CN212413692U - Ceramic radiating fin convenient to install - Google Patents
Ceramic radiating fin convenient to install Download PDFInfo
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- CN212413692U CN212413692U CN202021709270.7U CN202021709270U CN212413692U CN 212413692 U CN212413692 U CN 212413692U CN 202021709270 U CN202021709270 U CN 202021709270U CN 212413692 U CN212413692 U CN 212413692U
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- ceramic
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- adapter
- paster
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Abstract
The utility model discloses a ceramic cooling fin convenient to installation, including first ceramic paster and second ceramic paster, first ceramic paster is located the top position of second ceramic paster, two frame fixed slots have all been seted up in the outside of first ceramic paster and second ceramic paster, the equal fixed mounting of internal surface of first ceramic paster and second ceramic paster has the heat conduction copper. A ceramic cooling fin convenient to installation, belong to the ceramic cooling fin field, can be when ceramic cooling fin installs, it is quick to press from both sides tight fixedly to first ceramic paster and second ceramic paster, make things convenient for the installation of ceramic cooling fin to use, can contact heat back, dispel the heat with heat conduction to air cooling fin, constituted and absorbed the heat through first ceramic paster and second ceramic paster, the radiating structure of rethread air cooling fin, increase the area of contact of air, carry out efficient heat dissipation cooling.
Description
Technical Field
The utility model relates to a fin field, in particular to ceramic cooling fin convenient to installation.
Background
The ceramic radiating fin is a radiating fin produced by using a ceramic material and has the characteristics of high temperature resistance and corrosion resistance, so the ceramic radiating fin can be used for radiating heat by using various high-temperature and high-corrosion fluids, the radiating effect is good under the corrosion fluids, the service life is long, the ceramic radiating fin is several times or dozens of times of that of the ceramic radiating fin under the same condition, the ceramic radiating fin is widely applied to industries such as metallurgy, refractory materials, building materials, chemical engineering, nonferrous materials and the like, a large amount of energy is saved for enterprises, the production cost is reduced, the ceramic radiating fin is widely used in a large amount, the use demand of the ceramic radiating fin is gradually improved, but the existing ceramic radiating fin cannot meet the demand of people, and therefore the ceramic radiating fin which is more convenient to use; when ceramic radiating fin used the installation, can not carry out quick installation fixedly to ceramic radiating fin, the installation of inconvenient ceramic radiating fin is used, and simultaneously, ceramic radiating fin is behind the contact heat, and the scope of air contact is less, the unable quick heat dissipation that dispels to holistic radiating effect has been reduced.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a ceramic heat sink which is easy to install and can effectively solve the problems in the background.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a ceramic radiating fin convenient to install comprises a first ceramic patch and a second ceramic patch, wherein the first ceramic patch is positioned above the second ceramic patch, two frame fixing grooves are formed in the outer sides of the first ceramic patch and the second ceramic patch, heat-conducting copper plates are fixedly arranged on the inner surfaces of the first ceramic patch and the second ceramic patch, a plurality of copper plate sub-fins are fixedly arranged on the upper surface and the lower surface of each heat-conducting copper plate, patch installing frames are arranged on the outer surfaces of the first ceramic patch and the second ceramic patch and positioned outside the frame fixing grooves, a plurality of fixing clamping grooves are formed in the inner sides of the patch installing frames, frame extruding plates are arranged on the inner sides of the patch installing frames and positioned inside the fixing clamping grooves, extruding buttons are fixedly arranged on the lower surfaces of the frame extruding plates, and a first adapter seat and a second adapter seat are arranged on the upper surface of the first ceramic patch, first switching seat is located one side position of second switching seat, the equal fixed mounting in inboard of first switching seat and second switching seat has the fixed nail of pressing, one side external fixed surface of first switching seat installs first heat conduction copper pipe, one side external fixed surface of second switching seat installs second heat conduction copper pipe, the one end that first heat conduction copper pipe kept away from first switching seat and second heat conduction copper pipe kept away from the second switching seat has the switching copper pipe, the outside of switching copper pipe is provided with a plurality of air heat radiation fins, the equal adhesion of the lower surface of first ceramic paster and the upper surface of second ceramic paster has heat conduction adhesion to link to paste.
Preferably, the first ceramic patch and the second ceramic patch are both cuboids in shape, and are vertically arranged and installed.
Preferably, the copper plate sub-fins are fixedly connected with the heat conduction copper plate through integral forming, and the copper plate sub-fins are attached to the inner walls of the first ceramic patch and the second ceramic patch.
Preferably, the number of the patch mounting frames is two, and the patch mounting frames are clamped into the inner side of the frame fixing groove and fixedly connected with the first ceramic patch and the second ceramic patch.
Preferably, the patch mounting frame is of a v-21274-shaped structural design, two sides of the frame extrusion plate are clamped into the inner side of the fixing clamping groove to be fixedly connected with the patch mounting frame, and the frame extrusion plate is located below the second ceramic patch.
Preferably, the fixed pressure nail penetrates through the first adapter and the second adapter to be fixedly connected with the first ceramic patch, the first adapter and the second adapter are fixedly connected with the first ceramic patch through the fixed pressure nail, and the first adapter and the second adapter are arranged in parallel.
Preferably, the first heat conduction copper pipe and the second heat conduction copper pipe are the same in size, the first heat conduction copper pipe and the second heat conduction copper pipe are symmetrically arranged and installed, and the first heat conduction copper pipe and the second heat conduction copper pipe are inserted into the inner positions of the switching copper pipes.
Preferably, the adapter copper pipe penetrates through the air heat dissipation fins, the air heat dissipation fins are fixedly connected with the adapter copper pipe through welding, the air heat dissipation fins are arranged in a straight line, and the air heat dissipation fins are designed by an aluminum material structure.
Preferably, the switching copper tubes and the first ceramic patches are vertically arranged, and the air heat dissipation fins are located above the first ceramic patches.
Compared with the prior art, the utility model discloses following beneficial effect has: this ceramic cooling fin convenient to installation, first ceramic paster through setting up, second ceramic paster, the frame fixed slot, the paster installation frame, fixed slot, frame stripper plate and extrusion button, can be when ceramic cooling fin installs, it is quick to press from both sides tight fixedly to first ceramic paster and second ceramic paster, make things convenient for ceramic cooling fin's installation to use, first switching seat through setting up, the second switching seat, the fixing pressure nail, first heat conduction copper pipe, second heat conduction copper pipe, switching copper pipe and air cooling fin, after can the contact heat, dispel the heat to air cooling fin with heat conduction, constituted and absorbed the heat through first ceramic paster and second ceramic paster, the radiating structure of rethread air cooling fin, increase the area of contact of air, carry out efficient heat dissipation and cool down.
Drawings
Fig. 1 is a schematic view of an overall structure of a ceramic heat sink convenient to mount according to the present invention;
fig. 2 is a top view of a first ceramic patch of a ceramic heat sink of the present invention for easy installation;
FIG. 3 is a schematic view of a first ceramic patch of a ceramic heat sink of the present invention for easy installation;
fig. 4 is a side view of a chip mounting frame for a ceramic heat sink of the present invention for easy installation;
fig. 5 is a schematic view of an air cooling fin of a ceramic heat sink of the present invention for easy installation;
fig. 6 is a top view of the first ceramic patch of the ceramic heat sink convenient for installation of the present invention.
In the figure: 1. a first ceramic patch; 2. a second ceramic patch; 3. a frame fixing groove; 4. a heat-conducting copper plate; 5. the copper plate is divided into fins; 6. mounting a patch mounting frame; 7. fixing the clamping groove; 8. a frame stripper plate; 9. pressing the button; 10. a first adapter; 11. a second adapter; 12. fixing the pressing nail; 13. a first heat conducting copper tube; 14. a second heat conducting copper pipe; 15. transferring a copper pipe; 16. air heat dissipation fins; 17. and heat conducting adhesion.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-6, a ceramic heat sink convenient for installation comprises a first ceramic patch 1 and a second ceramic patch 2, wherein the first ceramic patch 1 is located above the second ceramic patch 2, two frame fixing grooves 3 are respectively formed on the outer sides of the first ceramic patch 1 and the second ceramic patch 2, heat-conducting copper plates 4 are respectively fixedly mounted on the inner surfaces of the first ceramic patch 1 and the second ceramic patch 2, a plurality of copper plate sub-fins 5 are respectively fixedly mounted on the upper surface and the lower surface of each heat-conducting copper plate 4, patch mounting frames 6 are respectively arranged on the outer surfaces of the first ceramic patch 1 and the second ceramic patch 2 at the outer side positions of the frame fixing grooves 3, a plurality of fixing clamping grooves 7 are formed on the inner side of the patch mounting frames 6, a frame extruding plate 8 is arranged on the inner side of the fixing clamping grooves 7, an extruding button 9 is fixedly mounted on the lower surface of the frame extruding plate 8, the upper surface of the first ceramic patch 1 is provided with a first adapter seat 10 and a second adapter seat 11, the first adapter seat 10 is positioned at one side of the second adapter seat 11, the inner sides of the first adapter seat 10 and the second adapter seat 11 are both fixedly provided with a fixed pressing nail 12, the outer surface of one side of the first adapter seat 10 is fixedly provided with a first heat conduction copper pipe 13, the outer surface of one side of the second adapter seat 11 is fixedly provided with a second heat conduction copper pipe 14, one end of the first heat conduction copper pipe 13, which is far away from the first adapter seat 10, and one end of the second heat conduction copper pipe 14, which is far away from the second adapter seat 11, are fixedly provided with an adapter copper pipe 15, the outer side of the adapter copper pipe 15 is provided with a plurality of air heat dissipation fins 16, and heat conduction adhesive connecting pastes 17 are adhered to the lower surface of the first ceramic patch 1 and the upper;
in this embodiment, the first ceramic patch 1 and the second ceramic patch 2 are both rectangular solids, and the first ceramic patch 1 and the second ceramic patch 2 are vertically arranged and installed.
In this embodiment, in order to increase the heat conduction effect of first ceramic paster 1 and second ceramic paster 2, copper divides fin 5 to pass through integrated into one piece and heat conduction copper 4 fixed connection, and copper divides fin 5 to be connected with the inner wall laminating of first ceramic paster 1 and second ceramic paster 2, and heat conduction copper 4 and copper divide fin 5 to pass through the structure of copper material, increase the effect of heat conduction in the inside of first ceramic paster 1 and second ceramic paster 2.
In this embodiment, in order to connect the first ceramic chip 1 and the second ceramic chip 2, the number of the chip mounting frames 6 is two, the chip mounting frames 6 are clamped into the inner side of the frame fixing groove 3 to be fixedly connected with the first ceramic chip 1 and the second ceramic chip 2, and the chip mounting frames 6 can connect the first ceramic chip 1 and the second ceramic chip 2.
In the embodiment, in order to push the second ceramic patch 2 to move, the patch mounting frame 6 is a v-21274, and has a shape structure design, two sides of the frame pressing plate 8 are clamped into the inner side of the fixing clamping groove 7 to be fixedly connected with the patch mounting frame 6, the frame pressing plate 8 is located below the second ceramic patch 2, and the frame pressing plate 8 pushes below the second ceramic patch 2.
In this embodiment, in order to fix first adapter 10 and second adapter 11, fixed pressure nail 12 penetrates first adapter 10 and second adapter 11 and first ceramic paster 1 fixed connection, and first adapter 10 and second adapter 11 pass through fixed pressure nail 12 and first ceramic paster 1 fixed connection, and first adapter 10 and second adapter 11 are placed the installation in parallel.
In this embodiment, the first heat conduction copper pipe 13 and the second heat conduction copper pipe 14 have the same size, the first heat conduction copper pipe 13 and the second heat conduction copper pipe 14 are symmetrically arranged, and both the first heat conduction copper pipe 13 and the second heat conduction copper pipe 14 are inserted into the inner position of the adapter copper pipe 15.
In this embodiment, in order to dissipate heat, the adapting copper tube 15 penetrates the air heat dissipating fins 16, the air heat dissipating fins 16 are fixedly connected with the adapting copper tube 15 by welding, the air heat dissipating fins 16 are arranged in a straight line, the air heat dissipating fins 16 are designed to be an aluminum structure, and the aluminum structure of the air heat dissipating fins 16 can increase the heat dissipating effect.
In this embodiment, the adapting copper tube 15 is vertically arranged with the first ceramic patch 1, and the air heat sink fin 16 is located above the first ceramic patch 1.
It should be noted that the utility model is a ceramic heat sink convenient for installation, when in use, the first ceramic patch 1 and the second ceramic patch 2 form the main structure part of the ceramic heat sink, which is used for heat derivation and heat dissipation at the installation position, when the first ceramic patch 1 and the second ceramic patch 2 are installed, the adhesion installation effect and the heat conduction effect are increased by the heat conduction adhesion connection 17, when the first ceramic patch 1 and the second ceramic patch 2 are installed and used, the first ceramic patch 1 and the second ceramic patch 2 are attached around the upper and lower parts of the installation position, then the patch installation frame 6 is connected with the first ceramic patch 1 and the second ceramic patch 2 by clamping the inner side of the frame fixing groove 3, by upwards pressing the frame extrusion plate 8 at the inner side of the patch installation frame 6, the frame extrusion plate 8 is moved upwards to push the second ceramic patch 2, then, the first ceramic patch 1 and the second ceramic patch 2 are clamped at the outer side of the installation position by matching with the pulling of the patch installation frame 6, meanwhile, the frame extrusion plate 8 is clamped at the inner side of the fixing clamping groove 7 for fixing, the first ceramic patch 1 and the second ceramic patch 2 are firmly pushed tightly, and are quickly installed and fixed, when the first ceramic patch 1 and the second ceramic patch 2 conduct heat conduction and heat dissipation, the first ceramic patch 1 and the second ceramic patch 2 increase the heat conduction efficiency through the internal heat conduction copper plate 4, meanwhile, the copper plate sub-fins 5 can increase the heat contact area, the first ceramic patch 1 can transfer heat to the first adapter 10 and the second adapter 11, the heat is transferred to the first heat conduction copper pipe 13 and the second heat conduction copper pipe 14 through the first adapter 10 and the second adapter 11, and finally, the first heat conduction copper pipe 13 and the second heat conduction copper pipe 14 transfer heat to the adapter 15, the contact area between the air and the air is increased through the plurality of air heat dissipation fins 16 on the switching copper pipe 15, efficient heat dissipation and cooling are carried out, and a structure that the heat is absorbed through the first ceramic patch 1 and the second ceramic patch 2 and then the heat is dissipated through the air heat dissipation fins 16 is formed.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. The utility model provides a ceramic cooling fin convenient to installation which characterized in that: comprises a first ceramic patch (1) and a second ceramic patch (2), wherein the first ceramic patch (1) is positioned above the second ceramic patch (2), two frame fixing grooves (3) are respectively formed in the outer sides of the first ceramic patch (1) and the second ceramic patch (2), heat-conducting copper plates (4) are respectively and fixedly arranged on the inner surfaces of the first ceramic patch (1) and the second ceramic patch (2), a plurality of copper plate sub-fins (5) are respectively and fixedly arranged on the upper surface and the lower surface of each heat-conducting copper plate (4), a patch mounting frame (6) is respectively arranged at the outer side positions, positioned on the frame fixing grooves (3), of the outer surfaces of the first ceramic patch (1) and the second ceramic patch (2), a plurality of fixing clamping grooves (7) are formed in the inner side of the patch mounting frame (6), and a frame extrusion plate (8) is arranged at the inner side position, positioned on the fixing clamping grooves (7), of the patch mounting frame (6), the lower surface of the frame extrusion plate (8) is fixedly provided with an extrusion button (9), the upper surface of the first ceramic patch (1) is provided with a first adapter (10) and a second adapter (11), the first adapter (10) is positioned at one side of the second adapter (11), the inner sides of the first adapter (10) and the second adapter (11) are fixedly provided with a fixed pressing nail (12), the outer surface of one side of the first adapter (10) is fixedly provided with a first heat conduction copper pipe (13), the outer surface of one side of the second adapter (11) is fixedly provided with a second heat conduction copper pipe (14), one end of the first heat conduction copper pipe (13) far away from the first adapter (10) and one end of the second heat conduction copper pipe (14) far away from the second adapter (11) are fixedly provided with an adapter copper pipe (15), the outer side of the adapter copper pipe (15) is provided with a plurality of air heat dissipation fins (16), and the lower surface of the first ceramic patch (1) and the upper surface of the second ceramic patch (2) are both adhered with heat conducting adhesive connecting pastes (17).
2. A ceramic heat sink for ease of installation as recited in claim 1 wherein: the shape of first ceramic paster (1) and second ceramic paster (2) is the cuboid, first ceramic paster (1) and second ceramic paster (2) are arranged the installation perpendicularly.
3. A ceramic heat sink for ease of installation as recited in claim 1 wherein: the copper divides fin (5) to pass through integrated into one piece and heat conduction copper (4) fixed connection, the copper divides fin (5) to be connected with the laminating of the inner wall of first ceramic paster (1) and second ceramic paster (2).
4. A ceramic heat sink for ease of installation as recited in claim 1 wherein: the number of paster installation frame (6) is two, inboard and first ceramic paster (1) and second ceramic paster (2) fixed connection to frame fixed slot (3) are gone into to paster installation frame (6).
5. A ceramic heat sink for ease of installation as recited in claim 1 wherein: the patch mounting frame (6) is of a v-21274and a V-shaped structure design, two sides of the frame extrusion plate (8) are clamped into the inner side of the fixed clamping groove (7) to be fixedly connected with the patch mounting frame (6), and the frame extrusion plate (8) is located below the second ceramic patch (2).
6. A ceramic heat sink for ease of installation as recited in claim 1 wherein: the fixed pressure nail (12) runs through a first adapter (10) and a second adapter (11) and is fixedly connected with the first ceramic patch (1), the first adapter (10) and the second adapter (11) are fixedly connected with the first ceramic patch (1) through the fixed pressure nail (12), and the first adapter (10) and the second adapter (11) are arranged in parallel.
7. A ceramic heat sink for ease of installation as recited in claim 1 wherein: the sizes of the first heat conduction copper pipes (13) and the second heat conduction copper pipes (14) are the same, the first heat conduction copper pipes (13) and the second heat conduction copper pipes (14) are symmetrically arranged and installed, and the first heat conduction copper pipes (13) and the second heat conduction copper pipes (14) are inserted into the inner positions of the adapter copper pipes (15).
8. A ceramic heat sink for ease of installation as recited in claim 1 wherein: the air cooling fin structure is characterized in that the switching copper tube (15) penetrates through the air cooling fins (16), the air cooling fins (16) are fixedly connected with the switching copper tube (15) through welding, the air cooling fins (16) are arranged in a straight line, and the air cooling fins (16) are designed to be made of aluminum.
9. A ceramic heat sink for ease of installation as recited in claim 1 wherein: the switching copper tubes (15) and the first ceramic patches (1) are vertically arranged, and the air heat dissipation fins (16) are located above the first ceramic patches (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202021709270.7U CN212413692U (en) | 2020-08-17 | 2020-08-17 | Ceramic radiating fin convenient to install |
Applications Claiming Priority (1)
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CN202021709270.7U CN212413692U (en) | 2020-08-17 | 2020-08-17 | Ceramic radiating fin convenient to install |
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CN212413692U true CN212413692U (en) | 2021-01-26 |
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CN202021709270.7U Expired - Fee Related CN212413692U (en) | 2020-08-17 | 2020-08-17 | Ceramic radiating fin convenient to install |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112074149A (en) * | 2020-08-17 | 2020-12-11 | 容泰半导体(江苏)有限公司 | Ceramic radiating fin convenient to install |
-
2020
- 2020-08-17 CN CN202021709270.7U patent/CN212413692U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112074149A (en) * | 2020-08-17 | 2020-12-11 | 容泰半导体(江苏)有限公司 | Ceramic radiating fin convenient to install |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210126 Termination date: 20210817 |