CN214481255U - Sound cavity module and mobile terminal - Google Patents
Sound cavity module and mobile terminal Download PDFInfo
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- CN214481255U CN214481255U CN202120671721.0U CN202120671721U CN214481255U CN 214481255 U CN214481255 U CN 214481255U CN 202120671721 U CN202120671721 U CN 202120671721U CN 214481255 U CN214481255 U CN 214481255U
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- circuit board
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- lower cover
- sound cavity
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Abstract
The utility model relates to the technical field of mobile terminals, and discloses a sound cavity module and a mobile terminal, wherein the sound cavity module comprises a lower cover, and the lower cover is provided with a connecting area and a sound cavity area; the upper cover is connected with the lower cover through an ultrasonic welding process so as to be matched with the sound cavity area to form a horn sound cavity; the sounding component is positioned in the horn sound cavity and is in sealing fit with the upper cover and the lower cover; the stereoplasm circuit board, stereoplasm circuit board and lower cover have the integral type structure of moulding plastics and forming, and have first portion and second portion, wherein, first position is in loudspeaker sound intracavity for be connected with sound producing component, the second position is in the joining region, be used for with mainboard bullet foot connected. The mobile terminal comprises the sound cavity module. This sound chamber module and mobile terminal can improve the loaded down with trivial details and big problem of the sealed bad risk in sound chamber of current full chamber sound chamber module assembly process.
Description
Technical Field
The utility model relates to a mobile terminal technical field, in particular to sound chamber module and mobile terminal.
Background
In the prior art, in a mobile terminal (for example, a mobile phone, a tablet pc, etc.) using a full-cavity audio cavity module, a Flexible Printed Circuit (FPC) is attached inside an audio cavity lower cover, and a part of the FPC extends out from between the audio cavity upper cover and the audio cavity lower cover to connect with a main board spring pin. Because the upper cover of the sound cavity and the lower cover of the sound cavity are ultrasonically welded, in order to avoid the damage of the FPC in the ultrasonic welding process of the upper cover of the sound cavity and the lower cover of the sound cavity, gaps are required to be formed between the positions, corresponding to the FPC, of the upper cover and the lower cover and the FPC (gaps may also be formed between the upper cover and the FPC, and holes are formed in the positions, corresponding to the FPC, of the lower cover), and after the upper cover of the sound cavity and the lower cover of the sound cavity are ultrasonically welded, a sealant is coated between the FPC and the upper cover and between the FPC and the lower cover to seal the sound cavity.
The disadvantages of this structure are: not only the process flow for preparing the sound cavity module is complex and tedious, but also the risk of poor sound cavity sealing is greater.
SUMMERY OF THE UTILITY MODEL
The utility model provides a sound chamber module and mobile terminal can improve the loaded down with trivial details and big problem of sound chamber sealing bad risk of current full chamber sound chamber module assembly process.
In order to achieve the above purpose, the utility model provides the following technical scheme:
a sound chamber module comprising:
a lower cover having a connection region and a tone cavity region;
the upper cover is connected with the lower cover through an ultrasonic welding process so as to be matched with the sound cavity area to form a horn sound cavity;
the sounding component is positioned in the horn sound cavity and is in sealing fit with the upper cover and the lower cover;
the stereoplasm circuit board, the stereoplasm circuit board with the lower cover has the integral type structure of moulding plastics and forming, and has first portion and second portion, wherein, first portion is located loudspeaker sound intracavity, be used for with sound producing component connects, the second portion is located the joining region is used for playing the foot with the mainboard and is connected.
In the sound cavity module provided by the utility model, the hard circuit board is provided with a first part and a second part, and the first part is positioned in the loudspeaker sound cavity of the lower cover and is used for being connected with the sound production component; the second position is located the joining region of lower cover for be connected with mainboard bullet foot, realize being connected between sound producing component and the mainboard bullet foot through having the stereoplasm circuit board of the integral type structure that forms of moulding plastics with the lower cover, stereoplasm circuit board and lower cover are the integral type structure that forms of moulding plastics, so need not to coat sealed glue again between stereoplasm circuit board and the lower cover, can simplify the process flow of preparation sound chamber module, and reduce the sealed bad risk in loudspeaker sound chamber.
In addition, the hard circuit board and the lower cover are of an integrated structure, the accuracy of the positions of the pad areas (namely the first pad area and the second pad area mentioned below) on the hard circuit board is improved, the accuracy of the whole machine assembly is improved, and the situation that the circuit board outside the loudspeaker sound cavity is tilted can be reduced or even avoided.
Optionally, the lower cover includes a bottom plate and an enclosure frame formed on a side of the bottom plate facing the upper cover, and the bottom plate, the enclosure frame and the upper cover cooperate to enclose the horn sound cavity;
the hard circuit board is formed on the surface of the bottom plate facing the upper cover, and the enclosure frame is located between the hard circuit board and the upper cover.
Optionally, the rigid circuit board is a PCB board.
Optionally, the rigid circuit board is a circuit steel sheet.
Optionally, the loudspeaker comprises a flexible circuit board located in the loudspeaker sound cavity, wherein one end of the flexible circuit board is connected with the sound production component, and the other end of the flexible circuit board is connected with the first part of the hard circuit board.
Optionally, the first portion of the hard circuit board includes two first pad areas, the second portion of the hard circuit board includes second pad areas corresponding to the first pad areas one to one, the two first pad areas are connected to the positive electrode and the negative electrode of the sound generating component through the flexible circuit board, and the two second pad areas are used for conducting the corresponding first pad areas and the mainboard spring pins.
Optionally, both the first pad regions are tin-plated regions, and/or both the second pad regions are gold-plated regions.
Optionally, the sound generating component and the hard circuit board are both hot-pressed and welded with the flexible circuit board.
Optionally, the circuit steel sheet includes a positioning portion, and the positioning portion is located on a side of the sound cavity area, which is away from the connection area.
Optionally, the positioning portion includes a positioning portion body and at least two positioning holes disposed on the positioning portion body, and/or a pre-breaking groove is disposed at a joint of the positioning portion and the lower cover.
The utility model also provides a mobile terminal, an arbitrary sound chamber module that provides in the above-mentioned technical scheme.
The utility model provides a mobile terminal which comprises the sound cavity module, wherein, the hard circuit board is provided with a first part and a second part, and the first part is positioned in the loudspeaker sound cavity of the lower cover and is used for being connected with a sound production component; the second position is located the joining region of lower cover for be connected with mainboard bullet foot, realize being connected between sound producing component and the mainboard bullet foot through having the stereoplasm circuit board of the integral type structure that forms of moulding plastics with the lower cover, stereoplasm circuit board and lower cover are the integral type structure that forms of moulding plastics, so need not to coat sealed glue again between stereoplasm circuit board and the lower cover, can simplify the process flow of preparation sound chamber module, and reduce the sealed bad risk in loudspeaker sound chamber.
In addition, the hard circuit board and the lower cover are of an integrated structure, the accuracy of the positions of the pad areas (namely the first pad area and the second pad area mentioned below) on the hard circuit board is improved, the accuracy of the whole machine assembly is improved, and the situation that the circuit board outside the loudspeaker sound cavity is tilted can be reduced or even avoided.
Drawings
Fig. 1 is a schematic structural diagram of a sound cavity module according to an embodiment of the present invention;
fig. 2 is an exploded view of the acoustic cavity module shown in fig. 1 (the rigid circuit board and the lower cover are also exploded for convenience of illustration);
FIG. 3 is a schematic structural view of the acoustic cavity module shown in FIG. 1 without the upper cover;
fig. 4 is a schematic structural diagram of another sound cavity module according to an embodiment of the present invention;
fig. 5 is an exploded view of the acoustic cavity module shown in fig. 4 (the rigid circuit board and the lower cover are also exploded for convenience of illustration);
fig. 6 is a schematic structural view of the acoustic cavity module shown in fig. 4 without the upper cover.
Icon: 1-lower cover; 11-a joining region; 12-the vocal cavity region; 13-a base plate; 14-enclosing a frame; 2-covering the upper cover; 21-avoiding holes; 3-a sound producing component; 4-a rigid circuit board; 411-first pad area; 42-a second portion; 421-a second pad region; 43-a PCB board; 44-circuit steel sheet; 5-a flexible circuit board; 6-a positioning part; 61-a positioning part body; 62-locating holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1-3, the sound cavity module provided in this embodiment includes a lower cover 1, an upper cover 2, a sound component 3 (e.g., Speaker), and a rigid circuit board 4, wherein the lower cover 1 has a connection area 11 and a sound cavity area 12; the upper cover 2 is connected with the lower cover 1 through an ultrasonic welding process so as to be matched with the sound cavity area 12 to form a horn sound cavity; the sounding component 3 is positioned in the horn sound cavity and is in sealing fit with the upper cover 2 and the lower cover 1; hard circuit board 4 and lower cover 1 have the integral type structure that forms of moulding plastics, and have first portion and second portion 42, and first portion is located loudspeaker sound intracavity for be connected with sound producing component 3, and second portion 42 is located joining region 11, is used for being connected with mainboard bullet foot.
In the sound cavity module provided by the embodiment, the hard circuit board 4 has a first portion and a second portion 42, the first portion is located in the horn sound cavity of the lower cover 1 and is used for being connected with the sound component 3; the second portion 42 is located in the connecting area 11 of the lower cover 1 and is used for being connected with the main board spring feet, the hard circuit board 4 with the integral structure formed by injection molding and the lower cover 1 are used for realizing connection between the sounding component 3 and the main board spring feet, and the hard circuit board 4 and the lower cover 1 are of the integral structure formed by injection molding, so that sealant does not need to be coated between the hard circuit board 4 and the lower cover 1, the process flow for preparing the sound cavity module can be simplified, and the risk of poor sealing of the sound cavity of the loudspeaker is reduced.
In addition, the hard circuit board 4 and the lower cover 1 are of an integral structure, which is beneficial to improving the accuracy of the positions of the pad areas (namely the first pad area 411 and the second pad area 421 mentioned below) on the hard circuit board 4, improving the accuracy of the whole machine assembly, and reducing or even avoiding the situation that the circuit board outside the horn sound cavity is tilted.
In an alternative implementation manner, the lower cover 1 includes a bottom plate 13 and an enclosure frame 14 formed on a side of the bottom plate 13 facing the upper cover 2, and the bottom plate 13, the enclosure frame 14 and the upper cover 2 cooperatively enclose the horn sound cavity;
the hard circuit board 4 is formed on the surface of the bottom plate 13 facing the upper cover 2, and the enclosure frame 14 is located between the hard circuit board 4 and the upper cover 2.
The hard circuit board 4 is arranged on the surface of the bottom plate 13 facing the upper cover 2, so that the connection between the hard circuit board 4 and the sounding component 3 is more convenient; enclose frame 14 and be located between stereoplasm circuit board 4 and upper cover 2, enclose frame 14 and upper cover 2 ultrasonic bonding promptly, can simplify being connected between lower cover 1 and the upper cover 2, simultaneously, be favorable to reducing the sealed bad risk in loudspeaker sound chamber.
Of course, in other embodiments, the hard circuit board 4 may also be formed on the surrounding frame 14 of the lower cover 1, and the hard circuit board 4 may be spaced from the bottom plate 13.
When the above-mentioned hard circuit board 4 is specifically provided, as shown in fig. 2 and 3, the hard circuit board 4 includes, but is not limited to, a PCB board 43 (printed circuit board) as shown in fig. 3, or a circuit steel sheet 44 as shown in fig. 5.
When the rigid circuit board 4 is the PCB 43, the thickness of the PCB 43 may be 0.3mm, and the positioning of the PCB 43 in the mold may be in an overall shape.
When the hard circuit board 4 is the circuit steel sheet 44, the circuit steel sheet 44 may be made of SUS304 having a thickness of 0.2 mm.
In a specific implementation manner, as shown in fig. 3 and 6, the sound cavity module may include a flexible circuit board 5(FPC) located in the sound cavity of the speaker, one end of the flexible circuit board 5 is connected to the sound generating component 3, and the other end of the flexible circuit board is connected to the first portion of the hard circuit board 4, that is, the first portion of the hard circuit board 4 is connected to the sound generating component 3 through the flexible circuit board 5. Alternatively, the sound emitting part 3 and the hard circuit board 4 may be both thermocompression bonded to the flexible circuit board 5.
Further, in an optional implementation manner, the first portion of the hard circuit board 4 includes two first pad areas 411, the second portion 42 of the hard circuit board 4 includes second pad areas 421 corresponding to the first pad areas 411 one by one, the two first pad areas 411 are connected to the positive electrode and the negative electrode of the sound generating component 3 through the flexible circuit board 5, and the two second pad areas 421 are used for conducting the corresponding first pad areas 411 and the motherboard elastic foot.
Specifically, when the two first pad areas 411 are arranged, both the two first pad areas 411 may be tin-plated areas; specifically, when the two second pad regions 421 are provided, both the two second pad regions 421 may be gold-plated regions.
As shown in fig. 4 and 6, when the hard circuit board 4 is a circuit steel sheet 44, in order to facilitate the positioning of the circuit steel sheet 44 in the mold, the circuit steel sheet 44 may include a positioning portion 6, and the positioning portion 6 is located on a side of the sound cavity region 12 away from the connection region 11.
Alternatively, as shown in fig. 5, the positioning portion 6 may include a positioning portion body 61 and at least two positioning holes 62 provided on the positioning portion body 61. Specifically, the number of the positioning holes 62 may be two, three, or four, and so on.
In order to facilitate the removal of the positioning portion 6 after the injection molding of the hard circuit board 4 and the lower cover 1, in an optional implementation manner, a pre-breaking groove is arranged at a joint of the positioning portion 6 and the lower cover 1.
Can be equipped with the step that is used for installing vocal part 3 on the lower cover 1, can have on the upper cover 2 and be used for avoiding hole 21 with vocal part 3 complex, the equipment process of a sound chamber module that this embodiment provided can be as follows:
gluing the step surface of the lower cover 1, then loading the sounding component 3, and gluing and sealing the periphery of the sounding component 3; an FPC is arranged, and the FPC is in hot-press welding with a welding disc on the sounding component 3 and a welding disc on the hard circuit board 4; then, buckling the upper cover 2 on the lower cover 1, and carrying out ultrasonic welding; and finally, gluing and sealing the joint of the avoidance hole 21 of the upper cover 2 and the sounding component 3, thus finishing the assembling process of the whole sound cavity module. It should be noted that the above assembly process can be fully automated.
The mobile terminal provided by the embodiment comprises the sound cavity module, wherein in the sound cavity module, the hard circuit board 4 is provided with a first part and a second part 42, and the first part is positioned in the loudspeaker sound cavity of the lower cover 1 and is used for being connected with the sound production component 3; the second portion 42 is located in the connecting area 11 of the lower cover 1 and is used for being connected with the main board spring feet, the hard circuit board 4 with the integral structure formed by injection molding and the lower cover 1 are used for realizing connection between the sounding component 3 and the main board spring feet, and the hard circuit board 4 and the lower cover 1 are of the integral structure formed by injection molding, so that sealant does not need to be coated between the hard circuit board 4 and the lower cover 1, the process flow for preparing the sound cavity module can be simplified, and the risk of poor sealing of the sound cavity of the loudspeaker is reduced.
In addition, the hard circuit board 4 and the lower cover 1 are of an integral structure, which is beneficial to improving the accuracy of the positions of the pad areas (namely the first pad area 411 and the second pad area 421) on the hard circuit board 4 and the accuracy of the whole machine assembly, and can reduce or even avoid the situation that the circuit board outside the horn sound cavity is tilted.
It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (11)
1. A sound cavity module, comprising:
a lower cover having a connection region and a tone cavity region;
the upper cover is connected with the lower cover through an ultrasonic welding process so as to be matched with the sound cavity area to form a horn sound cavity;
the sounding component is positioned in the horn sound cavity and is in sealing fit with the upper cover and the lower cover;
the stereoplasm circuit board, the stereoplasm circuit board with the lower cover has the integral type structure of moulding plastics and forming, and has first portion and second portion, wherein, first portion is located loudspeaker sound intracavity, be used for with sound producing component connects, the second portion is located the joining region is used for playing the foot with the mainboard and is connected.
2. The sound cavity module according to claim 1, wherein the lower cover includes a bottom plate and an enclosure formed on a side of the bottom plate facing the upper cover, and the bottom plate, the enclosure and the upper cover cooperate to enclose the horn sound cavity;
the hard circuit board is formed on the surface of the bottom plate facing the upper cover, and the enclosure frame is located between the hard circuit board and the upper cover.
3. The acoustic cavity module set of claim 1, wherein the rigid circuit board is a PCB board.
4. The acoustic cavity module set forth in claim 1 wherein said rigid circuit board is a sheet of circuit steel.
5. The sound cavity module according to any one of claims 1-4, comprising a flexible circuit board located in the horn sound cavity, wherein one end of the flexible circuit board is connected to the sound emitting component, and the other end of the flexible circuit board is connected to the first portion of the rigid circuit board.
6. The sound cavity module according to claim 5, wherein the first portion of the hard circuit board includes two first land areas, the second portion of the hard circuit board includes second land areas corresponding to the first land areas one by one, the two first land areas are connected to the positive and negative electrodes of the sound generating component through the flexible circuit board, and the two second land areas are used for conducting the corresponding first land areas and the motherboard elastic pins.
7. The sound cavity module according to claim 6, wherein both of the first land areas are tin-plated areas, and/or both of the second land areas are gold-plated areas.
8. The acoustic cavity module set according to claim 5, wherein the sound generating component and the hard circuit board are both thermocompression bonded to the flexible circuit board.
9. The acoustic cavity module according to claim 4, wherein the circuit steel sheet includes a positioning portion, and the positioning portion is located on a side of the acoustic cavity area facing away from the connection area.
10. The sound cavity module according to claim 9, wherein the positioning portion comprises a positioning portion body and at least two positioning holes disposed on the positioning portion body, and/or a pre-breaking groove is disposed at a connection portion of the positioning portion and the lower cover.
11. A mobile terminal, characterized in that it comprises a sound cavity module according to any one of claims 1-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120671721.0U CN214481255U (en) | 2021-04-01 | 2021-04-01 | Sound cavity module and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120671721.0U CN214481255U (en) | 2021-04-01 | 2021-04-01 | Sound cavity module and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214481255U true CN214481255U (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120671721.0U Active CN214481255U (en) | 2021-04-01 | 2021-04-01 | Sound cavity module and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214481255U (en) |
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2021
- 2021-04-01 CN CN202120671721.0U patent/CN214481255U/en active Active
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