WO2022110965A1

WO2022110965A1 - Optical module

Info

Publication number: WO2022110965A1
Application number: PCT/CN2021/117229
Authority: WO
Inventors: 尹延龙; 陈思涛; 隋少帅; 赵其圣
Original assignee: 青岛海信宽带多媒体技术有限公司
Priority date: 2020-11-24
Filing date: 2021-09-08
Publication date: 2022-06-02
Also published as: CN114545564A; CN114545564B

Abstract

Provided is an optical module, comprising: a circuit board (300), a first optical fiber array (302), a second optical fiber array (303), a lithium niobate chip (500), and a silicon optical chip (400). The circuit board (300) is provided with a laser (301); a signal light emitted from the laser (301) enters a first optical core array (302) by way of the lithium niobate chip (500), performing a light emission function; the lithium niobate chip (500) contains a modulation unit; at the same time, by means of an optical coupling connection between the silicon optical chip (400) and the lithium niobate chip (500), monitoring of the modulated optical path is achieved. An optical transceiver device consists of a combination of a silicon optical chip (400) and a lithium niobate chip (500), achieving the modulation of an optical signal and monitoring of a modulated signal, making full use of the high bandwidth, low drive voltage, and low insertion loss of a lithium niobate modulator and the advantage of a high degree of integration of a silicon optical chip device.

Description

一种光模块an optical module

本公开要求在2020年11月24日提交中国专利局、申请号为202011328746.7、专利名称为“一种光模块”的优先权，其全部内容通过引用结合在本公开中。This disclosure claims the priority of the application number 202011328746.7 and the patent name "An Optical Module" filed with the China Patent Office on November 24, 2020, the entire contents of which are incorporated in this disclosure by reference.

技术领域technical field

本公开涉及光通信技术领域，尤其涉及一种光模块。The present disclosure relates to the technical field of optical communication, and in particular, to an optical module.

背景技术Background technique

随着云计算、移动互联网、视频等新型业务和应用模式发展，光通信技术的发展进步变的愈加重要。而在光通信技术中，光模块是实现光电信号相互转换的工具，是光通信设备中的关键器件之一，并且随着光通信技术发展的需求光模块的传输速率不断提高。With the development of new business and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of photoelectric signals, and it is one of the key components in the optical communication equipment. With the development of the optical communication technology, the transmission rate of the optical module continues to increase.

目前，硅光芯片作为光模块中的光引擎技术方案，在光模块产品中得到了越来越多的关注。At present, silicon photonics chips, as the technical solution of optical engines in optical modules, have received more and more attention in optical module products.

发明内容SUMMARY OF THE INVENTION

本公开实施例公开了一种光模块，包括：电路板，所述电路板上设置有激光器；铌酸锂芯片，用于接收所述激光器发射的光，并将所述光进行调制成信号光；第一光纤阵列，接收所述铌酸锂芯片的信号光；第二光纤阵列；硅光芯片，包括：光接收单元和光监测单元；所述光接收单元用于接收所述第二光纤阵列的光信号，并将接收到的光信号转化为电信号；所述光监测单元与所述铌酸锂芯片耦合连接，用于监测所述光发射信号。An embodiment of the present disclosure discloses an optical module, comprising: a circuit board on which a laser is arranged; a lithium niobate chip for receiving light emitted by the laser and modulating the light into signal light a first optical fiber array, receiving the signal light of the lithium niobate chip; a second optical fiber array; a silicon photonic chip, including: a light receiving unit and a light monitoring unit; the light receiving unit is used to receive the second optical fiber array. The optical signal is converted into an electrical signal; the optical monitoring unit is coupled and connected to the lithium niobate chip for monitoring the optical emission signal.

附图说明Description of drawings

为了更清楚地说明本公开的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，对于本领域普通技术人员而言，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions of the present disclosure more clearly, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, for those of ordinary skill in the art, without any creative effort, the Additional drawings can be obtained from these drawings.

图1为光通信终端连接关系示意图；Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals;

图2为光网络终端结构示意图；FIG. 2 is a schematic structural diagram of an optical network terminal;

图3为本公开实施例提供的一种光模块的结构示意图；FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

图4为本公开实施例提供的一种光模块的分解结构示意图；FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present disclosure;

图5为本公开实施例提供的一种光收发器件结构示意图一；FIG. 5 is a schematic structural diagram 1 of an optical transceiver device according to an embodiment of the present disclosure;

图6为本公开实施例提供的一种硅光芯片和铌酸锂芯片连接示意图一；FIG. 6 is a schematic diagram 1 of connection between a silicon photonics chip and a lithium niobate chip according to an embodiment of the present disclosure;

图7为本公开实施例提供的一种硅光芯片和铌酸锂芯片连接示意图二；FIG. 7 is a second schematic diagram of connection between a silicon photonics chip and a lithium niobate chip according to an embodiment of the present disclosure;

图8为本公开实施例提供的一种硅光芯片和铌酸锂芯片连接示意图三；FIG. 8 is a third schematic diagram of connection between a silicon photonics chip and a lithium niobate chip according to an embodiment of the present disclosure;

图9为本公开实施例提供的一种光收发器件光路示意图；FIG. 9 is a schematic diagram of an optical path of an optical transceiver device according to an embodiment of the present disclosure;

图10为本公开实施例提供的一种光收发器件结构示意图二；FIG. 10 is a second schematic structural diagram of an optical transceiver device according to an embodiment of the present disclosure;

图11为本公开实施例提供的一种光收发器件结构示意图三；FIG. 11 is a third schematic structural diagram of an optical transceiver device according to an embodiment of the present disclosure;

图12为本公开实施例提供的一种光收发器件结构示意图四；FIG. 12 is a fourth schematic structural diagram of an optical transceiver device according to an embodiment of the present disclosure;

图13为本公开实施例提供的一种光收发器件结构示意图五。FIG. 13 is a fifth structural schematic diagram of an optical transceiver device according to an embodiment of the present disclosure.

具体实施方式Detailed ways

为了使本技术领域的人员更好地理解本公开中的技术方案，下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本公开保护的范围。In order for those skilled in the art to better understand the technical solutions in the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described The embodiments are only some, but not all, embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present disclosure.

光纤通信的核心环节之一是光、电信号的相互转换。光纤通信使用携带信息的光信号在光纤/光波导等信息传输设备中传输，利用光在光纤/光波导中的无源传输特性可以实现低成本、低损耗的信息传输；而计算机等信息处理设备使用的是电信号，为了在光纤/光波导等信息传输设备与计算机等信息处理设备之间建立信息连接，就需要实现电信号与光信号的相互转换。One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides. The passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used. In order to establish an information connection between information transmission equipment such as optical fibers/optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion of electrical signals and optical signals.

光模块在光纤通信技术领域中实现上述光、电信号的相互转换功能，光信号与电信号的相互转换是光模块的核心功能。光模块通过其内部电路板上的金手指实现与外部上位机之间的电连接，主要的电连接包括供电、I2C信号、数据信号以及接地等；采用金手指实现的电连接方式已经成为光模块行业的主流连接方式，以此为基础，金手指上引脚的定义形成了多种行业协议/规范。The optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module. The optical module realizes the electrical connection with the external host computer through the gold finger on its internal circuit board. The main electrical connections include power supply, I2C signal, data signal and grounding, etc. The electrical connection method realized by the gold finger has become the optical module. The mainstream connection method of the industry, based on this, the definition of pins on the gold finger has formed a variety of industry protocols/norms.

图1为光通信终端连接关系示意图。如图1所示，光通信终端的连接主要包括光网络终端100、光模块200、光纤101及网线103之间的相互连接；FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in FIG. 1 , the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

光纤101的一端连接远端服务器，网线103的一端连接本地信息处理设备，本地信息处理设备与远端服务器的连接由光纤101与网线103的连接完成；而光纤101与网线103之间的连接由具有光模块200的光网络终端100完成。One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.

光模块200的光口对外接入光纤101，与光纤101建立双向的光信号连接；光模块200的电口对外接入光网络终端100中，与光网络终端100建立双向的电信号连接；在光模块内部实现光信号与电信号的相互转换，从而实现在光纤与光网络终端之间建立信息连接；在本公开的某一些实施例中，来自光纤的光信号由光模块转换为电信号后输入至光网络终端100中，来自光网络终端100的电信号由光模块转换为光信号输入至光纤中。The optical port of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101; the electrical port of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100; The optical module realizes mutual conversion between optical signals and electrical signals, so as to establish an information connection between the optical fiber and the optical network terminal; in some embodiments of the present disclosure, after the optical signal from the optical fiber is converted into an electrical signal by the optical module Input to the optical network terminal 100, the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber.

光网络终端具有光模块接口102，用于接入光模块200，与光模块200建立双向的电信号连接；光网络终端具有网线接口104，用于接入网线103，与网线103建立双向的电信号连接；光模块200与网线103之间通过光网络终端100建立连接，在本公开的某一些实施例中，光网络终端将来自光模块的信号传递给网线，将来自网线的信号传递给光模块，光网络终端作为光模块的上位机监控光模块的工作。The optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200; Signal connection; a connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. In some embodiments of the present disclosure, the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical network. The optical network terminal acts as the host computer of the optical module to monitor the work of the optical module.

至此，远端服务器通过光纤、光模块、光网络终端及网线，与本地信息处理设备之间建立双向的信号传递通道。So far, the remote server has established a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.

常见的信息处理设备包括路由器、交换机、电子计算机等；光网络终端是光模块的上位机，向光模块提供数据信号，并接收来自光模块的数据信号，常见的光模块上位机还有光线路终端等。Common information processing equipment includes routers, switches, electronic computers, etc.; the optical network terminal is the host computer of the optical module, providing data signals to the optical module and receiving data signals from the optical module. Common optical module host computers and optical lines terminal etc.

图2为光网络终端结构示意图。如图2所示，在光网络终端100中具有PCB电路板105，在PCB电路板105的表面设置笼子106；在笼子106内部设置有电连接器，用于接入金手指等光模块电口；在笼子106上设置有散热器107，散热器107具有增大散热面积的翅片等凸起部。FIG. 2 is a schematic structural diagram of an optical network terminal. As shown in FIG. 2, the optical network terminal 100 has a PCB circuit board 105, and a cage 106 is provided on the surface of the PCB circuit board 105; an electrical connector is provided inside the cage 106 for connecting to an optical module electrical port such as a golden finger. ; A radiator 107 is provided on the cage 106, and the radiator 107 has raised portions such as fins that increase the heat dissipation area.

光模块200***光网络终端中，在本公开的某一些实施例中光模块的电口***笼子106内部的电连接器，光模块的光口与光纤101连接。The optical module 200 is inserted into the optical network terminal. In some embodiments of the present disclosure, the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .

笼子106位于电路板上，电路板上的电连接器包裹在笼子中；光模块***笼子中，由笼子固定光模块，光模块产生的热量传导给笼子106，然后通过笼子上的散热器107进行扩散。The cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage; the optical module is inserted into the cage, the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage 106, and then passes through the radiator 107 on the cage. diffusion.

图3为本公开实施例提供的一种光模块结构示意图，图4为本公开实施例提供光模块分解结构示意图。如图3、图4所示，本公开实施例提供的光模块200包括上壳体201、下壳体202、解锁部件203、电路板300、光收发器件；FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure, and FIG. 4 is a schematic structural diagram of an exploded optical module according to an embodiment of the present disclosure. As shown in FIG. 3 and FIG. 4 , the optical module 200 provided by the embodiment of the present disclosure includes an upper casing 201, a lower casing 202, an unlocking part 203, a circuit board 300, and an optical transceiver device;

上壳体201盖合在下壳体202上，以形成具有两个开口的包裹腔体；包裹腔体的外轮廓一般呈现方形体，在本公开的某一些实施例中，下壳体包括底板以及位于底板两侧、与底板垂直设置的两个侧板；上壳体包括盖板，盖板盖合在上壳体的两个侧板上，以形成包裹腔体；上壳体还可以包括位于盖板两侧、与盖板垂直设置的两个侧壁，由两个侧壁与两个侧板结合，以实现上壳体盖合在下壳体上。The upper casing 201 is closed on the lower casing 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square body, in some embodiments of the present disclosure, the lower casing includes a bottom plate and Two side plates are located on both sides of the bottom plate and are vertically arranged with the bottom plate; the upper shell includes a cover plate, and the cover plate is closed on the two side plates of the upper shell to form a wrapping cavity; the upper shell can also include a The two side walls on both sides of the cover plate and the two side walls vertically arranged with the cover plate are combined with the two side plates to realize that the upper casing is covered on the lower casing.

两个开口中的其中一个开口为电口204，电路板的金手指从电口204伸出，***光网络终端等上位机中；另一个开口为光口205，用于外部光纤接入以连接光模块内部的光收发器件；电路板300、光收发器件等光电器件位于包裹腔体中。One of the two openings is an electrical port 204, and the gold fingers of the circuit board protrude from the electrical port 204 and are inserted into a host computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect Optical transceivers inside the optical module; optoelectronic devices such as the circuit board 300 and the optical transceivers are located in the package cavity.

采用上壳体、下壳体结合的装配方式，便于将电路板300、光收发器件等器件安装到壳体中，由上壳体、下壳体形成光模块最外层的封装保护壳体；上壳体及下壳体一般采用金属材料，利于实现电磁屏蔽以及散热；一般不会将光模块的壳体做成一体部件，这样在装配电路板等器件时，定位部件、散热以及电磁屏蔽部件无法安装，也不利于生产自动化。The combination of the upper casing and the lower casing is adopted, which facilitates the installation of the circuit board 300, the optical transceiver and other components into the casing, and the upper casing and the lower casing form the outermost encapsulation protection casing of the optical module; The upper casing and the lower casing are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation; generally, the casing of the optical module is not made into an integral part, so that when assembling circuit boards and other devices, positioning parts, heat dissipation and electromagnetic shielding parts It cannot be installed and is not conducive to production automation.

解锁部件203位于包裹腔体/下壳体202的外壁，用于实现光模块与上位机之间的固定连接，或解除光模块与上位机之间的固定连接。The unlocking part 203 is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.

解锁部件203具有与上位机笼子匹配的卡合部件；拉动解锁部件的末端可以在使解锁部件在外壁的表面相对移动；光模块***上位机的笼子里，由解锁部件的卡合部件将光模块固定在上位机的笼子里；通过拉动解锁部件，解锁部件的卡合部件随之移动，进而改变卡合部件与上位机的连接关系，以解除光模块与上位机的卡合关系，从而可以将光模块从上位机的笼子里抽出。The unlocking part 203 has an engaging part matched with the cage of the upper computer; pulling the end of the unlocking part can make the unlocking part move relatively on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is moved by the engaging part of the unlocking part. It is fixed in the cage of the upper computer; by pulling the unlocking part, the engaging part of the unlocking part moves with it, thereby changing the connection relationship between the engaging part and the upper computer, so as to release the engaging relationship between the optical module and the upper computer, so that the The optical module is pulled out from the cage of the host computer.

电路板300上设置有电路走线、电子元件(如电容、电阻、三极管、MOS管)及芯片(如MCU、激光驱动芯片、限幅放大芯片、时钟数据恢复CDR、电源管理芯片、数据处理芯片DSP)等。The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, MOS tubes) and chips (such as MCU, laser driver chip, amplitude limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip) DSP), etc.

电路板通过电路走线将光模块中的用电器件按照电路设计连接在一起，以实现供电、电信号传输及接地等电功能。The circuit board connects the electrical components in the optical module together according to the circuit design through circuit traces, so as to realize electrical functions such as power supply, electrical signal transmission and grounding.

电路板一般为硬性电路板，硬性电路板由于其相对坚硬的材质，还可以实现承载作用，如硬性电路板可以平稳的承载芯片；当光收发器件位于电路板上时，硬性电路板也可以提供平稳的承载；硬性电路板还可以***上位机笼子中的电连接器中，在本公开的某一些实施例中，在硬性电路板的一侧末端表面形成金属引脚/金手指，用于与电连接器连接；这些都是柔性电路板不便于实现的。The circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; when the optical transceiver is located on the circuit board, the rigid circuit board can also provide Stable bearing; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage. In some embodiments of the present disclosure, metal pins/gold fingers are formed on one end surface of the rigid circuit board for connecting with Electrical connector connections; these are inconvenient to implement with flexible circuit boards.

部分光模块中也会使用柔性电路板，作为硬性电路板的补充；柔性电路板一般与硬性电路板配合使用，如硬性电路板与光收发器件之间可以采用柔性电路板连接。Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards. For example, flexible circuit boards can be used to connect the rigid circuit boards and optical transceivers.

图5为本公开实施例提供的一种光收发器件结构示意图一。如图5所示，光收发器件设置于电路板300上，同时与第一光纤阵列302和第二光纤阵列303连接，可实现光信号的接收和发射。本公开实施例中，为实现铌酸锂调制器在硅光芯片的集成应用，光收发器件包括：硅光芯片400和铌酸锂芯片500，硅光芯片400包括：监测探测器401和第一耦合器402。铌酸锂芯片500包括光调制单元，用于接收激光器301发射的光，并将所述光调制成信号光。第一光纤阵列，接收铌酸锂芯片的信号光，实现光发射。硅光芯片400，包括：光接收单元和光监测单元。光接收单元用于接收第二光纤阵列303的光信号，并将接收到的光信号转化为电信号。光监测单元与铌酸锂芯片耦合连接，用于监测所述光发射信号。FIG. 5 is a schematic structural diagram 1 of an optical transceiver device according to an embodiment of the present disclosure. As shown in FIG. 5 , the optical transceiver device is arranged on the circuit board 300 and connected to the first optical fiber array 302 and the second optical fiber array 303 at the same time, so as to realize the reception and transmission of optical signals. In the embodiment of the present disclosure, in order to realize the integrated application of the lithium niobate modulator in the silicon photonics chip, the optical transceiver device includes: a silicon photonics chip 400 and a lithium niobate chip 500, and the silicon photonics chip 400 includes: a monitoring detector 401 and a first Coupler 402 . The lithium niobate chip 500 includes a light modulation unit for receiving the light emitted by the laser 301 and modulating the light into signal light. The first optical fiber array receives the signal light of the lithium niobate chip to realize light emission. The silicon photonics chip 400 includes: a light receiving unit and a light monitoring unit. The light receiving unit is used for receiving the optical signal of the second optical fiber array 303 and converting the received optical signal into an electrical signal. The light monitoring unit is coupled and connected to the lithium niobate chip for monitoring the light emission signal.

光监测单元包括：监测探测器401和第一耦合器402，铌酸锂芯片500设置第一铌酸锂耦合器501。第一耦合器402与第一铌酸锂耦合器501连接，实现第一铌酸锂耦合器501中的光信号向第一耦合器402的传输。监测探测器401用于监测第一耦合器402接收的光信号的强度。The light monitoring unit includes: a monitoring detector 401 and a first coupler 402 , and the lithium niobate chip 500 is provided with a first lithium niobate coupler 501 . The first coupler 402 is connected to the first lithium niobate coupler 501 to realize the transmission of the optical signal in the first lithium niobate coupler 501 to the first coupler 402 . The monitoring detector 401 is used to monitor the intensity of the optical signal received by the first coupler 402 .

电路板300上设置有激光器301，激光器301发射的信号光经铌酸锂芯片500进入第一光纤阵列302，实现光发射功能，同时，通过硅光芯片400与铌酸锂芯片500之间的光耦合连接，实现对发射光路的监测。硅光芯片400设置光接收单元，可同时实现光接收功能。本公开提供的光收发器件由硅光芯片和铌酸锂芯片共同组合，实现光信号的调制及对调制信号的监测，将发射光路的光监测单元设置于硅光芯片上，有利于充分利用铌酸锂调制器高带宽，低驱动电压、低***损耗以及硅光芯片器件高度集成化的优势。The circuit board 300 is provided with a laser 301, and the signal light emitted by the laser 301 enters the first optical fiber array 302 through the lithium niobate chip 500 to realize the light emission function. Coupling connection to realize the monitoring of the emission optical path. The silicon photonics chip 400 is provided with a light receiving unit, which can realize the light receiving function at the same time. The optical transceiver provided by the present disclosure is composed of a silicon photonic chip and a lithium niobate chip to realize modulation of the optical signal and monitoring of the modulation signal. The optical monitoring unit of the emission optical path is arranged on the silicon photonic chip, which is conducive to making full use of niobium. Lithium oxide modulators have the advantages of high bandwidth, low driving voltage, low insertion loss and high integration of silicon photonic chip devices.

铌酸锂芯片500还包括：第二铌酸锂耦合器504、铌酸锂调制器502、分光器503、第三耦合器505。第二铌酸锂耦合器504与激光器301耦合连接，用于接收激光器301发射的发射光信号。所述发射光信号经过第二铌酸锂耦合器504进入铌酸锂芯片500，经铌酸锂调制器502的调制和分光器503分光后，分为两路，一路为信号光，另一路为监测光信号。第一光纤阵列302与分光器503的一个输出端耦合连接，用于接收信号光，实现光发射。监测探测器401与分光器503的另一个输出端耦合连接，用于监测所述监测信号光。本公开实施例中，光调制单元为铌酸锂调制器。电路板300上设置激光器301，第二铌酸锂耦合器504的一端与激光器301耦合连接，用于接收激光器301发射的光信号。第二铌酸锂耦合器504的另一端与铌酸锂调制器502连接，将接收到的光信号传送至铌酸锂调制器502进行调制。铌酸锂调制器502与分光器503连接，调制后的光信号经分光器503分光后，一路作为信号光。The lithium niobate chip 500 further includes: a second lithium niobate coupler 504 , a lithium niobate modulator 502 , a light splitter 503 , and a third coupler 505 . The second lithium niobate coupler 504 is coupled and connected to the laser 301 for receiving the emission light signal emitted by the laser 301 . The emitted light signal enters the lithium niobate chip 500 through the second lithium niobate coupler 504, and after modulation by the lithium niobate modulator 502 and light splitting by the optical splitter 503, is divided into two paths, one for the signal light and the other for the light. Monitor light signals. The first optical fiber array 302 is coupled and connected to an output end of the optical splitter 503 for receiving signal light and realizing light emission. The monitoring detector 401 is coupled and connected to the other output end of the optical splitter 503 for monitoring the monitoring signal light. In the embodiment of the present disclosure, the light modulation unit is a lithium niobate modulator. A laser 301 is provided on the circuit board 300 , and one end of the second lithium niobate coupler 504 is coupled and connected to the laser 301 for receiving the optical signal emitted by the laser 301 . The other end of the second lithium niobate coupler 504 is connected to the lithium niobate modulator 502, and transmits the received optical signal to the lithium niobate modulator 502 for modulation. The lithium niobate modulator 502 is connected to the optical splitter 503. After the modulated optical signal is split by the optical splitter 503, one channel is used as signal light.

传送至第三耦合器505，第三耦合器505与外部第一光纤阵列302连接，实现信号光的发射；另一路作为监测光信号经第一铌酸锂耦合器501、第一耦合器402输入监测探测器401。It is transmitted to the third coupler 505, and the third coupler 505 is connected to the external first optical fiber array 302 to realize the emission of signal light; Monitor detector 401 .

在本公开的某一些实施例中，铌酸锂调制器502包括：依次连接的第一功分器5021、行波电极5022、移相器5023和第二功分器5024。第一功分器5021通过第二铌酸锂耦合器504接收来自激光器301的光信号，并将所述光信号进行分束。分束后的光信号每一束均与一个行波电极5022连接，用于对光信号进行加载调制。每一个行波电极5022均与一个移相器5023波导连接，对加载调制后的光进行相位调制。第二功分器5024的输入端与多个移相器5023连接，输出端与分光器503连接，形成调制光信号。In some embodiments of the present disclosure, the lithium niobate modulator 502 includes: a first power divider 5021 , a traveling wave electrode 5022 , a phase shifter 5023 and a second power divider 5024 , which are connected in sequence. The first power splitter 5021 receives the optical signal from the laser 301 through the second lithium niobate coupler 504, and splits the optical signal. Each beam of the split optical signal is connected to a traveling wave electrode 5022 for loading and modulating the optical signal. Each traveling wave electrode 5022 is connected to a waveguide of a phase shifter 5023 to perform phase modulation on the loaded and modulated light. The input end of the second power divider 5024 is connected to a plurality of phase shifters 5023, and the output end is connected to the optical splitter 503 to form a modulated optical signal.

为同时实现光接收功能，硅光芯片400包括：依次连接的第二硅耦合器403、偏振调控器404、可调光衰减器405和高速光探测器406，硅光芯片400上各器件之间采用硅光波导连接。其中第二硅耦合器403还与第二光纤阵列303连接，用于将第二光纤阵列303耦合至硅光芯片400硅光波导。偏振调控器404设置于第二硅耦合器403与可调光衰减器405之间，通过第二硅耦合器403接收来自第二光纤阵列303的接收光信号，并控制所述接收光信号的偏振态。可调光衰减器405，用于接收来自偏振调控器404的接收光信号并对所述接收光信号做可调衰减处理。高速光探测器406，与可调光衰减器405的另一端连接，用于将所述接收光信号转化为电信号。In order to realize the light receiving function at the same time, the silicon photonics chip 400 includes: a second silicon coupler 403, a polarization regulator 404, a tunable optical attenuator 405 and a high-speed photodetector 406, which are connected in sequence. Silicon optical waveguide connection is used. The second silicon coupler 403 is also connected to the second optical fiber array 303 for coupling the second optical fiber array 303 to the silicon optical chip 400 silicon optical waveguide. The polarization regulator 404 is arranged between the second silicon coupler 403 and the adjustable optical attenuator 405, receives the received optical signal from the second optical fiber array 303 through the second silicon coupler 403, and controls the polarization of the received optical signal state. The adjustable optical attenuator 405 is configured to receive the received optical signal from the polarization regulator 404 and perform adjustable attenuation processing on the received optical signal. The high-speed optical detector 406 is connected to the other end of the adjustable optical attenuator 405 for converting the received optical signal into an electrical signal.

第二光纤阵列303的光信号经第二硅耦合器403耦合进入硅光芯片400，再经过偏振调控器404和可调光衰减器405后，最后经过高速光探测器406实现光电信号的转换。依次连接的第二硅耦合器403、偏振调控器404、可调光衰减器405和高速光探测器406形成一个光接收单元，实现光接收功能。The optical signal of the second optical fiber array 303 is coupled into the silicon optical chip 400 through the second silicon coupler 403 , passes through the polarization regulator 404 and the adjustable optical attenuator 405 , and finally passes through the high-speed photodetector 406 to realize the conversion of the photoelectric signal. The second silicon coupler 403 , the polarization regulator 404 , the adjustable optical attenuator 405 and the high-speed optical detector 406 connected in sequence form a light-receiving unit to realize the light-receiving function.

图6为本公开实施例提供的一种硅光芯片和铌酸锂芯片连接示意图一，图7为本公开实施例提供的一种硅光芯片和铌酸锂芯片连接示意图二，图8为本公开实施例提供的一种硅光芯片和铌酸锂芯片连接示意图三。如图6、图7和图8所示，第一耦合器402与第一铌酸锂耦合器501之间的连接类型可以是端面耦合器，也可以是光栅耦合器。或直接采用光纤连接铌酸锂芯片的铌酸锂波导与硅光芯片的硅光波导，以实现硅光芯片400和铌酸锂芯片500之间的光信号的传输。FIG. 6 is a schematic diagram of the connection between a silicon photonics chip and a lithium niobate chip according to an embodiment of the present disclosure. FIG. 7 is a schematic diagram of the connection between a silicon photonics chip and a lithium niobate chip according to an embodiment of the disclosure. Schematic diagram three of the connection between a silicon photonics chip and a lithium niobate chip provided by the disclosed embodiments. As shown in FIG. 6 , FIG. 7 and FIG. 8 , the connection type between the first coupler 402 and the first lithium niobate coupler 501 may be an end-face coupler or a grating coupler. Or directly use an optical fiber to connect the lithium niobate waveguide of the lithium niobate chip and the silicon optical waveguide of the silicon optical chip, so as to realize the transmission of the optical signal between the silicon optical chip 400 and the lithium niobate chip 500 .

图9为本公开实施例提供的一种光收发器件光路示意图，如图9所示激光器301发射的信号光经第二铌酸锂耦合器504耦合进入铌酸锂芯片500的铌酸锂波导，经过铌酸锂调制器502的调制后，经分光器503分为两路，其中一路作为信号光经第三耦合器505进入第一光纤阵列302；另一路监测光信号经第一铌酸锂耦合器501、第一耦合器402输入监测探测器401。铌酸锂芯片500包含了调制单元，实现光发射功能，同时，通过硅光芯片400与铌酸锂芯片500之间的光耦合连接，实现对铌酸锂调制器502调制光路的监测。硅光芯片400设置有偏振调控器404、可调光衰减器405和高速光探测器406组合形成的光接收单元，可实现光接收功能。FIG. 9 is a schematic diagram of an optical circuit of an optical transceiver device provided by an embodiment of the present disclosure. As shown in FIG. 9 , the signal light emitted by the laser 301 is coupled into the lithium niobate waveguide of the lithium niobate chip 500 through the second lithium niobate coupler 504 . After being modulated by the lithium niobate modulator 502, it is divided into two paths by the optical splitter 503, one of which is used as a signal light to enter the first optical fiber array 302 via the third coupler 505; the other path of monitoring light is coupled by the first lithium niobate. The first coupler 501 and the first coupler 402 are input to the monitoring detector 401 . The lithium niobate chip 500 includes a modulation unit to realize the light emission function, and at the same time, through the optical coupling connection between the silicon photonics chip 400 and the lithium niobate chip 500 , the monitoring of the modulation optical path of the lithium niobate modulator 502 is realized. The silicon photonic chip 400 is provided with a light receiving unit formed by a combination of a polarization regulator 404, an adjustable optical attenuator 405 and a high-speed optical detector 406, which can realize the light receiving function.

图10为本公开实施例提供的一种光收发器件结构示意图二，为了实现多路信号并行，铌酸锂芯片500还包括：第三功分器506，设置于第二铌酸锂耦合器504和铌酸锂调制器 502之间，第三功分器506的输入端与第二铌酸锂耦合器504连接，第三功分器506的每个输出端与一个铌酸锂调制器502连接。FIG. 10 is a second structural schematic diagram of an optical transceiver device provided by an embodiment of the present disclosure. In order to realize parallel multi-channel signals, the lithium niobate chip 500 further includes: a third power divider 506 , which is arranged on the second lithium niobate coupler 504 and the lithium niobate modulator 502, the input end of the third power divider 506 is connected to the second lithium niobate coupler 504, and each output end of the third power divider 506 is connected to a lithium niobate modulator 502 .

本公开中第三功分器506的个数可以是1个、2个或多个，具体数量可根据设计需要进行选择。同样的，第二铌酸锂耦合器504的数量则需要根据第三功分器506分路后信号光的路数进行匹配设定。如图10所示，本公开提供了一种四通道发射和接收的实现方式，铌酸锂芯片500上设置：2个激光器301、2个第三功分器506，每个第三功分器506的输出端为2，因此设置与之对应的4个铌酸锂调制器502、4个分光器503、4个第三耦合器505、4个第一铌酸锂耦合器501。而硅光芯片400设置与之对应的4个第一耦合器402、4个监测探测器401。The number of the third power dividers 506 in the present disclosure may be one, two or more, and the specific number may be selected according to design requirements. Similarly, the number of the second lithium niobate couplers 504 needs to be matched and set according to the number of paths of the signal light after the third power divider 506 is split. As shown in FIG. 10 , the present disclosure provides an implementation of four-channel transmission and reception. The lithium niobate chip 500 is provided with: 2 lasers 301 , 2 third power dividers 506 , each third power divider The output terminal of 506 is 2, so 4 lithium niobate modulators 502, 4 optical splitters 503, 4 third couplers 505, and 4 first lithium niobate couplers 501 are set corresponding to it. On the other hand, the silicon photonic chip 400 is provided with four first couplers 402 and four monitoring detectors 401 corresponding thereto.

激光器301作为信号光源，其发射的光经过第三功分器506分为两路，每一路均与一个铌酸锂调制器502连接，调制后的信号光再由分光器分为信号光和监测光信号，每一路监测光信号对应一个监测光信号，每一路信号光对应一条出射光纤，所有的出射光纤组合成第一光纤阵列。同理，为实现4通道信号光接收，硅光芯片400可同时设置四个光接收单元。The laser 301 is used as a signal light source, and the light emitted by the laser 301 is divided into two paths by a third power splitter 506, each of which is connected to a lithium niobate modulator 502, and the modulated signal light is divided into signal light and monitoring light by the optical splitter. For optical signals, each monitoring optical signal corresponds to a monitoring optical signal, each signal light corresponds to an outgoing optical fiber, and all outgoing optical fibers are combined into a first optical fiber array. Similarly, in order to realize 4-channel signal light reception, the silicon photonic chip 400 can be provided with four light receiving units at the same time.

本公开实施例提供的光收发器件包括硅光芯片400和铌酸锂芯片500，其中铌酸锂芯片500包含光调制单元，实现光发射功能；硅光芯片400包含了光探测单元，实现光接收功能；此外由于铌酸锂芯片很难集成光探测器，因此对于调制器中所必须的监测探测器，同样由硅光芯片提供，并通过硅光芯片400与铌酸锂芯片500之间的光耦合器，实现调制器光路的监测。本公开实施例由硅光芯片400和铌酸锂芯片500共同组合，实现光信号的调制及对调制信号的监测，充分利用铌酸锂调制器高带宽，低驱动电压、低***损耗以及硅光芯片器件高度集成化的优势。本公开提出的铌酸锂芯片与硅光芯片协同设计的光收发芯片技术方案，打破了目前硅光芯片与铌酸锂材料在工艺上不兼容的技术壁垒。虽然是两个芯片，但是关键的单元器件比如调制器，是由部分铌酸锂器件和硅光器件共同构成，与目前的独立铌酸锂调制器，以及硅光键合铌酸锂薄膜制作的调制器在结构上有明显的不同。The optical transceiver device provided by the embodiment of the present disclosure includes a silicon photonic chip 400 and a lithium niobate chip 500, wherein the lithium niobate chip 500 includes a light modulation unit to realize a light emission function; the silicon photonic chip 400 includes a light detection unit to realize light reception. In addition, because the lithium niobate chip is difficult to integrate the photodetector, the necessary monitoring detector in the modulator is also provided by the silicon photonics chip, and passes the light between the silicon photonics chip 400 and the lithium niobate chip 500 Coupler to realize the monitoring of the modulator optical path. The embodiment of the present disclosure is combined by the silicon photonics chip 400 and the lithium niobate chip 500 to realize modulation of the optical signal and monitoring of the modulation signal, and make full use of the high bandwidth, low driving voltage, low insertion loss and silicon photonics of the lithium niobate modulator. The advantages of high integration of chip devices. The optical transceiver chip technical scheme of co-design of the lithium niobate chip and the silicon photonics chip proposed in the present disclosure breaks the technical barrier of the current incompatibility between the silicon photonics chip and the lithium niobate material in terms of technology. Although it is two chips, the key unit devices such as modulators are composed of some lithium niobate devices and silicon photonics devices, which are made with the current independent lithium niobate modulators and silicon photonic bonded lithium niobate films. The modulators are significantly different in structure.

图11为本公开实施例提供的一种光收发器件结构示意图三。如图11所示，为减少移相器等器件的功耗，可将移相器5023、第二功分器5024、分光器503、第三耦合器505设置于硅光芯片400内，同时，为实现铌酸锂芯片500与硅光芯片400之间光信号的传输适应性调整光耦合器的位置，将第一耦合器402与第一铌酸锂耦合器501设置于行波电极5022、移相器5023之间。FIG. 11 is a third schematic structural diagram of an optical transceiver device according to an embodiment of the present disclosure. As shown in FIG. 11, in order to reduce the power consumption of the phase shifter and other devices, the phase shifter 5023, the second power splitter 5024, the optical splitter 503, and the third coupler 505 can be arranged in the silicon photonics chip 400, and at the same time, In order to realize the optical signal transmission between the lithium niobate chip 500 and the silicon optical chip 400, the position of the optical coupler can be adjusted adaptively. between the phase detectors 5023.

本实施例中光调制单元包括：第二铌酸锂耦合器504、第一功分器5021、行波电极5022和第一铌酸锂耦合器501；硅光芯片还包括：移相器5023、第二功分器5024、分光器503和第一耦合器402。第二铌酸锂耦合器504与激光器301光耦合连接，用于接收激光器301发射的光信号。第一功分器5021，通过第二铌酸锂耦合器504接收来自激光器301的发射光信号，并将所述发射光信号进行分束。行波电极5022与第一功分器5021的光输出端波导连接，接收分束后的光信号并进行加载调制。第一铌酸锂耦合器501接收所述行波电极的光信号。第一耦合器402的一端与第一铌酸锂耦合器501的耦合连接，另一端与移相器5023的输入端波导连接，实现发射光信号从铌酸锂芯片500到硅光芯片400的传输。第二功分器5024的光输入端与移相器5023的输出端波导连接，第二功分器5024的光输出端与分光器503的光输入端波导连接。分光器503将调制后的信号光分为信号光和监测光信号。硅光芯片400设置光监测单元，与分光器503的一个光输出端波导连接，用于监测所述监测光信号，实现对调制后发射光的监测，此处光监测单元为监测探测器。第三耦合器505设置于第一光纤阵列302与分光器503之间，第一光纤阵列302通过第三耦合器505与分光器503的另一个光输出端连接，接收所述信号光，实现光发射。In this embodiment, the optical modulation unit includes: a second lithium niobate coupler 504, a first power divider 5021, a traveling wave electrode 5022 and a first lithium niobate coupler 501; the silicon photonic chip further includes: a phase shifter 5023, The second power splitter 5024 , the optical splitter 503 and the first coupler 402 . The second lithium niobate coupler 504 is optically coupled and connected to the laser 301 for receiving the optical signal emitted by the laser 301 . The first power splitter 5021 receives the emitted light signal from the laser 301 through the second lithium niobate coupler 504, and splits the emitted light signal. The traveling wave electrode 5022 is connected to the waveguide of the optical output end of the first power splitter 5021, receives the split optical signal and performs loading modulation. The first lithium niobate coupler 501 receives the optical signal of the traveling wave electrode. One end of the first coupler 402 is coupled to the first lithium niobate coupler 501 , and the other end is connected to the waveguide of the input end of the phase shifter 5023 to realize the transmission of the emitted light signal from the lithium niobate chip 500 to the silicon photonics chip 400 . The optical input end of the second power divider 5024 is connected to the waveguide of the output end of the phase shifter 5023 , and the optical output end of the second power divider 5024 is connected to the waveguide of the optical input end of the optical splitter 503 . The optical splitter 503 divides the modulated signal light into a signal light and a monitoring light signal. The silicon photonic chip 400 is provided with an optical monitoring unit, which is connected to an optical output end of the optical splitter 503 with a waveguide for monitoring the monitoring optical signal to monitor the modulated emitted light, where the optical monitoring unit is a monitoring detector. The third coupler 505 is disposed between the first optical fiber array 302 and the optical splitter 503. The first optical fiber array 302 is connected to the other optical output end of the optical splitter 503 through the third coupler 505, and receives the signal light to realize optical emission.

在该实施例中，激光器301发射的信号光经第二铌酸锂耦合器504耦合进入铌酸锂芯片500的铌酸锂波导，依次经过第三功分器506、第一功分器5021后，进入行波电极5022，经第一铌酸锂耦合器501与第一耦合器402后进入硅光波导；然后经移相器5023、第二功分器5024后进入分光器503分光，一路作为信号光传送至第三耦合器505，第三耦合器505与外部第一光纤阵列302连接，实现信号光的发射；另一路作为监测光信号输入监测探测器401。硅光芯片400中光接收单元与前文所述保持一致，在此不再一一赘述。In this embodiment, the signal light emitted by the laser 301 is coupled into the lithium niobate waveguide of the lithium niobate chip 500 through the second lithium niobate coupler 504, and then passes through the third power divider 506 and the first power divider 5021 in sequence. , enter the traveling wave electrode 5022, enter the silicon optical waveguide through the first lithium niobate coupler 501 and the first coupler 402; then enter the optical splitter 503 after passing through the phase shifter 5023 and the second power splitter 5024. The signal light is transmitted to the third coupler 505, and the third coupler 505 is connected to the external first optical fiber array 302 to realize the emission of the signal light; the other way is input to the monitoring detector 401 as a monitoring light signal. The light receiving units in the silicon photonics chip 400 are consistent with those described above, and will not be repeated here.

本公开实施例中将调制器的器件拆分，第一功分器5021、行波电极5022设置于铌酸锂芯片，将功耗较高的移相器5023设置于硅光芯片中，其他器件根据实际需要进行相应的位置设计，充分利用铌酸锂调制器高带宽、低驱动电压、低***损耗以及硅光芯片器件高度集成化的优势，有利于减少芯片功耗。In the embodiment of the present disclosure, the devices of the modulator are split, the first power divider 5021 and the traveling wave electrode 5022 are arranged in the lithium niobate chip, the phase shifter 5023 with higher power consumption is arranged in the silicon photonics chip, and other devices The corresponding position design is carried out according to the actual needs, and the advantages of high bandwidth, low driving voltage, low insertion loss and high integration of silicon photonic chip devices of the lithium niobate modulator are fully utilized, which is conducive to reducing chip power consumption.

图12为本公开实施例提供的一种光收发器件结构示意图四，图13为本公开实施例提供的一种光收发器件结构示意图五。结合图12和图13所示，本公开还可在铌酸锂芯片500或者硅光芯片400中集成复用器507或者解复用器407，可以实现基于波分复用技术的光收发组件。为了实现光模块的多波合束功能，在偏振调控器404与第二光纤阵列303之间设置解复用器407，用于将接收到的混合波长的光信号分解为不同波长的光信号。同理，在第一光纤阵列302与分光器503之间设置复用器，将不同波长的光信号合并为一束混合波长的光信号发射。FIG. 12 is a fourth schematic structural diagram of an optical transceiver device provided by an embodiment of the present disclosure, and FIG. 13 is a fifth structural schematic diagram of an optical transceiver device provided by an embodiment of the present disclosure. 12 and FIG. 13 , the present disclosure may further integrate a multiplexer 507 or a demultiplexer 407 in the lithium niobate chip 500 or the silicon photonics chip 400 to realize an optical transceiver component based on wavelength division multiplexing technology. In order to realize the multi-wavelength beam combining function of the optical module, a demultiplexer 407 is arranged between the polarization regulator 404 and the second fiber array 303 for decomposing the received optical signals of mixed wavelengths into optical signals of different wavelengths. Similarly, a multiplexer is set between the first optical fiber array 302 and the optical splitter 503 to combine optical signals of different wavelengths into a bundle of optical signals of mixed wavelengths for emission.

如图12所示，光收发器件设置于电路板300上，同时与第一光纤阵列302和第二光纤阵列303连接，可实现光信号的接收和发射。光收发器件包括：硅光芯片400和铌酸锂芯片500，硅光芯片400包括：监测探测器401和第一耦合器402。铌酸锂芯片500包括第二铌酸锂耦合器504、铌酸锂调制器502、分光器503、复用器507和第三耦合器505，用于接收激光器301发射的光，并将所述光调制成信号光。铌酸锂调制器502包括：依次连接的第一功分器5021、行波电极5022、移相器5023和第二功分器5024。As shown in FIG. 12 , the optical transceiver device is disposed on the circuit board 300 and connected to the first optical fiber array 302 and the second optical fiber array 303 at the same time, so as to realize the reception and transmission of optical signals. The optical transceiver device includes: a silicon photonics chip 400 and a lithium niobate chip 500 , and the silicon photonics chip 400 includes a monitoring detector 401 and a first coupler 402 . The lithium niobate chip 500 includes a second lithium niobate coupler 504, a lithium niobate modulator 502, an optical splitter 503, a multiplexer 507, and a third coupler 505 for receiving the light emitted by the laser 301 and converting the The light is modulated into signal light. The lithium niobate modulator 502 includes: a first power divider 5021 , a traveling wave electrode 5022 , a phase shifter 5023 and a second power divider 5024 which are connected in sequence.

电路板300上设置4个激光器301，分别发射不同波长的单一信号光，第一功分器5021通过第二铌酸锂耦合器504接收来自激光器301的信号光，并将所述信号光进行分束。分束后的信号光每一束均与一个行波电极5022连接，用于对信号光进行加载调制。每一个行波电极5022均与一个移相器5023波导连接，对加载调制后的光进行相位调制。第二功分器5024的光输出端与分光器503的光输入端波导连接。分光器503将调制后的信号光分为信号光和监测光信号。第一耦合器402与第一铌酸锂耦合器501连接，实现第一铌酸锂耦合器501中的光信号向第一耦合器402的传输。监测探测器401用于监测第一耦合器402接收的光信号的强度。监测探测器401通过第一铌酸锂耦合器501、与分光器503的一个光输出端波导连接，用于监测所述监测光信号，实现对调制后发射光的监测。第三耦合器505设置于第一光纤阵列302与分光器503之间，复用器507设置于第三耦合器505与分光器503之间，用于4个通道的发射光信号的合波，第一光纤阵列302接收来自复用器507的合波后的光信号，复用器507的输入端可与多个分光器503连接，实现多波长合束的光发射。硅光芯片400还包括：光接收单元。光接收单元用于接收第二光纤阵列303的光信号，并将接收到的光信号转化为电信号。Four lasers 301 are set on the circuit board 300, respectively emitting single signal light of different wavelengths. The first power divider 5021 receives the signal light from the laser 301 through the second lithium niobate coupler 504, and divides the signal light. bundle. Each beam of the split signal light is connected to a traveling wave electrode 5022 for loading and modulating the signal light. Each traveling wave electrode 5022 is connected to a waveguide of a phase shifter 5023 to perform phase modulation on the loaded and modulated light. The optical output end of the second power splitter 5024 is waveguide-connected to the optical input end of the optical splitter 503 . The optical splitter 503 divides the modulated signal light into a signal light and a monitoring light signal. The first coupler 402 is connected to the first lithium niobate coupler 501 to realize the transmission of the optical signal in the first lithium niobate coupler 501 to the first coupler 402 . The monitoring detector 401 is used to monitor the intensity of the optical signal received by the first coupler 402 . The monitoring detector 401 is connected to an optical output end waveguide of the optical splitter 503 through the first lithium niobate coupler 501, and is used for monitoring the monitoring optical signal, so as to realize the monitoring of the modulated emitted light. The third coupler 505 is arranged between the first optical fiber array 302 and the optical splitter 503, and the multiplexer 507 is arranged between the third coupler 505 and the optical splitter 503, and is used for combining the transmitted optical signals of the four channels. The first fiber array 302 receives the combined optical signal from the multiplexer 507, and the input end of the multiplexer 507 can be connected to a plurality of optical splitters 503 to realize multi-wavelength combined light emission. The silicon photonics chip 400 further includes: a light receiving unit. The light receiving unit is used for receiving the optical signal of the second optical fiber array 303 and converting the received optical signal into an electrical signal.

硅光芯片400还包括：依次连接的第二硅耦合器403、解复用器407、偏振调控器404、可调光衰减器405和高速光探测器406，硅光芯片400上各器件之间采用硅光波导连接。其中第二硅耦合器403还与第二光纤阵列303连接，用于将第二光纤阵列303耦合至硅光芯片400进行硅光波导。第二光纤阵列303输入的为含有多种波长的信号光，经解复用器407分束成为单一波长的信号光。偏振调控器404设置于第二硅耦合器403与可调光衰减器405之通过第二硅耦合器403接收来自第二光纤阵列303的接收光信号，并控制所述接收光信号的偏振态。可调光衰减器405，用于接收来自偏振调控器404的接收光信号并对所述接收光信号做可调衰减处理。高速光探测器406，与可调光衰减器405的另一端连接，用于将所述接收光信号转化为电信号。The silicon photonics chip 400 further includes: a second silicon coupler 403 , a demultiplexer 407 , a polarization regulator 404 , a tunable optical attenuator 405 and a high-speed photodetector 406 , which are connected in sequence. Silicon optical waveguide connection is used. The second silicon coupler 403 is also connected to the second optical fiber array 303 for coupling the second optical fiber array 303 to the silicon optical chip 400 for silicon optical waveguide. The input of the second fiber array 303 is signal light with multiple wavelengths, which is split into signal light with a single wavelength by the demultiplexer 407 . The polarization regulator 404 is disposed between the second silicon coupler 403 and the adjustable optical attenuator 405 to receive the received optical signal from the second optical fiber array 303 through the second silicon coupler 403 and control the polarization state of the received optical signal. The adjustable optical attenuator 405 is configured to receive the received optical signal from the polarization regulator 404 and perform adjustable attenuation processing on the received optical signal. The high-speed optical detector 406 is connected to the other end of the adjustable optical attenuator 405 for converting the received optical signal into an electrical signal.

第二光纤阵列303的光信号经第二硅耦合器403耦合进入硅光芯片400，经解复用器407分束成为单一波长的信号光，再经过偏振调控器404和可调光衰减器405后，最后经过高速光探测器406实现光电信号的转换。依次连接的第二硅耦合器403、偏振调控器404、可调光衰减器405和高速光探测器406形成一个光接收单元，实现光接收功能。The optical signal of the second optical fiber array 303 is coupled into the silicon optical chip 400 through the second silicon coupler 403 , split into a single wavelength signal light by the demultiplexer 407 , and then passed through the polarization regulator 404 and the adjustable optical attenuator 405 Finally, the conversion of the photoelectric signal is realized through the high-speed photodetector 406 . The second silicon coupler 403 , the polarization regulator 404 , the adjustable optical attenuator 405 and the high-speed optical detector 406 connected in sequence form a light-receiving unit to realize the light-receiving function.

图13提供的实施例将移相器5023、第二功分器5024、分光器503、复用器507、第三耦合器505设置于硅光芯片400内，同时，为实现铌酸锂芯片500与硅光芯片400之间光信号的传输适应性调整光耦合器的位置，将第一耦合器402与第一铌酸锂耦合器501设置于行波电极5022、移相器5023之间，其他与前文图12所述一直，不再一一赘述。In the embodiment provided in FIG. 13 , the phase shifter 5023 , the second power splitter 5024 , the optical splitter 503 , the multiplexer 507 , and the third coupler 505 are arranged in the silicon photonics chip 400 . At the same time, in order to realize the lithium niobate chip 500 The optical signal transmission between the silicon photonic chip 400 is adapted to adjust the position of the optical coupler, and the first coupler 402 and the first lithium niobate coupler 501 are arranged between the traveling wave electrode 5022 and the phase shifter 5023, and other It is the same as that described above in FIG. 12 and will not be repeated one by one.

在该实施例中，激光器301发射的信号光经第二铌酸锂耦合器504耦合进入铌酸锂芯片500的铌酸锂波导，依次经过第三功分器506、第一功分器5021后，进入行波电极5022，经第一铌酸锂耦合器501与第一耦合器402后进入硅光波导；然后经移相器5023、第二功分器5024后进入分光器503分光，一路作为信号光经复用器507合波后形成具有多波长的信号光，传送至第三耦合器505，第三耦合器505与外部第一光纤阵列302连接，实现信号光的发射；另一路作为监测光信号输入监测探测器401。硅光芯片400中光接收单元与前文所述保持一致，在此不再一一赘述。本公开提供了一种铌酸锂芯片与硅光芯片的协同合作的设计方案，由铌酸锂器件和硅光芯片共同组合，实现光信号的调制及对光信号的监测。打破了目前硅光芯片与铌酸锂材料在工艺上不兼容的技术壁垒。虽然是两个芯片，但是关键的单元器件比如调制器，是由部分铌酸锂器件和硅光器件共同构成，与目前已报道的独立铌酸锂调制器，以及硅光键合铌酸锂薄膜制作的调制器在结构上有明显的不同。充分利用铌酸锂调制器高带宽，低驱动电压、低***损耗以及硅光芯片器件高度集成化的优势，突破硅光调制器传输速率的限制，实现更高的通信容量。In this embodiment, the signal light emitted by the laser 301 is coupled into the lithium niobate waveguide of the lithium niobate chip 500 through the second lithium niobate coupler 504, and then passes through the third power divider 506 and the first power divider 5021 in sequence. , enter the traveling wave electrode 5022, enter the silicon optical waveguide through the first lithium niobate coupler 501 and the first coupler 402; then enter the optical splitter 503 after passing through the phase shifter 5023 and the second power splitter 5024. The signal light is combined by the multiplexer 507 to form a multi-wavelength signal light, which is sent to the third coupler 505, and the third coupler 505 is connected to the external first fiber array 302 to realize the emission of signal light; the other channel is used for monitoring The light signal is input to the monitoring detector 401 . The light receiving units in the silicon photonics chip 400 are consistent with those described above, and will not be repeated here. The present disclosure provides a design scheme for the cooperation between a lithium niobate chip and a silicon photonics chip. The lithium niobate device and the silicon photonics chip are combined together to realize modulation of optical signals and monitoring of optical signals. It breaks the technical barrier that the current silicon photonic chip and lithium niobate material are incompatible in process. Although it is two chips, the key unit devices such as modulators are composed of some lithium niobate devices and silicon photonics devices, which are combined with the independent lithium niobate modulators and silicon photonic bonded lithium niobate films that have been reported so far. The fabricated modulators are significantly different in structure. Make full use of the advantages of high bandwidth, low driving voltage, low insertion loss and high integration of silicon photonic chip devices of lithium niobate modulators, break through the limitation of the transmission rate of silicon photonic modulators, and achieve higher communication capacity.

由于以上实施方式均是在其他方式之上引用结合进行说明，不同实施例之间均具有相同的部分，本说明书中各个实施例之间相同、相似的部分互相参见即可。在此不再详细阐述。Since the above embodiments are all cited and combined with other modes for description, different embodiments all have the same parts, and the same and similar parts between the various embodiments in this specification can be referred to each other. It will not be elaborated here.

需要说明的是，在本说明书中，诸如“第一”和“第二”等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或暗示这些实体或操作之间存在任何这种实际的关系或顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的电路结构、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种电路结构、物品或者设备所固有的要素。在没有更多限制的情况下，有语句“包括一个……”限定的要素，并不排除在包括所述要素的电路结构、物品或者设备中还存在另外的相同要素。It should be noted that, in this specification, relational terms such as "first" and "second" etc. are only used to distinguish one entity or operation from another entity or operation, and are not necessarily required or implied Any such actual relationship or ordering exists between these entities or operations. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a circuit structure, article or device comprising a list of elements includes not only those elements, but also not expressly listed Other elements, or elements inherent to such a circuit structure, article, or device are also included. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the circuit structure, article or device that includes the element.

本领域技术人员在考虑说明书及实践这里发明的公开后，将容易想到本公开的其他实施方案。本公开旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求的内容指出。Other embodiments of the present disclosure will readily suggest themselves to those skilled in the art upon consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common general knowledge or techniques in the technical field not disclosed by this disclosure . The specification and examples are to be regarded as exemplary only, with the true scope and spirit of the disclosure being indicated by the content of the claims.

以上所述的本公开实施方式并不构成对本公开保护范围的限定。The above-described embodiments of the present disclosure do not limit the protection scope of the present disclosure.

Claims

一种光模块，其特征在于，包括：An optical module, characterized in that it includes:

电路板，所述电路板上设置有激光器；a circuit board, the circuit board is provided with a laser;

铌酸锂芯片包括光调制单元，用于接收所述激光器发射的光，并将所述光调制成信号光；The lithium niobate chip includes a light modulation unit for receiving the light emitted by the laser and modulating the light into signal light;

第一光纤阵列，接收所述铌酸锂芯片的信号光；a first optical fiber array, receiving the signal light of the lithium niobate chip;

第二光纤阵列；a second optical fiber array;

硅光芯片，包括：光接收单元和光监测单元；Silicon photonic chip, including: light receiving unit and light monitoring unit;

所述光接收单元用于接收所述第二光纤阵列的光信号，并将接收到的光信号转化为电信号；The light receiving unit is configured to receive the optical signal of the second optical fiber array, and convert the received optical signal into an electrical signal;

所述光监测单元与所述铌酸锂芯片耦合连接，用于监测所述光发射信号。The light monitoring unit is coupled and connected to the lithium niobate chip for monitoring the light emission signal.
根据权利要求1所述的光模块，其特征在于，所述铌酸锂芯片包括：第二铌酸锂耦合器、铌酸锂调制器、分光器和第一铌酸锂耦合器；所述光调制单元为所述铌酸锂调制器；The optical module according to claim 1, wherein the lithium niobate chip comprises: a second lithium niobate coupler, a lithium niobate modulator, a light splitter and a first lithium niobate coupler; the optical The modulation unit is the lithium niobate modulator;

所述第二铌酸锂耦合器与所述激光器连接，用于接收所述激光器发射的发射光信号；the second lithium niobate coupler is connected to the laser, and is used for receiving the emission light signal emitted by the laser;

所述发射光信号经过所述第二铌酸锂耦合器进入所述铌酸锂芯片，经所述铌酸锂调制器的调制和所述分光器分光后，分为信号光和监测光信号；The emitted light signal enters the lithium niobate chip through the second lithium niobate coupler, and is divided into signal light and monitoring light signal after modulation by the lithium niobate modulator and light splitting by the optical splitter;

所述第一光纤阵列与所述分光器的一个输出端耦合连接，用于接收所述信号光，the first optical fiber array is coupled and connected to an output end of the optical splitter for receiving the signal light,

所述光监测单元包括监测探测器和第一耦合器；the light monitoring unit includes a monitoring detector and a first coupler;

所述第一铌酸锂耦合器与所述第一耦合器连接，用于将所述监测光信号输入所述硅光芯片；the first lithium niobate coupler is connected to the first coupler, and is used for inputting the monitoring optical signal into the silicon photonics chip;

所述监测探测器与所述分光器的另一个输出端耦合连接，用于监测所述监测信号光。The monitoring detector is coupled and connected to the other output end of the optical splitter for monitoring the monitoring signal light.
根据权利要求2所述的光模块，其特征在于，所述第一铌酸锂耦合器与所述第一耦合器为端面耦合器，或所述第一铌酸锂耦合器与所述第一耦合器通过光纤或光栅连接。The optical module according to claim 2, wherein the first lithium niobate coupler and the first coupler are end-face couplers, or the first lithium niobate coupler and the first The couplers are connected by optical fibers or gratings.
根据权利要求2所述的光模块，其特征在于，所述光接收单元包括：偏振调控器，与所述第二光纤阵列耦合连接，用于接收所述第二光纤阵列的接收光信号，控制所述接收光信号的偏振态；The optical module according to claim 2, wherein the light receiving unit comprises: a polarization regulator, coupled and connected to the second optical fiber array, for receiving the received optical signal from the second optical fiber array, and controlling the polarization state of the received optical signal;

可调光衰减器，一端与所述偏振调控器连接，用于接收所述偏振调控器的接收光信号并对所述接收光信号做衰减处理；an adjustable optical attenuator, one end of which is connected to the polarization regulator, and is used for receiving the received optical signal of the polarization regulator and attenuating the received optical signal;

和高速光探测器，与所述可调光衰减器的另一端连接，用于将所述接收光信号转化为电信号。and a high-speed optical detector, connected to the other end of the adjustable optical attenuator, for converting the received optical signal into an electrical signal.
根据权利要求4所述的光模块，其特征在于，所述偏振调控器与第二光纤阵列通过光耦合器连接。The optical module according to claim 4, wherein the polarization regulator is connected to the second optical fiber array through an optical coupler.
根据权利要求2所述的光模块，其特征在于，所述铌酸锂调制器包括：The optical module according to claim 2, wherein the lithium niobate modulator comprises:

第一功分器，接收所述第二铌酸锂耦合器的光信号，并将所述光信号进行分束；a first power splitter, receiving the optical signal of the second lithium niobate coupler, and splitting the optical signal;

行波电极，接收分束后的光并进行加载调制；The traveling wave electrode receives the split light and performs loading modulation;

移相器，与所述行波电极的一端波导连接，用于对加载调制后的光进行相位调制；a phase shifter, connected to the waveguide at one end of the traveling wave electrode, and used for phase modulation of the loaded and modulated light;

第二功分器，输入端与所述移相器连接，输出端与所述分光器连接，形成调制光信号。The second power divider has an input end connected to the phase shifter and an output end connected to the optical splitter to form a modulated optical signal.
根据权利要求6所述的光模块，其特征在于，所述铌酸锂芯片还包括：第三功分器；所述第三功分器的输入端与所述第二铌酸锂耦合器连接，输出端均与所述铌酸锂调制器连接。The optical module according to claim 6, wherein the lithium niobate chip further comprises: a third power divider; an input end of the third power divider is connected to the second lithium niobate coupler , the output ends are all connected with the lithium niobate modulator.
根据权利要求2所述的光模块，其特征在于，所述铌酸锂芯片还包括：第三耦合器，设置于所述分光器与第一光纤阵列，用于将所述信号光输入所述第一光纤阵列。The optical module according to claim 2, wherein the lithium niobate chip further comprises: a third coupler, disposed between the optical splitter and the first optical fiber array, for inputting the signal light into the The first fiber array.
根据权利要求1所述的光模块，其特征在于，所述光调制单元包括：第二铌酸锂耦合器、第一功分器、行波电极和第一铌酸锂耦合器；The optical module according to claim 1, wherein the optical modulation unit comprises: a second lithium niobate coupler, a first power divider, a traveling wave electrode and a first lithium niobate coupler;

所述第二铌酸锂耦合器与所述激光器连接，用于接收所述激光器发射的发射光信号；the second lithium niobate coupler is connected to the laser, and is used for receiving the emission light signal emitted by the laser;

第一功分器，接收所述第二铌酸锂耦合器的光信号，并将所述光信号进行分束；a first power splitter, receiving the optical signal of the second lithium niobate coupler, and splitting the optical signal;

行波电极，接收分束后的光信号并进行加载调制；The traveling wave electrode receives the split optical signal and loads and modulates it;

第一铌酸锂耦合器接收所述行波电极的光信号；the first lithium niobate coupler receives the optical signal of the traveling wave electrode;

所述硅光芯片还包括：移相器、第二功分器、分光器和第一耦合器；The silicon photonics chip further includes: a phase shifter, a second power splitter, a light splitter and a first coupler;

所述第一耦合器的一端与所述第一铌酸锂耦合器的耦合连接，另一端与所述移相器波导连接；One end of the first coupler is coupled to the first lithium niobate coupler, and the other end is connected to the phase shifter waveguide;

第二功分器的光输入端与所述移相器波导连接，光输出端与所述分光器的光输入端波导连接；The optical input end of the second power splitter is connected to the waveguide of the phase shifter, and the optical output end is connected to the waveguide of the optical input end of the optical splitter;

所述分光器将调制后的信号光分为信号光和监测光信号；The optical splitter divides the modulated signal light into signal light and monitoring light signal;

所述光监测单元与所述分光器的一个光输出端波导连接，用于监测所述监测光信号；The optical monitoring unit is connected to an optical output end waveguide of the optical splitter, and is used for monitoring the monitoring optical signal;

所述第一光纤阵列与所述分光器的另一个光输出端波导连接，接收所述信号光；the first optical fiber array is connected to another optical output end of the optical splitter with a waveguide to receive the signal light;

所述光接收单元包括：偏振调控器，与所述第二光纤阵列耦合连接，用于接收所述第二光纤阵列的接收光信号，控制所述接收光信号的偏振态；The light receiving unit includes: a polarization regulator, coupled and connected to the second optical fiber array, for receiving the received optical signal of the second optical fiber array, and controlling the polarization state of the received optical signal;

可调光衰减器，一端与所述偏振调控器连接，用于接收所述偏振调控器的接收光信号并对所述接收光信号做衰减处理；an adjustable optical attenuator, one end of which is connected to the polarization regulator, and is used for receiving the received optical signal of the polarization regulator and attenuating the received optical signal;

和高速光探测器，与所述可调光衰减器的另一端连接，用于将所述接收光信号转化为电信号。and a high-speed optical detector, connected to the other end of the adjustable optical attenuator, for converting the received optical signal into an electrical signal.
根据权利要求9所述的光模块，其特征在于，所述硅光芯片还包括：光复用器和光解复用器；The optical module according to claim 9, wherein the silicon optical chip further comprises: an optical multiplexer and an optical demultiplexer;

所述光复用器设置于所述分光器与所述第一光纤阵列之间，用于发射光信号的合波；The optical multiplexer is arranged between the optical splitter and the first optical fiber array, and is used to combine the transmitted optical signals;

所述光解复用器设置于所述偏振调控器与第二光纤阵列之间，用于接收光信号的分波。The optical demultiplexer is arranged between the polarization regulator and the second optical fiber array, and is used for receiving the demultiplexing of the optical signal.