CN216600554U

CN216600554U - High-efficient heat abstractor of external heat transfer source

Info

Publication number: CN216600554U
Application number: CN202122598822.2U
Authority: CN
Inventors: 朱超; 徐金博; 高丙午
Original assignee: Dongguan City Hao Electronic Technology Co ltd
Current assignee: Dongguan City Hao Electronic Technology Co ltd
Priority date: 2021-10-27
Filing date: 2021-10-27
Publication date: 2022-05-24
Anticipated expiration: 2031-10-27

Abstract

The utility model belongs to the technical field of heat dissipation equipment, and particularly relates to an external heat exchange source efficient heat dissipation device which comprises an installation mechanism and a heat exchange mechanism, wherein the installation mechanism comprises a first installation seat and a second installation seat, the heat exchange mechanism comprises a first fin component, a second fin component and a heat transfer pipe, the first fin component and the second fin component are respectively arranged on the first installation seat and the second installation seat, and two ends of the heat transfer pipe are respectively abutted against the first fin component and the second fin component; be provided with the heat-conducting plate that can the butt PCB generate heat the source on the first mount pad, the tip of heat-transfer pipe extends to between heat-conducting plate and the first fin subassembly, the lateral wall both ends of heat-transfer pipe respectively with first fin subassembly and heat-conducting plate butt. Carry out partial heat transfer through setting up the first fin subassembly near PCB earlier, with another partial heat transfer to the second fin subassembly of PCB one side through the heat-transfer pipe that extends, realize two-way heat dissipation, greatly improve radiating fin's heat transfer area, radiating efficiency effectively.

Description

High-efficient heat abstractor of external heat transfer source

Technical Field

The utility model belongs to the technical field of heat dissipation equipment, and particularly relates to an efficient heat dissipation device with an external heat exchange source.

Background

The CPU (central processing unit) fan is also called a heat radiation fan, is a fan used for radiating the CPU, is provided for a radiator and a case, and is used for quickly conducting the heat of the CPU out and blowing the heat to the nearby air so as to achieve the effect of cooling. The cooling effect is directly related to the quality of the CPU cooling fan and the cooling fin. The CPU fan is of various kinds depending on the place of installation size, kind of bearing, number of blades, and the like.

Along with science and technology development, the wind channel design of quick-witted case changes gradually, and the radiator among the prior art mostly only has fin and copper tubular construction, and copper pipe, fin and CPU butt realize heat-conduction, and the fan of machine case passes through the wind channel and takes away the heat of fin and copper pipe from the machine case, realizes the heat dissipation.

However, most of the conventional fins are directly stacked on the CPU, and in order to reduce the load of the frame for loading the fins, the number of fins in the prior art is small, the contact area between the heat conduction of the fins and the air flow in the air duct is small, the heat transfer efficiency is not high, and the heat dissipation effect is seriously affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an efficient heat dissipation device with an external heat exchange source, and aims to solve the technical problems that in the prior art, the contact area between fin heat conduction of a radiator and airflow in an air duct is small, the heat transfer efficiency is not high, and the heat dissipation effect is seriously influenced.

In order to achieve the above object, an embodiment of the present invention provides an external heat exchange source efficient heat dissipation device, including a mounting mechanism and a heat exchange mechanism, where the mounting mechanism includes a first mounting seat and a second mounting seat, the first mounting seat is disposed on a preset mounting position of a PCB and aligned with the preset mounting position, and the second mounting seat is connected to one end of the first mounting seat; the heat exchange mechanism comprises a first fin assembly, a second fin assembly and a heat transfer pipe, the first fin assembly and the second fin assembly are respectively arranged on the first mounting seat and the second mounting seat, and two ends of the heat transfer pipe are respectively abutted against the first fin assembly and the second fin assembly; the heat conduction plate capable of being abutted to a PCB heating source is arranged on the first mounting seat, the end portion of the heat conduction pipe extends to the heat conduction plate and between the first fin assemblies, and two ends of the outer side wall of the heat conduction pipe are respectively abutted to the first fin assemblies and the heat conduction plate.

Optionally, the first mounting seat includes a first loading plate and a first limiting frame, the first loading plate is disposed on a preset mounting position of the PCB, and the first limiting frame is disposed on the first loading plate and is formed with a first mounting groove for mounting the first fin assembly.

Optionally, the first loading plate is arranged along the horizontal direction, the first loading plate is formed with a first end face and a second end face in a vertically symmetrical mode, a first limiting hole is formed in the first end face, a heat exchange aluminum pipe is installed in the first limiting hole, a second limiting hole is formed in the second end face, the heat conduction plate is arranged in the second limiting hole, the first limiting hole is communicated with the second limiting hole, and the heat exchange aluminum pipe is abutted to the heat conduction plate for heat transfer.

Optionally, be provided with on the first terminal surface and be used for spacingly the spacing part of heat-transfer pipe, spacing part includes first spacing platform and the spacing platform of second, first spacing platform with the spacing platform of second sets up respectively the both ends of first terminal surface just are located respectively the both sides in first spacing hole, first spacing platform with be provided with respectively on the spacing platform of second can the joint adaptation the first draw-in groove and the second draw-in groove of heat-transfer pipe, first fin subassembly is installed in the first mounting groove, the tip joint adaptation of heat-transfer pipe is in first draw-in groove with in the second draw-in groove, the upper and lower both ends of heat-transfer pipe respectively with the heat transfer aluminum pipe with the bottom butt of first fin subassembly.

Optionally, the second mounting seat includes a connection seat and a second loading plate, the second loading plate is disposed at one end of the first mounting seat, the connection seat is fixedly disposed at the bottom of the second loading plate, the other end of the connection seat is connected to the PCB, and the second fin assembly is fixedly disposed on the second loading plate; the two ends of the second loading plate extend horizontally and oppositely, the number of the second fin assemblies is two, the two groups of the second fin assemblies are arranged at the two ends of the second loading plate respectively, the number of the heat transfer pipes is multiple, and the multiple groups of the heat transfer pipes are uniformly distributed on the two groups of the second fin assemblies.

One or more technical schemes in the high-efficiency heat dissipation device with the external heat exchange source provided by the embodiment of the utility model at least have one of the following technical effects: the high-efficiency heat dissipation device with the external heat exchange source comprises a heat conduction plate, a first fin assembly, a second fin assembly, a heat conduction pipe and a heat conduction pipe.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of an external heat exchange source efficient heat dissipation device according to an embodiment of the present invention.

Fig. 2 is an exploded view of the high-efficiency heat dissipation device with an external heat source in fig. 1.

Fig. 3 is a schematic structural diagram of a first loading plate according to an embodiment of the present invention.

Fig. 4 is an exploded view of an external heat exchange source high-efficiency heat dissipation device according to another embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

10-installation mechanism 20-heat exchange mechanism 11-first installation seat

12-second mounting base 21-first fin assembly 22-second fin assembly

23-heat exchange copper pipe 24-heat transfer pipe 25-heat conduction plate

111-first loading plate 112-first limit frame 113-first end face

114-second end face 115-first limiting hole 231-abutting pipe

232-extension pipe 121-connecting seat 122-second loading plate

26-heat exchange aluminum pipe.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to fig. 1-4 are exemplary and intended to be used to illustrate embodiments of the utility model, and should not be construed as limiting the utility model.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.

In an embodiment of the present invention, as shown in fig. 1 to 4, an external heat exchange source efficient heat dissipation apparatus is provided, including a mounting mechanism 10 and a heat exchange mechanism 20, where the mounting mechanism 10 includes a first mounting seat 11 and a second mounting seat 12, the first mounting seat 11 is disposed on a preset mounting position of a PCB and aligned with the preset mounting position, and the second mounting seat 12 is connected to one end of the first mounting seat 11; the heat exchange mechanism 20 comprises a first fin assembly 21, a second fin assembly 22 and a heat transfer pipe 24, the first fin assembly 21 and the second fin assembly 22 are respectively arranged on the first mounting seat 11 and the second mounting seat 12, and two ends of the heat transfer pipe 24 are respectively abutted against the first fin assembly 21 and the second fin assembly 22; the first mounting seat 11 is provided with a heat conducting plate 25 capable of contacting a PCB heat source, an end portion of the heat conducting pipe 24 extends between the heat conducting plate 25 and the first fin assembly 21, both ends of an outer side wall of the heat conducting pipe 24 are respectively contacted with the first fin assembly 21 and the heat conducting plate 25, in this embodiment, the heat conducting pipe 24 is cast and molded by a casting machine made of copper alloy, and the heat conducting pipe 24 is internally filled with heat conducting liquid.

Specifically, the heat transfer pipe 24 at one end transfers heat on the heat conduction plate 25 to the first fin assembly 21, and the heat transfer pipe 24 at the other end transfers heat to the second fin assembly 22, compared with the technical problems that the contact area between the fin heat conduction of the traditional radiator and air flow in an air duct is small, the heat transfer efficiency is not high, and the heat dissipation effect is seriously affected.

As shown in fig. 1 to 4, in another embodiment of the present invention, the first mounting seat 11 includes a first loading plate 111 and a first limiting frame 112, the first loading plate 111 is disposed on a predetermined PCB mounting position, the first limiting frame 112 is disposed on the first loading plate 111 and is formed with a first mounting groove for mounting the first fin assembly 21, specifically, the first loading plate 111 is connected to a heat source of a PCB by a screw thread, the first limiting frame 112 includes two limiting side plates, the two limiting side plates are respectively disposed on two sides of an end portion of the first loading plate 111, the first mounting groove is formed between the two connecting side plates, the first fin assembly 21 includes a plurality of sets of first heat dissipating fins, the plurality of sets of first heat dissipating fins are disposed on the first loading plate 111 in parallel at intervals, the first heat dissipating fins are disposed in parallel with the limiting side plates, an air channel structure parallel to the limiting side plate is formed between the adjacent first radiating fins, and the bottom parts of the first radiating fins are abutted to the heat transfer pipe 24.

In another embodiment of the present invention, as shown in fig. 1 to 4, the first loading plate 111 is arranged along a horizontal direction, the first loading plate 111 is formed with a first end surface 113 and a second end surface 114 in a vertical symmetry manner, a first limiting hole 115 is formed on the first end surface 113, a heat exchange aluminum pipe 26 is installed in the first limiting hole 115, a second limiting hole is formed on the second end surface 114, the heat conducting plate 25 is arranged in the second limiting hole, the first limiting hole 115 is communicated with the second limiting hole, the heat exchange aluminum pipe 26 and the heat conducting plate 25 are in butt joint for heat transfer, specifically, the limiting side plate is arranged at the edge of the first end surface 113, the first limiting hole 115 comprises an extending groove and a butt joint groove, the butt joint groove is located at the middle position of the first end surface 113, the number of the extending grooves is two, the extending grooves are symmetrically arranged at two sides of the butt joint groove, the heat exchange aluminum pipe 26 comprises an S-shaped aluminum pipe and a U-shaped aluminum pipe, the S-shaped aluminum pipe is fixedly arranged in the butt joint groove, one end of the U-shaped aluminum pipe is arranged in the corresponding extension groove, and the other end of the U-shaped aluminum pipe extends to the butt joint groove and the outer side wall of the S-shaped aluminum pipe is abutted to the outer side wall of the U-shaped aluminum pipe.

As shown in fig. 4, in another embodiment of the present invention, the first loading plate 111 is disposed along a horizontal direction, the first loading plate 111 is formed with a first end surface 113 and a second end surface 114 in a vertical symmetry manner, a first limiting hole 115 is formed on the first end surface 113, a heat exchange copper tube 23 is installed in the first limiting hole 115, a second limiting hole is formed on the second end surface 114, the heat conducting plate 25 is disposed in the second limiting hole, the first limiting hole 115 is communicated with the second limiting hole, and the heat exchange copper tube 23 is abutted to the heat conducting plate 25 for heat transfer; the number of the heat exchange copper pipes 23 in this embodiment is multiple, multiple sets of the heat exchange copper pipes 23 are laid in the abutting groove in parallel, two ends of each heat exchange copper pipe 23 are bent and extend upwards to the first fin assembly 21, and the end of each heat exchange copper pipe 23 abuts against the first fin assembly 21 to realize heat exchange.

As shown in fig. 4, in this embodiment, the heat exchange copper tube 23 includes an abutting tube 231 and an extending tube 232, the abutting tube 231 is disposed in the first limiting hole 115, one end of the extending tube 232 is connected to the abutting tube 231, and the other end of the extending tube 232 abuts against the first fin assembly 21 for heat exchange.

Specifically, the heat exchange copper pipe 23 is in a U-shaped cladding structure and is matched with the first fin assembly 21 to wrap the heat transfer pipe 24, heat of a heat source is firstly transferred to the abutting pipe 231 through the heat conduction plate 25, the abutting pipe 231 transfers heat to the heat transfer pipe 24 and simultaneously transfers heat to the first fin assembly 21 through the extension pipe 232, and the first fin assembly 21 is abutted against the heat transfer pipe 24, so that the first fin assembly 21 has two heat sources; compared with the technical problems that in the prior art, two ends of a copper pipe are respectively abutted against a fin and a CPU (central processing unit) which are close to the copper pipe, the copper pipe is easy to deform and damage under the working condition of uneven heating for a long time, and the enterprise development is not facilitated, in the heat dissipation device provided by the embodiment of the utility model, the heat exchange copper pipe 23 abutted against the heat transfer pipe 24 is not only in heat transfer with the heat transfer pipe 24, but also in heat transfer with the first fin assembly 21, the temperatures applied to the upper end and the lower end of the heat transfer pipe 24 are close, the temperature difference is low, the defect that the heat transfer pipe 24 deforms due to overlarge temperature difference and the heat dissipation effect is influenced is effectively overcome, the service life of the heat dissipation device is favorably prolonged, the practicability of the heat dissipation device is further improved, and the enterprise development is facilitated.

As shown in fig. 1 to 3, in another embodiment of the present invention, the first end surface 113 is provided with a limiting member for limiting the heat transfer pipe 24, the limiting member includes a first limiting table and a second limiting table, the first limiting table and the second limiting table are respectively disposed at two ends of the first end surface 113 and are respectively located at two sides of the first limiting hole 115, the first limiting table and the second limiting table are respectively provided with a first clamping groove and a second clamping groove capable of being clamped and adapted to the heat transfer pipe 24, the first fin assembly 21 is mounted in the first mounting groove, an end of the heat transfer pipe 24 is clamped and adapted in the first clamping groove and the second clamping groove, upper and lower ends of the heat transfer pipe 24 are respectively abutted against the heat exchange aluminum pipe 26 and the bottom of the first fin assembly 21, specifically, the number of the heat transfer pipes 24 in this embodiment is plural, the end of each heat transfer pipe 24 is formed with a sealing end, the sealing end is formed by hot melting after the heat transfer pipe 24 is filled with heat conducting liquid by a hot melting sealing machine, the sealing end is in clamping fit with the first clamping groove, all the heat transfer pipes 24 are sequentially arranged along the horizontal direction, and the whole calandria structure formed by all the heat transfer pipes 24 is in clamping fit with the second clamping groove.

As shown in fig. 1 to 3, in another embodiment of the present invention, the second mounting seat 12 includes a connection seat 121 and a second loading plate 122, the second loading plate 122 is disposed at one end of the first mounting seat 11, the connection seat 121 is fixedly disposed at the bottom of the second loading plate 122, the other end of the connection seat 121 is connected to a PCB, and the second fin assembly 22 is fixedly disposed on the second loading plate 122; two ends of the second loading plate 122 extend horizontally and oppositely, the number of the second fin assemblies 22 is two, and the two sets of the second fin assemblies 22 are respectively arranged at two ends of the second loading plate 122; specifically, all the heat transfer tubes 24 extending to the outside of the second neck are arranged in a dispersed manner, for example, in the present embodiment, the number of the heat transfer tubes 24 is four, one end of each of two sets of the heat transfer tubes 24 is bent toward one end of the second loading plate 122, one end of each of the other two sets of the heat transfer tubes 24 is bent toward the other end of the second loading plate 122, and the bent end of each of the heat transfer tubes 24 is in contact with the corresponding second fin unit 22 to realize heat transfer.

As shown in fig. 1 to 3, in this embodiment, the second loading plate 122 is fixedly disposed at one end of two sets of the limiting side plates, which is far away from the first fin assembly 21, specifically, the second loading plate 122 is disposed in a rectangular structure, the side walls of the two sets of the limiting side plates of the second loading plate 122 are fixedly connected, reinforcing ribs are formed between the second loading plate 122 and the limiting side plates, and in other embodiments, the second loading plate 122 and the first loading plate 111 are in a split design.

The above description is intended to be illustrative of the preferred embodiment of the present invention and should not be taken as limiting the utility model, but rather, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.

Claims

1. The utility model provides a high-efficient heat abstractor of external heat transfer source which characterized in that includes:

the installation mechanism comprises a first installation seat and a second installation seat, the first installation seat is arranged on a preset installation position of the PCB and is aligned with the preset installation position, and the second installation seat is connected to one end of the first installation seat;

the heat exchange mechanism comprises a first fin assembly, a second fin assembly and a heat transfer pipe, the first fin assembly and the second fin assembly are respectively arranged on the first mounting seat and the second mounting seat, and two ends of the heat transfer pipe are respectively abutted to the first fin assembly and the second fin assembly;

wherein, be provided with the heat-conducting plate that can butt PCB generate heat the source on the first mount pad, the tip of heat-conducting pipe extends to the heat-conducting plate with between the first fin subassembly, the lateral wall both ends of heat-conducting pipe respectively with first fin subassembly with the heat-conducting plate butt.

2. The external heat exchange source high-efficiency heat dissipation device as recited in claim 1, wherein: the first mounting seat comprises a first loading plate and a first limiting frame, the first loading plate is arranged on a PCB (printed Circuit Board) preset mounting position, and the first limiting frame is arranged on the first loading plate and is provided with a first mounting groove for mounting the first fin assembly.

3. The external heat exchange source high-efficiency heat dissipation device as recited in claim 2, wherein: the first loading plate is arranged along the horizontal direction, a first end face and a second end face are formed on the first loading plate in an up-down symmetrical mode, a first limiting hole is formed in the first end face, a heat exchange aluminum pipe is installed in the first limiting hole, a second limiting hole is formed in the second end face, the heat conduction plate is arranged in the second limiting hole, the first limiting hole is communicated with the second limiting hole, and the heat exchange aluminum pipe is abutted to the heat conduction plate for heat transfer.

4. The external heat exchange source high-efficiency heat dissipation device as recited in claim 3, wherein: be provided with on the first terminal surface and be used for spacingly the spacing part of heat-transfer pipe, spacing part includes first spacing platform and the spacing platform of second, first spacing platform with the spacing platform of second sets up respectively the both ends of first terminal surface just are located respectively the both sides in first spacing hole, first spacing platform with be provided with respectively on the spacing platform of second can the joint adaptation the first draw-in groove and the second draw-in groove of heat-transfer pipe, first fin subassembly is installed in the first mounting groove, the tip joint adaptation of heat-transfer pipe is in first draw-in groove with in the second draw-in groove, the upper and lower both ends of heat-transfer pipe respectively with the heat transfer aluminum pipe with the bottom butt of first fin subassembly.

5. The external heat exchange source efficient heat dissipation device as recited in any one of claims 1 to 4, wherein: the second mounting seat comprises a connecting seat and a second loading plate, the second loading plate is arranged at one end of the first mounting seat, the connecting seat is fixedly arranged at the bottom of the second loading plate, the other end of the connecting seat is connected with the PCB, and the second fin assembly is fixedly arranged on the second loading plate;

the two ends of the second loading plate extend horizontally and oppositely, the number of the second fin assemblies is two, the two groups of the second fin assemblies are arranged at the two ends of the second loading plate respectively, the number of the heat transfer pipes is multiple, and the multiple groups of the heat transfer pipes are uniformly distributed on the two groups of the second fin assemblies.