CN203707127U - COB packaging structure with low thermal resistance and high luminous efficiency - Google Patents
COB packaging structure with low thermal resistance and high luminous efficiency Download PDFInfo
- Publication number
- CN203707127U CN203707127U CN201420023257.4U CN201420023257U CN203707127U CN 203707127 U CN203707127 U CN 203707127U CN 201420023257 U CN201420023257 U CN 201420023257U CN 203707127 U CN203707127 U CN 203707127U
- Authority
- CN
- China
- Prior art keywords
- bowl cup
- aluminium base
- thermal resistance
- aluminum substrate
- low thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 30
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 235000012431 wafers Nutrition 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011889 copper foil Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims abstract description 9
- 239000004332 silver Substances 0.000 claims abstract description 9
- 238000005530 etching Methods 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000004411 aluminium Substances 0.000 claims description 24
- 238000005538 encapsulation Methods 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 7
- 230000004888 barrier function Effects 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 8
- 230000005855 radiation Effects 0.000 abstract description 6
- 238000000605 extraction Methods 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 abstract description 3
- 230000005619 thermoelectricity Effects 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract 3
- 238000007747 plating Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- VQLYBLABXAHUDN-UHFFFAOYSA-N bis(4-fluorophenyl)-methyl-(1,2,4-triazol-1-ylmethyl)silane;methyl n-(1h-benzimidazol-2-yl)carbamate Chemical compound C1=CC=C2NC(NC(=O)OC)=NC2=C1.C=1C=C(F)C=CC=1[Si](C=1C=CC(F)=CC=1)(C)CN1C=NC=N1 VQLYBLABXAHUDN-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
Disclosed in the utility model is a chip-on-board (COB) packaging structure with low thermal resistance and high luminous efficiency. The COB packaging structure comprises an aluminum substrate; a bowl cup that is manufactured by using etching and countersinking techniques is arranged at the center of the aluminum substrate; and a plurality of light-emitting wafers that are fixed at the aluminum substrate by die bonding glues are arranged at the aluminum substrate. An insulated layer and a conductive copper foil are pressed at the periphery of the aluminum substrate; and the light-emitting wafers are connected to the conductive copper foil by a metal lead. Besides, the aluminum substrate is also coated with a packaging glue layer for protecting the light-emitting wafers; and the packaging glue layer covers the upper portion of the bowl cup. The provided COB packaging structure has the good optical structure and the good heat radiation structure and also has the low thermal resistance and the high heat conduction performance. A silver plating layer with high light reflection is arranged at the bottom and the periphery of the bowl cup, so that the light extraction efficiency is improved; and because of the thermoelectricity separating structure, characteristics of the performance stability, high security and low cost are ensured.
Description
Technical field
The utility model relates to COB encapsulating structure manufacturing technology field, particularly the COB encapsulating structure of the high light efficiency of a kind of low thermal resistance.
Background technology
COB is the english abbreviation of Chip On Board (chip on board directly fills), is that one directly pastes LED chip on pcb board by adhesive or scolder, then realizes the encapsulation technology of electrical interconnection between chip and pcb board by Bonding.Be applied in early days IC encapsulation field, its product has a clear superiority in and is widely used in LED encapsulation in heat radiation, cost and application, and therefore, SMT mode traditional in product from now on can progressively be replaced.
The COB encapsulation of existing LED, wherein a class adopts and on the Copper Foil on the aluminium-base plate insulating layer of carrying out circuit, plates silver lustre and do die bond region, by wafer integration packaging, although this structure is simple and convenient, but luminescent wafer has intermediate insulating layer to hinder in downward heat radiation process, capacity of heat transmission deficiency, properties of product make people worried; Other class employing brill bowl cup on the aluminium base of carrying out circuit is silver-plated or form crystal bonding area by the mode of pressing circuit on the extraordinary minute surface substrate of reflectance, all exist crystal bonding area bowl cup surrounding wall of cup to have insulating barrier to expose with upper type, luminescent wafer part light needs these light of wall of cup reflex time to be easy to be absorbed and cause the problems such as product light efficiency reduction by the insulating barrier of antiradar reflectivity.
Utility model content
The utility model provides the COB encapsulating structure of the high light efficiency of a kind of low thermal resistance, object is to overcome above-mentioned technical deficiency, gather the advantage of two types, provide that a kind of light extraction efficiency is high, thermal resistance is low, good, the safe and COB packaging cheaply of stable performance, heat conduction.
For achieving the above object, the technical scheme that the utility model provides is: the COB encapsulating structure that the high light efficiency of a kind of low thermal resistance is provided, comprise aluminium base, the central authorities of described aluminium base have the bowl cup that uses etching and counterbore fabrication techniques, in described bowl cup, be provided with by crystal-bonding adhesive and be fixed on the multiple luminescent wafers on aluminium base, the pressing of described aluminium base surrounding has insulating barrier and copper-foil conducting electricity, described luminescent wafer is connected to copper-foil conducting electricity by metal lead wire, on described aluminium base, be also coated with the encapsulation glue-line for the protection of luminescent wafer, described encapsulation glue-line covers described bowl cup top.
Described bowl cup bottom and surrounding have high reflective silver coating.
Described bowl cup is made based on described aluminium base, and described bowl cup is an entirety with described aluminium base.
The beneficial effects of the utility model are, described bowl cup is an entirety with described aluminium base, thereby there is good optical texture and radiator structure, possess low thermal resistance and high thermal conductivity, described bowl cup bottom and surrounding have high reflective silver coating, improved light extraction efficiency, thermoelectricity isolating construction has ensured stable, the safe and low cost characteristic of performance.Therefore the utility model be that a kind of thermal resistance is low, heat conduction good, light extraction efficiency is high, stable performance, safe COB packaging.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model embodiment;
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Shown in figure 1, the utility model embodiment provides the COB encapsulating structure of the high light efficiency of a kind of low thermal resistance, comprise aluminium base 1, the central authorities of described aluminium base 1 have the bowl cup that uses etching and counterbore fabrication techniques, described bowl cup bottom and surrounding have high reflective silver coating 2, in described bowl cup, be provided with by crystal-bonding adhesive and be fixed on the multiple luminescent wafers 3 on aluminium base 1, described aluminium base 1 surrounding pressing has insulating barrier 6 and copper-foil conducting electricity 7, described luminous brilliant 3 are connected to copper-foil conducting electricity 7 by metal lead wire 4, forming circuit loop, on described aluminium base 1, be also coated with the encapsulation glue-line 5 for the protection of luminescent wafer 3, described encapsulation glue-line 5 covers described bowl cup top.
In described aluminium base 1, bowl cup is to form through etching technique and counterbore fabrication techniques, described etching technique manufacturing process is first on substrate 1, to set die bond region to use mask to cover, exposed metal part is directly contacted to ablation certain thickness with corrosive liquid, die bond region is highlighted, and corrosion area uses insulating barrier 6 and copper-foil conducting electricity 7 in the pressing of pressing technology; Die bond region is used counterbore technique to use given shape drill bit to make bowl cup.Whole bowl cup and surrounding wall of cup and aluminium base bottom heat radiation layer are an entirety, and luminescent wafer heat radiation approach is more unobstructed, and bowl cup bottom and surrounding are used silver lustre technique to plate high reflective silver coating 2, improve reflectance, and light efficiency is higher.
Therefore, COB encapsulating structure described in the utility model has advantages of that thermal resistance is low, light extraction efficiency is high, stable performance, safe, on concrete, described bowl cup is an entirety with described aluminium base, thereby there is good optical texture and radiator structure, luminescent wafer heat radiation approach is more unobstructed, naked layer Interference absorb when bowl cup surrounding wall of cup reflection ray, the silver coating of bowl cup bottom and surrounding has improved the light emission rate of luminescence chip, its thermoelectricity isolating construction ensured performance stable, heat conduction is good, safe and the feature such as low cost.
The above; it is only preferably embodiment of the utility model; but protection range of the present utility model is not limited to this; any be familiar with those skilled in the art the utility model disclose technical scope in; the variation that can expect easily or replacement, within all should being encompassed in protection range of the present utility model.Therefore, protection range of the present utility model should be as the criterion with the protection range of claim.
Claims (3)
1. the COB encapsulating structure of the high light efficiency of low thermal resistance; it is characterized in that; comprise aluminium base; the central authorities of described aluminium base have the bowl cup that uses etching and counterbore fabrication techniques; in described bowl cup, be provided with by crystal-bonding adhesive and be fixed on the multiple luminescent wafers on aluminium base; the pressing of described aluminium base surrounding has insulating barrier and copper-foil conducting electricity; described luminescent wafer is connected to copper-foil conducting electricity by metal lead wire; on described aluminium base, be also coated with the encapsulation glue-line for the protection of luminescent wafer, described encapsulation glue-line covers described bowl cup top.
2. the COB encapsulating structure of the high light efficiency of a kind of low thermal resistance as claimed in claim 1, is characterized in that, described bowl cup bottom and surrounding have high reflective silver coating.
3. the COB encapsulating structure of the high light efficiency of a kind of low thermal resistance as claimed in claim 1, is characterized in that, described bowl cup is made based on described aluminium base, and described bowl cup is an entirety with described aluminium base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420023257.4U CN203707127U (en) | 2014-01-14 | 2014-01-14 | COB packaging structure with low thermal resistance and high luminous efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420023257.4U CN203707127U (en) | 2014-01-14 | 2014-01-14 | COB packaging structure with low thermal resistance and high luminous efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203707127U true CN203707127U (en) | 2014-07-09 |
Family
ID=51057526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420023257.4U Expired - Lifetime CN203707127U (en) | 2014-01-14 | 2014-01-14 | COB packaging structure with low thermal resistance and high luminous efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203707127U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538510A (en) * | 2014-12-19 | 2015-04-22 | 重庆新天阳照明科技股份有限公司 | LED mirror surface aluminum substrate packaging process |
| CN106340502A (en) * | 2015-07-09 | 2017-01-18 | 普因特工程有限公司 | Chip substrate with concave part and chip package same |
| CN106340578A (en) * | 2015-07-09 | 2017-01-18 | 普因特工程有限公司 | Chip substrate with plating layer and chip package using same |
-
2014
- 2014-01-14 CN CN201420023257.4U patent/CN203707127U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104538510A (en) * | 2014-12-19 | 2015-04-22 | 重庆新天阳照明科技股份有限公司 | LED mirror surface aluminum substrate packaging process |
| CN106340502A (en) * | 2015-07-09 | 2017-01-18 | 普因特工程有限公司 | Chip substrate with concave part and chip package same |
| CN106340578A (en) * | 2015-07-09 | 2017-01-18 | 普因特工程有限公司 | Chip substrate with plating layer and chip package using same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140709 |