CN112782813A

CN112782813A - Optical module

Info

Publication number: CN112782813A
Application number: CN201911081020.5A
Authority: CN
Inventors: 郑龙; 杨思更
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2019-11-07
Filing date: 2019-11-07
Publication date: 2021-05-11
Anticipated expiration: 2039-11-07
Also published as: CN112782813B

Abstract

The invention discloses an optical module, which comprises a circuit board, a silicon optical chip, an optical fiber ribbon and a control chip, wherein the silicon optical chip, the optical fiber ribbon and the control chip are arranged on the circuit board; the silicon optical chip is coupled with one end of the optical fiber ribbon. The receiving optical waveguide in the silicon optical chip is connected with the optical fiber ribbon and used for receiving a receiving optical signal from the optical fiber ribbon; the optical power monitoring unit is connected with the receiving optical waveguide through the monitoring optical waveguide and is used for receiving the receiving optical signal split by the receiving optical waveguide according to the splitting ratio and monitoring the optical power; the optical power monitoring unit is connected with the control chip, and the control chip is used for receiving monitoring data of the optical power monitoring unit so as to determine whether the coupling connection between the silicon optical chip and the optical fiber ribbon meets the requirement. Therefore, the optical module provided by the invention has the advantages that the optical power monitoring unit is additionally arranged in the silicon optical chip, the optical power monitoring unit is used for monitoring the power of the received optical signal from the optical fiber ribbon, the coupling effect of the silicon optical chip and the optical fiber ribbon can be accurately determined, and the detection process of the optical module is simplified.

Description

Optical module

Technical Field

The invention relates to the technical field of optical fiber communication, in particular to an optical module.

Background

Optical modules are important products in the optical communication industry, which implement interconversion between optical signals and telecommunications, provide optical signals for transmission in optical fibers, and provide electrical signals for transmission in electronic devices.

Existing light modules may generally include: the optical fiber ribbon can input optical signals to the silicon optical chip and also can receive optical signals output by the silicon optical chip. However, the diameter of the optical fiber ribbon is too small, so that when the optical fiber ribbon is butted with the silicon optical chip, the coupling effect of the optical module is poor due to the fact that accurate butting cannot be achieved easily.

Therefore, the coupling connection of the silicon optical chip and the optical fiber ribbon directly determines whether the optical module can be normally used. Therefore, before an optical module is manufactured, the optical module needs to be detected to determine whether the coupling connection between the silicon optical chip and the optical fiber ribbon in the optical module meets the requirement.

At present, the commonly adopted detection method is to apply the optical module in an actual working scene, and determine whether the coupling connection between the silicon optical chip and the optical fiber ribbon in the optical module meets the requirement by detecting whether the optical module can normally work, and the detection process of the detection method is complex.

Disclosure of Invention

The invention provides an optical module, which aims to solve the problem that the process of detecting the optical module by using the existing method is complex.

The present invention provides an optical module, comprising:

the circuit board is provided with a power supply circuit and a signal circuit and is used for power supply and signal electric connection;

the control chip is arranged on the circuit board, connected with the optical power monitoring unit of the silicon optical chip and used for receiving monitoring data of the optical power monitoring unit;

the silicon optical chip is arranged on the circuit board, is connected with a signal circuit of the circuit board and is used for receiving a receiving optical signal from the optical fiber ribbon;

one end of the optical fiber ribbon is coupled with the silicon optical chip and used for transmitting and receiving optical signals;

the silicon optical chip comprises:

the light inlet of the receiving optical waveguide is connected with the optical fiber ribbon and used for receiving a receiving optical signal from the optical fiber ribbon;

one end of the monitoring optical waveguide is connected with the receiving optical waveguide and is used for receiving emergent light split by the receiving optical waveguide according to the light splitting ratio;

and one end of the optical power monitoring unit is connected with the control chip, and the other end of the optical power monitoring unit is connected with the monitoring optical waveguide and is used for carrying out optical power monitoring on the received optical signal transmitted by the monitoring optical waveguide.

According to the technical scheme, the optical module provided by the embodiment of the invention comprises a circuit board, and a silicon optical chip, an optical fiber ribbon and a control chip which are arranged on the circuit board; the silicon optical chip is coupled with one end of the optical fiber ribbon. The silicon optical chip comprises a receiving optical waveguide and an optical power monitoring unit, wherein an optical inlet of the receiving optical waveguide is opposite to the optical fiber ribbon and is used for receiving a receiving optical signal from the optical fiber ribbon; the optical power monitoring unit is connected with the receiving optical waveguide through the monitoring optical waveguide and is used for receiving the receiving optical signal split by the receiving optical waveguide according to the splitting ratio and carrying out optical power monitoring on the receiving optical signal; the optical power monitoring unit is connected with the control chip, and the control chip is used for receiving monitoring data of the optical power monitoring unit so as to determine whether the coupling connection between the silicon optical chip and the optical fiber ribbon meets the requirement. Therefore, the optical module provided by the invention can detect the coupling effect of the silicon optical chip and the optical fiber ribbon, namely, the optical power monitoring unit is additionally arranged in the silicon optical chip and used for monitoring the power of the received optical signal from the optical fiber ribbon, and the coupling effect of the silicon optical chip and the optical fiber ribbon can be accurately determined according to the monitoring data, so that the detection process of the optical module is simplified.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any inventive exercise.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic view of an overall structure of an optical module according to an embodiment of the present invention;

fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present invention;

fig. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present invention;

FIG. 6 is an overall optical path diagram of a silicon optical chip according to an embodiment of the present invention;

FIG. 7 is a diagram of a modulation optical path of a silicon optical chip according to an embodiment of the present invention;

fig. 8 is a circuit diagram of the connection between the control chip and the optical power monitoring unit according to the embodiment of the present invention;

FIG. 9 is a diagram of an optical path of a silicon optical chip according to an embodiment of the present invention;

fig. 10 is an optical path diagram of a control chip connected to a plurality of optical power monitoring units according to an embodiment of the present invention;

fig. 11 is another optical path diagram of the connection between the control chip and the plurality of optical power monitoring units according to the embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network unit 100, the optical module 200, the optical fiber 101, and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network unit 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and in the photoelectric conversion process, information only changes in a transmission carrier, and information does not change.

The optical network unit 100 has an optical module interface 102, which is used for accessing the optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200; the optical network unit 100 has a network cable interface 104 for accessing the network cable 103 and establishing a bidirectional electrical signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network unit 100, specifically, the optical network unit 100 transmits a signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, and the optical network unit 100 serves as an upper computer of the optical module 200 to monitor the operation of the optical module. Unlike the optical module, the optical network unit 100 has a certain information processing capability.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the onu 100 is an upper computer of the optical module, and provides a data signal to the optical module and receives a data signal from the optical module.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into the optical network unit 100, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and an optical port of the optical module 200 is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board 105, and the electric connector on the circuit board 105 is wrapped in the cage 106, so that the electric connector is arranged inside the cage 106; the optical module 200 is inserted into the cage 106, the optical module 200 is held by the cage 106, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by the heat sink 107 on the cage 106.

Fig. 3 is a schematic view of an overall structure of an optical module according to an embodiment of the present invention; fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present invention; fig. 5 is a schematic diagram of an internal structure of an optical module according to an embodiment of the present invention.

Referring to fig. 3 and 4, an optical module according to an embodiment of the present invention is different from the optical module structure according to the foregoing embodiment in that a silicon optical chip 400 is used to replace an optical transceiver to implement optical-to-electrical conversion of the optical module in the present embodiment. Specifically, the optical module provided in this embodiment includes: the optical fiber cable comprises an upper shell 201, a lower shell 202, an unlocking handle 203, a circuit board 300, a silicon optical chip 400, an optical fiber ribbon 500, a light source 600, a control chip 700, a light-emitting device and a third optical fiber 503, wherein the upper shell 201 and the lower shell 202 form a wrapping cavity with two openings (204, 205), and the circuit board 300, the silicon optical chip 400 and the optical fiber ribbon 500 are all located in the wrapping cavity.

The outer contour of the package cavity generally presents a square shape, and specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell 201 comprises a cover plate, and the cover plate covers two side plates of the upper shell 201 to form a wrapping cavity; the upper casing 201 may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper casing 201 on the lower casing 202.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board 300 extends out of the electric port 204 and is inserted into an upper computer such as an optical network unit; the other opening is an optical port 205 (optical interface 205) for the optical fiber ribbon 500 to access to connect the silicon optical chip 400 inside the optical module.

The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that the circuit board 300, the silicon optical chip 400 and other devices can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 form an outermost packaging protection shell of the optical module; the upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realizing electromagnetic shielding and heat dissipation; generally, the shell of the optical module cannot be made into an integrated structure, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation structure and the electromagnetic shielding structure cannot be installed, and the production automation is not facilitated.

The circuit board 300 has a power supply circuit and a signal circuit for power supply and signal electrical connection. One end of the circuit board 300 is provided with an optical interface 205, the optical interface 205 serves as an optical port of an optical module, one end of the circuit board 300 serves as an electrical port 204 of the optical module, and the optical port is opposite to the electrical port 204. The optical interface 205 is used for receiving the optical signal converted from the electrical signal from the circuit board 300, and transmitting the optical signal to the circuit board 300. An optical port plug 206 is arranged at one end of the optical interface 205, and the optical port plug 206 is connected with the optical interface 205 in an embedded manner, so that when the optical module is not used, a sealing effect is achieved, and dust pollution caused by long-time exposure is avoided. The light opening plug 206 can be made of rubber, has flexibility and can achieve a good sealing effect.

The unlocking handle 203 is located on the outer wall of the wrapping cavity/lower shell 202 and used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking handle 203 is provided with a clamping structure matched with the upper computer cage; the tail end of the unlocking handle is pulled to enable the unlocking handle to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer through a clamping structure of the unlocking handle; by pulling the unlocking handle, the clamping structure of the unlocking handle moves along with the unlocking handle, so that the connection relation between the clamping structure and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The optical transceiver comprises two parts, namely an optical transmitting part and an optical receiving part, which are respectively used for realizing the transmission of optical signals and the reception of the optical signals. The light emitting part and the light receiving part may be combined together or may be independent of each other. The light emitting component and the light receiving component provided by the embodiment of the application are combined together to form a light receiving and transmitting integrated structure.

In order to realize the photoelectric conversion of the optical module, the silicon optical chip 400 is arranged on the circuit board 300, the silicon optical chip 400 can simultaneously modulate the emergent light generated by the light source 600 according to the power supply circuit and the signal circuit of the circuit board 300 into an emergent light signal meeting the requirement, and transmit the emergent light signal to the optical interface 205, and modulate the optical signal from the optical interface 205 into an electrical signal, and transmit the electrical signal to the circuit board 300, so that the silicon optical chip can be used as an optical transceiver integrated component to realize the conversion of the photoelectric signal. One end of the silicon optical chip 400 is connected to the signal circuit of the circuit board 300, and the other end of the silicon optical chip 400 is connected to the optical interface 205 through the optical fiber ribbon 500. Silicon optical chip 400 is used to transmit optical signals to optical interface 205 through optical fiber ribbon 500 and receive optical signals from optical interface 205 through optical fiber ribbon 500 when performing optical-to-electrical conversion.

One end of the optical fiber ribbon 500 is coupled to the silicon optical chip 400, and the other end of the optical fiber ribbon 500 is connected to the optical interface 205, so as to receive and transmit optical signals. For this purpose, the optical fiber ribbon 500 may include two groups of optical fibers, i.e., a first optical fiber 501 and a second optical fiber 502, the first optical fiber 501 is used to transmit the optical signal modulated by the silicon optical chip 400 to the optical interface 205, the second optical fiber 502 is used to transmit the optical signal from the optical interface 205 to the silicon optical chip 400, and the optical signal is modulated to form an electrical signal and then transmitted to the circuit board 300.

Specifically, as shown in fig. 5, fiber optic ribbon 500 includes: the optical fiber comprises a first optical fiber 501 and a second optical fiber 502 which are arranged in parallel, one end of the first optical fiber 501 is coupled with the light outlet 405 of the silicon optical chip 400, the other end of the first optical fiber 501 is connected with the optical interface 205, and the first optical fiber 501 is used for receiving an emergent light signal modulated by the silicon optical chip 400 and transmitting the emergent light signal into the optical interface 205. One end of the second optical fiber 502 is coupled to the light receiving port 406 of the silicon optical chip 400, the other end of the second optical fiber 502 is connected to the optical interface 205, the second optical fiber 502 is configured to receive a light receiving signal sent by the optical interface 205, and the light receiving signal is modulated by the silicon optical chip 400 to obtain an electrical signal and sent to the circuit board 300.

The silicon optical chip 400 is used for realizing optical modulation, so that the power of an optical signal meets the use requirement of an optical module, but because the silicon optical chip 400 cannot emit light, an external light source is required to realize the emission of the optical signal in the light emission process. For this reason, the optical module provided in this embodiment further includes a light source 600, and the light source 600 is disposed on the circuit board 300, connected to the power supply circuit of the circuit board 300, and configured to generate outgoing light. The light source 600 is connected with the silicon optical chip 400 through the third optical fiber 503, one end of the third optical fiber 503 is coupled with the silicon optical chip 400, the other end of the third optical fiber 503 is connected with the light source 600, and emergent light generated by the light source 600 enters the silicon optical chip 400 through the third optical fiber 503.

The light source 600 is internally packaged with a laser chip, in the light emission process, the circuit board 300 supplies power to the light source 600 to drive the light source 600 to generate emergent light, the silicon optical chip 400 receives the emergent light generated by the light source 600 through the third optical fiber 503 and modulates the emergent light to obtain an emergent light signal, so that the optical power of the emergent light signal meets the optical requirement of the optical module, and the modulated optical signal is transmitted to the optical interface 205 through the first optical fiber 501. The number of the laser chips arranged in the light source 600 may be multiple, the specific arrangement number may be determined according to the use requirement of the optical module, that is, the arrangement is performed according to the light path of the modulated light of the silicon optical chip 400, if the silicon optical chip 400 can realize the modulation of three paths of incident light and four paths of emergent light, then three laser chips need to be arranged, and the light emitted by each laser chip enters the corresponding incident light waveguide in the silicon optical chip 400.

FIG. 6 is an overall optical path diagram of a silicon optical chip according to an embodiment of the present invention; fig. 7 is a modulation optical path diagram of a silicon optical chip according to an embodiment of the present invention. Referring to fig. 6 and fig. 7, in order to realize the modulation of the optical signal in the optical module during the optical transmission process, the silicon optical chip 400 provided in this embodiment includes: an incident optical waveguide 401, an optical power monitoring unit 402, an optical power modulating unit 403, a monitoring optical waveguide 407, and an exit optical waveguide 404.

In the light emitting process, the light inlet of the incident light waveguide 401 is connected to the light source 600 through the third optical fiber 503, and the incident light waveguide 401 is configured to receive the emergent light generated by the light source 600 through the third optical fiber 503. The number of the incident light waveguides 401 may be multiple, and at this time, the number of the light inlets of the silicon optical chip 400 is also multiple, so that the number of the incident light waveguides 401, the number of the laser chips, and the number of the light inlets are the same to ensure efficient transmission of light. That is, each incident light waveguide 401 is connected to the corresponding laser chip through the corresponding light inlet and the third optical fiber 503, so that the outgoing light emitted from each laser chip in the light source 600 can enter the corresponding incident light waveguide 401 to continue propagating.

The optical power modulation unit 403 is a device for implementing optical modulation of the silicon optical chip 400, one end of the optical power modulation unit 403 is connected to the light outlet of the incident light waveguide 401, and the optical power modulation unit 403 is configured to perform optical power modulation on the emergent light transmitted from the incident light waveguide 401 according to a signal circuit of the circuit board, so as to obtain an emergent light signal.

One end of the outgoing optical waveguide 404 is connected to the other end of the optical power modulation unit 403, the outgoing optical waveguide 404 is used for emitting the outgoing optical signal modulated by the optical power modulation unit 403, the other end of the outgoing optical waveguide 404 is connected to the optical fiber ribbon 500, and the outgoing optical signal enters the optical fiber ribbon 500 through the outgoing optical waveguide 404 and then is emitted. Specifically, the emergent optical waveguide 404 is connected to the first optical fiber 501, and the emergent optical signal enters the first optical fiber 501 after passing through the emergent optical waveguide 404, and is transmitted into the optical interface 205 by the first optical fiber 501.

To ensure that the optical power modulation unit 403 can modulate three outgoing light beams to obtain four outgoing light signals, in this embodiment, the optical power modulation unit 403 includes: a light splitting unit group 4031, a modulation unit group 4032, and a light combining unit group 4033.

One end of the light splitting unit group 4031 is connected to the incident light waveguide 401, and is configured to split the outgoing light transmitted by the incident light waveguide 401. Since the emergent light transmitted by the incident light waveguide 401 is emitted by the light source 600, and the optical power modulation unit 403 modulates the emergent light to obtain an optical signal meeting the optical power requirement, the optical power of the emergent light entering the optical power modulation unit 403 has a certain requirement, and cannot be higher than the upper threshold limit or lower than the lower threshold limit. Therefore, in order to ensure that the optical power of the outgoing light entering the optical power modulation unit 403 meets the modulation requirement, the light splitting unit 4031 is required to split and combine the multiple beams of light emitted by the light source 600, so as to complement the optical power of some outgoing light. For example, the light source 600 emits three beams of light, which enter the corresponding incident light waveguides (4011, 4012, 4013) through the three light inlets (L0, L1, L2), respectively, and since the optical power of the three beams of light may not meet the optical power requirement, the three beams of light need to be split into two beams of light, specifically, the light in the light inlet L1 is split by the splitting unit 1 (split 1 in fig. 7) and then is respectively combined into the emergent light in the light inlets L0 and L2, so as to respectively reinforce the optical power of the emergent light in the light inlets L0 and L2.

One end of the modulation unit group 4032 is connected to the other end of the optical splitting unit group 4031 through the first optical waveguide group, and the modulation unit group 4032 is configured to perform optical power modulation on outgoing light split by the optical splitting unit group 4031 according to a signal circuit of the circuit board, so as to obtain a modulated optical signal. The number of the modulation unit groups 4032 is related to how many optical signals the silicon optical chip 400 needs to output, and if the silicon optical chip 400 needs to emit four optical signals, four modulation unit groups 4032 need to be arranged.

The modulation unit group 4032 includes two modulation circuits, one of which is provided with a phase converter and a modulator, the phase converter is connected to the modulator through an optical waveguide, and the other is provided with only the modulator. In order to ensure that the optical power of the optical signal in the modulation unit group 4032 meets the modulation requirement, the optical splitting unit group 4031 needs to be used for optical splitting before entering the modulation unit group 4032. As shown in fig. 7, the spectroscopic unit group 4031 includes seven spectroscopic units, each having a spectroscopic ratio of 1: 1. The light splitting unit 1 is configured to split the outgoing light from the second incident light waveguide 4012. One end of the first incident optical waveguide 4011 is provided with a light splitting unit 2 (light splitting 2 in fig. 7), the light splitting unit 2 is connected to the light splitting unit 1 through an optical waveguide, and the light splitting unit 1 supplements a part of light after light splitting processing into the first incident optical waveguide 4011 through a corresponding optical waveguide. One end of the third incident optical waveguide 4013 is provided with a light splitting unit 3 (light splitting 3 in fig. 7), the light splitting unit 1 and the light splitting unit 3 are connected by an optical waveguide, and the light splitting unit 1 supplements the other part of light after light splitting treatment into the third incident optical waveguide 4013 through a corresponding optical waveguide.

The other end of the light splitting unit 2 is connected with two optical waveguides, wherein the other end of one optical waveguide is connected with a light splitting unit 4 (light splitting 4 in fig. 7), and the other end of the other optical waveguide is connected with a light splitting unit 5 (light splitting 5 in fig. 7); the other end of the light splitting unit 3 is connected to two optical waveguides, the other end of one optical waveguide is connected to the light splitting unit 6 (light splitting 6 in fig. 7), and the other end of the other optical waveguide is connected to the light splitting unit 7 (light splitting 7 in fig. 7), so that the three-way outgoing light is split into four-way optical signals by seven light splitting units. The other ends of the light splitting unit 4, the light splitting unit 5, the light splitting unit 6 and the light splitting unit 7 are respectively connected to one modulation unit group 4032, and the four modulation unit groups 4032 respectively modulate four optical signals to obtain four optical signals meeting optical power requirements.

In order to obtain an optical signal of optical power required by the optical module, two modulation circuits are built in the modulation unit group 4032, so that the light splitting unit 4, the light splitting unit 5, the light splitting unit 6, and the light splitting unit 7 perform light splitting again, that is, two optical waveguides are connected to the other ends of the light splitting unit 4, the light splitting unit 5, the light splitting unit 6, and the light splitting unit 7, respectively, wherein one optical waveguide is connected to the phase converter and the modulator, and the other optical waveguide is connected to the modulator. The modulation unit set 4032 may adopt an MZ (mach-zehnder) modulator, and the modulation principle thereof may be that two modulation circuits generate an optical interference effect, so that the two lights generate a phase difference, and a high-speed modulation optical signal, that is, an emergent optical signal meeting the optical power requirement is obtained after superposition.

In this embodiment, the light combining unit 4033 is used to realize superposition of two paths of light, so as to obtain an emergent light signal. One end of the optical combining unit 4033 is connected to the other end of the modulating unit 4032 through the second optical waveguide set, the other end of the optical combining unit 4033 is connected to the emergent optical waveguide 404, and the optical combining unit is configured to combine the modulated optical signals to obtain an emergent optical signal. The number of the combining unit groups 4033 is the same as the number of the modulation unit groups 4032, and is related to several optical signals output by the silicon optical chip 400. In the case that the silicon optical chip 400 needs to output four optical signals, four groups (four combined optical units) are also provided in the combined optical unit 4033, and each combined optical unit 4033 is correspondingly connected to one modulation unit 4032. Because two modulation circuits are arranged in the modulation unit 4032, in order to superimpose light, the optical combining unit 4033 is connected to the modulation unit 4032 through two optical waveguides, that is, one end of the optical combining unit 4033 is connected to two optical waveguides, one of the optical waveguides is connected to the one of the modulation unit 4032 where the phase converter and the modulator are arranged, and the other optical waveguide is connected to the other one of the modulation unit 4032 where only the modulator is arranged.

The other end of the light combining unit 4033 is connected to the outgoing light waveguide 404, and the other end of the outgoing light waveguide 404 is connected to the first optical fiber 501, where the outgoing light signal is an optical signal meeting the optical power requirement. The outgoing optical signal enters the first optical fiber 501 after passing through the outgoing optical waveguide 404, and the outgoing optical signal is propagated into the optical interface 205 by the first optical fiber 501. The number of the outgoing optical waveguides 404 is the same as the number of the combined optical unit groups 4033, and is related to several optical signals output by the silicon optical chip 400. In the case where the silicon optical chip 400 needs to output four optical signals, four sets of exit optical waveguides 404 are also provided. Specifically, the first outgoing optical waveguide 4041 is connected to the light combining unit 1 (light combining 1 in fig. 7), and a first outgoing optical signal TX0 generated by the light combining unit 1 propagates in the first outgoing optical waveguide 4041; the second outgoing optical waveguide 4042 is connected to the light combining unit 2 (light combining unit 2 in fig. 7), and a second outgoing optical signal TX1 generated by the light combining unit 2 propagates in the second outgoing optical waveguide 4042; the third outgoing optical waveguide 4043 is connected to the light combining unit 3 (light combining unit 3 in fig. 7), and a third outgoing optical signal TX2 generated by the light combining unit 3 propagates in the third outgoing optical waveguide 4043; the fourth outgoing optical waveguide 4044 is connected to the light combining unit 4 (light combining unit 4 in fig. 7), and a fourth outgoing optical signal TX3 generated by the light combining unit 4 propagates through the fourth outgoing optical waveguide 4044. The four outgoing optical waveguides 404 propagate the corresponding outgoing optical signals into the first optical fiber 501, and then the first optical fiber 501 propagates the four outgoing optical signals into the optical interface 205.

In the optical module provided in this embodiment, when performing photoelectric conversion, the silicon optical chip 400 needs to be capable of receiving an optical signal from the optical fiber ribbon 500 (light receiving process) and also receiving an optical signal from the light source 600 through the third optical fiber 503 (light emitting process). In order to ensure efficient transmission of the optical module, the silicon optical chip 400 is required to be coupled with the optical fiber ribbon 500 and the third optical fiber 503 well. Specifically, when the silicon optical chip 400 and the optical fiber ribbon 500 are coupled to realize photoelectric conversion, the diameter of the optical fiber is too small, and when the optical fiber ribbon 500 is butted with the silicon optical chip 400, the coupling effect of the optical module is very poor due to the fact that accurate butting cannot be achieved. Therefore, in order to ensure the coupling effect of the optical module, power detection needs to be performed on the light entering the silicon optical chip 400 to determine whether the optical fiber ribbon 500 and the silicon optical chip 400 are coupled in place.

In the optical module provided in this embodiment, when detecting the coupling effect between the optical fiber ribbon 500 and the silicon optical chip 400, the adopted method is to transmit the received optical signal generated by the external light emitting device to the silicon optical chip 400 through the optical fiber ribbon 500, and by comparing the optical power of the received optical signal generated by the external light emitting device with the optical power of the optical signal transmitted by the silicon optical chip 400, if the optical power of the optical signal transmitted in the silicon optical chip 400 is smaller than the optical power of the received optical signal generated by the light emitting device, it is indicated that the optical fiber ribbon 500 is not coupled with the silicon optical chip 400 in place.

The above embodiments are described with respect to the silicon photonic chip 400 during light emission, and the outgoing optical waveguide 404 of the silicon photonic chip 400 is used as the receiving optical waveguide 404 during light reception. According to the above-mentioned detection method, in order to perform power detection and monitoring of optical coupling effect, as shown in fig. 6, the optical module provided in this embodiment is provided with an inverted optical power monitoring unit 402 and a monitoring optical waveguide 407 in a silicon optical chip 400, and one end of the monitoring optical waveguide 407 is connected to the receiving optical waveguide 404, and is configured to receive the outgoing light split by the receiving optical waveguide 404 according to the splitting ratio; . Since the optical fiber ribbon 500 is connected to the receiving optical waveguide 404 in the silicon optical chip 400, and the receiving optical signal enters the silicon optical chip 400 from the optical fiber ribbon 500, one end of the reverse optical power monitoring unit 402 is connected to the control chip 400, and the other end is connected to the receiving optical waveguide 404 through the monitoring optical waveguide 407, for receiving the receiving optical signal propagated in the monitoring optical waveguide 407, and performing optical power monitoring on the receiving optical signal, where the receiving optical signal for performing optical power monitoring is obtained by splitting the receiving optical signal by the receiving optical waveguide 404 according to a splitting ratio. The optical power monitoring unit 402 may be a Monitor Photodiode (MPD), and the optical power monitoring unit 402 includes a P-pole and an N-pole. The optical power monitoring unit 402 is connected to the receiving optical waveguide 404, and when the outgoing light propagates in the receiving optical waveguide 404, the optical power monitoring unit 402 can receive a certain proportion of optical signals for power monitoring.

In this embodiment, the received light signal is generated by a light emitting device. When the coupling effect of the silicon optical chip 400 and the optical fiber ribbon 500 in the optical module is detected, the optical module is externally connected with a light emitting device, and the light emitting device generates an optical signal. The light emitting device is connected to the optical fiber ribbon 500, the light emitting device is connected to the silicon optical chip 400 through the optical fiber ribbon 500, and the light emitting device is configured to generate a receiving optical signal, and the receiving optical signal propagates into the silicon optical chip 400 through the optical fiber ribbon 500. Specifically, the light emitting device is connected to the second optical fiber 502, one end of the second optical fiber 502 is coupled to the light receiving port 406 of the silicon optical chip 400, the other end of the second optical fiber 502 is connected to the light emitting device, the second optical fiber 502 is configured to receive a receiving optical signal sent by the light emitting device, and the receiving optical signal enters the silicon optical chip 400 through the second optical fiber 502.

During light reception, the light input port of the receiving optical waveguide 404 is coupled to the optical fiber ribbon 500 for receiving a receiving optical signal from the optical fiber ribbon 500. The received optical signal entering the silicon photonic chip 400 propagates in the received optical waveguide 404 in the direction from TX0 to L0 as shown in fig. 7.

The reversed optical power monitoring unit 402 means that the setting direction of the optical power monitoring unit 402 is opposite to the modulation direction of the optical signal in the silicon photo chip 400, the modulation direction of the optical signal in the silicon photo chip 400 is the direction from L0 to TX0, and the setting direction of the optical power monitoring unit 402 provided in the present embodiment is the direction from TX0 to L0. The optical power monitoring unit 402 is disposed in the same direction as the direction in which the received optical signal enters the silicon optical chip 400 from the optical fiber ribbon 500.

The receiving optical waveguide 404 is a main path, and the portion connected to the optical power monitoring unit 402 is a branch path, that is, the monitoring optical waveguide 407 is a branch path, and the optical signal in the branch path accounts for 2% -5% of the optical signal in the main path. That is, after the received optical signal propagating in the receiving optical waveguide 404 reaches the connection point of the branch, light with a splitting ratio of 2% to 5% is split and propagates into the optical power monitoring unit 402 through the branch, and the optical power monitoring unit 402 performs power monitoring to determine whether the silicon optical chip 400 and the optical fiber ribbon 500 are coupled in place. When splitting optical signals to the branch, a splitting ratio, such as 2% to 5%, may be set in the optical power monitoring unit 402, so that only optical signals meeting the ratio requirement are split into the branch to enter the optical power monitoring unit 402.

In order to ensure that the optical power monitoring unit 402 can monitor and find that the silicon optical chip 400 and the optical fiber ribbon 500 are coupled in place, in the optical module provided in this embodiment, the silicon optical chip 400 is connected to a control chip 700, the control chip 700 is disposed on the circuit board 300 and connected to the optical power monitoring unit 402, and is configured to receive monitoring data of the optical power monitoring unit 402, analyze and calculate according to the monitoring data, and determine whether the monitored power reaches a maximum value, so as to determine whether the silicon optical chip 400 and the optical fiber ribbon 500 are coupled in place. If the monitored power reaches the maximum value, it is indicated that the silicon optical chip 400 and the optical fiber ribbon 500 are coupled in place, the maximum value of the power refers to the optical power value corresponding to the optical module in the optimal coupling, that is, the optical power value corresponding to the optimal position reached by the silicon optical chip 400 and the optical fiber ribbon 500 in the butt joint, and the maximum value of the power is the same as the optical power of the light-receiving signal sent by the light-emitting device.

Fig. 8 is a circuit diagram of the connection between the control chip and the optical power monitoring unit according to the embodiment of the present invention. As shown in fig. 5 and 8, to receive the monitoring data of the optical power monitoring unit 402, the control chip 700 includes: MCU701, first resistance 703, second resistance 704, filter capacitance 702 and bias voltage. The control chip 700 is connected to the optical power monitoring unit 402, and the optical power monitoring unit 402 includes a P-pole (MPD-P in fig. 8) and an N-pole (MPD-N in fig. 8), for which the MCU701 is connected to the P-pole of the optical power monitoring unit 402.

One end of the first resistor 703 (R1 in fig. 8) is connected to the N-pole of the optical power monitoring unit 402, and the other end of the first resistor 703 is connected to a bias voltage (VCC in fig. 8) to perform bias processing; one end of the second resistor 704 (R2 in fig. 8) is connected to the P pole of the optical power monitoring unit 402; the other end of the second resistor 704 is connected to one end of the filter capacitor 702 (C1 in fig. 8) to form a sampling circuit. The other end of the filter capacitor 702 is connected to the MCU701 through an analog-to-digital conversion interface (ADC in fig. 8), the data collected by the sampling circuit is transmitted to the MCU701, and processed by the MCU701, and it is determined whether the silicon optical chip 400 and the optical fiber ribbon 500 are coupled in place by determining whether the collected power reaches a maximum value. MCU701 can select the singlechip as.

In this embodiment, the N-pole of the optical power monitoring unit 402 is connected to the bias voltage via the first resistor, but in other embodiments, the N-pole of the optical power monitoring unit 402 may be directly connected to the bias voltage. Both embodiments can realize the monitoring of the optical signal, and the difference is that the optical signal is poorer when the scheme which is not connected with the bias voltage through the first resistor is used for power monitoring.

Specifically, in another embodiment, the control chip 700 includes: MCU701, second resistance 704, bias voltage and filter capacitance 702. The MCU701 is connected with the P pole of the optical power monitoring unit 402; the N-pole of the optical power monitoring unit 402 is connected to a bias voltage; one end of the second resistor 704 is connected to the P-pole of the optical power monitoring unit 402; the other end of the second resistor 704 is connected to one end of the filter capacitor 702, and the other end of the filter capacitor 702 is connected to the MCU701 through an analog-to-digital conversion interface.

According to the two schemes for connecting the control chip 700 and the optical power monitoring unit 402 provided by the foregoing embodiment, both the power monitoring of the optical power monitoring unit 402 can be realized, and the monitoring data is sent to the control chip 700, so that the optical power of the emergent light emitted by the light source 600 after entering the silicon optical chip 400 can be known, the control chip 700 can conveniently judge according to the monitored power data, and the coupling effect between the silicon optical chip 400 and the optical fiber ribbon 500 can be further determined.

Fig. 9 is a light path diagram of a silicon optical chip according to an embodiment of the present invention. Referring to fig. 9, since the silicon optical chip 400 can simultaneously implement receiving of multiple paths of outgoing light and transmitting of multiple paths of optical signals, the usage requirement of the optical module is met. Therefore, when the silicon optical chip 400 needs to receive multiple optical signals, a plurality of incident light waveguides 401 are disposed in the silicon optical chip 400, and for this reason, the same number of laser chips are correspondingly disposed in the light source 600. Meanwhile, a plurality of receiving optical waveguides 404 are arranged in the silicon optical chip 400, and the number of the receiving optical waveguides 404 is related to the requirement of the silicon optical chip 400 to transmit several optical signals.

When a plurality of receiving optical waveguides 404 are disposed in the silicon optical chip 400, in order to perform power detection on the received optical signal propagating in each receiving optical waveguide 404, one optical power monitoring unit 402 needs to be correspondingly disposed at each receiving optical waveguide 404, that is, the optical power monitoring units 402 and the receiving optical waveguides 404 are disposed in the same number and are connected in a one-to-one correspondence manner. Specifically, the first optical power monitoring unit 4021 is connected to the first receiving optical waveguide 4041, the second optical power monitoring unit 4022 is connected to the second receiving optical waveguide 4042, the third optical power monitoring unit 4023 is connected to the third receiving optical waveguide 4043, and the fourth optical power monitoring unit 4024 is connected to the fourth receiving optical waveguide 4044.

Fig. 10 is an optical path diagram of a control chip connected to a plurality of optical power monitoring units according to an embodiment of the present invention. The control chip 700 is connected to the plurality of optical power monitoring units 402 to receive the monitoring data of each optical power monitoring unit 402. Referring to fig. 8 and fig. 10, this embodiment provides a possible specific implementation manner that the control chip is connected to the plurality of optical power monitoring units, that is, the N pole (MPD-N in fig. 10) of each optical power monitoring unit 402 is connected together in series, the P pole (MPD-P in fig. 10) of each optical power monitoring unit 402 is connected together in series, and the plurality of optical power monitoring units 402 connected together in series are connected to the control chip 700 through the same interface (ADC).

In this embodiment, taking the silicon optical chip 400 as an example in which four receiving optical waveguides and four optical power monitoring units are disposed, N stages of four MPDs are connected together, and the connected N stages (MPD-N) are further connected to the control chip 700; and, connecting the P stages of the four MPDs together, and connecting the connected P stages (MPD-P) with the control chip 700. Specifically, the MPD-N connected together is connected to a bias voltage VCC through a first resistor 703, or the MPD-N connected together is directly connected to the bias voltage VCC for bias processing. The MPD-P connected together is connected to an analog-to-digital conversion interface (ADC) of the MCU701 through the second resistor 704 and the filter capacitor 702 for data sampling, so as to send the monitoring data of the optical power monitoring unit 402 to the control chip 700, and the optical power of the received optical signal propagating in the first incident optical waveguide 4011, the second incident optical waveguide 4012, the third incident optical waveguide 4013, or the fourth receiving optical waveguide 4044 can be obtained.

Since the plurality of optical power monitoring units 402 are connected to the control chip 700 in series, in order to ensure that the control chip 700 can receive the optical power of the received optical signal in the corresponding receiving optical waveguide 404 monitored by the optical power monitoring unit 402 during power monitoring, the plurality of optical power monitoring units 402 are required to separately monitor the received optical signal in the corresponding receiving optical waveguide 404 according to a certain period. That is, after the first optical power monitoring unit 402 monitors the optical power of the received optical signal in the corresponding received optical waveguide 404, the next optical power monitoring unit 402 is controlled to monitor the optical power of the received optical signal in the corresponding received optical waveguide 404, and so on. That is, the plurality of optical power monitoring units 402 do not operate simultaneously, but start sequentially according to a certain period cycle, and when one optical power monitoring unit 402 is monitoring, the other optical power monitoring units 402 are in an unexecuted monitoring state, so as to respectively determine the coupling state of each path in the silicon optical chip 400 and the optical fiber ribbon 500.

However, since the four MPDs are connected in series, if the four MPDs simultaneously monitor the optical power of the received optical signal in the corresponding receiving optical waveguide 404, the four MPDs are connected to the control chip 700 through the same interface, so that the monitoring data of the four MPDs are merged together and sent to the control chip 700, and the control chip 700 cannot accurately determine which MPD the received monitoring data corresponds to. Therefore, although the connection mode provided by this embodiment can save resources, simultaneous monitoring of optical signals in the four receiving optical waveguides cannot be realized, and the monitoring efficiency is lower. Therefore, the optical module provided by the embodiment of the invention also provides a connection scheme of the control chip and the plurality of optical power monitoring units, which can perform simultaneous monitoring.

Fig. 11 is another optical path diagram of the connection between the control chip and the plurality of optical power monitoring units according to the embodiment of the present invention. In another possible embodiment, referring to fig. 11, the P pole (MPD-P in fig. 11) and the N pole (MPD-N in fig. 11) of each optical power monitoring unit 402 are connected together, and each optical power monitoring unit 402 is connected to the control chip 700 through a corresponding interface. The P pole and the N pole of each optical power monitoring unit 402 are connected by the same bias and sampling circuit as the circuit shown in fig. 8, and the specific connection manner may refer to the description of the circuit shown in fig. 8 in the foregoing embodiment, and is not described herein again.

In this embodiment, the P-stage of the optical power monitoring unit 402 and the N-stage thereof are connected together, so that the optical power monitoring units 402 are devices existing individually, and each optical power monitoring unit 402 is connected to the control chip 700. Therefore, a plurality of ADC interfaces are required to be arranged on the control chip 700, and the number of the ADC interfaces is the same as the number of the optical power monitoring units 402. Taking the example that four receiving optical waveguides 404 and four optical power monitoring units 402 are arranged in the silicon optical chip 400, the number of ADC interfaces is also four (not shown in the figure), and after the P-stage of the first optical power monitoring unit 4021 (MPD 1 in fig. 11) and the N-stage of the first optical power monitoring unit are connected together, the first optical power monitoring unit is connected to the control chip 700 through the first ADC interface; after the P stage of the second optical power monitoring unit 4022 (MPD 2 in fig. 11) and the N stage thereof are connected together, the second optical power monitoring unit is connected to the control chip 700 through the second ADC interface; after the P stage of the third optical power monitoring unit 4023 (MPD 3 in fig. 11) and the N stage thereof are connected together, the third optical power monitoring unit is connected to the control chip 700 through a third ADC interface; after the P stage of the fourth optical power monitoring unit 4024 (MPD 4 in fig. 11) and the N stage thereof are connected together, they are connected to the control chip 700 through the fourth ADC interface. The specific connection manner of the P-stage and the N-stage of each optical power monitoring unit 402 and the control chip 700 can refer to the circuit diagram shown in fig. 8.

It can be seen that, in the present embodiment, the plurality of optical power monitoring units 402 are connected to the control chip 700 in parallel, and the plurality of optical power monitoring units 402 do not affect each other when monitoring the optical power. Specifically, each optical power monitoring unit 402 is connected to the control chip 700 through different ADC interfaces, so that the control chip 700 can independently receive monitoring data from different optical power monitoring units 402, multiple sets of monitoring data do not interfere with each other, the processing process of the control chip 700 is not affected, and the accuracy of data reception can be ensured. Therefore, the connection method provided by this embodiment can enable a plurality of optical power monitoring units 402 to operate independently, and can monitor the optical power of the received optical signal in the receiving optical waveguide 404 connected thereto at the same time, thereby improving the monitoring efficiency.

In the optical module provided by the embodiment of the invention, the silicon optical chip 400 replaces a traditional optical transceiver as an optical transceiver integrated component, and is used for simultaneously realizing conversion of photoelectric signals. In order to ensure that the optical power of the silicon optical chip 400 in modulating the optical signal can meet the use requirement of the optical module, the optical power monitoring unit 402 is arranged in the silicon optical chip 400 to perform power monitoring on the received optical signal from the optical fiber ribbon 500, so as to detect whether the silicon optical chip 400 and the optical fiber ribbon 500 are coupled in place.

The silicon optical chip 400 can realize the input and output of multiple optical signals, which can be determined according to the practical application. Taking the silicon optical chip 400 to realize three-input four-output as an example, referring to fig. 9, the optical power modulation unit 403 in the silicon optical chip 400 needs to modulate three-output light into four-output light signals, for this reason, the silicon optical chip 400 includes three incident optical waveguides (4011, 4012, 4013), the optical power modulation unit 403, four receiving optical waveguides (4041, 4042, 4043, 4044), four monitoring optical waveguides 407, four optical power monitoring units (4021, 4022, 4023, 4024) connected with the four receiving optical waveguides in a one-to-one correspondence manner, and three laser chips are packaged in the light source 600 to generate three-beam output light.

Based on the silicon optical chip 400, when the coupling state of the silicon optical chip 400 and the optical fiber ribbon 500 in the optical module is detected, an optical power monitoring unit is respectively connected to the four receiving optical waveguides. In the light receiving process, the silicon optical chip 400 is provided with four light inlets, one end of each light inlet is connected to one receiving optical waveguide 404, and the other end of each light inlet is connected to the optical fiber ribbon 500, so that each receiving optical waveguide 404 receives the receiving optical signal from the optical fiber ribbon 500 through the corresponding light inlet.

Specifically, a first light inlet (not shown in the figure) corresponding to the first receiving optical waveguide 4041 is opposite to the light outlet of the optical fiber ribbon 500, and the first receiving optical waveguide 4041 is configured to receive a first receiving optical signal TX0 from the optical fiber ribbon 500 through the first light inlet; the first optical power monitoring unit 4021 is connected to the first receiving optical waveguide 4041 through the first monitoring optical waveguide, and is configured to monitor the first receiving optical signal that propagates through the first monitoring optical waveguide by splitting light. A second light inlet (not shown) corresponding to the second receiving optical waveguide 4042 is opposite to the light outlet of the optical fiber ribbon 500, and the second receiving optical waveguide 4042 is configured to receive a second receiving optical signal TX1 from the optical fiber ribbon 500 through the second light inlet; the second optical power monitoring unit 4022 is connected to the second receiving optical waveguide through the second monitoring optical waveguide, and is configured to monitor the second receiving optical signal that enters the second monitoring optical waveguide through splitting. A third light inlet (not shown) corresponding to the third receiving optical waveguide 4043 is opposite to the light outlet of the optical fiber ribbon 500, and the third receiving optical waveguide 4043 is configured to receive a third receiving optical signal TX2 from the optical fiber ribbon 500 through the third light inlet; the third optical power monitoring unit 4023 is connected to the third receiving optical waveguide through the third monitoring optical waveguide, and is configured to monitor a third receiving optical signal that enters the third monitoring optical waveguide through splitting. A fourth light inlet (not shown) corresponding to the fourth receiving optical waveguide 4044 is opposite to the light outlet of the optical fiber ribbon 500, and the fourth receiving optical waveguide is configured to receive a fourth receiving optical signal TX3 from the optical fiber ribbon 500 through the fourth light inlet; the fourth optical power monitoring unit 4024 is connected to the fourth receiving optical waveguide through the fourth monitoring optical waveguide, and is configured to monitor a fourth receiving optical signal that enters the fourth monitoring optical waveguide through splitting.

The four optical power monitoring units 402 are respectively connected to the control chip 700, and a specific optical path connection manner may adopt any one of fig. 10 and fig. 11, and a specific selection may be determined according to an actual use requirement, which is not limited herein. Accordingly, the connection manner of the four optical power monitoring units 402 and the control chip 700 may be as shown in fig. 8, and specific reference is made to the description of the foregoing embodiments, which is not repeated herein.

As can be seen from the above technical solutions, an optical module provided in the embodiment of the present invention includes a circuit board 300, and a silicon optical chip 400, an optical fiber ribbon 500 and a control chip 700 that are disposed on the circuit board 300; the silicon optical chip is coupled to one end of the optical fiber ribbon 500. The silicon optical chip 400 includes a receiving optical waveguide 404 and an optical power monitoring unit 402, wherein an optical inlet of the receiving optical waveguide 404 is opposite to the optical fiber ribbon 500 and is used for receiving a receiving optical signal from the optical fiber ribbon 500; the optical power monitoring unit 402 is connected to the receiving optical waveguide 404 through a monitoring optical waveguide, and is configured to receive a receiving optical signal split by the receiving optical waveguide 404 according to a splitting ratio, and perform optical power monitoring on the receiving optical signal; the optical power monitoring unit 402 is connected to the control chip 700, and the control chip 700 is configured to receive monitoring data of the optical power monitoring unit 402 to determine whether the coupling connection between the silicon optical chip 400 and the optical fiber ribbon 500 meets the requirement. Therefore, the optical module provided by the invention can detect the coupling effect of the silicon optical chip 400 and the optical fiber ribbon 500, that is, the optical power monitoring unit 402 is additionally arranged in the silicon optical chip 400, the optical power monitoring unit 402 monitors the power of the received optical signal from the optical fiber ribbon 500, and the coupling effect of the silicon optical chip 400 and the optical fiber ribbon 500 can be accurately determined according to the monitoring data, so that the detection process of the optical module is simplified.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A light module, comprising:

the silicon optical chip comprises:

2. The optical module according to claim 1, wherein a splitting ratio of the received optical signal propagating in the receiving optical waveguide is 2% to 5%, and an optical signal corresponding to the splitting ratio of 2% to 5% propagates into the optical power monitoring unit through the monitoring optical waveguide.

3. The light module of claim 1, wherein the control chip comprises:

the MCU is connected with the P pole of the optical power monitoring unit; the optical power monitoring unit comprises a P pole and an N stage;

one end of the first resistor is connected with the N pole of the optical power monitoring unit, and the other end of the first resistor is connected with a bias voltage;

one end of the second resistor is connected with the P pole of the optical power monitoring unit;

and one end of the filter capacitor is connected with the other end of the second resistor, and the other end of the filter capacitor is connected with the MCU.

4. The light module of claim 1, wherein the control chip comprises:

the MCU is connected with the P pole of the optical power monitoring unit; the optical power monitoring unit comprises a P pole and an N pole, and the N pole of the optical power monitoring unit is connected with a bias voltage;

5. The optical module according to claim 1, wherein the silicon optical chip comprises a plurality of receiving optical waveguides and a plurality of optical power monitoring units, and the optical power monitoring units are connected with the receiving optical waveguides in a one-to-one correspondence manner;

the optical power monitoring units comprise P poles and N stages, the P poles of each optical power monitoring unit are connected together in series, the N poles of each optical power monitoring unit are connected together in series, and the plurality of optical power monitoring units connected together in series are connected with the control chip through the same interface.

6. The optical module according to claim 1, wherein the silicon optical chip comprises a plurality of receiving optical waveguides and a plurality of optical power monitoring units, and the optical power monitoring units are connected with the receiving optical waveguides in a one-to-one correspondence manner;

the optical power monitoring units comprise P poles and N stages, the P poles and the N poles of the optical power monitoring units are connected together, and the optical power monitoring units are respectively connected with the control chip through corresponding interfaces.

7. The optical module according to claim 1, wherein the silicon optical chip comprises four receiving optical waveguides, four monitoring optical waveguides, and four optical power monitoring units connected to the four receiving optical waveguides in a one-to-one correspondence;

a first light inlet corresponding to the first receiving optical waveguide is opposite to a light outlet of the optical fiber ribbon, and the first receiving optical waveguide is used for receiving a first receiving optical signal from the optical fiber ribbon through the first light inlet; the first optical power monitoring unit is connected with the first receiving optical waveguide through a first monitoring optical waveguide and is used for monitoring a first receiving optical signal;

a second light inlet corresponding to the second receiving optical waveguide is opposite to the light outlet of the optical fiber ribbon, and the second receiving optical waveguide is used for receiving a second receiving optical signal from the optical fiber ribbon through the second light inlet; the second optical power monitoring unit is connected with the second receiving optical waveguide through a second monitoring optical waveguide and is used for monitoring a second receiving optical signal;

a third light inlet corresponding to the third receiving optical waveguide is opposite to the light outlet of the optical fiber ribbon, and the third receiving optical waveguide is used for receiving a third receiving optical signal from the optical fiber ribbon through the third light inlet; the third optical power monitoring unit is connected with the third receiving optical waveguide through a third monitoring optical waveguide and is used for monitoring a third receiving optical signal;

a fourth light inlet corresponding to the fourth receiving optical waveguide is opposite to the light outlet of the optical fiber ribbon, and the fourth receiving optical waveguide is used for receiving a fourth receiving optical signal from the optical fiber ribbon through the fourth light inlet; the fourth optical power monitoring unit is connected to the fourth receiving optical waveguide through a fourth monitoring optical waveguide, and is configured to monitor a fourth receiving optical signal.

8. The optical module of claim 1, further comprising:

the light-emitting device is connected with the silicon optical chip through the optical fiber ribbon and used for generating a receiving optical signal, and the receiving optical signal is transmitted into the silicon optical chip through the optical fiber ribbon.

9. The optical module of claim 8, wherein the optical fiber ribbon comprises:

one end of the first optical fiber is coupled with the light outlet of the silicon optical chip;

and one end of the second optical fiber is coupled with the light receiving port of the silicon optical chip, the other end of the second optical fiber is connected with the light emitting device, the second optical fiber is used for receiving a receiving optical signal sent by the light emitting device, and the receiving optical signal enters the silicon optical chip through the second optical fiber.