CN210117426U - Continuous electrolysis equipment for reducing copper sulfate concentration in plating solution - Google Patents
Continuous electrolysis equipment for reducing copper sulfate concentration in plating solution Download PDFInfo
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- CN210117426U CN210117426U CN201920892192.XU CN201920892192U CN210117426U CN 210117426 U CN210117426 U CN 210117426U CN 201920892192 U CN201920892192 U CN 201920892192U CN 210117426 U CN210117426 U CN 210117426U
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Abstract
The utility model relates to a continuous electrolysis equipment for reducing copper sulfate concentration in plating bath belongs to electrolysis treatment facility technical field. The copper sulfate electroplating bath device comprises an electrolytic bath containing copper sulfate electroplating solution, wherein a lead plate and a copper plate are immersed in the copper sulfate electroplating solution, the lead plate is connected with the positive electrode of a high-frequency rectifier, the copper plate is connected with the negative electrode of the high-frequency rectifier, an overflow port is formed in the side wall of the electrolytic bath, one end of a first circulation pipeline is installed at the overflow port, the other end of the first circulation pipeline extends into a liquid storage tank, a second circulation pipeline used for conveying the electroplating solution in the liquid storage tank into the electrolytic bath is installed on the liquid storage tank, and a third circulation pipeline used for conveying the electroplating solution in the liquid storage. The utility model discloses can realize that plating bath is handled and not stop production, electroplate and go on simultaneously with the electrolysis, make full use of electrolysis result reduces the concentration of copper sulfate solution in the plating bath to reduce workman intensity of labour, reduce the manufacturing cost of enterprise.
Description
Technical Field
The utility model relates to a continuous electrolytic treatment's equipment for reducing copper sulfate concentration in plating bath belongs to electrolytic treatment equipment technical field.
Background
The iron wire continuous copper plating process adopts a copper sulfate natural color electroplating solution process, and the ratio of the anode to the cathode usually exceeds 2: 1, when producing high-conductivity copper clad steel wires, the current density can reach more than 6A/dm, therefore, the dissolving speed of the anode copper plate is faster than the speed of the divalent copper ions in the plating solution to be precipitated at the cathode, thus, the divalent copper in the plating solution gradually rises along with the increase of the production time, namely, the concentration of the copper sulfate solution rises, the dispersing capacity of the plating solution is reduced, the plating layer is coarse in crystallization, and defects such as peeling are easy to occur.
In order to solve the problem of the concentration increase of the copper sulfate solution, at present, part of the plating solution is generally extracted from a plating solution tank to be diluted to reduce the concentration of the copper sulfate solution, production stop treatment is needed during the dilution treatment, and the treatment process can cause the problems of production cost improvement, low production efficiency, labor intensity increase of workers and the like.
Accordingly, there is a need for a continuous electrolysis apparatus for reducing the copper sulfate concentration in a bath that overcomes the above problems.
Disclosure of Invention
An object of the utility model is to solve the weak point that above-mentioned prior art exists, provide a continuous electrolysis equipment for reducing copper sulfate concentration in plating bath, this equipment can realize that the plating bath is handled and is not stopped production, electroplates and goes on simultaneously with the electrolysis, and make full use of electrolysis result reduces the concentration of copper sulfate solution in the plating bath to reduce workman intensity of labour, reduce the manufacturing cost of enterprise.
A continuous electrolysis device for reducing the concentration of copper sulfate in a plating solution is characterized by comprising an electrolytic tank 1 containing a copper sulfate plating solution, wherein a lead plate 2 and a copper plate 3 are immersed in the copper sulfate plating solution, the lead plate 2 is connected with the positive electrode of a high-frequency rectifier 4, the copper plate 3 is connected with the negative electrode of the high-frequency rectifier 4, the output current of the high-frequency rectifier 4 is 2-3A, an overflow port 5 is formed in the side wall of the electrolytic tank 1, one end of a first circulation pipeline 6 is installed at the overflow port 5, the other end of the first circulation pipeline extends into a liquid storage tank 7, a second circulation pipeline 8 for conveying the plating solution in the liquid storage tank 7 into the electrolytic tank 1 is installed on the liquid storage tank 7, and a third circulation pipeline 10 for conveying the plating solution in the liquid storage tank 7 into a plating tank 9;
preferably, the number of the copper plates 3 is two, and the two copper plates 3 are arranged on two sides of the lead plate 2;
preferably, the longitudinal section of the lead plate 2 is in a wave shape or a sawtooth shape;
preferably, the output current of the high-frequency rectifier 4 is 2-3A;
preferably, a first corrosion-resistant circulating pump 11 is installed on the second circulating pipeline 8, and a second corrosion-resistant pump 16 is installed on the third circulating pipeline 10;
preferably, one end of the second circulating pipeline 8 is communicated with the liquid storage tank 7, the other end of the second circulating pipeline extends into the electrolytic tank 1, one end of the second circulating pipeline extending into the electrolytic tank 1 is in a straight line shape and is positioned at the bottom of the electrolytic tank 1, and a plurality of liquid outlet holes 17 are formed in the length direction of the straight line-shaped structure;
preferably, the liquid outlet holes 17 are distributed on the upper surface and the left and right sides of the second circulating pipeline 8;
preferably, the end of the second circulation pipeline 8 extending into the electrolytic cell 1 is 15 cm away from the bottom of the electrolytic cell 1;
preferably, the anode of the high-frequency rectifier 4 is connected with a first copper rod 12, the cathode of the high-frequency rectifier is connected with a second copper rod 13, copper hooks 14 are respectively installed at the tops of the lead plate 2 and the copper plate 3, the copper hooks 14 of the lead plate 2 are hung on the first copper rod 12, and the copper hooks 14 of the copper plate 3 are hung on the second copper rod 13;
preferably, a horizontal support plate 15 is arranged at the notch of the liquid storage tank 7, two through openings are formed in the support plate 15 and are respectively used for passing through the second circulation pipeline 8 and the third circulation pipeline 10, and the first corrosion-resistant circulation pump 11 and the second corrosion-resistant circulation pump 16 are placed on the support plate 15;
preferably, the electrolytic tank 1, the liquid storage tank 7 and the electroplating tank 9 are all made of PP materials.
The utility model discloses a continuous electrolysis equipment structural design for reducing copper sulfate concentration in plating bath is ingenious, adopts the principle method contrary with electroplating process, carries out undercurrent's electrolytic treatment to high concentration copper sulfate plating bath in the electrolysis trough, adopts the stereotype to do the positive pole promptly, adopts the copper to do the negative pole, leads to 2-3A's undercurrent. Oxygen is generated by electrolysis near the anode, so that the concentration of acid ions in the copper sulfate plating solution is gradually increased; on the cathode copper plate, divalent copper ions are separated out in the form of elemental copper, so that the acidity of the plating solution is gradually improved through continuous electrolytic treatment, the supplement amount of sulfuric acid is reduced, the concentration of the copper sulfate plating solution in the electrolytic bath is reduced, the copper sulfate plating solution is pumped into the liquid storage tank through the first circulating pipeline and then is pumped into the electroplating bath through the liquid storage tank, the concentration of the copper sulfate plating solution in the electroplating bath is reduced, production stop treatment is not needed in the whole process, meanwhile, excessive copper ions in the plating solution can be deposited on the cathode in the form of elemental copper through electrolytic treatment, and the copper plate on which copper is deposited can be recycled repeatedly and used as supplement of an electroplating copper anode.
The utility model has the advantages as follows:
1. the plating solution can be treated without stopping continuously, and can be used for independent electrolysis after the plating bath stops working, so that the operation is flexible and convenient;
2. copper sulfate is effectively consumed, and the generated sulfuric acid and copper are raw materials which need to be supplemented and added every day, so that the process effectiveness is ensured, and the labor force and the fund are saved;
3. in order to improve the efficiency of electrolytic treatment, a plurality of groups of electrolytic plates can be continuously adopted to carry out electrolytic treatment simultaneously in the daily electroplating process, and the aim of balancing the concentration of copper sulfate in the plating solution can be basically achieved.
Drawings
FIG. 1: the utility model relates to a structure schematic diagram of continuous electrolysis equipment for reducing the concentration of copper sulfate in plating solution;
FIG. 2: the first copper bar, the second copper bar, the high-frequency rectifier, the lead plate and the copper plate are matched;
FIG. 3: a cross-sectional view of the liquid outlet hole.
In the figure: 1. An electrolytic cell; 2. A lead plate; 3. A copper plate; 4. A high frequency rectifier; 5. an overflow port; 6. a first circulation line; 7. a liquid storage tank; 8. a second circulation line; 9. an electroplating bath; 10. a third circulation line; 11. a first corrosion-resistant circulating pump; 12. a first copper bar; 13. a second copper bar; 14. a copper hook; 15. a support plate; 16. a second corrosion resistant pump; 17. and a liquid outlet hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the utility model provides a continuous electrolysis equipment for reducing copper sulfate concentration in plating bath, including the electrolysis trough 1 that contains the copper sulfate plating bath, the copper sulfate plating bath is soaked with stereotype 2, copper 3, stereotype 2 is connected with the positive pole of high frequency rectifier 4, copper 3 is connected with the negative pole of high frequency rectifier 4, seted up overflow mouth 5 on the electrolysis trough 1 lateral wall, first circulation pipeline 6 one end is installed in overflow mouth 5, the other end extends to in reservoir 7, install on reservoir 7 and be used for carrying the plating bath in reservoir 7 to the second circulation pipeline 8 in electrolysis trough 1, still install on reservoir 7 and be used for carrying the plating bath in reservoir 7 to the third circulation pipeline 10 in the plating bath 9, electrolysis trough 1, reservoir 7, plating bath 9 are made by the PP material;
in order to improve the electrolysis speed, the number of the copper plates 3 is two, and the two copper plates 3 are arranged on two sides of the lead plate 2;
in order to further improve the electrolysis speed, the longitudinal section of the lead plate 2 is in a wave shape or a sawtooth shape;
in order to pump the plating solution quickly and have longer service life, a first corrosion-resistant circulating pump 11 is arranged on the second circulating pipeline 8, and a second corrosion-resistant pump 16 is arranged on the third circulating pipeline 10;
in order to carry out ion exchange maximally, one end of the second circulating pipeline 8 is communicated with the liquid storage tank 7, the other end of the second circulating pipeline extends into the electrolytic tank 1, one end extending into the electrolytic tank 1 is in a straight shape and is positioned at the bottom of the electrolytic tank 1, a plurality of liquid outlet holes 17 are formed along the length direction of the straight-line-shaped structure, and the liquid outlet holes 17 are distributed on the upper surface, the left side and the right side of the second circulating pipeline 8;
in order to prevent impurities at the bottom of the electrolytic cell 1 from floating upwards, one end of the second circulating pipeline 8, which extends into the electrolytic cell 1, is 15 cm away from the bottom of the electrolytic cell 1;
because the weight of the lead plate 2 and the copper plate 3 is heavier and needs to be hung, the anode of the high-frequency rectifier 4 is connected with a first copper rod 12, the cathode of the high-frequency rectifier is connected with a second copper rod 13, the first copper rod 12 and the second copper rod 13 are placed at the notch of the electrolytic cell 1, copper hooks 14 are respectively installed at the tops of the lead plate 2 and the copper plate 3, the copper hook 14 of the lead plate 2 is hung on the first copper rod 12, and the copper hook 14 of the copper plate 3 is hung on the second copper rod 13;
a horizontal support plate 15 is arranged at the notch of the liquid storage tank 7, two through openings are formed in the support plate 15 and are respectively used for passing through the second circulating pipeline 8 and the third circulating pipeline 10, and the first corrosion-resistant circulating pump 11 and the second corrosion-resistant circulating pump 16 are placed on the support plate 15.
And (3) electroplating process: the cathode provides electrons, the anode (copper plate) loses electrons to form copper ions, the copper ions generated on the anode are positively charged, the cathode (iron wire) is a place where the electrons are gathered, the electrons show negative charges, the same polarity attract each other, the positively charged copper ions move towards the cathode, and the electrons are attached to the surface of the cathode after being obtained, so that a copper simple substance is formed, and the process of plating copper by the iron wire is also completed.
An electrolysis process: the anode (lead plate) is used as an inert electrode, and cannot lose electrons, so that substances around the anode cannot lose electrons, and positive ions such as copper ions and hydrogen ions in sulfuric acid cannot lose electrons, so that only water can lose electrons, the chemical formula of the water is H-OH, hydrogen and hydroxide radicals are connected through hydrogen bonds, when the electrons need to be lost, the hydrogen bonds are opened, the hydrogen ions are released, and meanwhile, the hydroxide radicals lose the electrons to form oxygen; a large amount of electrons are gathered on the cathode (copper plate), and copper ions in the electrolyte are discharged in preference to hydrogen ions due to high electrode potential, so that the copper ions are deposited on the cathode copper plate after obtaining cathode electrons, and a large amount of hydrogen ions are generated near the anode of the electrolytic cell to form sulfuric acid; and elemental copper is continuously deposited on the cathode of the electrolytic cell.
The final purpose of the electrolysis is to deposit copper sulfate in the electrolyte on the surface of the cathode copper plate in a pure copper form, so that the copper sulfate can be reused in an anode copper plate of a copper plating process, in addition, sulfuric acid can be generated in the electrolyte, and the copper sulfate can also be reused in a plating solution for copper plating, thereby reducing the concentration of copper sulfate in the plating solution.
The invention adopts a principle method which is opposite to an electroplating process, and carries out low-current electrolytic treatment on high-concentration copper sulfate plating solution in an electrolytic bath, namely, a lead plate is used as an anode, a copper plate is used as a cathode, and 2-3A of low current is applied. Oxygen is generated by electrolysis near the anode, so that the concentration of acid ions in the copper sulfate plating solution is gradually increased; on the cathode copper plate, divalent copper ions are separated out in the form of elemental copper, so that the acidity of the plating solution is gradually improved through continuous electrolytic treatment, the supplement amount of sulfuric acid is reduced, the concentration of the copper sulfate plating solution in the electrolytic bath is reduced, the copper sulfate plating solution is pumped into the liquid storage tank through the first circulating pipeline and then is pumped into the electroplating bath through the liquid storage tank, the concentration of the copper sulfate plating solution in the electroplating bath is reduced, production stop treatment is not needed in the whole process, meanwhile, excessive copper ions in the plating solution can be deposited on the cathode in the form of elemental copper through electrolytic treatment, and the copper plate on which copper is deposited can be recycled repeatedly and used as supplement of an electroplating copper anode.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The continuous electrolysis equipment for reducing the concentration of copper sulfate in a plating solution is characterized by comprising an electrolytic tank (1) containing a copper sulfate plating solution, wherein a lead plate (2) and a copper plate (3) are immersed in the copper sulfate plating solution, the lead plate (2) is connected with the positive electrode of a high-frequency rectifier (4), the copper plate (3) is connected with the negative electrode of the high-frequency rectifier (4), an overflow port (5) is formed in the side wall of the electrolytic tank (1), one end of a first circulation pipeline (6) is installed at the overflow port (5), the other end of the first circulation pipeline extends into a liquid storage tank (7), a second circulation pipeline (8) used for conveying the plating solution in the liquid storage tank (7) into the electrolytic tank (1) is installed on the liquid storage tank (7), and a third circulation pipeline (10) used for conveying the plating solution in the liquid storage tank (7) into a plating tank (9) is also installed.
2. A continuous electrolytic installation for reducing the copper sulphate concentration in a bath according to claim 1 characterised in that the number of copper plates (3) is two, two copper plates (3) being arranged on either side of the lead plate (2).
3. A continuous electrolytic plant for reducing the copper sulphate concentration in a bath according to claim 1 characterised in that the longitudinal section of said lead plate (2) is undulated or serrated.
4. A continuous electrolytic apparatus for reducing the concentration of copper sulfate in a bath according to claim 1, characterized in that the output current density of said high frequency rectifier (4) is 0.5-1A/dm.
5. A continuous electrolytic plant for reducing the copper sulphate concentration in a bath according to claim 1 characterised in that a first corrosion resistant circulation pump (11) is provided in the second circulation line (8) and a second corrosion resistant circulation pump (16) is provided in the third circulation line (10).
6. A continuous electrolytic apparatus for reducing the concentration of copper sulfate in a plating bath according to claim 5, characterized in that one end of the second circulation line (8) is connected to the reservoir (7) and the other end extends into the electrolytic cell (1), the end extending into the electrolytic cell (1) is in a straight line shape and is positioned at the bottom of the electrolytic cell (1), and a plurality of liquid outlet holes (17) are formed along the length direction of the straight line shape.
7. A continuous electrolytic apparatus for reducing the concentration of copper sulfate in a bath according to claim 6, characterized in that said exit openings (17) are arranged on the upper surface and on the left and right sides of the second circulation line (8).
8. A continuous electrolytic installation for reducing the copper sulphate concentration in a bath according to claim 6 characterised in that the second recycle line (8) extends into the electrolytic cell (1) at a distance of 15 cm from the bottom of the electrolytic cell (1).
9. The continuous electrolysis equipment for reducing the concentration of copper sulfate in the plating solution according to claim 1, characterized in that the positive electrode of the high-frequency rectifier (4) is connected with a first copper rod (12), the negative electrode is connected with a second copper rod (13), copper hooks (14) are respectively installed at the top of the lead plate (2) and the copper plate (3), the copper hooks (14) of the lead plate (2) are hung on the first copper rod (12), and the copper hooks (14) of the copper plate (3) are hung on the second copper rod (13).
10. The continuous electrolysis equipment for reducing the concentration of copper sulfate in the plating solution according to claim 5, characterized in that a horizontal support plate (15) is arranged at the notch of the liquid storage tank (7), two through ports are arranged on the support plate (15) and are respectively used for passing through the second circulation pipeline (8) and the third circulation pipeline (10), and the first corrosion-resistant circulation pump (11) and the second corrosion-resistant circulation pump (16) are arranged on the support plate (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920892192.XU CN210117426U (en) | 2019-06-14 | 2019-06-14 | Continuous electrolysis equipment for reducing copper sulfate concentration in plating solution |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920892192.XU CN210117426U (en) | 2019-06-14 | 2019-06-14 | Continuous electrolysis equipment for reducing copper sulfate concentration in plating solution |
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| CN210117426U true CN210117426U (en) | 2020-02-28 |
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| CN201920892192.XU Expired - Fee Related CN210117426U (en) | 2019-06-14 | 2019-06-14 | Continuous electrolysis equipment for reducing copper sulfate concentration in plating solution |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113122895A (en) * | 2021-03-19 | 2021-07-16 | 同济大学 | Method for regulating and controlling electrochemical induced mineral deposition rate by parallel connection of cathodes |
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2019
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113122895A (en) * | 2021-03-19 | 2021-07-16 | 同济大学 | Method for regulating and controlling electrochemical induced mineral deposition rate by parallel connection of cathodes |
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