CN213660364U - Solid crystal feeding and discharging mechanism - Google Patents
Solid crystal feeding and discharging mechanism Download PDFInfo
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- CN213660364U CN213660364U CN202022299137.5U CN202022299137U CN213660364U CN 213660364 U CN213660364 U CN 213660364U CN 202022299137 U CN202022299137 U CN 202022299137U CN 213660364 U CN213660364 U CN 213660364U
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- jig
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Abstract
The utility model discloses a go up unloading mechanism admittedly brilliant, include: the fixture clamping mechanism is arranged in the fixture loading area and used for loading fixtures; a loaded jig clamping mechanism arranged in the jig loaded area; a wafer loading mechanism and an X-axis moving platform arranged in the wafer loading area; the vacuum suction nozzle mounting platform is arranged on the Z-axis moving platform; the vacuum suction nozzle mounting platform is provided with two groups of vacuum suction nozzles at intervals, wherein the first group of vacuum suction nozzles are used for sucking the jig to be filled in the jig area to be filled and transferring the jig to the jig supporting plate of the wafer filling area, and the second vacuum suction nozzle is used for sucking the filled jig on the jig supporting plate of the wafer filling area and transferring the filled jig to the filled jig clamping mechanism of the jig filling area.
Description
Technical Field
The utility model relates to a transistor packaging equipment technical field, in particular to unloading mechanism on solid crystal.
Background
At present, in the process of packaging a transistor, a jig provided with pins needs to be manually moved from a to-be-loaded area of the jig to a wafer loading area to load a wafer onto the pins, and the jig provided with the loaded wafer is manually moved from the wafer loading area to the loaded area after the wafer is loaded.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that to current transistor packaging in-process, the tool that is equipped with the pin needs the manual work to move the above-mentioned problem that exists and provide the solid brilliant unloading mechanism of going up of an automatic transport tool to improve productivity.
The utility model discloses the technical problem that will solve can realize through following technical scheme:
a solid crystal feeding and discharging mechanism comprises:
the jig to be loaded area is provided with a jig clamping mechanism to be loaded, and the jig to be loaded clamping mechanism is used for stacking the jigs to be loaded;
the jig loading area is provided with a loaded jig clamping mechanism which is used for stacking the loaded jigs; the filled jig clamping mechanism and the jig clamping mechanism to be filled are arranged in parallel along the Y-axis direction;
the wafer loading area is provided with a wafer loading mechanism and an X-axis moving platform, the X-axis moving platform is provided with a jig supporting plate which is driven by the X-axis moving platform to move back and forth between a wafer loading station and a wafer loaded station, and the jig supporting plate is provided with a jig clamping mechanism for clamping a jig;
a Y-axis moving platform arranged in parallel along the Y-axis direction;
the Z-axis moving platform is arranged on the Y-axis moving platform and driven by the Y-axis moving platform to reciprocate along the Y-axis direction;
the vacuum suction nozzle mounting platform is mounted on the Z-axis moving platform and driven by the Z-axis moving platform to move up and down along the Z-axis direction;
the vacuum suction nozzle mounting platform is provided with at least a first group of vacuum suction nozzles and at least a second group of vacuum suction nozzles at intervals, wherein the first group of vacuum suction nozzles are used for sucking the jig to be filled in the jig area to be filled and transferring the jig to the jig supporting plate of the wafer filling area, and the second vacuum suction nozzles are used for sucking the filled jig on the jig supporting plate of the wafer filling area and transferring the filled jig to the filled jig clamping mechanism of the jig filling area.
In a preferred embodiment of the present invention, the loaded jig clamping mechanism and the to-be-loaded jig clamping mechanism are both cylinder clamping mechanisms, so as to adapt to jigs with different sizes.
In a preferred embodiment of the present invention, the jig clamping mechanism is a cylinder clamping mechanism, so that the jig clamping mechanism can adapt to jigs with different sizes.
Owing to adopted above-mentioned technical scheme, the utility model discloses can realize the full automatic movement of tool, need not manual operation, improve production efficiency, also can not lead to the wafer to shift simultaneously.
Drawings
Fig. 1 is a top view of the feeding and discharging mechanism for die bonding of the present invention.
Fig. 2 is a front view of the solid crystal feeding and discharging mechanism of the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings and the detailed description.
Referring to fig. 1 and 2, the die bonding loading and unloading mechanism shown in the figures comprises a jig to-be-loaded area 100, a jig loaded area 200 and a wafer loading area 300.
A jig to be loaded clamping mechanism 110 is arranged in the jig to be loaded area 100, and the jig to be loaded clamping mechanism 110 is used for stacking jigs 120 to be loaded; the fixture 110 to be filled is a cylinder fixture, and the size of the fixture 110 to be filled can be adjusted by the cylinder 130 in the cylinder fixture to adapt to fixtures with different sizes.
A loaded jig holding mechanism 210 is provided in the jig loaded area 200, the loaded jig holding mechanism 210 being configured to stack the loaded jigs 220; the filled jig clamping mechanism 210 is also an air cylinder clamping mechanism, and the size of the filled jig clamping mechanism 210 can be adjusted through the air cylinder 230 in the air cylinder clamping mechanism so as to adapt to jigs with different sizes.
In the actual operation process, the filled jig clamping mechanism 210 and the jig clamping mechanism 110 to be filled are longitudinally arranged in parallel along the Y-axis direction, so that the operation is convenient.
The wafer loading area 300 is located at one end of the jig loading area 100 and the jig loading area 200, and is arranged laterally in the X-axis direction.
A wafer loading mechanism (not shown) and an X-axis moving platform 310 are arranged in the wafer loading area 300, a jig supporting plate 340 driven by the X-axis moving platform 310 to move back and forth between the wafer loading station 320 and the wafer loaded station 330 is arranged on the X-axis moving platform 310, and a jig clamping mechanism 350 is arranged on the jig supporting plate 340 for clamping a jig; the jig clamping mechanism 350 is also an air cylinder clamping mechanism, and the size of the jig clamping mechanism 350 can be adjusted through an air cylinder 351 in the air cylinder clamping mechanism so as to adapt to jigs with different sizes.
The utility model also comprises a Y-axis moving platform 400 which is arranged in parallel along the Y-axis direction, and a Z-axis moving platform 500 which is driven by the Y-axis moving platform 400 to reciprocate along the Y-axis direction is arranged on the Y-axis moving platform 400; the Z-axis moving platform 500 is provided with a vacuum nozzle mounting platform 600 driven by the Z-axis moving platform 500 to move up and down in the Z-axis direction.
At least a first group of vacuum nozzles 610 and at least a second group of vacuum nozzles 620 are installed at intervals in the X-axis direction on the vacuum nozzle mounting platform 600. The number and positions of the first group of vacuum nozzles 610 and the second group of vacuum nozzles 620 may be set according to the specification of the jig.
The working principle of the utility model is as follows:
first, the jig 120 to be loaded with pins is stacked in the jig clamping mechanism 110.
Then, the Y-axis moving platform 400 is started, and the Z-axis moving platform 500 is driven by the Y-axis moving platform 400 to move to the positions of the jig to-be-filled area 100 and the jig filled area 200.
Then, the Z-axis moving platform 500 is started to drive the vacuum nozzle mounting platform 600 to move downwards, so that the first group of vacuum nozzles 610 on the vacuum nozzle mounting platform 600 suck one to-be-filled jig 120 in the to-be-filled jig clamping mechanism 110.
Then, the Z-axis moving platform 500 is activated to drive the vacuum nozzle mounting platform 600 to move up to a prescribed position.
The X-axis motion stage 310 is then activated to drive the tool pallet 340 to the wafer loading station 320.
Then, the Y-axis moving platform 400 is started, the Z-axis moving platform 500 is driven by the Y-axis moving platform 400 to move to the wafer loading area 300, and one to-be-loaded fixture 120 sucked by the first group of vacuum nozzles 610 is positioned above the fixture supporting plate 340 of the wafer loading station 320. Then, the first set of vacuum nozzles 610 is vented to lose vacuum, and the jig 120 to be filled is dropped onto the jig pallet 340. Then, the air cylinder 361 of the air cylinder clamping mechanism is started to clamp the jig 120 to be loaded on the jig supporting plate 340 for loading the wafer.
After the wafer loading is completed, the X-axis moving platform 310 is started to drive the tool support plate 340 to move to the wafer loaded station 330 with the easy-loading tool 220.
Then, the Y-axis moving platform 400 is started, the Z-axis moving platform 500 is driven by the Y-axis moving platform 400 to move to the wafer loading area 300, and then the Z-axis moving platform 500 is started to drive the vacuum nozzle mounting platform 600 to move downward, so that the second group of vacuum nozzles 620 on the vacuum nozzle mounting platform 600 suck the easy-loading jigs 220 on the jig pallet 340 in the wafer loading station 330.
Then, the Z-axis moving platform 500 is activated to drive the vacuum nozzle mounting platform 600 to move up to a prescribed position.
Then, the Y-axis moving platform 400 is started, the Z-axis moving platform 500 is driven by the Y-axis moving platform 400 to move to the positions of the jig to-be-filled area 100 and the jig filled area 200, and one filled jig 220 sucked by the second group of vacuum suction nozzles 620 is located above the jig filled area 200. The second set of vacuum nozzles 620 is then de-vacuumized to drop the loaded fixture 220 onto the loaded fixture clamping mechanism 210. Meanwhile, the first group of vacuum nozzles 610 on the vacuum nozzle mounting platform 600 sucks another jig 120 to be filled in the jig clamping mechanism 110 to be filled, and the steps are repeated.
Claims (3)
1. The utility model provides a solid crystal goes up unloading mechanism which characterized in that includes:
the jig to be loaded area is provided with a jig clamping mechanism to be loaded, and the jig to be loaded clamping mechanism is used for stacking the jigs to be loaded;
the jig loading area is provided with a loaded jig clamping mechanism which is used for stacking the loaded jigs; the filled jig clamping mechanism and the jig clamping mechanism to be filled are arranged in parallel along the Y-axis direction;
the wafer loading area is provided with a wafer loading mechanism and an X-axis moving platform, the X-axis moving platform is provided with a jig supporting plate which is driven by the X-axis moving platform to move back and forth between a wafer loading station and a wafer loaded station, and the jig supporting plate is provided with a jig clamping mechanism for clamping a jig;
a Y-axis moving platform arranged in parallel along the Y-axis direction;
the Z-axis moving platform is arranged on the Y-axis moving platform and driven by the Y-axis moving platform to reciprocate along the Y-axis direction;
the vacuum suction nozzle mounting platform is mounted on the Z-axis moving platform and driven by the Z-axis moving platform to move up and down along the Z-axis direction;
the vacuum suction nozzle mounting platform is provided with at least a first group of vacuum suction nozzles and at least a second group of vacuum suction nozzles at intervals, wherein the first group of vacuum suction nozzles are used for sucking the jig to be filled in the jig area to be filled and transferring the jig to the jig supporting plate of the wafer filling area, and the second vacuum suction nozzles are used for sucking the filled jig on the jig supporting plate of the wafer filling area and transferring the filled jig to the filled jig clamping mechanism of the jig filling area.
2. The die bonding loading and unloading mechanism of claim 1, wherein the loaded jig clamping mechanism and the to-be-loaded jig clamping mechanism are both cylinder clamping mechanisms.
3. The die bonding loading and unloading mechanism of claim 1, wherein the jig clamping mechanism is a cylinder clamping mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022299137.5U CN213660364U (en) | 2020-10-15 | 2020-10-15 | Solid crystal feeding and discharging mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022299137.5U CN213660364U (en) | 2020-10-15 | 2020-10-15 | Solid crystal feeding and discharging mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213660364U true CN213660364U (en) | 2021-07-09 |
Family
ID=76701757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022299137.5U Active CN213660364U (en) | 2020-10-15 | 2020-10-15 | Solid crystal feeding and discharging mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213660364U (en) |
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2020
- 2020-10-15 CN CN202022299137.5U patent/CN213660364U/en active Active
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