CN104914949A - Combined type computer water-cooling heat dissipation device - Google Patents
Combined type computer water-cooling heat dissipation device Download PDFInfo
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- CN104914949A CN104914949A CN201510277442.5A CN201510277442A CN104914949A CN 104914949 A CN104914949 A CN 104914949A CN 201510277442 A CN201510277442 A CN 201510277442A CN 104914949 A CN104914949 A CN 104914949A
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- top board
- heat dissipation
- circulation line
- cooling fluid
- cooling heat
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Abstract
The invention relates to a combined type computer water-cooling heat dissipation device which comprises a base board and a top board. The base board is fixedly connected to the bottom of the top board. Fans are arranged in the base board. The top board is provided with a heat dissipation liquid flow device. A water pump, a heat dissipation liquid containing box and a circulating pipeline are arranged in the heat dissipation liquid flow device. The water pump is connected with the heat dissipation liquid containing box. The circulating pipeline is provided with multiple S-shaped bends, one end of the circulating pipeline is connected with the water pump, the other end of the circulating pipeline is connected with the heat dissipation liquid containing box to form a heat dissipation loop, and a heat dissipation pipe is fixedly connected to the outer side of the circulating pipeline and is wavy. The combined type computer water-cooling heat dissipation device is simple in structure, high in practicality and remarkable in heat dissipation effect.
Description
Technical field
The present invention relates to heat abstractor, particularly a kind of modular computer water-cooling heat radiating device.
Background technology
As everyone knows, current computing machine and the cooling system of electronic installation generally are wind-cooling heat dissipating, wind-cooling heat dissipating is when computing machine uses for a long time, heat generating components temperature is higher, radiating effect is not remarkable, thus the serious radiating effect affecting computing machine, cause the damage of computer components, computer water-cooling heat radiation is as the active radiating mode of a kind of computing machine comparatively popular in recent years, usually utilize special heat exchange liquid under the driving of driving pump, heat exchange hydraulic pressure is entered in each heat exchange element, repeatedly circulate, fan is finally utilized to be shed from fuselage by heat, but existing water-cooling cellular construction is complicated, some maze-type structures can cause cooling fluid pressure drop excessive, thus seriously restrict radiating efficiency.
Summary of the invention
For the deficiency that prior art exists, the invention provides that a kind of structure is simple, practical, the significant a kind of modular computer water-cooling heat radiating device of radiating effect.
To achieve these goals, the present invention realizes by the following technical solutions: a kind of modular computer water-cooling heat radiating device, comprise substrate and top board, substrate is fixedly connected on the bottom of top board, substrate inside is provided with fan, top board is provided with cooling fluid flow device, cooling fluid flow device inside is provided with water pump, cooling fluid storage case and circulation line, water pump is connected with cooling fluid storage case, circulation line is provided with multiple serpentine and bends, one end of circulation line connects water pump, the other end and cooling fluid storage case connect to form heat-radiation loop, the outside of described circulation line is fixedly connected with radiating tube, radiating tube is waveform.
Further, described circulation line is provided with multiple serpentine and bends, and is parallel to each other between adjacent circulation line;
Further, described substrate and top board are square, and the size of substrate and top board is mated mutually;
Further, the number that described basic inside is provided with fan is two, and two fans are arranged in parallel;
Further, described substrate is aluminum alloy material, is provided with a small amount of aluminium alloy post bottom described top board, for supporting cooling fluid flow device.
The invention has the beneficial effects as follows: substrate is fixedly connected on the bottom of top board, substrate inside is provided with fan, top board is provided with cooling fluid flow device, cooling fluid flow device inside is provided with water pump, cooling fluid storage case and circulation line, water pump is connected with cooling fluid storage case, circulation line is provided with multiple serpentine and bends, one end of circulation line connects water pump, the other end and cooling fluid storage case connect to form heat-radiation loop, the outside of described circulation line is fixedly connected with radiating tube, radiating tube is waveform, there is provided a kind of structure simple, practical, the significant a kind of modular computer water-cooling heat radiating device of radiating effect.
Accompanying drawing explanation
The present invention is described in detail below in conjunction with the drawings and specific embodiments;
Fig. 1 is front view of the present invention;
Fig. 2 is top board structure schematic diagram of the present invention;
Fig. 3 is one-piece construction schematic diagram of the present invention;
Fig. 4 is partial sectional view of the present invention.
In figure: 1, substrate, 2, top board, 3, fan, 4, water pump, 5, cooling fluid storage case, 6, circulation line, 7, serpentine bends, 8, radiating tube.
Embodiment
The technological means realized for making the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with embodiment, setting forth the present invention further.
As Figure 1-4, a kind of modular computer water-cooling heat radiating device, comprise substrate 1 and top board 2, described substrate 1 is fixedly connected on the bottom of top board 2, described substrate 1 inside is provided with fan 3, described top board 2 is provided with cooling fluid flow device, described cooling fluid flow device inside is provided with water pump 4, cooling fluid storage case 5 and circulation line 6, described water pump 4 is connected with cooling fluid storage case 5, circulation line 6 is provided with multiple serpentine bending 7, one end of circulation line 6 connects water pump 4, the other end and cooling fluid storage case 5 connect to form heat-radiation loop, the outside of described circulation line 6 is fixedly connected with radiating tube 8, described radiating tube 8 is waveform.
The outside of circulation line 6 is fixedly connected with radiating tube 8, and radiating tube 8 uniform winding, around circulation line 6, adds contact area, improves radiating efficiency; Substrate 1 inside is provided with fan 3, cooling fluid flow device inside is provided with water pump 4, cooling fluid storage case 5 and circulation line 6, described water pump 4 is connected with cooling fluid storage case 5, circulation line 6 is provided with multiple serpentine bending 7, one end of circulation line 6 connects water pump 4, the other end and cooling fluid storage case 5 connect to form heat-radiation loop, and fan can improve the radiating effect of cooling fluid flow device further.
The technical scheme that the present invention optimizes further, described circulation line 6 is provided with multiple serpentine bending 7, is parallel to each other between adjacent circulation line 6.
The technical scheme that the present invention optimizes further, described substrate 1 and top board 2 are square, and the size of substrate 1 and top board 2 is mated mutually.
The technical scheme that the present invention optimizes further, the number that described basic 1 inside is provided with fan 3 is two, and two fans 3 are arranged in parallel.
The technical scheme that the present invention optimizes further, described substrate 1 is aluminum alloy material, is provided with a small amount of aluminium alloy post bottom described top board 2, for supporting cooling fluid flow device.
More than show and describe ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and instructions just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (5)
1. a modular computer water-cooling heat radiating device, it is characterized in that, comprise substrate (1) and top board (2), described substrate (1) is fixedly connected on the bottom of top board (2), described substrate (1) inside is provided with fan (3), described top board (2) is provided with cooling fluid flow device, described cooling fluid flow device inside is provided with water pump (4), cooling fluid storage case (5) and circulation line (6), described water pump (4) is connected with cooling fluid storage case (5), circulation line (6) is provided with multiple serpentine bending (7), one end of circulation line (6) connects water pump (4), the other end and cooling fluid storage case (5) connect to form heat-radiation loop, the outside of described circulation line (6) is fixedly connected with radiating tube (8), described radiating tube (8) is waveform.
2. a kind of modular computer water-cooling heat radiating device according to claim 1, is characterized in that, described circulation line (6) is provided with multiple serpentine bending (7), is parallel to each other between adjacent circulation line (6).
3. a kind of modular computer water-cooling heat radiating device according to claim 1, is characterized in that, described substrate (1) and top board (2) are square, and the size of substrate (1) and top board (2) is mated mutually.
4. a kind of modular computer water-cooling heat radiating device according to claim 1, is characterized in that, the number that described basic (1) inside is provided with fan (3) is two, and two fans (3) are arranged in parallel.
5. a kind of modular computer water-cooling heat radiating device according to claim 1, is characterized in that, described substrate (1) is aluminum alloy material, and described top board (2) bottom is provided with a small amount of aluminium alloy post, for supporting cooling fluid flow device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510277442.5A CN104914949A (en) | 2015-05-27 | 2015-05-27 | Combined type computer water-cooling heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510277442.5A CN104914949A (en) | 2015-05-27 | 2015-05-27 | Combined type computer water-cooling heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104914949A true CN104914949A (en) | 2015-09-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510277442.5A Pending CN104914949A (en) | 2015-05-27 | 2015-05-27 | Combined type computer water-cooling heat dissipation device |
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| Country | Link |
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| CN (1) | CN104914949A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105449560A (en) * | 2015-12-31 | 2016-03-30 | 国网湖北省电力公司武汉市汉南区供电公司 | Switch control box |
| CN105739651A (en) * | 2016-01-27 | 2016-07-06 | 商洛学院 | Computer CPU cooler |
| CN110748819A (en) * | 2019-10-29 | 2020-02-04 | 徐州爱特普电子有限公司 | LED explosion-proof lamp with water-cooling effect |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2622866Y (en) * | 2003-06-03 | 2004-06-30 | 王锐 | Air-liquid integrated radiator of CPU |
| CN201166825Y (en) * | 2008-02-15 | 2008-12-17 | 林佳静 | Water-cooled notebook computer radiator |
| CN102841664A (en) * | 2012-08-22 | 2012-12-26 | 青岛文创科技有限公司 | Heat radiator for computer mainboard |
| CN204314813U (en) * | 2014-12-25 | 2015-05-06 | 宋德明 | A kind of computing machine with water-cooling system |
-
2015
- 2015-05-27 CN CN201510277442.5A patent/CN104914949A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2622866Y (en) * | 2003-06-03 | 2004-06-30 | 王锐 | Air-liquid integrated radiator of CPU |
| CN201166825Y (en) * | 2008-02-15 | 2008-12-17 | 林佳静 | Water-cooled notebook computer radiator |
| CN102841664A (en) * | 2012-08-22 | 2012-12-26 | 青岛文创科技有限公司 | Heat radiator for computer mainboard |
| CN204314813U (en) * | 2014-12-25 | 2015-05-06 | 宋德明 | A kind of computing machine with water-cooling system |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105449560A (en) * | 2015-12-31 | 2016-03-30 | 国网湖北省电力公司武汉市汉南区供电公司 | Switch control box |
| CN105449560B (en) * | 2015-12-31 | 2017-06-30 | 国网湖北省电力公司武汉市汉南区供电公司 | Switch control box |
| CN105739651A (en) * | 2016-01-27 | 2016-07-06 | 商洛学院 | Computer CPU cooler |
| CN110748819A (en) * | 2019-10-29 | 2020-02-04 | 徐州爱特普电子有限公司 | LED explosion-proof lamp with water-cooling effect |
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Application publication date: 20150916 |
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| RJ01 | Rejection of invention patent application after publication |