CN211440666U - Automatic cutting machine for semiconductor packaging wafer - Google Patents
Automatic cutting machine for semiconductor packaging wafer Download PDFInfo
- Publication number
- CN211440666U CN211440666U CN201922064912.6U CN201922064912U CN211440666U CN 211440666 U CN211440666 U CN 211440666U CN 201922064912 U CN201922064912 U CN 201922064912U CN 211440666 U CN211440666 U CN 211440666U
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- China
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- support column
- compression spring
- fixed mounting
- cutting machine
- semiconductor package
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- 238000005520 cutting process Methods 0.000 title claims abstract description 22
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 title description 5
- 235000012431 wafers Nutrition 0.000 claims abstract description 33
- 230000006835 compression Effects 0.000 claims abstract description 29
- 238000007906 compression Methods 0.000 claims abstract description 29
- 239000004579 marble Substances 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 claims abstract 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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Abstract
The utility model discloses a semiconductor package wafer automatic cutout machine, the on-line screen storage device comprises a base, the equal fixed mounting in the left and right both ends of base top surface has the support column, two the upper end of support column is connected with same mounting panel, the output of pneumatic cylinder runs through the mounting panel and is connected with the movable plate, movable plate right side wall fixed mounting has the push rod motor, fixed mounting has the scribing sword on the installation piece, all the cover is equipped with first compression spring on the support column, two lie in first compression spring below on the support column and run through and install same limiting plate, lie in the limiting plate below on the support column and all overlap and be equipped with second compression spring. The utility model discloses in, carry out spacing scribing cutting again to marble bench wafer, after the cutting, first compression spring and second compression spring kick-back, and the wafer after the cutting of being convenient for to take can once be to a plurality of wafers scribing cutting, and the work that has reduced the workman is slight, has increaseed work efficiency.
Description
Technical Field
The utility model relates to a wafer preparation equipment field especially relates to semiconductor package wafer automatic cutout machine.
Background
Silicon semiconductor integrated circuits are used more and more widely, wherein the silicon semiconductor integrated circuits all need to use wafers, and the wafers used for the silicon semiconductor integrated circuits are processed in the early stage. The traditional wafer processing is purely manual operation, that is, a worker uses a cutting machine (a diamond cutting machine, a laser cutting machine, etc.) to process a wafer, and the existing wafer processing technology has the following problems due to manual operation: firstly, the processing precision is low, the stability of a manual control cutting machine is poor, the distance between the cut wafers is large, and the uniformity is poor; secondly, the material of the wafer which can be cut is single, and the applicability is poor; thirdly, the rejection rate is high, the material consumption is large, and the production efficiency is low; and fourthly, the precision requirement on the work in the machining process is high, and meanwhile, the labor intensity is high, and the body of a worker is easily injured.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing an automatic cutting machine for semiconductor packaging wafers.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the automatic cutting machine for the semiconductor packaging wafer comprises a base, wherein support columns are fixedly arranged at the left end and the right end of the top surface of the base, the upper ends of the two support columns are connected with the same mounting plate, a hydraulic cylinder is fixedly arranged on the top surface of the mounting plate, a moving plate is arranged on the two support columns in a penetrating manner, the output end of the hydraulic cylinder penetrates through the mounting plate and is connected with the moving plate, a push rod motor is fixedly arranged on the right wall of the moving plate, a sliding groove is arranged on the moving plate, a sliding seat is slidably arranged on the sliding groove, a push rod is connected to the output end of the push rod motor through the right wall of the sliding groove, the other end of the push rod is connected with the sliding seat, a mounting block is fixedly arranged at the lower end of the sliding seat, a scribing knife is, all the cover of locating the limiting plate below on the support column is equipped with second compression spring, base top surface fixed mounting has the marble platform.
Preferably, the sliding groove and the sliding seat are matched in size.
Preferably, the mounting plate is located directly above the moving plate.
Preferably, the bottom surface of the base is fixedly provided with a locking universal wheel.
Preferably, the limiting plate is provided with a rectangular through hole.
Preferably, the marble table is provided with a placing area.
The utility model has the advantages that: 1. the utility model discloses in, first compression spring and second compression spring compress tightly the stopper downwards, carry out spacing scribing cutting again to marble bench wafer.
2. The utility model discloses in, after the cutting, first compression spring and second compression spring kick-back take the limiting plate back to the normal position, the wafer after the cutting of being convenient for take.
3. The utility model discloses in, can once carry out the scribing cutting to a plurality of wafers, it is slight to have reduced workman's work, has increaseed work efficiency.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is the utility model discloses a limiting plate's schematic structure diagram.
Reference numbers in the figures: the device comprises a base 1, a support column 2, a mounting plate 3, a hydraulic cylinder 4, a moving plate 5, a sliding chute 6, a sliding seat 7, a mounting block 8, a scribing knife 9, a first compression spring 10, a limiting plate 11, a second compression spring 12, a marble table 13, a universal wheel 14, a push rod motor 15, a push rod 16 and a rectangular through hole 17.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-2, an automatic cutting machine for semiconductor packaging wafers comprises a base 1, wherein support columns 2 are fixedly mounted at the left end and the right end of the top surface of the base 1, the upper ends of the two support columns 2 are connected with a same mounting plate 3, a hydraulic cylinder 4 is fixedly mounted on the top surface of the mounting plate 3, a movable plate 5 is mounted on the two support columns 2 in a penetrating manner, the mounting plate 3 is positioned right above the movable plate 5, the output end of the hydraulic cylinder 4 penetrates through the mounting plate and is connected with the movable plate 5, a push rod motor 15 is fixedly mounted on the right wall of the movable plate 5, a sliding groove 6 is arranged on the movable plate 5, a sliding seat 7 is slidably mounted on the sliding groove 6, the sliding groove 6 is matched with the sliding seat 7 in size, the output end of the push rod motor 15 penetrates through the right wall, the mounting block 8 is fixedly provided with a scribing cutter 9, the supporting columns 2 are sleeved with first compression springs 10, two supporting columns 2 are provided with a same limiting plate 11 below the first compression springs 10 in a penetrating manner, the limiting plate 11 is provided with a rectangular through hole 17, the supporting columns 2 are provided with second compression springs 12 below the limiting plate 11 in a sleeved manner, the first compression springs 10 and the second compression springs 12 press the limiting blocks 11 downwards to limit the wafers on the marble table 13 and then scribe and cut the wafers, the top surface of the base 1 is fixedly provided with a marble table 13, the marble table 13 is provided with a placing area, the bottom surface of the base 1 is fixedly provided with a locking universal wheel 14, after the cutting is finished, the first compression springs 10 and the second compression springs 12 rebound to bring the limiting plate 11 back to the original position, so that the cut wafers can be taken conveniently, and a plurality of wafers can be scribed and cut at one time, the work intensity of workers is reduced, and the work efficiency is improved.
The working principle is as follows: when the utility model is used, a plurality of wafers are placed on the marble table 13, the position is adjusted, the hydraulic cylinder 4 is opened, the output end of the hydraulic cylinder 4 presses the movable plate 5 downwards, the movable plate 5 compresses the first compression spring 10 on the supporting column 2, the first compression spring 10 presses the limiting plate 11 downwards, the limiting plate 11 compresses the second compression spring 12, the first compression spring 10 and the second compression spring 12 press the limiting block 11 downwards to position the wafers on the marble table 13, the push rod motor 15 is opened, the output end of the push rod motor 15 drives the push rod 16 to move, the push rod 16 drives the slide seat 7 to move, the slide seat 7 drives the mounting block 8 to move, thereby driving the scribing knife 9 to scribe and cut the wafers through the rectangular through hole 17, after the movable plate is cut, the output end of the hydraulic cylinder 4 moves the movable plate 4 upwards, the first compression spring 10 and the second compression spring 12 rebound, bringing the limit plate 11 back to the original position.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. Semiconductor package wafer automatic cutout machine, including base (1), its characterized in that, the equal fixed mounting in base (1) top surface left and right both ends has support column (2), two the upper end of support column (2) is connected with same mounting panel (3), mounting panel (3) top surface fixed mounting pneumatic cylinder (4), two run through on support column (2) and install movable plate (5), the output of pneumatic cylinder (4) runs through the mounting panel and is connected with movable plate (5), movable plate (5) right wall fixed mounting has push rod motor (15), be equipped with spout (6) on movable plate (5), spout (6) slidable mounting has slide (7), the output of push rod motor (15) runs through slide (6) right wall and is connected with catch bar (16), the other end and the slide (7) of catch bar (16) are connected, slide (7) lower extreme fixed mounting has installation piece (8), fixed mounting has scribing sword (9) on installation piece (8), all the cover is equipped with first compression spring (10), two on support column (2) lie in first compression spring (10) below and run through and install same limiting plate (11), lie in limiting plate (11) below on support column (2) and all overlap and be equipped with second compression spring (12), base (1) top surface fixed mounting has marble platform (13).
2. The automatic cutting machine for semiconductor package wafers as claimed in claim 1, characterized in that the size of the slide (7) and the slide groove (6) are adapted.
3. The automatic cutting machine for semiconductor package wafers as claimed in claim 1, wherein the mounting plate (3) is located right above the moving plate (5).
4. The automatic cutting machine for semiconductor package wafers as claimed in claim 1, wherein the base (1) is fixedly mounted with a locking universal wheel (14) on the bottom surface.
5. The automatic cutting machine for semiconductor package wafers as claimed in claim 1, wherein the limiting plate (11) is provided with a rectangular through hole (17).
6. The automatic cutting machine for semiconductor package wafers as claimed in claim 1, wherein the marble table (13) is provided with a placing area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922064912.6U CN211440666U (en) | 2019-11-26 | 2019-11-26 | Automatic cutting machine for semiconductor packaging wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922064912.6U CN211440666U (en) | 2019-11-26 | 2019-11-26 | Automatic cutting machine for semiconductor packaging wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211440666U true CN211440666U (en) | 2020-09-08 |
Family
ID=72320176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922064912.6U Active CN211440666U (en) | 2019-11-26 | 2019-11-26 | Automatic cutting machine for semiconductor packaging wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211440666U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114227959A (en) * | 2021-12-14 | 2022-03-25 | 湖南艾凯瑞斯智能科技有限公司 | Grinding wheel scribing machine with auxiliary cutting and positioning function for wafer processing |
-
2019
- 2019-11-26 CN CN201922064912.6U patent/CN211440666U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114227959A (en) * | 2021-12-14 | 2022-03-25 | 湖南艾凯瑞斯智能科技有限公司 | Grinding wheel scribing machine with auxiliary cutting and positioning function for wafer processing |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Semiconductor packaging wafer automatic cutting machine Granted publication date: 20200908 Pledgee: Agricultural Bank of China Limited Dongguan Liaobu Branch Pledgor: Dongguan PINGJING Microelectronics Technology Co.,Ltd. Registration number: Y2024980022606 |