CN212992848U - Small heat exchange device for heat dissipation of electronic component - Google Patents
Small heat exchange device for heat dissipation of electronic component Download PDFInfo
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- CN212992848U CN212992848U CN202022091247.2U CN202022091247U CN212992848U CN 212992848 U CN212992848 U CN 212992848U CN 202022091247 U CN202022091247 U CN 202022091247U CN 212992848 U CN212992848 U CN 212992848U
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- radiator
- pipe
- exchange device
- heat exchange
- electronic component
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Abstract
The utility model discloses a small-size heat exchange device that electronic components heat dissipation was used, including the radiator, the connection gasket is installed in the front side four corners of radiator, and miniature fan is installed to the front side of radiator, and the triangle connection piece is installed in the four corners of miniature fan, and the triangle connection piece passes through the fastening bolt fastening connection with the connection gasket, and the embedded interlude of radiator has the cooling tube. The utility model provides an in the high intensive setting, the too high problem that leads to burning out of components and parts easily of heat that electronic components accumulated together.
Description
Technical Field
The utility model relates to a heat exchange device technical field specifically is a small-size heat exchange device of electronic components heat dissipation usefulness.
Background
The electronic components are components of electronic elements and small machines and instruments, are usually composed of a plurality of parts and can be commonly used in similar products; it is a general name of electronic devices such as capacitor, transistor, balance spring and spiral spring. Electronic devices are becoming more and more complex due to the needs of social development, which requires that the electronic devices have the characteristics of reliability, high speed, low power consumption, light weight, miniaturization, low cost and the like, but in such a high-density arrangement, the heat accumulated by electronic components is too high, which easily causes the burning of the components, and the heat dissipation device is particularly important, so a small heat exchange device for dissipating heat of the electronic components is designed.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to prior art, the utility model provides a small-size heat exchange device of electronic components heat dissipation usefulness has solved high intensive setting, and the too high problem that leads to burning out of components and parts easily of heat that electronic components accumulated together.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a small-size heat exchange device of electronic components heat dissipation usefulness, includes the radiator, the connection gasket is installed in the front side four corners of radiator, miniature fan is installed to the front side of radiator, the triangle connection piece is installed in the four corners of miniature fan, the triangle connection piece passes through the fastening bolt fastening connection with the connection gasket, the embedded interlude of radiator has the cooling tube.
The small heat exchange device for heat dissipation of the electronic component comprises a plurality of heat dissipation fins, wherein each heat dissipation fin is arranged at an equal interval, and the plurality of heat dissipation fins are arranged at equal intervals, so that air flow is increased, and heat dissipation efficiency is improved.
In the foregoing small heat exchange device for dissipating heat of an electronic component, the heat dissipation fin is made of one of copper materials or aluminum materials.
The small-size heat exchange device that electron components heat dissipation was used, the cooling tube includes feed liquor pipe, drain pipe and connecting pipe, feed liquor pipe, drain pipe and connecting pipe are connected and are formed the cooling tube, the connecting pipe is installed in the connection department of buckling of feed liquor pipe and drain pipe, and the connecting pipe has strengthened the intensity of cooling tube in the department of buckling.
According to the small heat exchange device for heat dissipation of the electronic component, the cooling pipe is arranged in the inner cavity of the radiator in an S shape, the cooling pipe is wound in the inner cavity of the radiator in the S shape, the flowing contact area of the cooling pipe in the inner cavity of the radiator is increased, the heat transfer speed is accelerated, and the heat dissipation efficiency is improved.
In the small heat exchange device for heat dissipation of the electronic component, the inner cavity of the radiator is provided with a plurality of connecting holes matched with the liquid inlet pipe and the liquid outlet pipe.
The utility model has the advantages that: when the electronic component works, the generated heat is absorbed by the radiating fins on the radiator and carries out heat exchange, the radiator comprises a plurality of radiating fins, every two radiating fins are arranged at equal intervals, the plurality of radiating fins are arranged at equal intervals, the air flow is increased, the radiating efficiency is accelerated, meanwhile, the radiator is provided with the micro fan, the heat radiation fan further blows heat, and simultaneously outputs cooling liquid in the liquid inlet pipe of the cooling pipe, the cooling pipe is arranged in the inner cavity of the radiator in an S shape, the S-shaped cooling pipe is wound in the inner cavity of the radiator, the flowing contact area of the cooling pipe in the inner cavity of the radiator is increased, the heat transfer speed is accelerated, and the heat radiation efficiency is increased, so that the heat emitted by the electronic components during operation can be discharged in time, thereby solving the problem of high-density arrangement, the problem that the heat accumulated by the electronic components is too high easily causes the burning of the components.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a structural section view of the present invention.
In the figure: 1. radiator, 101, radiating fin, 2, connecting pad, 3, miniature fan, 4, fastening bolt, 5, triangle connection piece, 6, cooling tube, 601, feed liquor pipe, 602, drain pipe, 603, connecting pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to FIGS. 1-2: a small-sized heat exchange device for heat dissipation of electronic components comprises a radiator 1, wherein the radiator 1 comprises a plurality of radiating fins 101, every two radiating fins 101 are arranged at equal intervals, the radiating fins 101 are made of copper materials or aluminum materials, four corners of the front side of the radiator 1 are provided with connecting gaskets 2, the front side of the radiator 1 is provided with a micro fan 3, four corners of the micro fan 3 are provided with triangular connecting sheets 5, the triangular connecting sheets 5 are fixedly connected with the connecting gaskets 2 through fastening bolts 4, a cooling pipe 6 is embedded in the radiator 1 in a penetrating manner, the cooling pipe 6 comprises a liquid inlet pipe 601, a liquid outlet pipe 602, a connecting pipe 603 and the liquid inlet pipe 601, the liquid outlet pipe 602 and the connecting pipe 603 are connected to form a cooling pipe 6, the connecting pipe 603 is installed at the connection bending position of the liquid inlet pipe 601 and the liquid outlet pipe 602, the cooling pipe 6 is arranged in the inner cavity of the radiator 1 in an S shape, and the inner cavity of the radiator 1 is provided with a plurality of connecting holes matched with the liquid inlet pipe 601 and the liquid outlet pipe 602.
To sum up, when the electronic component is in use, when the electronic component works, the generated heat is absorbed by the heat dissipating fins 101 on the heat sink 1 and exchanges heat, the heat sink 1 comprises a plurality of heat dissipating fins 101, every two heat dissipating fins 101 are arranged at equal intervals, the plurality of heat dissipating fins 101 are arranged at equal intervals, so that the air flow is increased, the heat dissipating efficiency is improved, meanwhile, the micro-fan 3 is arranged on the heat sink 1, the heat is further blown away by the heat dissipating fan 3, meanwhile, the cooling liquid is output in the liquid inlet pipe 601 of the cooling pipe 6, the cooling pipe 6 is arranged in the inner cavity of the heat sink 1 in an S shape, the S-shaped cooling pipe 6 is wound in the inner cavity of the heat sink 1, the flowing contact area of the cooling pipe 6 in the inner cavity of the heat sink 1 is increased, the heat transfer speed is improved, the heat dissipating efficiency is improved, and the heat dissipated by, the problem of in the high intensive setting, the too high burning that leads to the components and parts easily of the heat that electronic components and parts accumulated together is solved.
The micro fan mentioned in the above embodiments is an electrical component that is easily available on the market, and the micro fan is a mature technology that is mastered by a person skilled in the art, and in this embodiment, only the micro fan is used without changing the structure and function thereof, and the micro fan is provided with a control switch matched with the micro fan, and the switch position can be specifically limited according to the actual use situation.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (6)
1. The utility model provides a small-size heat exchange device of electronic components heat dissipation usefulness, includes radiator (1), its characterized in that: connecting gaskets (2) are installed at four corners of the front side of the radiator (1), a micro fan (3) is installed at the front side of the radiator (1), triangular connecting pieces (5) are installed at four corners of the micro fan (3), the triangular connecting pieces (5) are connected with the connecting gaskets (2) through fastening bolts (4) in a fastening mode, and cooling pipes (6) are inserted into the embedded portions of the radiator (1).
2. The small heat exchange device for dissipating heat of an electronic component as claimed in claim 1, wherein: the radiator (1) comprises a plurality of radiating fins (101), and every two radiating fins (101) are arranged at equal intervals.
3. The small heat exchange device for dissipating heat of an electronic component as claimed in claim 2, wherein: the radiating fin (101) is made of one of copper materials or aluminum materials.
4. The small heat exchange device for dissipating heat of an electronic component as claimed in claim 1, wherein: cooling tube (6) are including feed liquor pipe (601), drain pipe (602) and connecting pipe (603), feed liquor pipe (601), drain pipe (602) and connecting pipe (603) are connected and are formed cooling tube (6), the connection department of buckling at feed liquor pipe (601) and drain pipe (602) is installed in connecting pipe (603).
5. The small heat exchange device for dissipating heat of an electronic component as claimed in claim 1, wherein: the cooling pipe (6) is arranged in the inner cavity of the radiator (1) in an S shape.
6. The small heat exchange device for dissipating heat of an electronic component as claimed in claim 1, wherein: the inner cavity of the radiator (1) is provided with a plurality of connecting holes matched with the liquid inlet pipe (601) and the liquid outlet pipe (602).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022091247.2U CN212992848U (en) | 2020-09-22 | 2020-09-22 | Small heat exchange device for heat dissipation of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022091247.2U CN212992848U (en) | 2020-09-22 | 2020-09-22 | Small heat exchange device for heat dissipation of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212992848U true CN212992848U (en) | 2021-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022091247.2U Active CN212992848U (en) | 2020-09-22 | 2020-09-22 | Small heat exchange device for heat dissipation of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212992848U (en) |
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2020
- 2020-09-22 CN CN202022091247.2U patent/CN212992848U/en active Active
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