CN112637753B - Preparation method of loudspeaker module - Google Patents
Preparation method of loudspeaker module Download PDFInfo
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- CN112637753B CN112637753B CN202011398612.2A CN202011398612A CN112637753B CN 112637753 B CN112637753 B CN 112637753B CN 202011398612 A CN202011398612 A CN 202011398612A CN 112637753 B CN112637753 B CN 112637753B
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- metal
- upper shell
- cavity
- sound
- metal upper
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The invention discloses a preparation method of a loudspeaker module, which comprises the following steps: s1, forming a surrounding structure on a metal upper shell to enable the surrounding structure to surround a cavity on the metal upper shell, wherein a sound outlet communicated with the cavity and the outside is formed in the surrounding structure; s2, forming a plastic support on the metal upper shell, wherein the plastic support is located in the cavity and comprises a sound outlet portion arranged at the sound outlet and a supporting portion used for supporting the loudspeaker single body, and a sound outlet hole is formed in the sound outlet portion; s3, mounting a loudspeaker monomer on the supporting part to enable the metal upper shell, the plastic support and the loudspeaker monomer to enclose a front sound cavity communicated with the sound outlet; and S4, mounting the metal lower shell to the metal upper shell to enable the metal upper shell, the plastic support, the loudspeaker monomer and the metal lower shell to form a rear sound cavity in a surrounding mode. Adopt metal epitheca and metal inferior valve to accomodate the plastic support, the maximize in the cavity space of sound chamber and back sound chamber before realizing under limited space does benefit to the promotion of cavity performance.
Description
Technical Field
The invention relates to the technical field of acoustic devices, in particular to a method for manufacturing a loudspeaker module.
Background
With the progress of science and technology, electronic products such as mobile phones, tablet computers and various wearable electronic devices tend to be miniaturized more and more, and how to reduce the volume of the electronic products becomes a very important part in the design of the electronic products.
The conventional moving-coil loudspeaker mainly comprises a moving-coil loudspeaker, an electromagnetic loudspeaker, a capacitive loudspeaker, a piezoelectric loudspeaker and the like, wherein the moving-coil loudspeaker is relatively simple to manufacture, low in cost, good in low-frequency sound production advantage and the like;
along with the miniaturized development of electronic product, the inside space of reserving for the installation speaker of current electronic product is also more and more littleer, and the goodness of speaker module acoustic performance depends on the size of speaker module casing sound cavity volume, current speaker module casing generally is made for the plastic material, for the structural strength who ensures speaker module casing, the thickness of the speaker module casing that the plastic material was made needs more than 0.7mm, so, the miniaturized development trend of speaker module and the maximize of sound cavity space design have been restricted.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the preparation method of the loudspeaker module is provided to meet the design requirement of a miniaturized large sound cavity of the loudspeaker module.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: a preparation method of a loudspeaker module comprises the following steps:
s1, forming a surrounding structure on a metal upper shell to enable the surrounding structure to surround a cavity on the metal upper shell, wherein a sound outlet which is communicated with the cavity and the outside is formed in the surrounding structure;
s2, forming a plastic support on the metal upper shell, wherein the plastic support is located in the cavity and comprises a sound outlet portion arranged at the sound outlet and a supporting portion used for supporting the loudspeaker monomer, and sound outlet holes are formed in the sound outlet portion;
s3, mounting a loudspeaker monomer on the supporting part to enable the metal upper shell, the plastic support and the loudspeaker monomer to enclose a front sound cavity communicated with the sound outlet;
and S4, mounting the metal lower shell to the metal upper shell to enable the metal upper shell, the plastic support, the loudspeaker monomer and the metal lower shell to form a rear sound cavity in a surrounding mode.
The invention has the beneficial effects that: the metal upper shell and the metal lower shell are both made of metal, so that the thickness of the metal upper shell and the thickness of the metal lower shell can be made to be 0.1mm on the premise of ensuring the structural strength of the loudspeaker module, and compared with the traditional plastic shell, the loudspeaker module is smaller in size and accords with the development trend of miniaturization of electronic products; the metal epitheca sets up to surround the structure and accomodates the plastic support, and speaker monomer, plastic support and metal epitheca three enclose into preceding vocal chamber, and four enclose into the back vocal chamber under speaker monomer, plastic support, metal epitheca and the metal inferior valve, have realized the maximize in the cavity space in preceding vocal chamber and back vocal chamber under the prerequisite that does not increase the whole volume of speaker module, do benefit to the promotion of speaker module cavity performance.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a speaker module according to a first embodiment of the invention;
fig. 2 is an assembly view of a speaker module manufactured by a method of manufacturing a speaker module according to a first embodiment of the present invention;
fig. 3 is an exploded view of a speaker module manufactured by a method for manufacturing a speaker module according to a first embodiment of the present invention;
fig. 4 is a schematic cross-sectional structural view of a speaker module manufactured by a manufacturing method of the speaker module according to an embodiment of the invention.
Description of the reference symbols:
1. a metal upper shell; 11. a surrounding structure; 12. a sound outlet; 13. a position avoiding groove; 2. a metal lower case; 3. a plastic bracket; 31. a support portion; 32. a sound emitting portion; 33. a sound outlet; 34. a support body; 4. a speaker unit; 5. sound-absorbing particles; 6. FPC; 7. a front acoustic chamber; 8. a rear acoustic chamber.
Detailed Description
In order to explain the technical contents, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The most key concept of the invention is as follows: adopt metal epitheca and metal inferior valve to accomodate plastic support and speaker monomer to the maximize in the cavity space in sound chamber and back sound chamber before realizing under limited space does benefit to the promotion of speaker module cavity performance.
Referring to fig. 1 to 4, a method for manufacturing a speaker module includes the following steps:
s1, forming a surrounding structure 11 on a metal upper shell 1, so that the surrounding structure 11 surrounds a cavity on the metal upper shell 1, wherein a sound outlet 12 communicating the cavity with the outside is formed in the surrounding structure 11;
s2, forming a plastic support 3 on the metal upper shell 1, wherein the plastic support 3 is located in the cavity, the plastic support 3 comprises a sound outlet portion 32 arranged at the sound outlet 12 and a supporting portion 31 used for supporting the loudspeaker single body 4, and a sound outlet hole 33 is formed in the sound outlet portion 32;
s3, mounting a loudspeaker single body 4 on the supporting part 31 to enable the metal upper shell 1, the plastic support 3 and the loudspeaker single body 4 to enclose a front sound cavity 7 communicated with the sound outlet 33;
and S4, mounting the metal lower shell 2 to the metal upper shell 1, so that the metal upper shell 1, the plastic support 3, the loudspeaker monomer 4 and the metal lower shell 2 enclose a rear sound cavity 8.
From the above description, the beneficial effects of the present invention are: the metal upper shell 1 and the metal lower shell 2 are both made of metal, so that on the premise of ensuring the structural strength of the loudspeaker module, the thicknesses of the metal upper shell 1 and the metal lower shell 2 can be made to be 0.1mm, and compared with the traditional plastic shell, the loudspeaker module is smaller in size and accords with the development trend of miniaturization of electronic products; metal epitheca 1 sets up to surround structure 11 and accomodates plastic support 3, speaker monomer 4, 1 three of plastic support 3 and metal epitheca enclose into preceding acoustic cavity 7, speaker monomer 4, plastic support 3, metal epitheca 1 and metal inferior valve 2 four enclose into back acoustic cavity 8, the maximize in the cavity space of preceding acoustic cavity 7 with back acoustic cavity 8 has been realized under the prerequisite that does not increase the whole volume of speaker module, do benefit to the promotion of speaker module cavity performance.
Further, in step S2, the plastic bracket 3 is formed on the metal upper case 1 by an in-mold injection molding process.
Known from the above description, through the injection moulding technology in the mould form on the metal epitheca 1 plastic support 3 can ensure plastic support 3 with the reliability of connecting between the metal epitheca 1 does benefit to structural strength's promotion, and the risk that 7 lou sound in preceding acoustic chamber can be reduced simultaneously does benefit to speaker module acoustic performance's promotion.
Further, in step S2, the plastic bracket 3 is adhesively connected to the metal top case 1 by gluing.
As can be known from the above description, the plastic support 3 is adhesively connected to the metal upper shell 1 in an adhesive manner, so that the process is simple and the production efficiency is improved.
Further, in step S4, the metal lower case 2 is mounted on the metal upper case 1 by laser welding or adhesive dispensing.
As can be seen from the above description, the connection mode between the metal upper case 1 and the metal lower case 2 can be selected according to the practical application requirement.
Further, step S1 specifically includes the following steps:
s11, stamping the periphery of a metal sheet, and turning over the periphery of the metal sheet in the same direction to form the surrounding structure 11.
From the above description, the enclosure structure 11 has a simple manufacturing process, is convenient to machine and form, and facilitates reduction of production cost.
Further, the method also comprises step S12: the sound outlet 12 is punched in the metal sheet.
As can be seen from the above description, the sound outlet 12 is formed by a blanking process, which is simple in process, convenient for machining and forming, and beneficial to reducing the production cost.
Further, the plastic bracket 3 further includes a supporting body 34, and the supporting body 34 is used for supporting the metal lower case 2.
As can be seen from the above description, the supporting body 34 can support the metal lower casing 2, which is beneficial to improving the structural strength.
Further, between the steps S3 and S4, there is further included a step S31: and sound absorption particles 5 are filled in the cavity.
Further, step S4 is followed by step S5: and coating a sealant at the joint of the metal lower shell 2 and the metal upper shell 1.
According to the description, the sealant can enhance the sealing performance of the metal upper shell 1 and the metal lower shell 2, and ensure the stability of the acoustic performance of the loudspeaker module.
Example one
Referring to fig. 1 to 4, a first embodiment of the present invention is: a preparation method of a loudspeaker module comprises the following steps:
s1, forming a surrounding structure 11 on a metal upper shell 1, so that the surrounding structure 11 surrounds a cavity on the metal upper shell 1, wherein a sound outlet 12 communicating the cavity with the outside is formed in the surrounding structure 11;
specifically, step S1 includes the following steps:
s11, stamping the periphery of a metal sheet to enable the periphery of the metal sheet to be turned over in the same direction to form the surrounding structure 11;
s12, punching a sound outlet 12 on the metal sheet;
s13, punching a position avoiding groove 13 on the metal sheet;
optionally, the step S1 may be performed sequentially according to the processing sequence of S11, S12, and S13, may also be performed sequentially according to the processing sequence of S12, S13, and S11, and may also be performed sequentially according to the processing sequence of S13, S12, and S11, which may be specifically exchanged according to actual application requirements and is not described herein again.
S2, forming a plastic support 3 on the metal upper shell 1, wherein the plastic support 3 is positioned in the cavity, the plastic support 3 comprises a sound outlet part 32 arranged at the sound outlet 12 and a supporting part 31 used for supporting the loudspeaker single body 4, and a sound outlet hole 33 is formed in the sound outlet part 32;
specifically, a molding area is obtained in the cavity, and an acoustic cavity area is obtained from the center of the molding area; the supporting portion 31 is connected to the molding region in the cavity of the metal upper case 1;
optionally, the plastic support 3 may be formed on the metal upper shell 1 by an in-mold injection molding process, so that the reliability of connection between the plastic support 3 and the metal upper shell 1 can be ensured, the improvement of structural strength is facilitated, meanwhile, the risk of sound leakage of the front acoustic cavity 7 can be reduced, and the improvement of acoustic performance of the speaker module is facilitated; or, can also be through sticky mode with plastic support 3 adhesive bonding is in on the metal epitheca 1, so, the process is simple, does benefit to production efficiency's promotion.
S3, mounting a loudspeaker single body 4 on the supporting part 31 to enable the metal upper shell 1, the plastic support 3 and the loudspeaker single body 4 to enclose a front sound cavity 7 communicated with the sound outlet hole 33;
s31, filling sound-absorbing particles 5 into the cavity, specifically, filling the sound-absorbing particles 5 into the cavity space on one side of the loudspeaker monomer 4, which is far away from the front sound cavity 7;
s32, mounting an FPC6 (namely a flexible circuit board) at a pad of the speaker monomer 4, wherein one end of the FPC6 is electrically connected to the pad of the speaker monomer 4, and the other end of the FPC6 penetrates through the avoiding groove 13 and is exposed out of the metal upper shell 1;
optionally, step S31 is performed before step S32, or step S31 is performed after step S32, which may be specifically set according to actual application requirements.
S4, mounting the metal lower shell 2 to the metal upper shell 1, so that the metal upper shell 1, the plastic support 3, the loudspeaker monomer 4 and the metal lower shell 2 enclose a rear sound cavity 8; optionally, the metal lower shell 2 is mounted on the metal upper shell 1 in a laser welding or dispensing connection manner; specifically, in this embodiment, the metal lower shell 2 is welded to the metal upper shell 1 by laser welding; the method comprises the following specific steps: firstly, covering the metal lower shell 2 on the metal upper shell 1, obtaining four groups of welding points at the joint of the metal lower shell 2 and the metal upper shell 1, wherein each group of welding points comprises two welding points which are symmetrically arranged, and respectively carrying out laser welding on the four groups of welding points.
S5, coating sealant at the joint of the metal lower shell 2 and the metal upper shell 1, specifically, uniformly coating the sealant along the joint of the metal upper shell 1 and the metal lower shell 2, and covering the four groups of welding points with the sealant.
And S6, coating sealant on the position avoiding groove 13.
In conclusion, the manufacturing method of the loudspeaker module provided by the invention has simple process steps, the metal upper shell and the metal lower shell are both made of metal, the thicknesses of the metal upper shell and the metal lower shell can be made to be 0.1mm on the premise of ensuring the structural strength of the loudspeaker module, and compared with the traditional plastic shell, the loudspeaker module has smaller volume and conforms to the development trend of miniaturization of electronic products; the metal epitheca sets up to surround the structure and accomodates the plastic support, and speaker monomer, plastic support and metal epitheca three enclose into preceding vocal chamber, and four enclose into the back vocal chamber under speaker monomer, plastic support, metal epitheca and the metal inferior valve, have realized the maximize in the cavity space in preceding vocal chamber and back vocal chamber under the limited space, do benefit to the promotion of speaker module cavity performance.
The above description is only an embodiment of the present invention, and is not intended to limit the scope of the present invention, and all equivalent modifications made by the present invention and the contents of the accompanying drawings, which are directly or indirectly applied to the related technical fields, are included in the scope of the present invention.
Claims (8)
1. A preparation method of a loudspeaker module is characterized by comprising the following steps:
s1, forming a surrounding structure on a metal upper shell to enable the surrounding structure to surround a cavity on the metal upper shell, wherein a sound outlet which is communicated with the cavity and the outside is formed in the surrounding structure;
s2, forming a plastic support on the metal upper shell, wherein the plastic support is located in the cavity and comprises a sound outlet portion arranged at the sound outlet and a supporting portion used for supporting the loudspeaker monomer, and sound outlet holes are formed in the sound outlet portion;
s3, mounting a loudspeaker monomer on the supporting part to enable the metal upper shell, the plastic support and the loudspeaker monomer to enclose a front sound cavity communicated with the sound outlet;
s4, mounting a metal lower shell to the metal upper shell to enable the metal upper shell, the plastic support, the loudspeaker monomer and the metal lower shell to form a rear sound cavity in a surrounding mode; the plastic support further comprises a support body, and the support body is used for supporting the metal lower shell.
2. The method for manufacturing a speaker module as claimed in claim 1, wherein in step S2, the plastic bracket is formed on the metal upper shell by an in-mold injection molding process.
3. The method as claimed in claim 1, wherein in step S2, the plastic bracket is adhered to the metal top case by gluing.
4. The method for manufacturing a speaker module as claimed in claim 1, wherein in step S4, the metal lower shell is mounted on the metal upper shell by laser welding or adhesive dispensing.
5. The method for manufacturing a speaker module according to claim 1, wherein the step S1 specifically includes the following steps:
s11, stamping the periphery of one metal sheet to enable the periphery of the metal sheet to be turned in the same direction to form the surrounding structure.
6. The method for manufacturing a speaker module according to claim 5, further comprising step S12: a sound port is punched in the metal sheet.
7. The method as claimed in claim 1, further comprising step S31 between step S3 and step S4: and sound absorption particles are filled in the cavity.
8. The method as claimed in claim 1, further comprising step S5 after step S4: and coating a sealant at the joint of the metal lower shell and the metal upper shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011398612.2A CN112637753B (en) | 2020-12-02 | 2020-12-02 | Preparation method of loudspeaker module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011398612.2A CN112637753B (en) | 2020-12-02 | 2020-12-02 | Preparation method of loudspeaker module |
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| CN112637753A CN112637753A (en) | 2021-04-09 |
| CN112637753B true CN112637753B (en) | 2022-09-06 |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113543011B (en) * | 2021-07-15 | 2023-03-10 | 歌尔股份有限公司 | Loudspeaker module, processing technology of shell of loudspeaker module and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103118320B (en) * | 2013-01-18 | 2015-11-11 | 歌尔声学股份有限公司 | A kind of ultrathin loudspeaker module |
| CN110679155B (en) * | 2017-06-20 | 2021-04-20 | 华为技术有限公司 | Electronic equipment |
| CN107547957B (en) * | 2017-08-22 | 2019-10-22 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
| CN109246563B (en) * | 2018-11-23 | 2020-11-03 | 歌尔股份有限公司 | Loudspeaker module |
| CN209659597U (en) * | 2018-12-30 | 2019-11-19 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
| CN209390294U (en) * | 2018-12-30 | 2019-09-13 | 瑞声科技(新加坡)有限公司 | Loudspeaker enclosure |
| CN211321501U (en) * | 2020-01-09 | 2020-08-21 | 瑞声科技(新加坡)有限公司 | Loudspeaker box |
| CN112004170B (en) * | 2020-08-27 | 2021-08-06 | 瑞声新能源发展(常州)有限公司科教城分公司 | Loudspeaker box |
| CN112004169B (en) * | 2020-08-27 | 2022-07-08 | 瑞声新能源发展(常州)有限公司科教城分公司 | Loudspeaker box |
| CN112073852B (en) * | 2020-08-27 | 2021-11-12 | 瑞声新能源发展(常州)有限公司科教城分公司 | Loudspeaker box |
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