CN214313140U

CN214313140U - Cutting device is used in semiconductor chip processing

Info

Publication number: CN214313140U
Application number: CN202120317065.4U
Authority: CN
Inventors: 郑昆鹏; 刘鹏辉; 刘新建; 胡永强
Original assignee: Henan Keen Surperhard Materials Technology Co ltd
Current assignee: Henan Keen Surperhard Materials Technology Co ltd
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2021-09-28
Anticipated expiration: 2031-02-03

Abstract

The utility model relates to a semiconductor chip processing technology field, concretely relates to cutting device is used in semiconductor chip processing, including chassis, loading platform, cutting bed and cutterbar, the chassis is respectively through first support frame and second support frame and loading platform fixed connection, the loading platform top is equipped with the cutting bed, the cutting bed top is located to the cutterbar. The utility model relates to a cutting device with press from both sides tight semiconductor chip function can not crooked or the departure causes the harm to the human body during cutting, and the cutting position is slidable, does benefit to multiple demand cutting and simple structure, is a low in cost, and the security is high, can freely adjust cutting device for semiconductor chip processing.

Description

Cutting device is used in semiconductor chip processing

Technical Field

The utility model relates to a semiconductor chip processing technology field, concretely relates to cutting device is used in semiconductor chip processing.

Background

The semiconductor chip is a semiconductor device which is formed by etching and wiring a semiconductor wafer and can realize a certain function. Not only silicon chips, but also gallium arsenide (gallium arsenide is toxic, so some inferior circuit boards do not decompose it), germanium and other semiconductor materials are commonly included. In the processing process of a semiconductor chip, a rib cutting forming process is an essential important process for packaging a product, a rib cutting forming die is used for cutting dams among outer pins of a lead frame and positions connected together on the lead frame strip, the product is completely punched and separated from the lead frame, and a semi-finished product is provided for a subsequent testing braid process. However, most of the existing cutting devices for processing semiconductor chips have complex structures and high manufacturing cost.

Authorization notice number: CN209087783U discloses device is cut in semiconductor chip processing, including the cutting machine body, the top fixedly connected with water tank of cutting machine body inner wall, the top fixedly connected with cutting board of water tank, the standing groove has been seted up at the top of cutting board, the inside swing joint of standing groove has the base plate body, the right side fixedly connected with water pump of water tank, the left side of water pump runs through the water tank and extends to the inside of water tank. This device is cut in semiconductor chip processing has solved current cutting machine and can't purify the cooling water after the cooling to lead to containing a large amount of semiconductor chip powders that are difficult to wash that come from the water pump or cutting left over in the cooling water, can mix with the cooling water when the cooling, make semiconductor chip's cutting accuracy reduce, lead to the problem that the defective rate of product improves, this device is cut in semiconductor chip processing possesses can purify advantage such as to the cooling water. However, the above patents still have the following problems:

(1) the cutting machine is not provided with a clamping mechanism, and is easy to skew or fly out to cause damage to human bodies during cutting.

(2) The cutting table is fixed in position and is not beneficial to cutting with various requirements.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model provides a cutting device for processing semiconductor chips, which is used for solving the problems that the prior art does not have a clamping mechanism and is easy to be inclined or fly out to cause damage to human bodies during cutting; the cutting position is fixed, is unfavorable for multiple demand cutting scheduling problem.

In order to solve the technical problem, the utility model discloses a following technical scheme: the utility model provides a cutting device is used in semiconductor chip processing, includes chassis, loading platform, cutting bed and cutterbar, the chassis is respectively through first support frame and second support frame and loading platform fixed connection, the loading platform top is equipped with the cutting bed, the cutting bed top is located to the cutterbar.

Preferably, the cutting table top is equipped with puts the thing platform, the cutting table passes through the pillar and puts thing platform fixed connection, it is equipped with the cutting groove to put thing platform middle part, it is equipped with two clamping mechanism, and two to put thing platform upper surface clamping mechanism is about cutting the groove mirror image.

Preferably, clamping mechanism includes roll structure, grip block and promotion dish, roll structure one end with put thing platform one end sliding connection, the roll structure other end and grip block one end fixed connection, the other end of grip block is located to the promotion dish.

Preferably, four ends below the cutting table are provided with idler wheels, two ends of the upper surface of the loading table are provided with sliding grooves, and the idler wheels are in rolling connection with the sliding grooves.

Preferably, the cutter includes cutting blade and connecting block, cutting blade and connecting block fixed connection, connecting block one side is equipped with the linking arm, just connecting block and linking arm fixed connection, the linking arm upper surface is equipped with the motor.

Preferably, a connecting column is arranged on the lower surface of the upper end of the connecting arm, the lower end of the connecting column is fixedly connected with the loading platform, a driving arm is arranged on one side of the connecting arm, the upper end of the driving arm is connected with a connecting rod, and two ends of the connecting rod are fixedly connected with the first supporting frame.

Compared with the prior art, the utility model, following beneficial effect has: the utility model relates to a cutting device with the function of clamping a semiconductor chip, which can not be inclined or fly out to cause damage to human body during cutting, the cutting position can be slid, which is beneficial to cutting with various requirements and has simple structure; the motor on the linking arm can start the cutterbar and cut, and the rolling structure in the clamping mechanism, pinch-off blades and push away the driving disk and can make the semiconductor chip of processing fix and put the thing bench, convenient operation and safety, and four ends in cutting bed below all are equipped with the gyro wheel, and loading platform upper surface both ends all are equipped with the spout, and gyro wheel and spout can make cutting bed shift position, satisfy multiple cutting demand, are a low in cost, and the security is high, can freely adjust cutting device for the semiconductor chip processing.

Drawings

Fig. 1 is a schematic perspective view of an embodiment of a cutting device for processing a semiconductor chip according to the present invention;

FIG. 2 is a schematic side view of a cutting device for semiconductor chip processing according to an embodiment of the present invention;

fig. 3 is a schematic top view of the cutting device for processing semiconductor chips according to the embodiment of the present invention;

reference numerals referred to in the drawings are:

the cutting device comprises an underframe 1, a first support frame 21, a second support frame 22, a loading platform 3, a sliding chute 31, a cutting table 4, a roller 41, an object placing platform 42, a clamping mechanism 43, a rolling structure 431, a clamping plate 432, a pushing disc 433, a cutting groove 44, a support 45, a cutter 5, a cutting blade 51, a connecting block 52, a motor 6, a driving arm 7, a connecting arm 8, a connecting rod 9 and a connecting column 10.

Detailed Description

In order to make the present invention better understood by those skilled in the art, the technical solution of the present invention is further explained below with reference to the accompanying drawings and embodiments:

example one

As shown in fig. 1 to 3, a cutting device for processing a semiconductor chip includes a base frame 1, a loading platform 3, a cutting table 4 and a cutter 5, wherein the base frame 1 is fixedly connected with the loading platform 3 through a first support frame 21 and a second support frame 22, the cutting table 4 is arranged above the loading platform 3, and the cutter 5 is arranged above the cutting table 4.

Cutting table 4 top is equipped with puts thing platform 42, and cutting table 4 is equipped with cutting groove 44 through pillar 45 with putting thing platform 42 fixed connection, puts thing platform 42 middle part, puts thing platform 42 upper surface and is equipped with two clamping mechanism 43, and two clamping mechanism 43 are about cutting groove 44 mirror image.

The clamping mechanism 43 comprises a rolling structure 431, a clamping plate 432 and a pushing disc 433, wherein one end of the rolling structure 431 is slidably connected with one end of the object placing table 42, the other end of the rolling structure 431 is fixedly connected with one end of the clamping plate 432, and the pushing disc 433 is arranged at the other end of the clamping plate 432.

Four ends below the cutting table 4 are provided with idler wheels 41, two ends of the upper surface of the loading table 3 are provided with sliding grooves 31, and the idler wheels 41 are in rolling connection with the sliding grooves 31.

Example two

The cutter 5 comprises a cutting blade 51 and a connecting block 52, the cutting blade 51 is fixedly connected with the connecting block 52, the connecting arm 8 is arranged on one side of the connecting block 52, the connecting block 52 is fixedly connected with the connecting arm 8, and the motor 6 is arranged on the upper surface of the connecting arm 8.

The lower surface of the upper end of the connecting arm 8 is provided with a connecting column 10, the lower end of the connecting column 10 is fixedly connected with the loading platform 3, one side of the connecting arm 8 is provided with a driving arm 7, the upper end of the driving arm 7 is connected with a connecting rod 9, and two ends of the connecting rod 9 are fixedly connected with a first supporting frame 21.

The advantages of the second embodiment over the first embodiment are: the motor 6 is arranged on the upper surface of the connecting arm 8, the cutter 5 is started by the motor 6 to cut, and the connecting column 10 ensures that the connecting arm 8 is stably connected with the loading platform 3.

The above description is only for the embodiments of the present invention, and the common general knowledge of the known specific structures and characteristics in the schemes is not described herein too much, and those skilled in the art will know all the common technical knowledge in the technical field of the present invention before the application date or the priority date, can know all the prior art in this field, and have the ability to apply the conventional experimental means before this date, and those skilled in the art can combine their own ability to perfect and implement the schemes, and some typical known structures or known methods should not become obstacles for those skilled in the art to implement the present application. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent.

Claims

1. A cutting device for processing a semiconductor chip is characterized in that: the cutting machine comprises an underframe (1), a loading platform (3), a cutting table (4) and a cutter (5), wherein the underframe (1) is fixedly connected with the loading platform (3) through a first support frame (21) and a second support frame (22) respectively, the cutting table (4) is arranged above the loading platform (3), and the cutter (5) is arranged above the cutting table (4); an object placing table (42) is arranged above the cutting table (4), the cutting table (4) is fixedly connected with the object placing table (42) through a support column (45), a cutting groove (44) is formed in the middle of the object placing table (42), two clamping mechanisms (43) are arranged on the upper surface of the object placing table (42), and the two clamping mechanisms (43) are mirrored about the cutting groove (44); clamping mechanism (43) are including rolling structure (431), clamp plate (432) and push disc (433), rolling structure (431) one end with put thing platform (42) one end sliding connection, the rolling structure (431) other end and clamp plate (432) one end fixed connection, the clamp plate (432) other end is located in push disc (433).

2. The dicing apparatus for semiconductor chip processing according to claim 1, wherein: four ends below the cutting table (4) are provided with idler wheels (41), two ends of the upper surface of the loading table (3) are provided with sliding grooves (31), and the idler wheels (41) are in rolling connection with the sliding grooves (31).

3. The dicing apparatus for semiconductor chip processing according to claim 2, wherein: cutterbar (5) are including cutting blade (51) and connecting block (52), cutting blade (51) and connecting block (52) fixed connection, connecting block (52) one side is equipped with linking arm (8), just connecting block (52) and linking arm (8) fixed connection, linking arm (8) upper surface is equipped with motor (6).

4. The dicing apparatus for semiconductor chip processing according to claim 3, wherein: the lower surface of the upper end of the connecting arm (8) is provided with a connecting column (10), the lower end of the connecting column (10) is fixedly connected with the loading platform (3), one side of the connecting arm (8) is provided with a driving arm (7), the upper end of the driving arm (7) is connected with a connecting rod (9), and the two ends of the connecting rod (9) are fixedly connected with a first supporting frame (21).