises a test carrier, a test heating assembly and a test moving assembly, each test carrier is used for placing and testing a chip to be tested, each test heating assembly is arranged above each test carrier, and each test moving assembly drives each test heating assembly to press and heat the chip on each test carrier;
the feeding and discharging module is arranged on the side edge of the test platform and used for placing a material tray of the chip;
the machine head module is arranged above the test platform and the feeding and discharging module and comprises at least two groups of suction nozzle assemblies, suction nozzle interval adjusting assemblies and machine head moving assemblies, the suction nozzle assemblies are arranged on the suction nozzle interval adjusting assemblies, the suction nozzle interval adjusting assemblies are arranged on the machine head moving assemblies, and the machine head moving assemblies further drive the suction nozzle assemblies to move in the X direction, the Y direction and the Z direction;
the suction nozzle distance adjusting assembly comprises an adjusting fixing plate, a guide plate, an adjusting driving assembly and a transmission connecting piece, wherein a horizontal through hole is formed in the adjusting fixing plate in a penetrating mode, a horizontal linear guide rail is fixedly arranged on one side of the adjusting fixing plate, and a vertical linear guide rail is arranged on the other side of the adjusting fixing plate; the suction nozzle assembly is arranged on the horizontal linear guide rail in a sliding manner; the guide plate is arranged on the vertical linear guide rail in a sliding manner; the guide plate is provided with a plurality of guide grooves dispersed in a fan shape, one end of the transmission connecting piece is fixedly connected with the suction nozzle assembly, and the other end of the transmission connecting piece extends through the horizontal through hole and is arranged in the guide grooves; the adjusting and driving assembly drives the guide plate to move on the vertical linear guide rail, and then drives the suction nozzle assembly to move on the horizontal linear guide rail through the transmission connecting piece.
As a preferred scheme, the test carrier comprises a test mainboard and a test plugboard, the test plugboard is arranged on the test mainboard, a plurality of test slots for placing test chips are formed in the test plugboard, and test probes are arranged in the bottoms of the test slots.
As a preferred scheme, the test heating assembly comprises a heating rod and a heating installation piece, and the heating rod is fixedly arranged on the heating installation piece.
As an optimal scheme, the test moving assembly comprises a test straight line module and a test lifting cylinder, the test lifting cylinder is arranged on the test straight line module, the test straight line module drives the test lifting cylinder to move in the horizontal direction, a push rod of the test lifting cylinder is fixedly connected with the heating installation piece, and the test lifting cylinder drives a heating rod on the heating installation piece to move in the vertical direction.
As an optimal scheme, go up the unloading module and include at least one and go up the unloading subassembly, go up the unloading subassembly including going up unloading material frame, going up the unloading lead screw, go up the unloading nut, go up the unloading motor and set up in the below position of going up unloading material frame, go up the unloading motor and be connected with the transmission of going up unloading nut through going up the unloading belt, go up in unloading lead screw cover locates the unloading nut, and the upper portion of going up the unloading lead screw runs through from the bottom of going up unloading material frame and sets up in going up unloading material frame.
As an optimal scheme, go up unloading subassembly department and be provided with and move the charging tray module, move the charging tray module and include hold-in range straight line module, move material lift cylinder, move the material clamping jaw, hold-in range straight line module drive moves the material clamping jaw and goes up unloading subassembly intervallic motion at least two, move material lift cylinder drive and move the material clamping jaw and do elevating movement on last unloading subassembly, it is used for going up unloading subassembly department clamp to get the charging tray to move the material clamping jaw.
As a preferred scheme, the suction nozzle assembly comprises a sliding support, a suction nozzle cylinder and a suction nozzle, the upper part of the sliding support is slidably arranged on the horizontal linear guide rail, the lower part of the sliding support is fixedly connected with the suction nozzle cylinder, and the suction nozzle is connected with a push rod of the suction nozzle cylinder.
As a preferred scheme, the machine head movement assembly comprises an X-direction movement module, a Y-direction movement module and a Z-direction movement module, the Y-direction movement module is arranged on the X-direction movement module, the Z-direction movement module is arranged on the Y-direction movement module, and the suction nozzle spacing adjustment assembly is arranged on the Z-direction movement module.
As a preferred scheme, the side of the test platform is also provided with a manual feeding and discharging platform for manually placing a single material tray for feeding or discharging.
As a preferred scheme, chip array test equipment still includes the rotatory module of chip, the rotatory module of chip includes rotary drive subassembly, rotary clamping jaw, rotary drive subassembly drive rotary clamping jaw is rotary motion, rotary clamping jaw department is provided with rotary sensor, and rotary clamping jaw is used for fixed chip.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the automatic test replaces manual labor, so that the positioning is accurate, the test efficiency can be greatly improved, and the advantages of simultaneously loading, unloading and testing a plurality of groups of chips are supported;
(2) the suction nozzle component realizes the increase or reduction adjustment of the distance in the horizontal direction, so that chips placed at different distances between the adsorption tray and the test carrier by the suction nozzle component are supported, the simultaneous feeding or discharging of a plurality of chips is realized, the feeding and discharging efficiency is greatly improved, and the suction nozzle component is also provided with an independent suction nozzle cylinder which can independently feed or discharge the chips;
(3) be provided with chip rotation module, when the orientation of the chip on the charging tray was inconsistent with the orientation of placing on the test carrier, can carry out the orientation adjustment through chip rotation module.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a top plan view of the overall structure of the present invention;
FIG. 3 is a first schematic view of the nozzle pitch adjustment assembly according to the present invention;
FIG. 4 is a schematic structural view II of a nozzle pitch adjustment assembly according to the present invention;
FIG. 5 is a first schematic structural diagram of a test module according to the present invention;
FIG. 6 is a second schematic structural diagram of the test module of the present invention;
FIG. 7 is a schematic structural view of a loading/unloading module according to the present invention;
FIG. 8 is a schematic structural view of the material moving tray module of the present invention;
FIG. 9 is a first schematic view of a first embodiment of a handpiece motion assembly of the present invention;
FIG. 10 is a second schematic structural view of the handpiece motion assembly of the present invention;
FIG. 11 is a first schematic structural diagram of a chip rotation module according to the present invention;
FIG. 12 is a second schematic view of a chip rotation module according to the present invention;
wherein: the device comprises a test platform 1, a test module 2, a test carrier 3, a test heating component 4, a test moving component 5, a feeding and discharging module 6, a machine head module 7, a suction nozzle component 8, a suction nozzle interval adjusting component 9, a machine head moving component 10, an adjusting fixing plate 11, a guide plate 12, an adjusting driving component 13, a transmission connecting piece 14, a horizontal through hole 15, a horizontal linear guide rail 16, a vertical linear guide rail 17, a guide groove 18, an adjusting screw rod 19, an adjusting nut 20, an adjusting motor 21, an adjusting coupler 22, a test main board 23, a test plugboard 24, a test slot 25, a heating rod 26, a heating installation piece 27, a test linear module 28, a test lifting cylinder 29, a heating sensor 30, a feeding and discharging component 31, a feeding and discharging material frame 32, a feeding and discharging screw rod 33, a feeding and discharging nut 34, a feeding and discharging motor 35, a feeding and discharging belt 36, a dividing and parallel feeding and discharging component 37, a feeding and discharging component 38, The device comprises an empty material feeding and discharging assembly 39, a material moving disc module 40, a synchronous belt linear module 41, a material moving lifting cylinder 42, a material moving clamping jaw 43, a synchronous belt rail 44, a synchronous belt driving motor 45, a transmission synchronous belt 46, a transmission block 47, a material moving plate 48, a material moving cylinder 49, a material moving clamping jaw 50, a sliding support 51, a suction nozzle cylinder 52, a suction nozzle 53, an X-direction moving module 54, a Y-direction moving module 55, a Z-direction moving module 56, a Z-direction motor 57, a Z-direction nut 58, a Z-direction screw rod 59, a Z-direction coupling 60, a Z-direction mounting plate 61, a Z-direction connecting piece 62, a Z-direction linear rail 63, a manual feeding and discharging platform 64, a chip rotating module 65, a rotating driving assembly 66, a rotating clamping jaw 67, a rotating sensor 68, a rotating driving motor 69, a rotating driving main wheel 70, a rotating driving guide wheel 71, a rotating driving driven wheel 72 and a rotating transmission belt 73.
Detailed Description
The invention will be further described with reference to specific embodiments. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Example (b):
as shown in fig. 1 to 6, a chip array test apparatus includes:
the testing device comprises a testing platform 1, wherein a plurality of testing modules 2 are arranged on the testing platform 1 in an array mode, each testing module 2 comprises a testing carrier 3, a testing heating component 4 and a testing moving component 5, the testing carrier 3 is used for placing and testing a chip to be tested, the testing heating component 4 is arranged above the testing carrier 3, and the testing moving component 5 drives the testing heating component 4 to press and heat the chip on the testing carrier 3;
the feeding and discharging module 6 is arranged on the side edge of the test platform 1, and is used for placing a material tray of the chip;
the machine head module 7 is arranged above the test platform 1 and the feeding and discharging module 6 and comprises at least two groups of suction nozzle assemblies 8, suction nozzle interval adjusting assemblies 9 and machine head moving assemblies 10, the suction nozzle assemblies 8 are arranged on the suction nozzle interval adjusting assemblies 9, the suction nozzle interval adjusting assemblies 9 are arranged on the machine head moving assemblies 10, and then the machine head moving assemblies 10 drive the suction nozzle assemblies 8 to move in the X direction, the Y direction and the Z direction;
the suction nozzle spacing adjusting assembly 9 comprises an adjusting fixing plate 11, a guide plate 12, an adjusting driving assembly 13 and a transmission connecting piece 14, wherein a horizontal through hole 15 is formed in the adjusting fixing plate 11 in a penetrating manner, a horizontal linear guide rail 16 is fixedly arranged on one side of the adjusting fixing plate 11, and a vertical linear guide rail 17 is arranged on the other side of the adjusting fixing plate 11; the suction nozzle assembly 8 is arranged on the horizontal linear guide rail 16 in a sliding manner; the guide plate 12 is arranged on the vertical linear guide rail 17 in a sliding manner; a plurality of guide grooves 18 dispersed in a fan shape are formed in the guide plate 12, one end of the transmission connecting piece 14 is fixedly connected with the suction nozzle assembly 8, and the other end of the transmission connecting piece extends through the horizontal through hole 15 and is arranged in the guide grooves 18; the adjusting and driving assembly 13 drives the guide plate 12 to move on the vertical linear guide rail 17, and then drives the suction nozzle assembly 8 to move on the horizontal linear guide rail 16 through the transmission connecting piece 14.
Specifically, in this embodiment, 3 sets of test modules 2 are arranged in each row of the X-direction array of the test platform 1, 5 sets of test modules 2 are arranged in each row of the Y-direction array, and the structures of each set of test modules 2 are the same.
More specifically, adjust drive assembly 13 and include accommodate the lead screw 19, adjusting nut 20, accommodate the motor 21 and set up on adjusting the fixed plate 11, be connected through adjusting coupling 22 between accommodate the motor 21 and the accommodate the lead screw 19, accommodate the lead screw 19 cover is located in adjusting nut 20, and adjusting nut 20 fixed connection is on deflector 12. Further, adjusting motor 21 drives deflector 12 and removes along the slip direction of vertical linear guide 17 when moving, deflector 12 is seted up and is the guide way 18 that the fan-shaped dispersion, because be provided with in the guide way 18 with the transmission connecting piece 14 of suction nozzle subassembly 8 fixed connection, guide way 18 supports and presses transmission connecting piece 14 and then drives suction nozzle subassembly 8 and remove, and suction nozzle subassembly 8 sets up on horizontal linear guide 16, it slides along horizontal linear guide 16 to be restricted, realize the increase of interval or reduce the adjustment along horizontal linear guide 16 direction under the drive of deflector 12, thereby support suction nozzle subassembly 8 adsorb the chip that charging tray and test carrier 3 both placed with different interval sizes, realize the material loading or unloading in the time of a plurality of chips, greatly promote unloading efficiency.
Furthermore, the horizontal linear guide rails 16 are linear rails, 4 groups of the horizontal linear guide rails are arranged in parallel in the horizontal direction, and the horizontal through holes 15 are formed in the middles of the 4 groups of the horizontal linear guide rails 16.
Preferably, the test carrier 3 includes a test motherboard 23 and a test board 24, the test board 24 is disposed on the test motherboard 23, a plurality of test slots 25 for placing test chips are disposed on the test board 24, and a test probe (not shown in the figure) is disposed in the bottom of the test slot 25.
More preferably, the test heating assembly 4 comprises a heating rod 26 and a heating installation member 27, wherein the heating rod 26 is fixedly arranged on the heating installation member 27.
More preferably, the test moving assembly 5 comprises a test straight line module 28 and a test lifting cylinder 29, the test lifting cylinder 29 is arranged on the test straight line module 28, the test straight line module 28 drives the test lifting cylinder 29 to move in the horizontal direction, a push rod of the test lifting cylinder 29 is fixedly connected with the heating installation part 27, and the test lifting cylinder 29 drives the heating rod 26 on the heating installation part 27 to move in the vertical direction.
Specifically, the heating installation member 27 is further provided with a heating sensor 30 for sensing the position of the chip in the test slot 25.
Further, a chip to be tested is placed in the test slot 25, when the heating sensor 30 senses that the chip is in the test slot 25, the test straight line module 28 drives the heating rod 26 on the test lifting cylinder 29 to move to a position above the chip to be tested, and the test lifting cylinder 29 drives the heating rod 26 to move downwards to press the chip to be tested to be in close contact with the test probe, so that the chip is tested.
Preferably, as shown in fig. 7, the feeding and discharging module 6 includes at least one feeding and discharging assembly 31, the feeding and discharging assembly 31 includes a feeding and discharging material frame 32, a feeding and discharging screw rod 33, a feeding and discharging nut 34, and a feeding and discharging motor 35, the feeding and discharging motor 35 is disposed at a position below the feeding and discharging material frame 32, the feeding and discharging motor 35 is in transmission connection with the feeding and discharging nut 34 through a feeding and discharging belt 36, the feeding and discharging screw rod 33 is sleeved in the feeding and discharging nut 34, and the upper portion of the feeding and discharging screw rod 33 is arranged in the feeding and discharging material frame 32 in a penetrating manner from the bottom of the feeding and discharging material frame 32.
Specifically, the feeding and discharging motor 35 drives the feeding and discharging nut 34 through the feeding and discharging belt 36, and then drives the feeding and discharging screw rod 33 to rotate, so as to drive the material tray in the feeding and discharging material frame 32 to move up and down.
More specifically, in this embodiment, the feeding and discharging assembly 31 has four groups, which are two and are respectively the feeding and discharging assembly 37, one waiting material feeding and discharging assembly 38, and one empty material feeding and discharging assembly 39, wherein the two feeding trays of the feeding and discharging assembly 37 are used for placing chips qualified in the test, the feeding tray of the waiting material feeding and discharging assembly 38 is used for placing chips to be tested, and the empty material feeding and discharging assembly 39 is used for recycling empty feeding trays.
More preferably, as shown in fig. 8, the feeding and discharging assembly 31 is provided with a material moving plate module 40, the material moving plate module 40 includes a synchronous belt linear module 41, a material moving lifting cylinder 42 and a material moving clamping jaw 43, the synchronous belt linear module 41 drives the material moving clamping jaw 43 to move between at least two feeding and discharging assemblies 31, the material moving lifting cylinder 42 drives the material moving clamping jaw 43 to move up and down on the feeding and discharging assembly 31, and the material moving clamping jaw 43 is used for the feeding and discharging assembly 31 to clamp the material plate.
Specifically, hold-in range straight line module 41 includes hold-in range track 44, hold-in range driving motor 45, drive hold-in range 46, transmission block 47, a side portion of transmission block 47 sets up on drive hold-in range 46, another lateral part and move material lift cylinder 42 fixed connection, bottom and set up on hold-in range track 44, drive block 47 on the hold-in range driving motor 45 drive hold-in range 46 moves on hold-in range track 44, and then drives and move on the material lift cylinder 42 and expect that clamping jaw 43 moves between the last unloading subassembly 31 of four groups in this embodiment.
More specifically, the material moving clamping jaw 43 includes a material moving plate 48, a material moving cylinder 49, and a material moving claw 50, wherein the material moving cylinder 49 is fixedly disposed on the material moving plate 48, and the material moving claw 50 is disposed on a push rod of the material moving cylinder 49. Further, the material moving cylinders 49 are four, and the material moving claws 50 of every two material moving cylinders 49 form a group of claw structures.
Preferably, the suction nozzle assembly 8 includes a sliding bracket 51, a suction nozzle cylinder 52, and a suction nozzle 53, wherein an upper portion of the sliding bracket 51 is slidably disposed on the horizontal linear guide 16, a lower portion of the sliding bracket 51 is fixedly connected to the suction nozzle cylinder 52, and the suction nozzle 53 is connected to a push rod of the suction nozzle cylinder 52.
Further, the sliding bracket 51 is connected to the upper and lower 4 sets of horizontal linear guide rails 16, and slides along the horizontal linear guide rails 16 to drive the lower nozzle cylinder 52 to move, and the transmission connecting member 14 is connected to the sliding bracket 51. Furthermore, in the present embodiment, the nozzle assemblies 8 have 8 sets, and the 8 sets of nozzle assemblies 8 move in the horizontal direction at equal intervals, because each set of nozzle assemblies 8 is individually provided with the nozzle cylinder 52, the suction nozzle 53 on each set of nozzle cylinder 52 is further driven to individually lift and lower.
Preferably, as shown in fig. 9 to 10, the head moving assembly 10 includes an X-direction moving module 54, a Y-direction moving module 55, and a Z-direction moving module 56, the Y-direction moving module 55 is disposed on the X-direction moving module 54, the Z-direction moving module 56 is disposed on the Y-direction moving module 55, and the nozzle spacing adjusting assembly 9 is disposed on the Z-direction moving module 56.
Specifically, the structures of the X-direction moving module 54 and the Y-direction moving module 55 are the same as the structure of the synchronous belt linear module 41, and include a synchronous belt track 44, a synchronous belt driving motor 45, a transmission synchronous belt 46 and a transmission block 47, which are not described in detail herein; z is to removing module 56 and including Z to motor 57, Z to nut 58, Z to lead screw 59, Z to shaft coupling 60, Z to mounting panel 61, Z sets up on Y is to removing module 55 to mounting panel 61, and Z sets up on Z to mounting panel 61 to motor 57, Z is connected with Z to lead screw 59 through Z to shaft coupling 60 to motor 57, Z is located Z to lead screw 59 to the nut 58 cover on, and Z is connected with Z to connecting piece 62 to nut 58, Z sets up on Z to linear rail 63 to connecting piece 62 slip, and this Z is vertical to setting up on Z to mounting panel 61 to linear rail 63.
More specifically, the adjustment fixing plate 11 of the nozzle pitch adjustment assembly 9 is disposed on the Z-direction connecting member 62.
Preferably, the side of the test platform 1 is further provided with a manual loading and unloading platform 64 for manually loading or unloading a single material tray.
Specifically, in this embodiment, the manual loading and unloading platform 64 is used for placing the chips that fail to be tested.
Preferably, as shown in fig. 11 to 12, the chip array testing apparatus further includes a chip rotation module 65, the chip rotation module 65 includes a rotation driving assembly 66 and a rotation clamping jaw 67, the rotation driving assembly 66 drives the rotation clamping jaw 67 to rotate, a rotation sensor 68 is disposed at the rotation clamping jaw 67, and the rotation clamping jaw 67 is used for fixing a chip.
Specifically, the rotary driving assembly 66 includes a rotary driving motor 69, a rotary driving main wheel 70, a rotary driving guide wheel 71, and a rotary driving driven wheel 72, the rotary driving motor 69 is connected to the rotary driving main wheel 70, the rotary driving guide wheel 71, and the rotary driving driven wheel 72 are connected by a rotary transmission belt 73, and the rotary clamping jaw 67 is disposed on the rotary driving driven wheel 72.
More specifically, when being provided with chip rotation module 65, when the orientation of the chip on the charging tray was inconsistent with the orientation of placing on the test carrier 3, orientation adjustment can be carried out through chip rotation module 65.
During specific implementation, firstly, an empty tray is placed on the manual loading and unloading platform 64 and used for placing chips which are unqualified in test, then the machine head module 7 takes the materials from the tray of the to-be-loaded loading and unloading assembly 38, the taken chips are placed in the test module 2 for testing, after the test is finished, the machine head module 7 takes the chips in the test module 2 back, if the taken-back materials are qualified, the taken-back materials are placed in the tray of the to-be-loaded and unloading assembly 37, if the taken-back chips are unqualified, the taken-back materials are placed in the tray on the manual loading and unloading platform 64, the actions are repeated, and after the chips on the tray of the to-be-loaded and unloading assembly 38 are taken out, the tray moving module 40 clamps the empty tray and recovers the empty tray to the empty-loaded and unloading assembly 39.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.
Claims (10)
1. A chip array test apparatus, comprising:
the test platform is provided with a plurality of test modules in an array mode, each test module comprises a test carrier, a test heating assembly and a test moving assembly, each test carrier is used for placing and testing a chip to be tested, each test heating assembly is arranged above each test carrier, and each test moving assembly drives each test heating assembly to press and heat the chip on each test carrier;
the feeding and discharging module is arranged on the side edge of the test platform and used for placing a material tray of the chip;
the machine head module is arranged above the test platform and the feeding and discharging module and comprises at least two groups of suction nozzle assemblies, suction nozzle interval adjusting assemblies and machine head moving assemblies, the suction nozzle assemblies are arranged on the suction nozzle interval adjusting assemblies, the suction nozzle interval adjusting assemblies are arranged on the machine head moving assemblies, and the machine head moving assemblies further drive the suction nozzle assemblies to move in the X direction, the Y direction and the Z direction;
the suction nozzle distance adjusting assembly comprises an adjusting fixing plate, a guide plate, an adjusting driving assembly and a transmission connecting piece, wherein a horizontal through hole is formed in the adjusting fixing plate in a penetrating mode, a horizontal linear guide rail is fixedly arranged on one side of the adjusting fixing plate, and a vertical linear guide rail is arranged on the other side of the adjusting fixing plate; the suction nozzle assembly is arranged on the horizontal linear guide rail in a sliding manner; the guide plate is arranged on the vertical linear guide rail in a sliding manner; the guide plate is provided with a plurality of guide grooves dispersed in a fan shape, one end of the transmission connecting piece is fixedly connected with the suction nozzle assembly, and the other end of the transmission connecting piece extends through the horizontal through hole and is arranged in the guide grooves; the adjusting and driving assembly drives the guide plate to move on the vertical linear guide rail, and then drives the suction nozzle assembly to move on the horizontal linear guide rail through the transmission connecting piece.
2. The chip array test apparatus of claim 1, wherein: the test carrier comprises a test mainboard and a test plugboard, wherein the test plugboard is arranged on the test mainboard, a plurality of test slots for placing test chips are formed in the test plugboard, and test probes are arranged in the bottoms of the test slots.
3. The chip array test apparatus of claim 2, wherein: the test heating assembly comprises a heating rod and a heating installation part, and the heating rod is fixedly arranged on the heating installation part.
4. The chip array test apparatus of claim 3, wherein: the test moving assembly comprises a test straight line module and a test lifting cylinder, the test lifting cylinder is arranged on the test straight line module, the test straight line module drives the test lifting cylinder to move in the horizontal direction, a push rod of the test lifting cylinder is fixedly connected with the heating installation part, and the test lifting cylinder drives a heating rod on the heating installation part to move in the vertical direction.
5. The chip array test apparatus of claim 1, wherein: the feeding and discharging module comprises at least one feeding and discharging assembly, the feeding and discharging assembly comprises a feeding and discharging material frame, a feeding and discharging screw rod, a feeding and discharging nut and a feeding and discharging motor, the feeding and discharging motor is arranged at the position below the feeding and discharging material frame, the feeding and discharging motor is in transmission connection with the feeding and discharging nut through a feeding and discharging belt, the feeding and discharging screw rod is sleeved in the feeding and discharging nut, and the upper portion of the feeding and discharging screw rod penetrates through the bottom of the feeding and discharging material frame and is arranged in the feeding and discharging material frame.
6. The chip array test apparatus of claim 5, wherein: go up unloading subassembly department and be provided with the material moving plate module, the material moving plate module includes hold-in range straight line module, moves material lift cylinder, moves the material clamping jaw, hold-in range straight line module drive moves the material clamping jaw and goes up unloading subassembly intervallic motion at least two, it moves material lift cylinder drive and moves the material clamping jaw and be elevating movement on last unloading subassembly, it is used for going up unloading subassembly department clamp to get the charging tray to move the material clamping jaw.
7. The chip array test apparatus of claim 1, wherein: the suction nozzle assembly comprises a sliding support, a suction nozzle cylinder and a suction nozzle, the upper portion of the sliding support is arranged on the horizontal linear guide rail in a sliding mode, the lower portion of the sliding support is fixedly connected with the suction nozzle cylinder, and the suction nozzle is connected with a push rod of the suction nozzle cylinder.
8. The chip array test apparatus of claim 7, wherein: the machine head motion assembly comprises an X-direction moving module, a Y-direction moving module and a Z-direction moving module, the Y-direction moving module is arranged on the X-direction moving module, the Z-direction moving module is arranged on the Y-direction moving module, and the suction nozzle spacing adjusting assembly is arranged on the Z-direction moving module.
9. The chip array test apparatus of claim 1, wherein: the side of the test platform is also provided with a manual feeding and discharging platform for manually placing single material disc for feeding or discharging.
10. The chip array test apparatus of claim 1, wherein: chip array test equipment still includes the rotatory module of chip, the rotatory module of chip includes rotary drive subassembly, rotatory clamping jaw, rotary motion is done to the rotatory clamping jaw of rotary drive subassembly drive, rotatory clamping jaw department is provided with rotary transducer, and rotatory clamping jaw is used for fixed chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121558117.3U CN215263804U (en) | 2021-07-09 | 2021-07-09 | Chip array test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121558117.3U CN215263804U (en) | 2021-07-09 | 2021-07-09 | Chip array test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215263804U true CN215263804U (en) | 2021-12-21 |
Family
ID=79490510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121558117.3U Active CN215263804U (en) | 2021-07-09 | 2021-07-09 | Chip array test equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215263804U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114371406A (en) * | 2022-01-26 | 2022-04-19 | 浙江杭可科技股份有限公司 | Movement mechanism for square lithium ion self-adaptive high-temperature negative pressure formation testing equipment |
| CN115156107A (en) * | 2022-06-29 | 2022-10-11 | 苏州乾鸣半导体设备有限公司 | Automatic chip testing and sorting machine |
| CN115249511A (en) * | 2022-08-01 | 2022-10-28 | 深圳市芯岛智能装备有限公司 | Multifunctional automatic testing machine for DDRSDRAM memory chip |
| CN116381447A (en) * | 2022-12-26 | 2023-07-04 | 苏州乾鸣半导体设备有限公司 | Automatic chip testing machine |
| CN117538722A (en) * | 2023-10-18 | 2024-02-09 | 无锡艾方芯动自动化设备有限公司 | Integral chip pressure measuring device |
| CN118033387A (en) * | 2024-04-15 | 2024-05-14 | 无锡伟测半导体科技有限公司 | Integrated circuit chip detection equipment |
-
2021
- 2021-07-09 CN CN202121558117.3U patent/CN215263804U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114371406A (en) * | 2022-01-26 | 2022-04-19 | 浙江杭可科技股份有限公司 | Movement mechanism for square lithium ion self-adaptive high-temperature negative pressure formation testing equipment |
| CN115156107A (en) * | 2022-06-29 | 2022-10-11 | 苏州乾鸣半导体设备有限公司 | Automatic chip testing and sorting machine |
| CN115249511A (en) * | 2022-08-01 | 2022-10-28 | 深圳市芯岛智能装备有限公司 | Multifunctional automatic testing machine for DDRSDRAM memory chip |
| CN115249511B (en) * | 2022-08-01 | 2024-06-04 | 深圳市芯岛智能装备有限公司 | Multifunctional automatic tester for DDRSDRAM memory chip |
| CN116381447A (en) * | 2022-12-26 | 2023-07-04 | 苏州乾鸣半导体设备有限公司 | Automatic chip testing machine |
| CN116381447B (en) * | 2022-12-26 | 2024-06-14 | 苏州乾鸣半导体设备有限公司 | Automatic chip testing machine |
| CN117538722A (en) * | 2023-10-18 | 2024-02-09 | 无锡艾方芯动自动化设备有限公司 | Integral chip pressure measuring device |
| CN118033387A (en) * | 2024-04-15 | 2024-05-14 | 无锡伟测半导体科技有限公司 | Integrated circuit chip detection equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215263804U (en) | Chip array test equipment | |
| CN215248106U (en) | Automatic chip testing equipment | |
| CN108689111B (en) | Automatic feeding equipment for power adapter test | |
| CN111792351B (en) | Automatic test equipment for wireless module | |
| CN113794083A (en) | Automatic pin inserting equipment for carrier | |
| CN115156107A (en) | Automatic chip testing and sorting machine | |
| CN111014055B (en) | Polaroid hole detection equipment | |
| CN215997609U (en) | High-efficiency chip testing equipment | |
| CN112828584B (en) | LED lighting device insulating rubber head and gasket assembling system | |
| CN112758677A (en) | Automatic jig cover plate elasticity testing device and testing method | |
| CN115849005A (en) | Synchronous feeding and discharging equipment | |
| CN216085670U (en) | Automatic pin inserting equipment for carrier | |
| CN205353301U (en) | Accurate electron base plate function automatic checkout device of polycell formula | |
| CN116381447B (en) | Automatic chip testing machine | |
| CN218370361U (en) | Resistance element electrical property test equipment | |
| CN116224044A (en) | Integrated circuit tester based on non-contact PCB | |
| CN115921360A (en) | Controllable multi-shaft variable-pitch pickup device of test sorting machine and operation equipment | |
| CN215853883U (en) | Feeding mechanism of chip equipment | |
| CN216836064U (en) | Single-double-panel full-automatic double-station testing through hole machine | |
| CN216706620U (en) | Automatic assembly device for detection card | |
| CN215100564U (en) | Blanking mechanism based on simultaneous positioning accuracy of a large number of soft boards is less than 0.02mm | |
| CN213943959U (en) | PCB board test machine | |
| CN212646898U (en) | PIN automatic checkout machine | |
| CN113677098A (en) | Transparent circuit board equipment of bending | |
| CN114589481A (en) | High-precision heat dissipation module nut riveting equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |