CN212910182U - Novel circuit board with quick heat dissipation - Google Patents
Novel circuit board with quick heat dissipation Download PDFInfo
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- CN212910182U CN212910182U CN202021750360.0U CN202021750360U CN212910182U CN 212910182 U CN212910182 U CN 212910182U CN 202021750360 U CN202021750360 U CN 202021750360U CN 212910182 U CN212910182 U CN 212910182U
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- heat
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Abstract
The utility model belongs to the field of circuit boards, in particular to a novel circuit board with rapid heat dissipation, which comprises a flexible circuit board body and a heat conduction back film arranged at the back of the flexible circuit board body, wherein the flexible circuit board body comprises a flexible base layer and a metal conductor, the metal conductor is embedded in the flexible base layer, and the two ends of the metal conductor are fixed at the outer wall side of the flexible base layer; the heat-conducting medium can flow in the coating film, the heat absorption that sends the inside metal conductor of flexible basic unit, fin and heat-conducting film and air contact through on the heat conduction notacoria, with heat transfer to the air, thereby reduce the heat of gathering on the flexible basic unit, reduce the temperature of flexible basic unit, when metal conductor takes place to transship or the short circuit, still can delay the time that flexible basic unit burns out, and after flexible basic unit burns out, inside liquid heat-conducting medium can flow, thereby water and go out the department of catching fire, avoid the expansion of intensity of a fire, reduce economic loss.
Description
Technical Field
The utility model relates to a circuit board field specifically is a quick novel circuit board dispels heat.
Background
The flexible circuit board is a unique solution to meet the miniaturization and movement requirements of electronic products, can be freely bent, wound and folded, can bear hundreds of thousands of dynamic bending without damaging a lead, can be randomly arranged according to the space layout requirement, and can be freely moved and stretched in a three-dimensional space, thereby achieving the integration of component assembly and lead connection, the flexible circuit board can greatly reduce the volume and the weight of the electronic products, and is suitable for the development requirements of the electronic products towards high density, miniaturization and high reliability.
The flexible circuit board usually adopts the flexible substrate inside to inlay and establishes the conducting wire, because the intensity of flexible substrate itself is not high, consequently is difficult to set up heat radiation structure on the circuit board, when the circuit transships or short circuit overheat, can burn the circuit board, can burn out other circuit structure even. Therefore, a person skilled in the art provides a novel circuit board with fast heat dissipation to solve the problems mentioned in the background art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a quick novel circuit board dispels heat to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a quick novel circuit board dispels heat, is in including flexible line plate body and setting the heat conduction notacoria at flexible line plate body back, the flexible line plate body includes flexible basic unit and metallic conductor, metallic conductor inlays to be established the inside of flexible basic unit, just metallic conductor's both ends are fixed in the outer wall side of flexible basic unit, the heat conduction notacoria includes coating film and heat-conducting medium, the coating film cladding is in the lateral wall of flexible basic unit, just the coating film with flexible basic unit sealing connection, the heat-conducting medium is located between coating film and the flexible basic unit, the laminating is fixed with heat-conducting film on coating film's the lateral wall, just be equipped with a plurality of fin on coating film's the lateral wall, the fin runs through coating film, and with coating film sealing fixation.
As a further aspect of the present invention: the flexible basic unit includes integrated into one piece's component installation department and wire extension, metal conductor includes integrated into one piece's wire and terminal, the wire inlays to be established and is fixed in the inside of wire, the wire extension is located the lateral wall of terminal.
As a further aspect of the present invention: the flexible base layer is provided with a plurality of through mounting holes, and the mounting holes are located on the element mounting part.
As a further aspect of the present invention: the joint of the wrapping film and the flexible base layer is provided with a bonding part, and the wrapping film and the flexible base layer are connected in a sealing mode through the bonding part.
As a further aspect of the present invention: the heat conducting medium is a liquid medium, and the radiating fins are metal foils.
As a further aspect of the present invention: the heat conducting medium is heat conducting oil or heat conducting silicone oil, and the radiating fins are copper foils or aluminum foils.
As a further aspect of the present invention: the heat conduction film is a heat conduction graphite sheet.
Compared with the prior art, the beneficial effects of the utility model are that:
through set up the heat conduction notacoria at flexible line plate body back, wherein the heat conduction notacoria includes coating film and heat-conducting medium, the sealed cladding of heat-conducting medium is on the surface of heat conduction notacoria by the coating film, so that the heat-conducting medium can flow in the coating film, can absorb the heat that the inside metallic conductor of flexible basic unit sent, and with heat transfer, fin and heat-conducting film through on the heat conduction notacoria contact with the air, with the heat transfer in the air, with this heat that reduces the last gathering of flexible basic unit, reduce the temperature of flexible basic unit, when metallic conductor takes place overload or short circuit, still can delay the time that flexible basic unit burns out, and after flexible burning out, inside liquid heat-conducting medium can flow out, thereby water the department of catching fire, avoid the expansion of intensity of a fire, reduce economic loss.
Drawings
FIG. 1 is a schematic structural view of a novel circuit board with fast heat dissipation;
FIG. 2 is a schematic view of a three-dimensional structure of the back side of a novel circuit board with fast heat dissipation;
FIG. 3 is a schematic view of a front side of a novel circuit board with fast heat dissipation;
fig. 4 is a schematic cross-sectional view of a novel circuit board with fast heat dissipation.
In the figure: 1. a flexible circuit board body; 101. mounting holes; 11. a flexible base layer; 111. a component mounting section; 112. a wire extension; 12. a metal conductor; 121. a wire; 122. a terminal; 2. a thermally conductive backing film; 21. coating a film; 211. an adhesive portion; 22. a heat-conducting medium; 3. a heat sink; 4. a thermally conductive film.
Detailed Description
Please refer to fig. 1-4, in an embodiment of the present invention, a novel circuit board with fast heat dissipation includes a flexible circuit board body 1 and a heat conductive back film 2 disposed on the back of the flexible circuit board body 1, the flexible circuit board body 1 includes a flexible base layer 11 and a metal conductor 12, the metal conductor 12 is embedded in the flexible base layer 11, and both ends of the metal conductor 12 are fixed on the outer wall side of the flexible base layer 11, the heat conductive back film 2 includes a coating film 21 and a heat conductive medium 22, the coating film 21 is coated on the outer wall of the flexible base layer 11, and the coating film 21 is connected to the flexible base layer 11 in a sealing manner, the heat conductive medium 22 is located between the coating film 21 and the flexible base layer 11, the heat conductive film 4 is fixed on the outer wall of the coating film 21 in a laminating manner, and a plurality of heat dissipation fins 3 are disposed on the outer wall of the coating film 21, the heat dissipation fins.
In this embodiment, the back of the flexible circuit board 1 is provided with the heat conducting back film 2, wherein the heat conducting back film 2 includes a covering film 21 and a heat conducting medium 22, the covering film 21 hermetically covers the heat conducting medium 22 on the surface of the heat conducting back film 2, so that the heat conducting medium 22 can flow in the covering film 21, and can absorb heat emitted by the metal conductor 12 inside the flexible base layer 11 and transfer the heat, wherein the heat conducting medium 22 is a liquid medium, the heat sink 3 is a metal foil, and the heat is transferred to the air by contacting the heat sink 3 and the heat conducting film 4 on the heat conducting back film 2, so as to reduce the heat accumulated on the flexible base layer 11, reduce the temperature of the flexible base layer 11, and when the metal conductor 12 is overloaded or short-circuited, the burning time of the flexible base layer 11 can be delayed, and when the flexible base layer 11 is burned out, the liquid medium 22 inside can flow out, thereby the ignition part is cast out, the expansion of the fire is avoided, and the economic loss is reduced.
In fig. 1: the flexible substrate 11 includes an integrally formed component mounting portion 111 and a wire extending portion 112, the metal conductor 12 includes an integrally formed wire 121 and a terminal 122, the wire 121 is embedded and fixed inside the wire 121, the wire extending portion 112 is located on an outer side wall of the terminal 122, when in use, the electronic component is mounted on the flexible circuit board body 1 at the component mounting portion 111, so that the pin of the electronic component and the terminal 122 are partially contacted and conductive, and the electronic component is electrically connected by the wire 121.
In fig. 2 and 3: the flexible base layer 11 is provided with a plurality of through mounting holes 101, the mounting holes 101 are located on the component mounting portion 111, and the mounting holes 101 are used for fixedly mounting electronic components on the component mounting portion 111, so that the electronic components can be more stably mounted.
In FIGS. 2 to 4: the joint of cover film 21 and flexible basic unit 11 is equipped with bonding portion 211, and cover film 21 and flexible basic unit 11 are through bonding portion 211 sealing connection, through set up bonding portion 211 between cover film 21 and flexible basic unit 11, make and be in encapsulated situation between cover film 21 and the flexible basic unit 11 to can make heat-conducting medium 22 flow in cover film 21, be used for absorbing the heat that metal conductor 12 sent.
Specifically, the heat conducting medium 22 is heat conducting oil or heat conducting silicone oil, the heat conducting oil has good heat conducting effect and fluidity, heat emitted by the metal conductor 12 inside the flexible base layer 11 can be absorbed and transferred, and the radiating fins 3 are copper foils or aluminum foils, so that the contact area with air can be increased, and heat and air are contacted to perform heat exchange.
Specifically, the heat conduction film 4 is a heat conduction graphite sheet, can conduct heat uniformly along two directions, shields a heat source, and plays a role in heat insulation and heat conduction.
The utility model discloses a theory of operation is: when in use, the electronic components are fixedly installed in the installation holes 101, the pins of the electronic components are partially contacted with the terminals 122 for electric conduction, the electric connection relationship between the electronic components is connected by the wires 121, the heat-conducting medium 22 is hermetically coated on the surface of the heat-conducting back film 2 by the coating film 21, so that the heat-conducting medium 22 can flow in the coating film 21, the heat emitted by the metal conductor 12 inside the flexible base layer 11 can be absorbed and transferred, wherein the heat-conducting medium 22 is a liquid medium, the heat sink 3 is a metal foil, the heat sink 3 on the heat-conducting back film 2 is contacted with air through the heat sink 3 and the heat-conducting film 4 on the heat-conducting back film 4, the heat is transferred to the air, so as to reduce the heat accumulated on the flexible base layer 11, reduce the temperature of the flexible base layer 11, when the metal conductor 12 is overloaded or short-circuited, the burning time of the flexible base layer 11 can be delayed, and, the liquid heat-conducting medium 22 in the fire extinguishing chamber flows out, so that the fire is extinguished, the fire is prevented from being expanded, and the economic loss is reduced.
The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. The novel circuit board with the rapid heat dissipation function is characterized by comprising a flexible circuit board body (1) and a heat conduction back film (2) arranged on the back of the flexible circuit board body (1), wherein the flexible circuit board body (1) comprises a flexible base layer (11) and a metal conductor (12), the metal conductor (12) is embedded in the flexible base layer (11), the two ends of the metal conductor (12) are fixed on the outer wall side of the flexible base layer (11), the heat conduction back film (2) comprises a coating film (21) and a heat conduction medium (22), the coating film (21) is coated on the outer wall of the flexible base layer (11), the coating film (21) is in sealing connection with the flexible base layer (11), the heat conduction medium (22) is positioned between the coating film (21) and the flexible base layer (11), and a heat conduction film (4) is laminated and fixed on the outer wall of the coating film (21), and a plurality of radiating fins (3) are arranged on the outer side wall of the coating film (21), and the radiating fins (3) penetrate through the coating film (21) and are fixedly sealed with the coating film (21).
2. The novel circuit board of claim 1, wherein the flexible base layer (11) includes an integrally formed component mounting portion (111) and a wire extending portion (112), the metal conductor (12) includes an integrally formed wire (121) and a terminal (122), the wire (121) is embedded and fixed inside the wire (121), and the wire extending portion (112) is located on an outer side wall of the terminal (122).
3. The novel circuit board of claim 2, wherein the flexible substrate (11) has a plurality of through mounting holes (101), and the mounting holes (101) are located on the component mounting portion (111).
4. The novel circuit board with relatively fast heat dissipation according to claim 1, wherein a bonding portion (211) is disposed at a joint of the cover film (21) and the flexible base layer (11), and the cover film (21) and the flexible base layer (11) are hermetically connected through the bonding portion (211).
5. The novel circuit board with rapid heat dissipation according to claim 1, wherein the heat conducting medium (22) is a liquid medium, and the heat sink (3) is a metal foil.
6. The novel circuit board with faster heat dissipation according to claim 1, wherein the heat conducting medium (22) is heat conducting oil or heat conducting silicone oil, and the heat dissipation plate (3) is copper foil or aluminum foil.
7. The novel circuit board with rapid heat dissipation according to claim 1, wherein the heat conducting film (4) is a heat conducting graphite sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021750360.0U CN212910182U (en) | 2020-08-20 | 2020-08-20 | Novel circuit board with quick heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021750360.0U CN212910182U (en) | 2020-08-20 | 2020-08-20 | Novel circuit board with quick heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212910182U true CN212910182U (en) | 2021-04-06 |
Family
ID=75247252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021750360.0U Active CN212910182U (en) | 2020-08-20 | 2020-08-20 | Novel circuit board with quick heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212910182U (en) |
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2020
- 2020-08-20 CN CN202021750360.0U patent/CN212910182U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220124 Address after: 334000 east of sanitary ware Industrial Park, Gongye 19th Road, Qianshan County, Shangrao City, Jiangxi Province Patentee after: Jiangxi chishuo Technology Co.,Ltd. Address before: 334500 Gongye 2nd Road, Qianshan Industrial Park, Qianshan County, Shangrao City, Jiangxi Province Patentee before: Jiangxi tianshengxiang Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |