CN210470096U - Power electronic radiator - Google Patents
Power electronic radiator Download PDFInfo
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- CN210470096U CN210470096U CN201921045704.5U CN201921045704U CN210470096U CN 210470096 U CN210470096 U CN 210470096U CN 201921045704 U CN201921045704 U CN 201921045704U CN 210470096 U CN210470096 U CN 210470096U
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- heat
- radiator
- heat source
- power electronic
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Abstract
The utility model provides a power electronic radiator, power electronic radiator includes: a heat sink substrate; the radiating fin is arranged on one surface of the radiator substrate; the plate is attached to the surface of the radiator base plate, which is far away from the radiator fins; a heat dissipation pipeline is formed between the plate and the heat radiator substrate, and heat transfer working media are filled in the heat dissipation pipeline. The utility model discloses a power electronic radiator is through addding panel to it has the heat dissipation pipeline of heat transfer working medium to form to fill between panel and radiator base plate, and the heat transfer working medium can evenly conduct the whole surface to the radiator base plate fast with the heat that power device produced, and then evenly conduct fast extremely radiating fin gives off, can reach quick radiating purpose.
Description
Technical Field
The utility model relates to a heat exchanger especially relates to a power electronic radiator.
Background
Power devices are widely used in power electronics. When the power device works, the temperature of the chip of the power device is increased due to heat generated by loss, so that the efficiency is reduced and the service life is shortened, and the failure of the power device and the explosion of the chip are caused.
In order to ensure the normal operation of the power device, the heat must be dissipated effectively in time. In the prior art, a power device is usually attached to the surface of a fin radiator to achieve the purpose of rapid heat dissipation. The conventional finned heat sink generally includes a heat sink base plate and heat dissipating fins inserted on the surface of the heat sink base plate.
However, the heat sink substrate in the existing fin heat sink generally has high thermal resistance. At this moment, when the power device is attached to the surface of the heat sink substrate, the high thermal resistance of the heat sink substrate can hinder the conduction of heat, so that the heat generated by the power device cannot be uniformly and rapidly conducted to the whole surface of the heat sink substrate and then is uniformly and rapidly conducted to the heat dissipation fins, and the rapid heat dissipation is not facilitated.
SUMMERY OF THE UTILITY MODEL
In view of the above prior art's shortcoming, the utility model aims to provide a power electronic radiator for the heat that the power device that leads to because the thermal resistance of radiator base plate is higher among the fin radiator of solution prior art produces can not evenly conduct fast to the whole surface of radiator base plate and then evenly conduct fast to radiating fin, is unfavorable for quick radiating problem.
To achieve the above and other related objects, the present invention provides a power electronic radiator, which comprises:
a heat sink substrate;
the radiating fin is arranged on one surface of the radiator substrate;
the plate is attached to the surface, away from the radiator fins, of the radiator substrate; and a heat dissipation pipeline is formed between the plate and the heat radiator substrate, and the heat dissipation pipeline is filled with heat transfer working media.
Optionally, the surface of the heat sink substrate, which is far away from the plate, is provided with a slot, and the heat dissipation fin is inserted into the slot.
Optionally, a protruding structure corresponding to the heat dissipation pipeline is formed on the plate.
Optionally, a first heat source attaching area is arranged on the surface, far away from the heat sink substrate, of the plate, and the surface of the first heat source attaching area is a plane.
Optionally, the first heat source attaching area is located on one side of the distribution area of the heat dissipation pipeline.
Optionally, the heat dissipation pipeline is located at the periphery of the first heat source attaching area.
Optionally, the power electronic heat sink further includes a heat source, and the heat source is attached to the first heat source attachment region.
Optionally, a second heat source attaching region is arranged on the surface, far away from the plate, of the radiator substrate, and the surface of the second heat source attaching region is a plane.
Optionally, the second heat source attaching area and the first heat source attaching area are located on the same side of the distribution area of the radiator pipe.
Optionally, the power electronic heat sink further includes a plurality of heat sources, and the plurality of heat sources are respectively attached to the first heat source attachment area and the second heat source attachment area.
As described above, the utility model discloses a power electronic radiator has following beneficial effect:
the utility model discloses a power electronic radiator is through addding panel to it has the heat dissipation pipeline of heat transfer working medium to form to fill between panel and radiator base plate, and the heat transfer working medium can evenly conduct the whole surface to the radiator base plate fast with the heat that power device produced, and then evenly conduct fast extremely radiating fin gives off, can reach quick radiating purpose.
Drawings
Fig. 1 to fig. 3 are schematic diagrams illustrating different exemplary power electronic heat sinks provided by the present invention.
Description of the element reference numerals
1 Heat sink base plate
2 Heat radiating fin
3 sheet material
31 convex structure
4 heat radiation pipeline
5 first Heat Source application region
6 second Heat Source application region
7 Heat source
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Please refer to fig. 1 to 3. It should be noted that the drawings provided in the present embodiment are only schematic and illustrative of the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
Referring to fig. 1 to 2, the present invention provides a power electronic heat sink, which includes: a heat sink substrate 1; the heat dissipation fin 2 is arranged on one surface of the heat dissipation base plate 1; the plate 3 is attached to the surface, away from the radiator fins 2, of the radiator base plate 1; a heat dissipation pipeline 4 is formed between the plate 3 and the heat sink substrate 1, and a heat transfer working medium (not shown) is filled in the heat dissipation pipeline 4. The utility model discloses a power electronic radiator is through addding panel 3, and panel 3 with it has to form to fill between the radiator base plate 1 heat transfer working medium heat dissipation pipeline 4, heat transfer working medium can evenly conduct the heat that power device produced fast extremely the whole surface of radiator base plate 1, and then evenly conduct fast extremely radiating fin 2 gives off, can reach quick radiating purpose.
As an example, the surface of the heat sink base plate 1 away from the plate 3 is provided with a slot (not shown), and the heat sink fin 2 is inserted into the slot. Of course, in other examples, the heat sink base plate 1 and the heat dissipating fins 2 may also be integrally formed, for example, the heat sink base plate 1 and the heat dissipating fins 2 may be prepared by stamping or the like from the same plate.
As an example, the heat dissipation pipeline 4 may be formed by using a blowing or stamping process, and the plate 3 is formed with a protruding structure 31 corresponding to the heat dissipation pipeline 4.
As an example, the shape of the heat dissipation pipeline 4 may include a hexagonal honeycomb shape, a circular honeycomb shape, a quadrangular honeycomb shape, a plurality of U-shapes connected end to end in series, a diamond shape, a triangular shape, a circular shape, a criss-cross mesh shape, or any combination of any one or more of them.
By way of example, the heat transfer working medium may comprise a thermal superconducting heat transfer working medium, i.e. the power electronics heat sink technology thermal superconducting heat transfer technology achieves heat transfer. A heat superconducting technology is a heat pipe technology that the heat transfer working medium is filled in a sealed and mutually communicated micro-channel system (namely the heat dissipation pipeline 4 in the embodiment), and the heat superconducting heat transfer is realized through the evaporation or condensation phase change of the heat transfer working medium; the other medium-heat superconducting technology is a phase transition suppression (PCI) heat transfer technology which realizes high-efficiency heat transfer by the state of the heat transfer working medium microstructure in the micro-channel system, namely boiling of the liquid heat transfer working medium (or condensation of the gaseous heat transfer working medium) is suppressed in the heat transfer process, and the consistency of the heat transfer working medium microstructure is achieved on the basis.
By way of example, the material of the plate 3 may include, but is not limited to, copper alloy, aluminum alloy, iron alloy, or any combination of any one or more thereof; the material of the heat sink substrate 1 may include, but is not limited to, copper alloy, aluminum alloy, iron alloy, or any combination of any one or more of the above; the material of the heat dissipation fin 2 may include, but is not limited to, copper alloy, aluminum alloy, iron alloy, or any combination of any one or more of the above.
As an example, a first heat source bonding area 5 is arranged on the surface of the plate 3 away from the heat sink substrate 1, and the surface of the first heat source bonding area 5 is a plane.
In one example, the first heat source attaching region 5 is located on one side of the distribution region of the heat dissipation pipe 4; as shown in fig. 1, the first heat source application region 5 may be located below the distribution region of the heat dissipation pipe 4.
In another example, the heat dissipation pipe 4 may also be located at the periphery of the first 5 heat source application region, as shown in fig. 3.
As an example, the power electronic heat sink further comprises a heat source 7, and the heat source 7 is attached to the first heat source attaching region 5. In particular, the heat source 7 may include a power device.
In another example, a surface of the heat sink substrate 1 away from the plate 3 is provided with a second heat source attaching region 6, and a surface of the second heat source attaching region 6 is a plane. The second heat source attaching area 6 and the first heat source attaching area 5 are positioned on the same side of the distribution area of the radiator pipeline 4; as shown in fig. 2, the second heat source application region 6 and the first heat source application region 5 are located below the distribution region of the radiator pipe 4.
As an example, the power electronic heat sink further includes a plurality of heat sources 7, and the plurality of heat sources 7 are respectively attached to the first heat source attaching area 5 and the second heat source attaching area 6. In particular, the heat source 7 may include a power device.
The utility model discloses a power electronic radiator is through addding panel 3, and panel 3 with it has to form to fill between the radiator base plate 1 heat transfer working medium heat dissipation pipeline 4, heat transfer working medium can evenly conduct the heat that power device produced fast extremely the whole surface of radiator base plate 1, and then evenly conduct fast extremely radiating fin 2 gives off, can reach quick radiating purpose.
To sum up, the utility model provides a power electronic radiator, power electronic radiator includes: a heat sink substrate; the radiating fin is arranged on one surface of the radiator substrate; the plate is attached to the surface, away from the radiator fins, of the radiator substrate; and a heat dissipation pipeline is formed between the plate and the heat radiator substrate, and the heat dissipation pipeline is filled with heat transfer working media. The utility model discloses a power electronic radiator is through addding panel to it has the heat dissipation pipeline of heat transfer working medium to form to fill between panel and radiator base plate, and the heat transfer working medium can evenly conduct the whole surface to the radiator base plate fast with the heat that power device produced, and then evenly conduct fast extremely radiating fin gives off, can reach quick radiating purpose.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A power electronic heat sink, comprising:
a heat sink substrate;
the radiating fin is arranged on one surface of the radiator substrate;
the plate is attached to the surface, away from the radiator fins, of the radiator substrate; and a heat dissipation pipeline is formed between the plate and the heat radiator substrate, and the heat dissipation pipeline is filled with heat transfer working media.
2. A power electronics heat sink according to claim 1, wherein: the surface of the radiator base plate, which is far away from the plate, is provided with a slot, and the radiating fins are inserted into the slot.
3. A power electronics heat sink according to claim 1, wherein: and a raised structure corresponding to the heat dissipation pipeline is formed on the plate.
4. A power electronics heat sink according to claim 1, wherein: the surface of the plate, which is far away from the radiator substrate, is provided with a first heat source bonding area, and the surface of the first heat source bonding area is a plane.
5. A power electronic heat sink according to claim 4, wherein: the first heat source attaching area is located on one side of the distribution area of the heat dissipation pipeline.
6. A power electronic heat sink according to claim 4, wherein: the heat dissipation pipeline is located on the periphery of the first heat source attaching area.
7. A power electronic heat sink according to any one of claims 4 to 6, wherein: the power electronic radiator further comprises a heat source, and the heat source is attached to the first heat source attachment area.
8. A power electronic heat sink according to any one of claims 4 to 6, wherein: and a second heat source bonding area is arranged on the surface, far away from the plate, of the radiator substrate, and the surface of the second heat source bonding area is a plane.
9. A power electronics heat sink according to claim 8, wherein: the second heat source attaching area and the first heat source attaching area are located on the same side of the distribution area of the radiator pipeline.
10. A power electronics heat sink according to claim 8, wherein: the power electronic radiator further comprises a plurality of heat sources, and the heat sources are respectively attached to the first heat source attaching area and the second heat source attaching area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921045704.5U CN210470096U (en) | 2019-07-05 | 2019-07-05 | Power electronic radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921045704.5U CN210470096U (en) | 2019-07-05 | 2019-07-05 | Power electronic radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210470096U true CN210470096U (en) | 2020-05-05 |
Family
ID=70444669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921045704.5U Active CN210470096U (en) | 2019-07-05 | 2019-07-05 | Power electronic radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210470096U (en) |
-
2019
- 2019-07-05 CN CN201921045704.5U patent/CN210470096U/en active Active
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| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20210208 Address after: 311100 Room 201, 2 / F, building 2, No. 9, Taiji Road, Yuhang Economic and Technological Development Zone, Yuhang District, Hangzhou City, Zhejiang Province Patentee after: Zhejiang Jiaxi Technology Co.,Ltd. Address before: Room 201, building 2, 188 Jinxiu Avenue, Yaozhuang Town, Jiashan County, Jiaxing City, Zhejiang Province Patentee before: ZHEJIANG KUNWU TECHNOLOGY Co.,Ltd. |