CN213991519U

CN213991519U - Heat dissipation device and electronic equipment

Info

Publication number: CN213991519U
Application number: CN202023283697.8U
Authority: CN
Inventors: 张欢
Original assignee: Lenovo Future Communication Technology Chongqing Co Ltd
Current assignee: Lenovo Future Communication Technology Chongqing Co Ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-08-17
Anticipated expiration: 2030-12-30

Abstract

The embodiment of the utility model provides a heat dissipation device and electronic equipment, the heat dissipation device comprises a heat dissipation piece, the heat dissipation piece comprises a plurality of heat dissipation blocks which are overlapped in sequence, the plurality of heat dissipation blocks are arranged in an inverted cone shape, the heat dissipation piece is provided with an attaching end and a heat dissipation end, the cross-sectional area of the attaching end is smaller than that of the heat dissipation end, the attaching end is used for attaching to a device to be dissipated, so that heat generated by the device to be dissipated is transmitted to the heat dissipation end through the attaching end of the heat dissipation piece, the heat generated by the device to be dissipated can be dissipated quickly, the cross-sectional area of the attaching end is smaller than that of the heat dissipation end, the heat dissipation piece is favorable for being used in a scene with limited space, such as chip heat dissipation with a small-size structure, namely, the heat dissipation device occupies a small space and can avoid the condition of interference with components around the device to be dissipated, and, the efficiency of heat dissipation can be accelerated. In addition, the heat dissipation device is simple in structure and low in setting cost.

Description

Heat dissipation device and electronic equipment

Technical Field

The utility model relates to an electronic equipment's heat dissipation technical field especially relates to a heat abstractor and electronic equipment.

Background

With the progress of chip design technology, the size of the chip is smaller and smaller, and the performance is gradually enhanced. However, the performance of the chip is enhanced, which generally results in increased power consumption and increased heat dissipation pressure. Meanwhile, the reduction of the size increases the power density of the chip and reduces the heat dissipation area, so that the heat dissipation difficulty of the chip is higher. In addition, there are usually many auxiliary devices around the chip, such as resistors, capacitors, inductors, etc., which are large in size, so that it is difficult for the conventional heat dissipation device to directly contact the chip to dissipate heat from the chip.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned technical problem that exists among the prior art, the utility model provides a heat abstractor and electronic equipment, this heat abstractor occupation space is little and the radiating efficiency is high.

An embodiment of the utility model provides a heat abstractor, heat abstractor includes:

the heat dissipation piece comprises a plurality of heat dissipation blocks which are sequentially superposed, the heat dissipation blocks are arranged in an inverted cone shape, the heat dissipation piece is provided with an attaching end and a heat dissipation end, the cross-sectional area of the attaching end is smaller than that of the heat dissipation end, and the attaching end is used for attaching to a device to be cooled.

In some embodiments, the heat dissipation device further comprises heat dissipation fins disposed on the heat dissipation end of the heat dissipation member.

In some embodiments, the heat sink includes a base plate and a plurality of heat sinks juxtaposed on the base plate, the base plate being disposed on the heat sink end.

In some embodiments, the heat dissipation device is used for dissipating heat of a chip of an electronic device, and the shape of the side surface of the heat dissipation member is matched with the shape and the arrangement position of components arranged around the chip.

In some embodiments, the heat dissipation blocks are plate-shaped, and the plate surfaces of adjacent heat dissipation blocks are attached to each other.

In some embodiments, the cross section of the heat dissipation block is rectangular, and the length and the width of the cross section of the plurality of heat dissipation blocks gradually increase along the direction from the fitting end to the heat dissipation end.

In some embodiments, the cross section of the heat dissipation block is circular, and the diameter of the cross section of the heat dissipation blocks gradually increases along the direction from the fitting end to the heat dissipation end.

In some embodiments, the heat sink and the heat sink fins are connected by welding; or

The radiating piece and the radiating fins are connected in a glue bonding mode.

In some embodiments, the heat dissipation block is made of an aluminum alloy material; and/or

The radiating fins are made of aluminum alloy materials.

An embodiment of the utility model provides an electronic equipment is still provided, including the chip to and foretell heat abstractor, heat abstractor is used for doing the chip heat dissipation.

Compared with the prior art, the utility model discloses beneficial effect lies in: the utility model discloses a be a plurality of radiating blocks of the radiating piece that the back taper was laid, and with the laminating end that the cross-section is little of radiating piece with treat the heat abstractor laminating, with the laminating end transmission to its heat dissipation end that will treat the produced heat of heat abstractor through the radiating piece, the realization is treated the produced heat of heat abstractor and can be distributed away fast, and the cross sectional area of above-mentioned laminating end is less than the heat dissipation end, be favorable to using this radiating piece under the limited scene in space, for example, for the chip heat dissipation of small-size structure, above-mentioned heat abstractor's occupation space can avoid with treating the condition that the components and parts around the heat abstractor interfere promptly, and the heat is held the transmission to the heat dissipation by the laminating, can accelerate the efficiency that the heat gived off. In addition, the heat dissipation device is simple in structure and low in setting cost.

Drawings

In the drawings, which are not necessarily drawn to scale, like reference numerals may describe similar components in different views. Like reference numerals having letter suffixes or different letter suffixes may represent different instances of similar components. The drawings illustrate various embodiments generally by way of example and not by way of limitation, and together with the description and claims serve to explain the disclosed embodiments. The same reference numbers will be used throughout the drawings to refer to the same or like parts, where appropriate. Such embodiments are illustrative, and are not intended to be exhaustive or exclusive embodiments of the present apparatus or method.

Fig. 1 is a schematic structural view of a heat sink of a heat dissipation device according to an embodiment of the present invention;

fig. 2 is a schematic structural view of a heat sink and heat dissipation fins of a heat dissipation device according to an embodiment of the present invention;

fig. 3 is an installation diagram of the heat dissipation device and the chip according to the embodiment of the present invention.

The members denoted by reference numerals in the drawings:

1-a heat sink; 11-a heat sink; 12-attaching ends; 13-a heat dissipation end; 2-radiating fins; 21-a bottom plate; 22-a heat sink; 3-chip.

Detailed Description

In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be described in detail with reference to the accompanying drawings and the detailed description. The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and the specific embodiments, but not to be construed as limiting the invention.

The use of "first," "second," and similar terms in the description herein do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element preceding the word covers the element listed after the word, and does not exclude the possibility that other elements are also covered. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

In the present invention, when it is described that a specific device is located between a first device and a second device, an intervening device may or may not be present between the specific device and the first device or the second device. When a particular device is described as being coupled to other devices, that particular device may be directly coupled to the other devices without intervening devices or may be directly coupled to the other devices with intervening devices.

All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.

The embodiment of the utility model provides a heat abstractor, as shown in fig. 1, heat abstractor includes radiating piece 1, and radiating piece 1 includes a plurality of radiating block 11 of superpose in proper order, and a plurality of radiating block 11 are the back taper and lay, and radiating piece 1 has laminating end 12 and radiating end 13, and the cross sectional area of laminating end 12 is less than the cross sectional area of radiating end 13, and laminating end 12 is used for laminating in treating heat abstractor.

It can be understood that the heat dissipation blocks 11 can be connected by welding or bolting, or by gluing, so that heat generated by the device to be heat dissipated can be quickly transferred from the attaching end 12 to the heat dissipating end 13, which is not limited in any way.

It can be understood that the attaching end 12 is attached to the heat generating surface of the device to be heat dissipated, and the shape of the attaching end 12 can be adapted to the shape of the heat generating surface, so as to increase the contact area between the heat dissipating member 1 and the device to be heat dissipated as much as possible, thereby increasing the heat dissipating efficiency.

The utility model discloses a be a plurality of radiating block 11 of the radiating piece 1 that the back taper was laid, and with the little laminating end 12 in cross-section of radiating piece 1 with treat the heat abstractor laminating, with the produced heat of heat abstractor will be treated and end 12 transmission to its heat dissipation end 13 through the laminating of radiating piece 1, the produced heat of heat abstractor is treated in the realization can distribute away fast, and the cross sectional area of above-mentioned laminating end 12 is less than heat dissipation end 13, be favorable to using this radiating piece 1 under the limited scene in space, for example for the chip 3 heat dissipation of small-size structure, promptly above-mentioned heat abstractor's occupation space can avoid with the condition of treating the components and parts interference around the heat abstractor for a short time, and the heat is held 12 transmission to heat dissipation end 13 by the laminating, can accelerate the efficiency that the heat gi. In addition, the heat dissipation device is simple in structure and low in setting cost.

In some embodiments, as shown in fig. 2, the heat dissipation device further includes a heat dissipation fin 2, and the heat dissipation fin 2 is disposed on the heat dissipation end 13 of the heat dissipation member 1. The heat dissipation fins 2 are arranged at the heat dissipation end 13, so that interference between other components close to the attachment end 12 can be avoided, the heat dissipation efficiency can be effectively improved, and the heat dissipation area can be increased.

In some embodiments, as shown in fig. 2, the heat sink fin 2 includes a base plate 21 and a plurality of heat sinks 22 standing on the base plate 21, the base plate 21 being provided on the heat dissipating end 13.

It can be understood that the bottom plate 21 covers the heat dissipating end 13 of the heat dissipating member 1, and the cross-sectional area of the bottom plate 21 is larger than that of the heat dissipating end 13, so that the heat at the heat dissipating end 13 can be rapidly transferred to the heat dissipating fins 2. The heat dissipation channels are formed among the heat dissipation fins 22, and the intervals between the heat dissipation fins 22 can be the same, so that heat can be dissipated quickly and uniformly.

In some embodiments, the heat dissipation device is used for dissipating heat of a chip 3 of an electronic device, and the shape of the side surface of the heat dissipation member 1 is adapted to the shape and the arrangement position of components arranged around the chip 3.

It can be understood that, the structural size of the chip 3 of the electronic device is smaller than that of the components around the chip, the attaching end 12 of the heat sink 1 in the inverted cone shape can attach to the chip 3, and the shape of the heat sink 1 is as close as possible to the components around the chip 3, but does not interfere with the components, so as to increase the heat dissipation area and increase the heat dissipation efficiency.

In some embodiments, the heat dissipation blocks 11 are plate-shaped, and the plate surfaces of adjacent heat dissipation blocks 11 are attached to each other. The heat dissipation plates can be connected by means of adhesive bonding. In addition, the number of the plate-shaped heat radiation blocks 11 may be adaptively increased according to a use scene of the heat radiation device.

In some embodiments, as shown in fig. 1, the cross section of the heat dissipation block 11 is rectangular, and the length and width of the cross section of the heat dissipation blocks 11 gradually increase along the direction from the fitting end 12 to the heat dissipation end 13, so that the heat generated by the device to be dissipated can be uniformly dissipated through the heat dissipation member 1.

In some embodiments, the cross-section of the heat dissipation block 11 is circular, and the diameter of the cross-section of the plurality of heat dissipation blocks 11 gradually increases along the direction from the fitting end 12 to the heat dissipation end 13.

In some embodiments, the heat sink 1 and the heat sink fins 2 are connected by welding; or the heat dissipation member 1 and the heat dissipation fins 2 are connected by gluing. The welding and adhesive bonding mode is stable, and stability of the heat dissipation device is facilitated.

In some embodiments, the heat dissipation block 11 is made of an aluminum alloy material; and/or the radiator fins 2 are made of aluminum alloy materials. The aluminum alloy has good heat-conducting property, is beneficial to heat conduction, and rapidly distributes heat.

The embodiment of the utility model provides an electronic equipment is still provided, as shown in fig. 3, electronic equipment includes chip 3 and foretell heat abstractor, and heat abstractor is used for dispelling the heat for chip 3. Through heat abstractor's the radiating piece 1 that the back taper was laid, can transmit the produced heat of heat abstractor to its heat dissipation end 13 through the laminating end 12 of radiating piece 1, the realization is treated the produced heat of heat abstractor and can be distributed away fast, and the cross sectional area of above-mentioned laminating end 12 is less than heat dissipation end 13, be favorable to using this radiating piece 1 under the limited scene in space, for example, for the chip 3 heat dissipation of small-size structure, above-mentioned heat abstractor's occupation space can avoid with the condition of treating the components and parts interference around the heat abstractor promptly, and the heat is transmitted to heat dissipation end 13 by laminating end 12, can accelerate the efficiency that the heat distributes. In addition, the heat dissipation device is simple in structure and low in setting cost.

It can be understood that a fan module may be disposed in the electronic device, the fan module is disposed near the heat dissipation device, and the air outlet of the fan module may be disposed toward the heat dissipation end 13 of the heat dissipation member 1, so as to possibly cool the heat dissipation member 1, thereby increasing the heat dissipation efficiency of the heat dissipation end 13.

Moreover, although exemplary embodiments have been described herein, the scope thereof includes any and all embodiments based on the present invention with equivalent elements, modifications, omissions, combinations (e.g., of various embodiments across), adaptations or variations. The elements of the claims are to be interpreted broadly based on the language employed in the claims and not limited to examples described in the present specification or during the prosecution of the application, which examples are to be construed as non-exclusive. It is intended, therefore, that the specification and examples be considered as exemplary only, with a true scope and spirit being indicated by the following claims and their full scope of equivalents.

The above description is intended to be illustrative and not restrictive. For example, the above-described examples (or one or more versions thereof) may be used in combination with each other. For example, other embodiments may be used by those of ordinary skill in the art upon reading the above description. Additionally, in the foregoing detailed description, various features may be grouped together to streamline the disclosure. This should not be interpreted as an intention that a disclosed feature not claimed is essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the detailed description as examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that these embodiments may be combined with each other in various combinations or permutations. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

The above embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and the protection scope of the present invention is defined by the claims. Various modifications and equivalents of the invention can be made by those skilled in the art within the spirit and scope of the invention, and such modifications and equivalents should also be considered as falling within the scope of the invention.

Claims

1. A heat dissipating device, comprising:

2. The heat dissipating device of claim 1, further comprising heat dissipating fins disposed on the heat dissipating end of the heat dissipating member.

3. The heat dissipating device of claim 2, wherein said heat dissipating fins comprise a base plate and a plurality of heat dissipating fins juxtaposed on said base plate, said base plate being disposed on said heat dissipating end.

4. The heat dissipation device of claim 1, wherein the heat dissipation device is used for dissipating heat of a chip of an electronic device, and a shape of a side surface of the heat dissipation member is adapted to an outer shape and an arrangement position of a component arranged around the chip.

5. The heat dissipating device of claim 1, wherein the heat dissipating blocks are plate-shaped, and plate surfaces of adjacent heat dissipating blocks are attached to each other.

6. The heat dissipating device of claim 5, wherein the cross section of the heat dissipating block is rectangular, and the length and width of the cross section of the heat dissipating blocks gradually increase along the direction from the fitting end to the heat dissipating end.

7. The heat dissipating device of claim 5, wherein the cross section of the heat dissipating block is circular, and the diameter of the cross section of the heat dissipating blocks increases gradually along the direction from the fitting end to the heat dissipating end.

8. The heat dissipating device of claim 2, wherein the heat dissipating member is connected to the heat dissipating fins by welding; or

9. The heat dissipating device of claim 2, wherein the heat dissipating block is made of an aluminum alloy material; and/or

The radiating fins are made of aluminum alloy materials.

10. An electronic device comprising a chip, and the heat dissipation device of any of claims 1-9, wherein the heat dissipation device is configured to dissipate heat from the chip.