CN214851234U - Optical module developments temperature test equipment that follows - Google Patents

Abstract

The optical module dynamic temperature cycle test equipment comprises a temperature cycle test box and an error code meter, wherein the temperature cycle test box comprises a temperature cycle test board and a plurality of wavelength division multiplexers, the temperature cycle test board is provided with a test light source and a plurality of tested light modules cascaded with the test light source, and an electric port transmitting end and a receiving end of the test light source are correspondingly connected with a transmitting electric port and a receiving electric port of the error code meter; the optical output interface of the test light source is connected with the optical input interface of the first tested optical module, and the optical input interface of the test light source is connected with the optical output interface of the last tested optical module; the optical input interface of the current measured optical module is connected with the optical output interface of the last measured optical module; the transmitting and receiving electric ports of the tested optical module correspondingly loop back; the wavelength division multiplexers are connected with the test light sources and the tested light modules in a one-to-one correspondence mode and used for selecting wavelengths. The test light source and the tested light modules are cascaded, so that batch test of the light modules is realized, the production efficiency is greatly improved, and the working hours and equipment are saved.

Description

Optical module developments temperature test equipment that follows

Technical Field

The application relates to the technical field of optical fiber communication, in particular to optical module dynamic temperature cycle testing equipment.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology become increasingly important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

The BIDI product belongs to an optical fiber bidirectional optical module, and the modules are produced and used in pairs, namely the receiving and transmitting wavelengths of the optical modules at two ends of the BIDI product are opposite, and the transmitting wavelength of the optical module at the A end is the same as the receiving wavelength of the optical module at the B end, so that module link connection is completed, and data transmission is realized. During the production of the BIDI series optical module, the debugging and the measurement are only carried out aiming at three temperature areas of high temperature, normal temperature and low temperature, the confirmation of a temperature interval cannot be carried out, and the light source is generally in the normal temperature state, so that the actual use scene is difficult to be truly simulated. The dynamic temperature cycle test system is a test system for monitoring the error rate of an optical module product in real time in the process of continuous temperature change, and the purpose of testing dynamic temperature cycle is to ensure the performance of the temperature blind zone of the optical module product.

However, in actual production, the temperature cycle time is long, one 2-channel error code tester can only test one optical module, the test of a single optical module consumes labor and equipment, and because the BIDI series optical module products are all single-fiber bidirectional optical modules, the multi-stage series test is difficult to realize, so that the batch test cannot be realized.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides optical module dynamic temperature cycle test equipment to solve the problems that when the current optical module is subjected to dynamic temperature cycle test, multistage series test is difficult to realize and batch test cannot be realized.

The application provides an optical module, includes:

the temperature cycle test box is internally provided with a test light source and a plurality of tested light modules cascaded with the test light source;

the error code instrument is provided with a transmitting electric port and a receiving electric port, the transmitting electric port is connected with the electric port transmitting end of the test light source, and the receiving electric port is connected with the electric port receiving end of the test light source;

wherein, the temperature cycle test box includes:

the temperature cycle test board is provided with a test light source and a plurality of tested light modules, an optical output interface of the test light source is correspondingly connected with an optical input interface of a first tested light module, and an optical input interface of the test light source is correspondingly connected with an optical output interface of a last tested light module; the optical input interface of the current measured optical module is correspondingly connected with the optical output interface of the last measured optical module; the transmitting electric port and the receiving electric port of the tested optical module are correspondingly looped back;

and the wavelength division multiplexers are connected with the test light sources and the tested light modules in a one-to-one correspondence manner and are used for carrying out wavelength selection on optical signals transmitted and received by the test light sources and the tested light modules.

The optical module dynamic temperature cycle test equipment comprises a temperature cycle test box and an error code meter, wherein a test light source and a plurality of tested light modules cascaded with the test light source are arranged in the temperature cycle test box; the temperature cycle test box comprises a temperature cycle test board and a plurality of wavelength division multiplexers, a test light source and a plurality of tested light modules are arranged on the temperature cycle test board, a light output interface of the test light source is correspondingly connected with a light input interface of a first tested light module, and a light input interface of the test light source is correspondingly connected with a light output interface of a last tested light module; the optical input interface of the current measured optical module is correspondingly connected with the optical output interface of the last measured optical module; the transmitting electric port and the receiving electric port of the tested optical module correspondingly loop back; the wavelength division multiplexers are connected with the test light sources and the tested light modules in a one-to-one correspondence mode and used for carrying out wavelength selection on optical signals transmitted and received by the test light sources and the tested light modules. This application cascades test light source and a plurality of photometry modules, the light path realizes cascading the back, the transmission electric mouth that will be surveyed the photometry module corresponds the loopback with receiving the electric mouth, accomplish the port on the circuit from this, accomplish the temperature from this and circulate the multistage link connection of a plurality of photometry modules that are surveyed in the test box, then the electric mouth transmission with test light source, the transmission of receiving terminal and error code appearance, receive the electric mouth and link together, so can realize the batch test of optical module developments temperature cycle, can improve production efficiency by a wide margin, save man-hour and equipment.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 5 is a schematic block diagram of an optical module dynamic temperature cycle testing apparatus provided in an embodiment of the present application;

fig. 6 is a schematic block diagram of a 4-level link in a dynamic temperature cycle testing device for an optical module according to an embodiment of the present disclosure;

fig. 7 is a functional diagram of a structure of a 4-level link in a dynamic temperature cycle test device for an optical module according to an embodiment of the present application;

FIG. 8 is a schematic block diagram of an exemplary light module dynamic temperature cycling test device.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the optical module realizes optical connection with external optical fibers through an optical interface, the external optical fibers are connected in various ways, and various optical fiber connector types are derived; the method is characterized in that the electric connection is realized by using a golden finger at an electric interface, which becomes the mainstream connection mode of the optical module industry, and on the basis, the definition of pins on the golden finger forms various industry protocols/specifications; the optical connection mode realized by adopting the optical interface and the optical fiber connector becomes the mainstream connection mode of the optical module industry, on the basis, the optical fiber connector also forms various industry standards, such as an LC interface, an SC interface, an MPO interface and the like, the optical interface of the optical module also makes adaptive structural design aiming at the optical fiber connector, and the optical fiber adapters arranged at the optical interface are various.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical interface of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; the electrical interface of the optical module 200 is externally connected to the optical network terminal 100, and establishes a bidirectional electrical signal connection with the optical network terminal 100; bidirectional interconversion of optical signals and electric signals is realized inside the optical module, so that information connection is established between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber 101.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal has a network cable interface 104, which is used for accessing the network cable 103 and establishing a bidirectional electrical signal connection (generally, an electrical signal of an ethernet protocol, which is different from an electrical signal used by an optical module in protocol/type) with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module. The optical network terminal is an upper computer of the optical module, provides data signals for the optical module and receives the data signals from the optical module, and a bidirectional signal transmission channel is established between the remote server and the local information processing equipment through the optical fiber, the optical module, the optical network terminal and a network cable.

Common local information processing apparatuses include routers, home switches, electronic computers, and the like; common optical network terminals include an optical network unit ONU, an optical line terminal OLT, a data center server, a data center switch, and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electrical connector is arranged in the cage 106 and used for accessing an electrical interface (such as a gold finger) of the optical module; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into an optical network terminal, the electrical interface of the optical module is inserted into the electrical connector inside the cage 106, and the optical interface of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiments of the present application includes an upper housing 201, a lower housing 202, a circuit board 203, and an optical sub-module 300.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access; the photoelectric devices such as the circuit board 203 and the optical sub-module 300 are positioned in the packaging cavity formed by the upper shell and the lower shell.

The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that the circuit board 203, the optical secondary module 300 and other devices can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 form an outermost packaging protection shell of the optical module; the upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realizing electromagnetic shielding and heat dissipation; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.

Typically, the optical module 200 further includes an unlocking component, which is located on an outer wall of the package cavity/lower housing 202, and is used for realizing a fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 203 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board 203 connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like.

The circuit board 203 is generally a rigid circuit board, which can also realize a bearing effect due to its relatively hard material, for example, the rigid circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The optical sub-assembly 300 is used to implement the transmission of optical signals and the reception of optical signals. In the embodiment of the present application, the optical subassembly 300 includes a circular-square tube 301, an optical transmitter module and an optical receiver module. Coaxial packaging of the optical transmitter and receiver components in the optical subassembly 300 is achieved by the round-square tube 301. The optical sub-assembly 300 is physically separated from the circuit board 203, and therefore, it is difficult for the optical sub-assembly 300 to be directly connected to the circuit board 203, so that the electrical connection is realized through the flexible circuit board in the embodiment of the present application. As shown in fig. 4, the optical sub-assembly 300 is electrically connected to the circuit board 203 through the flexible circuit board 400 and the flexible circuit board 500. In addition, the optical transmission module and the optical reception module may be separately packaged, and then the optical transmission module is electrically connected to the circuit board 203 through the flexible circuit board 400, and the optical reception module is electrically connected to the circuit board 203 through the flexible circuit board 500.

In the embodiment of the present application, the optical module 200 belongs to a BIDI optical module, and when an optical module of a BIDI product is produced, part of customers require a dynamic temperature cycle test, that is, after an optical module product ensures that a link is normal, the optical module product is placed into a temperature cycle box, and a bit error rate condition is monitored in real time along with a temperature change, so as to ensure that no temperature blind spot occurs in the temperature changing process of the optical module. If the conventional scheme is used for temperature cycling, only two modules can be temperature cycled in each set of system in a fixed temperature cycling period, if one module is a light source, only one module can be run, and equipment and working hours are wasted. And because the optical module only has one optical port, only one optical fiber can be inserted, the wavelength of the transmitted and received light is different, and the multi-level link test cannot be realized.

In order to solve the above problems, an embodiment of the present application provides an optical module dynamic temperature cycle test device, where the test device implements multistage series connection by adding a wavelength division multiplexer to a module port, and after a test board of a test box receives and transmits a self-loop link to an electrical port, a 2-way error code meter can test modules of two links at the same time, and each module link is designed according to a space of the test box, so that dozens of optical modules can be tested at the same time, which not only reduces labor hours, but also saves device cost, and greatly improves production efficiency.

Fig. 5 is a schematic block diagram of a dynamic temperature cycle test device for an optical module according to an embodiment of the present application. As shown in fig. 5, the optical module dynamic temperature cycle test apparatus provided in the embodiment of the present application includes a temperature cycle test box 600 and an error code meter 700, where a test light source 620 and a plurality of tested light modules cascaded with the test light source 620 are disposed in the temperature cycle test box 600, that is, the test light source 620 and the plurality of tested light modules are cascaded and then placed in the temperature cycle test box 600; the error code meter 700 is provided with a transmitting electric port 710 and a receiving electric port 720, the transmitting electric port 710 is connected with the electric port transmitting end of the test light source 620, and the receiving electric port 720 is connected with the electric port receiving end of the test light source 620.

The temperature cycle test box 600 includes a temperature cycle test board 610 and a plurality of wavelength division multiplexers 630, the test light source 620 and a plurality of measured light modules are all disposed on the temperature cycle test board 610, the wavelength division multiplexers 630 are connected with the test light source 620 and the measured light modules in a one-to-one correspondence, that is, the light port of the test light source 620 is connected with one wavelength division multiplexer, the light port of each measured light module is connected with one wavelength division multiplexer 630, so as to perform wavelength selection on the light signals transmitted and received by the test light source 620 and the measured light modules through the wavelength division multiplexers 630.

In this embodiment of the application, the measured optical module disposed on the temperature cycle test board 610 is a single-fiber bidirectional optical module, and because the transmitting and receiving wavelengths of the single-fiber bidirectional optical module are different, in order to avoid the light emission of the cascaded optical module from interfering with the previous-stage optical module, a wavelength division multiplexer is needed to perform light division, and the wavelength of the optical signal emitted by the measured optical module is selected, so as to emit the optical signal meeting the required wavelength to the next measured optical module; and the wavelength of the optical signal received by the tested optical module is selected, so that the optical signal meeting the required wavelength is transmitted into the tested optical module.

After the test light source 620 and the plurality of measured light modules are arranged on the temperature-cycling test board 610, a light source output interface of the test light source 620 is correspondingly connected with a light input interface of a first measured light module, so that an optical signal with a wavelength of 1 emitted by the test light source 620 is transmitted to the first measured light module; the first tested light module and the remaining tested light modules are in cascade connection, and the light input interface of the current tested light module is correspondingly connected with the light output interface of the last tested light module, so that the light path cascade connection of the plurality of tested light modules is realized; the optical output interface of the last measured optical module is correspondingly connected to the optical input interface of the test light source 620, so as to implement the cascade connection of the test light source 620 and the optical paths of the multiple measured optical modules.

After the test light source 620 and the multiple tested light modules are subjected to light path cascade, the transmitting electrical port and the receiving electrical port of each tested light module are correspondingly looped back, that is, the transmitting electrical port and the receiving electrical port of each tested light module are correspondingly shorted together, so that the optical signal with the wavelength of 1 received by the tested light module is converted into the optical signal with the wavelength of 2 to be transmitted, and the cascade of the light paths is realized.

After the transmitting electric port and the receiving electric port of the tested optical module are correspondingly looped back, the transmitting end of the electric port of the test light source 620 is connected with the transmitting electric port 710 of the error code meter 700, and the receiving end of the electric port of the test light source 620 is connected with the receiving electric port 720 of the error code meter 700, so that the error rate of the optical module product is detected in real time through the error code meter 700.

In this embodiment of the application, because the measured optical module is a single-fiber bidirectional optical module, the optical input interface and the optical output interface of the test light source 620 and the measured optical module are the same optical port, and the optical port is connected to the transmitting optical port and the receiving optical port of the wavelength division multiplexer, that is, the optical signal transmitted by the test light source 620 is transmitted to the first wavelength division multiplexer through the optical port, after the wavelength of the optical signal is subjected to optical division selection by the first wavelength division multiplexer, the optical signal is transmitted to the receiving optical port of the second wavelength division multiplexer connected to the first measured optical module through the transmitting optical port of the first wavelength division multiplexer, and the wavelength of the received optical signal is subjected to optical division selection by the second wavelength division multiplexer and then transmitted to the first measured optical module; the first measured optical module converts the received optical signal into an optical signal with another wavelength, transmits the optical signal to a receiving optical port of a third wavelength division multiplexer connected with the second measured optical module through an emitting optical port of the second wavelength division multiplexer, and transmits the optical signal to the second measured optical module through the third wavelength division multiplexer; by analogy, the last measured optical module is transmitted to the optical input interface of the test light source 620 through the light transmitting port of the nth wavelength division multiplexer, so that the cascade connection of the test light source 620 and the optical paths of the plurality of measured optical modules is realized.

Specifically, the optical module dynamic temperature cycle test device provided by the embodiment of the present application is described by taking the cascade of 4-stage linked optical paths as an example. Fig. 6 is a schematic block diagram of a 4-level link in a dynamic temperature cycle testing device for an optical module according to an embodiment of the present application. As shown in fig. 6, the optical module dynamic temperature cycle testing apparatus provided in the embodiment of the present application includes a testing light source 620, a wavelength division multiplexer 630, a first measured light module 210, a second measured light module 220, and a third measured light module 230, where the testing light source 620, the first measured light module 210, the second measured light module 220, and the third measured light module 230 are all disposed on the temperature cycle testing board 610; the wavelength division multiplexers include a first wavelength division multiplexer 630a, a second wavelength division multiplexer 630b, a third wavelength division multiplexer 630c and a fourth wavelength division multiplexer 630d, and the test light source 620 is connected with the first wavelength division multiplexer 630a and is used for splitting optical signals transmitted and received by the test light source 620; the first measured optical module 210 is connected to the second wavelength division multiplexer 630b, and is configured to split optical signals transmitted and received by the first measured optical module 210; the second measured optical module 220 is connected to the third wavelength division multiplexer 630c, and is configured to split optical signals transmitted and received by the second measured optical module 220; the third measured optical module 230 is connected to the fourth wavelength division multiplexer 630d, and is configured to split optical signals transmitted and received by the third measured optical module 230.

Fig. 7 is a functional diagram of a structure of a 4-level link in a dynamic temperature cycle test device for an optical module according to an embodiment of the present application. As shown in fig. 7, the thermal cycling test board 610 is provided with a first slot 6110, a second slot 6120, a third slot 6130 and a fourth slot 6140, and the test light source 620 is inserted into the first slot 6110 to fix the test light source 620 on the thermal cycling test board 610; the first light module 210 to be tested is inserted into the second slot 6120 to fix the first light module 210 to be tested on the thermal cycling test board 610; the second light module 220 is inserted into the third slot 6130, so as to fix the second light module 220 on the thermal cycling test board 610; the third light module 230 is inserted into the fourth slot 6140 to fix the third light module 230 on the testing board 610.

After the test light source 620, the measured light module and the wavelength division multiplexer are connected correspondingly, the optical output interface of the first wavelength division multiplexer 630a is connected with the optical input interface of the second wavelength division multiplexer 630b correspondingly, and the optical signal emitted by the test light source 620 is transmitted to the first measured light module 210; then, the optical output interface of the second wavelength division multiplexer 630b is correspondingly connected with the optical input interface of the third wavelength division multiplexer 630c, and the optical signal emitted by the first measured optical module 210 is transmitted to the second measured optical module 220; then, the optical output interface of the third wavelength division multiplexer 630c is correspondingly connected with the optical input interface of the fourth wavelength division multiplexer 630d, and the optical signal emitted by the second measured optical module 220 is transmitted to the third measured optical module 230; finally, the optical output interface of the fourth wavelength division multiplexer 630d is correspondingly connected to the optical input interface of the first wavelength division multiplexer 630a, and the optical signal emitted by the third measured optical module 230 is transmitted to the test light source 620. Thus, cascade connection of optical paths among the test light source 620, the first wavelength division multiplexer 630a, the second wavelength division multiplexer 630b, the first measured optical module 210, the third wavelength division multiplexer 630c, the second measured optical module 220, the fourth wavelength division multiplexer 630d, and the third measured optical module 230 is realized.

Because the measured optical module is a BIDI optical module, the measured optical module belongs to a single-fiber bidirectional optical module, the BIDI optical modules are produced and used in pairs, the receiving and transmitting wavelengths of the optical modules at the two ends are opposite, namely the transmitting wavelength of the end A is the same as the receiving wavelength of the end B. Therefore, the test light source 620 and the first measured light module 210 are a pair of BIDI optical modules, and the second measured light module 220 and the third measured light module 230 are a pair of BIDI optical modules.

In the embodiment of the present application, the first measured light module 210 and the third measured light module 230 are peer-to-peer BIDI optical modules, such as an a-side optical module; the testing light source 620 and the second measured light module 220 are the same-end BIDI optical module, such as a B-end optical module. In this way, the test light source 620 at the B end transmits the optical signal with the wavelength 1 to the first measured optical module 210 at the a end, the first measured optical module 210 converts the optical signal with the wavelength 1 into the optical signal with the wavelength 2, and transmits the optical signal with the wavelength 2 to the second measured optical module 220 at the B end, the second measured optical module 220 converts the optical signal with the wavelength 2 into the optical signal with the wavelength 1, and transmits the optical signal with the wavelength 1 to the third measured optical module 230 at the a end, and the third measured optical module 230 converts the optical signal with the wavelength 1 into the optical signal with the wavelength 2, and transmits the optical signal with the wavelength 2 to the test light source 620 at the B end.

Therefore, the wavelength of the optical signal output by the test light source 620 is the same as the wavelength of the optical signal input by the first tested light module 210, the wavelength of the optical signal output by the first tested light module 210 is the same as the wavelength of the optical signal input by the second tested light module 220, the wavelength of the optical signal output by the second tested light module 220 is the same as the wavelength of the optical signal input by the third tested light module 230, and the wavelength of the optical signal output by the third tested light module 230 is the same as the wavelength of the optical signal input by the test light source 620, so that the optical path cascade connection between the test light source, the four wavelength division multiplexers, and the three tested light modules is realized.

After the cascade connection of the optical paths is realized, only the transmitting and receiving of the electric port end of each tested optical module needs to be correspondingly and short-circuited, that is, the port self-loop on the circuit is completed, then only the electric port transmitting and receiving end of the test light source 620 needs to be connected to the same channel of the error code meter 700 for transmitting and receiving, and finally the whole link system is placed in a temperature cycle box, so that the cascade test of the dynamic temperature cycle can be realized.

In the optical module dynamic temperature cycle apparatus provided in the embodiment of the present application, the measured optical modules are BIDI optical modules, and are paired in production and use, so that the test apparatus is not limited to 4-stage link optical paths composed of the test light source 620 and three measured optical modules, such as 8-stage link optical paths and 16-stage link optical paths, as long as the sum of the numbers of the test light source 620 and the measured optical modules is even times of 2.

In this embodiment, as shown in fig. 7, the optical module dynamic temperature cycle testing apparatus further includes an MCU900 and a multiplexer 800, the MCU900 is connected to the input end of the multiplexer 800 through an SCL of an IIC line, the output ends of the multiplexer 800 are respectively connected to SCL ports of the measured optical modules, and the MCU900 is directly connected to SDA ports of the measured optical modules through an SDA of the IIC line. By adjusting the control port of the multiplexer 800, the monitoring information of each tested module in dynamic cascade can be monitored circularly, and the effectiveness of the testing equipment can be ensured.

FIG. 8 is a schematic block diagram of an exemplary light module dynamic temperature cycling test device. As shown in fig. 8, the existing temperature-cycling test box includes a temperature-cycling test board, a test light source and a tested light module are disposed on the temperature-cycling test board, the test light source and the tested light module are connected through an optical fiber, a power port transceiving end of the test light source is connected to transceiving of the same channel of the error code meter, and a power port transceiving end of the tested light module is connected to transceiving of the same channel of the error code meter.

Compared with the existing optical module dynamic temperature cycle test equipment, the optical module dynamic temperature cycle test equipment provided by the embodiment of the application only can be used for temperature cycle of 1-2 modules in a fixed temperature cycle period in the existing equipment, so that equipment and working hours are wasted; and the fixed temperature in the equipment that this application provided can realize in the cycle that several tens modules test simultaneously, has both reduced man-hour, can practice thrift equipment cost again, has improved production efficiency by a wide margin.

The optical module dynamic temperature cycle test equipment provided by the embodiment of the application comprises a temperature cycle test box and an error code meter, wherein a test light source and a plurality of tested light modules cascaded with the test light source are arranged in the temperature cycle test box; the temperature cycle test box comprises a temperature cycle test board and a plurality of wavelength division multiplexers, a test light source and a plurality of tested light modules are arranged on the temperature cycle test board, a light output interface of the test light source is correspondingly connected with a light input interface of a first tested light module, and a light input interface of the test light source is correspondingly connected with a light output interface of a last tested light module; the optical input interface of the current measured optical module is correspondingly connected with the optical output interface of the last measured optical module; the transmitting electric port and the receiving electric port of the tested optical module correspondingly loop back; the wavelength division multiplexers are connected with the test light sources and the tested light modules in a one-to-one correspondence mode and used for carrying out wavelength selection on optical signals transmitted and received by the test light sources and the tested light modules. This application cascades test light source and a plurality of photometry modules, the light path realizes cascading the back, the transmission electric mouth that will be surveyed the photometry module corresponds the loopback with receiving the electric mouth, accomplish the port on the circuit from this, accomplish the temperature and circulate the multistage link connection of a plurality of photometry modules of being surveyed in the test box from this, then the electric mouth transmission with test light source, the transmission of receiving terminal and error code appearance, receive the electric mouth and link together, the batch test of optical module developments temperature circulation has so been realized, the production efficiency is greatly improved, labor-hour and equipment are saved.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (10)

1. An optical module dynamic temperature cycle test device, comprising:

the temperature cycle test box is internally provided with a test light source and a plurality of tested light modules cascaded with the test light source;

the error code instrument is provided with a transmitting electric port and a receiving electric port, the transmitting electric port is connected with the electric port transmitting end of the test light source, and the receiving electric port is connected with the electric port receiving end of the test light source;

wherein, the temperature cycle test box includes:

the temperature cycle test board is provided with a test light source and a plurality of tested light modules, an optical output interface of the test light source is correspondingly connected with an optical input interface of a first tested light module, and an optical input interface of the test light source is correspondingly connected with an optical output interface of a last tested light module; the optical input interface of the current measured optical module is correspondingly connected with the optical output interface of the last measured optical module; the transmitting electric port and the receiving electric port of the tested optical module are correspondingly looped back;

and the wavelength division multiplexers are connected with the test light sources and the tested light modules in a one-to-one correspondence manner and are used for carrying out wavelength selection on optical signals transmitted and received by the test light sources and the tested light modules.

2. The optical module dynamic temperature cycle test device according to claim 1, wherein the plurality of measured optical modules include a first measured optical module, a second measured optical module, and a third measured optical module, the optical output interface of the test light source corresponds to the optical input interface of the first measured optical module, the optical output interface of the first measured optical module corresponds to the optical input interface of the second measured optical module, the optical output interface of the second measured optical module corresponds to the optical input interface of the third measured optical module, and the optical output interface of the third measured optical module corresponds to the optical input interface of the test light source.

3. The optical module dynamic temperature cycle test equipment according to claim 2, wherein the wavelength of the test light source output optical signal is the same as the wavelength of the first tested optical module input optical signal, the wavelength of the first tested optical module output optical signal is the same as the wavelength of the second tested optical module input optical signal, the wavelength of the second tested optical module output optical signal is the same as the wavelength of the third tested optical module input optical signal, and the wavelength of the third tested optical module output optical signal is the same as the wavelength of the test light source input optical signal.

4. The optical module dynamic temperature cycling test device according to claim 2, wherein the wavelength division multiplexer includes a first wavelength division multiplexer, a second wavelength division multiplexer, a third wavelength division multiplexer, and a fourth wavelength division multiplexer, the first wavelength division multiplexer is connected to the test optical module, the second wavelength division multiplexer is connected to the first measured optical module, the third wavelength division multiplexer is connected to the second measured optical module, and the fourth wavelength division multiplexer is connected to the third measured optical module.

5. The optical module dynamic temperature cycle test device according to claim 4, wherein the test light source, the optical input interface and the optical output interface of the measured optical module are the same optical port, and the optical port is connected to the transmitting optical port and the receiving optical port of the wavelength division multiplexer.

6. The optical module dynamic temperature cycle test device according to claim 2, wherein the temperature cycle test board is provided with a first slot, a second slot, a third slot and a fourth slot, the test light source is inserted into the first slot, the first light module to be tested is inserted into the second slot, the second light module to be tested is inserted into the third slot, and the third light module to be tested is inserted into the fourth slot.

7. The optical module dynamic temperature cycle test apparatus according to claim 2, wherein the test light source and the first measured optical module are a pair of BIDI optical modules, and the second measured optical module and the third measured optical module are a pair of BIDI optical modules.

8. The optical module dynamic temperature cycle test device according to claim 7, wherein the first measured optical module and the third measured optical module are same-end BIDI optical modules, and the test light source and the second measured optical module are same-end BIDI optical modules.

9. The light module dynamic temperature cycle test apparatus of claim 1, wherein the sum of the number of the test light sources and the light module under test is an even multiple of 2.

10. The optical module dynamic temperature cycle test equipment according to claim 1, further comprising an MCU and a multiplexer, wherein an SCL line of the MCU is connected to an input terminal of the multiplexer, and output terminals of the multiplexer are respectively connected to the measured optical module; and the SDA line of the MCU is respectively connected with the measured light module.

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