CN212810277U

CN212810277U - Semiconductor packaging body

Info

Publication number: CN212810277U
Application number: CN202021224041.6U
Authority: CN
Inventors: 赵子郡; 解瑞龙; 陈一凡; 焦欢乐
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-06-29
Filing date: 2020-06-29
Publication date: 2021-03-26
Anticipated expiration: 2030-06-29

Abstract

The utility model discloses a semiconductor package body, which comprises a heat radiating piece, a substrate and a chip, wherein the top of the heat radiating piece is provided with a groove, the substrate is arranged in the groove, a first non-conductive adhesive layer is arranged between the substrate and the groove, the bottom of the chip is provided with an adhesive layer, the chip is fixedly connected with the top of the substrate through the adhesive layer, the top of the chip is provided with a conductive welding plate, a plurality of pins are uniformly distributed on the edge of the top of the heat radiating piece, leads are arranged between the pins and the conductive welding plate, welding balls are arranged at both ends of the leads, the both ends of the leads are fixedly connected with the pins and the conductive welding plate through the welding balls, a package shell body is arranged above the heat radiating piece, a heat radiating fin is arranged above the package shell body, a heat conducting piece is filled between the radiating fin and the package, the heat dissipation effect is good, and with the chip setting inside the recess, reduce the packaging body volume, save material, reduce cost.

Description

Semiconductor packaging body

Technical Field

The utility model relates to the field of semiconductor technology, specifically a semiconductor package body.

Background

With the progress of semiconductor technology and the increasing density of integrated circuits, the number of pins of a package device is increasing, the speed requirement is also increasing, and the power consumption of the package device is increasing, so that the package range and the heat dissipation problem of the package device are becoming more and more important.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor package, simple structure, the radiating effect is good, with the chip setting inside the recess, reduces the packaging body volume, save material, reduce cost to solve the problem of proposing among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor package comprises a heat sink, a substrate and a chip, wherein a groove is arranged at the top of the heat sink, a substrate is arranged in the groove, a first non-conductive adhesive layer is arranged between the substrate and the groove, an adhesive layer is arranged at the bottom of the chip, the chip is fixedly connected with the top of the substrate through the adhesive layer, the top of the chip is provided with a conductive welding plate, a plurality of pins are uniformly distributed on the edge of the top of the heat radiating piece, lead wires are arranged between the pins and the conductive welding plate, welding balls are arranged at two ends of each lead wire, and both ends of the lead are fixedly connected with the pins and the conductive welding plate through welding balls, a packaging shell is arranged above the heat dissipation part, the packaging structure comprises a packaging shell, wherein a heat radiating fin is arranged above the packaging shell, a heat conducting piece is filled between the heat radiating fin and the packaging shell, and second non-conductive adhesive layers are coated at two ends of the bottom of the packaging shell and the heat radiating fin.

Furthermore, the packaging shell and the radiating fins are both adhered to the top of the radiating piece through a second non-conductive adhesive layer.

Furthermore, the substrate is adhered to the bottom of the inner cavity of the groove through the first non-conductive adhesive layer.

Further, the pins comprise an inner pin and an outer pin, the outer pin extends from the inside of the package shell to the outside of the package shell, and the outer pin is set to be in an L-shaped structure.

Furthermore, the packaging shell is of a trapezoidal structure, the radiating fins are of a rectangular structure, and the packaging shell is made of epoxy resin.

Furthermore, a gap is reserved between the chip and the groove, and heat-conducting colloid is filled in the gap.

Compared with the prior art, the beneficial effects of the utility model are that:

through fixing the chip inside the recess, reduce the packaging body volume, reduce lead wire use length, reduce cost, and through the heat-conducting colloid, absorb chip heat itself, prevent that it from being in high temperature state for a long time, influence its life, through setting up the heat-conducting piece, absorb packaging shell surface and its inside heat, effectually dispel the heat to the packaging body.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

Fig. 1 is a schematic cross-sectional structure of the present invention;

fig. 2 is a schematic view of the top structure of the heat sink of the present invention;

fig. 3 is an enlarged view of a of the present invention;

reference numbers in the figures: 1. a heat sink; 2. a substrate; 3. a chip; 4. a groove; 5. a first non-conductive adhesive layer; 6. bonding the adhesive layer; 7. electrically welding the plates; 8. a pin; 9. a lead wire; 10. welding the ball; 11. a package housing; 12. a heat sink; 13. a heat conductive member; 14. a second non-conductive adhesive layer; 15. an inner pin; 16. an outer pin; 17. and (3) heat-conducting colloid.

Detailed Description

The present invention will be further described with reference to the following embodiments, wherein the drawings are for illustrative purposes only and are not intended to be limiting, and in order to better illustrate the embodiments of the present invention, some components of the drawings may be omitted, enlarged or reduced and do not represent the size of an actual product.

As shown in fig. 1-3, a semiconductor package comprises a heat sink 1, a substrate 2 and a chip 3, wherein a groove 4 is formed in the top of the heat sink 1, the size of the package is reduced, the length of a lead 9 is reduced, and the cost is reduced, the substrate 2 is arranged inside the groove 4, a first nonconductive adhesive layer 5 is arranged between the substrate 2 and the groove 4, an adhesive layer 6 is arranged at the bottom of the chip 3, the chip 3 is fixedly connected with the top of the substrate 2 through the adhesive layer 6, a conductive welding plate 7 is arranged at the top of the chip 3, the welding ball 10 is connected to the surface of the conductive welding plate 7, so as to prevent the chip 3 from being damaged in the welding process, a plurality of pins 8 are uniformly distributed on the edge of the top of the heat sink 1, a lead 9 is arranged between the pin 8 and the conductive welding plate 7, welding balls 10 are arranged at two ends of the lead 9, and two ends of the lead 9 are connected with the, The conductive welding plate 7 is fixedly connected, a packaging shell 11 is arranged above the heat dissipation member 1, a heat dissipation sheet 12 is arranged above the packaging shell 11, a heat conduction member 13 is filled between the heat dissipation sheet 12 and the packaging shell 11, heat on the surface of the packaging shell 11 and inside the packaging shell is absorbed, the packaging body is effectively dissipated, and second non-conductive adhesive layers 14 are coated at two ends of the bottom of the packaging shell 11 and the two ends of the bottom of the heat dissipation sheet 12.

More specifically, the package housing 11 and the heat sink 12 are both adhered to the top of the heat sink 1 through the second non-conductive adhesive layer 14, the substrate 2 is adhered to the bottom of the inner cavity of the groove 4 through the first non-conductive adhesive layer 5, the pins 8 include inner pins 15 and outer pins 16, the outer pins 16 extend from the inside of the package housing 11 to the outside thereof, the outer pins 16 are in an "L" shape, the package housing 11 is in a trapezoid shape, the area of the package housing 11 is increased, the contact area between the heat conducting member 13 and the heat conducting member is increased, heat can be more rapidly transferred to the heat conducting member 13, the heat sink 12 is in a rectangular shape, the package housing 11 is made of epoxy resin, a gap is left between the chip 3 and the groove 4, and the heat conducting colloid 17 is filled in the gap to absorb the heat of the chip 3 and prevent the chip 3 from being in a high temperature state for, affecting the service life thereof.

The working principle is as follows: this kind of semiconductor package through fixing chip 3 inside recess 4, reduces the packaging body volume, reduces lead wire 9 and uses length, reduce cost, and through heat-conducting colloid 17, absorbs chip 3 heat itself, prevents that it from being in high temperature state for a long time, influences its life, through setting up heat-conducting piece 13, absorbs packaging shell 11 surface and its inside heat, effectually dispels the heat to the packaging body.

Although particular embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor package comprises a heat dissipation member (1), a substrate (2) and a chip (3), and is characterized in that: the heat dissipation structure is characterized in that a groove (4) is formed in the top of the heat dissipation member (1), a substrate (2) is arranged in the groove (4), a first non-conductive adhesive layer (5) is arranged between the substrate (2) and the groove (4), an adhesive layer (6) is arranged at the bottom of the chip (3), the chip (3) is fixedly connected with the top of the substrate (2) through the adhesive layer (6), a conductive welding plate (7) is arranged at the top of the chip (3), a plurality of pins (8) are uniformly distributed on the edge of the top of the heat dissipation member (1), a lead (9) is arranged between each pin (8) and the conductive welding plate (7), welding balls (10) are arranged at two ends of each lead (9), two ends of each lead (9) are fixedly connected with each pin (8) and each conductive welding plate (7) through each welding ball (10), and a packaging shell (11) is arranged above the heat dissipation member, the packaging structure is characterized in that a radiating fin (12) is arranged above the packaging shell (11), a heat conducting piece (13) is filled between the radiating fin (12) and the packaging shell (11), and second non-conductive adhesive layers (14) are coated at two ends of the bottoms of the packaging shell (11) and the radiating fin (12).

2. The semiconductor package of claim 1, wherein: the packaging shell (11) and the radiating fins (12) are both adhered to the top of the radiating piece (1) through a second non-conductive adhesive layer (14).

3. The semiconductor package of claim 1, wherein: the substrate (2) is adhered to the bottom of the inner cavity of the groove (4) through the first non-conductive adhesive layer (5).

4. The semiconductor package of claim 1, wherein: the pins (8) comprise inner pins (15) and outer pins (16), the outer pins (16) extend from the inside of the packaging shell (11) to the outside of the packaging shell, and the outer pins (16) are set to be L-shaped structures.

5. The semiconductor package of claim 1, wherein: the packaging shell (11) is of a trapezoidal structure, the radiating fins (12) are of a rectangular structure, and the packaging shell (11) is made of epoxy resin.

6. The semiconductor package of claim 1, wherein: a gap is reserved between the chip (3) and the groove (4), and heat-conducting colloid (17) is filled in the gap.