CN213585201U

CN213585201U - High temperature resistant charging substrate

Info

Publication number: CN213585201U
Application number: CN202022203553.0U
Authority: CN
Inventors: 李开龙
Original assignee: Dongguan Zhiyuan Intelligent Technology Co ltd
Current assignee: Dongguan Zhiyuan Intelligent Technology Co ltd
Priority date: 2020-09-30
Filing date: 2020-09-30
Publication date: 2021-06-29
Anticipated expiration: 2030-09-30

Abstract

The utility model discloses a high temperature resistant charging substrate, including circuit layer, insulating layer and aluminium base course, be provided with at least one charging chip above the circuit layer, just be provided with the adhesive linkage below the charging chip, the laminating sets up the metal reflection of light conducting layer on the inner wall of adhesive linkage, just the metal reflection of light conducting layer with circuit layer adhesive connection, circuit layer lower surface passes through the fixed connection insulating layer that laminates of bonding mode, the insulating layer lower surface passes through the fixed connection aluminium basic unit that laminates of bonding mode. The utility model discloses a high temperature resistant charging substrate, high temperature resistant ability is strong, can prevent that charging substrate from burning out inside charging chip because high temperature, overheated at work.

Description

High temperature resistant charging substrate

Technical Field

The utility model relates to a base plate field, specificly a high temperature resistant charging substrate.

Background

The substrate is a metal-based copper-clad plate with good heat dissipation function, a common single-sided plate is composed of three layers, namely a circuit layer, an insulating layer and a metal base layer, and the substrate is designed into a double-layer structure for high-end use and is structurally composed of the circuit layer, the insulating layer, an aluminum base, the insulating layer and the circuit layer. At present, aluminum substrates are rapidly developed and improved, but have more defects, such as poor heat resistance and poor conductivity.

SUMMERY OF THE UTILITY MODEL

To the weak point that exists among the above-mentioned technique, the utility model provides a high temperature resistant charging substrate, electric conductive property is good, and heat-resisting ability is strong, high temperature resistant.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a high temperature resistant charging substrate, includes circuit layer, insulating layer and aluminium base layer, be provided with at least one charging chip above the circuit layer, just be provided with the adhesive linkage below the charging chip, the laminating sets up the metal reflection of light conducting layer on the inner wall of adhesive linkage, just the metal reflection of light conducting layer with circuit layer adhesive connection, circuit layer lower surface passes through the fixed laminating of bonding means and connects the insulating layer, the insulating layer lower surface passes through the fixed laminating of bonding means and connects aluminium base layer.

As a further description, a gap is formed at the joint of the charging chip and the adhesive layer, and a plurality of dielectric materials are filled in the gap, and the dielectric materials are glass fiber polymers.

As a further illustration, the insulating layer is made of a high temperature resistant, insulating material.

As further elaboration, the aluminum base layer is sequentially provided with a tin-lead alloy film, a copper plate layer and an aluminum alloy plate from top to bottom.

As a further illustration, the bottom of the aluminum base layer is provided with a sealing resin base.

As a further illustration, a substrate housing is fixedly disposed outside the circuit layer.

To sum up, the utility model discloses following beneficial effect has: the utility model discloses a high temperature resistant charging substrate can prevent through setting up the insulating layer that charging substrate burns out inside charging chip because high temperature, overheated at work to the insulating layer adopts high temperature resistant, insulating material to make, and high temperature resistant ability is strong, and insulating nature is strong.

Drawings

Fig. 1 is a schematic view of an external structure of a high temperature-resistant charging substrate according to the present invention;

FIG. 2 is a schematic diagram of the aluminum substrate structure of the present invention;

fig. 3 is a schematic view of the internal structure of a high temperature resistant charging substrate of the present invention;

fig. 4 is a schematic view of the internal structure of the space of the present invention.

FIG. 1-sealing resin base; 2-a base shell; 3-an aluminum base layer; 4-an insulating layer; 5-a circuit layer; 6-a metal reflective conductive layer; 7-an adhesive layer; 8-a dielectric material; 9-a charging chip; a 10-tin-lead alloy film; 11-a copper plate layer; 12-aluminum alloy plate; 13-voids.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in the following fig. 1, fig. 2, fig. 3 and fig. 4, a high temperature resistant charging substrate comprises a circuit layer 5, an insulating layer 4 and an aluminum base layer 3, at least one charging chip 9 is arranged above the circuit layer 5, an adhesive layer 7 is arranged below the charging chip 9, a metal reflective conductive layer 6 is arranged on the inner wall of the adhesive layer 7 in a laminating manner, the metal reflective conductive layer 6 is in adhesive connection with the circuit layer 5, the insulating layer 4 is fixedly attached to the lower surface of the circuit layer 5 in an adhesive manner, and the aluminum base layer 3 is fixedly attached to the lower surface of the insulating layer 4 in an adhesive manner.

In this embodiment, chip 9 charges is formed with space 13 with the bonding layer 7 junction, and the inside packing in space 13 has a plurality of dielectric materials 8, and dielectric material 8 is the glass fiber polymer, insulating layer 4 adopts high temperature resistant, insulating material to make, aluminium basic unit 3 is provided with tin-lead alloy film 10, copper sheet layer 11 and aluminium alloy plate 12 from the top down in proper order, bonding layer 7 adopts epoxy thermosetting material to make, the bottom of aluminium basic unit 3 is provided with sealing resin base 1, the fixed basic unit shell 2 that sets up in outside of circuit layer 5.

In this embodiment, the utility model discloses a chip 9 that charges has better thermal behavior and electric conductive property, and is small, simple structure, be provided with adhesive linkage 7 below the chip 9 that charges, adhesive linkage 7 can be in the same place chip 9 and the metal reflection of light conducting layer 6 of charging closely combine, can avoid the phenomenon that chip 9 that charges breaks away from or damages to appear, chip 9 that charges is formed with space 13 with adhesive linkage 7 combination department, and the inside packing in space 13 has a plurality of dielectric materials 8, and dielectric material 8 is the glass fiber polymer, and dielectric material 8 is favorable to electrically conducting.

In this embodiment, the insulating layer 4 is connected in the fixed laminating of circuit layer 5 lower surface through the bonding mode, insulating layer 4 adopts high temperature resistant, insulating material to make, and insulating layer 4 can play insulating, high temperature resistant effect, can avoid in the use because the high temperature leads to charging chip 9 to burn out.

In this embodiment, aluminium basic unit 3 is provided with tin-lead alloy film 10, copper sheet layer 11 and aluminium alloy plate 12 from the top down in proper order, aluminium basic unit 3's bottom is provided with sealing resin base 1, circuit layer 5's the fixed basic unit's shell 2 that sets up in outside, sealing resin base 1 and basic unit's shell 2 mainly play protection and supporting role.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A high temperature resistant charging substrate, its characterized in that: including circuit layer, insulating layer and aluminium base layer, be provided with at least one chip that charges above the circuit layer, just be provided with the adhesive linkage below the chip that charges, the laminating sets up the metal reflection of light conducting layer on the inner wall of adhesive linkage, just the metal reflection of light conducting layer with circuit layer adhesive connection, circuit layer lower surface passes through the fixed laminating of bonding mode and connects the insulating layer, the insulating layer lower surface passes through the fixed laminating of bonding mode and connects aluminium basic unit.

2. The charging substrate of claim 1, wherein: a gap is formed at the joint of the charging chip and the bonding layer, a plurality of dielectric materials are filled in the gap, and the dielectric materials are glass fiber polymers.

3. The charging substrate of claim 1, wherein: the insulating layer is made of high-temperature-resistant and insulating materials.

4. The charging substrate of claim 1, wherein: the aluminum base layer is sequentially provided with a tin-lead alloy film, a copper plate layer and an aluminum alloy plate from top to bottom.

5. The charging substrate of claim 1, wherein: and a sealing resin base is arranged at the bottom of the aluminum base layer.

6. The charging substrate of claim 1, wherein: and a base layer shell is fixedly arranged outside the circuit layer.