CN212147208U

CN212147208U - A encapsulation moulding press for COB encapsulation LED display element

Info

Publication number: CN212147208U
Application number: CN201922215739.5U
Authority: CN
Inventors: 马新峰; 段健楠; 刘臣; 赵国惠; 韩悦
Original assignee: Changchun Xi Long Display Technology Co ltd
Current assignee: Changchun Xi Long Display Technology Co ltd
Priority date: 2019-12-12
Filing date: 2019-12-12
Publication date: 2020-12-15
Anticipated expiration: 2029-12-12

Abstract

The utility model relates to a packaging mould press for COB packaging LED display unit, in the compression molding component of the mould press, an upper mold moving guide post is fixed on a machine base, the lower part of the upper mold moving guide post is fixedly connected with a mould pressing lower mold platform, and the upper part of the upper mold moving guide post is fixedly connected with a motor fixing platform; the upper die heating platform is positioned between the motor fixing platform and the die pressing lower die platform; an output shaft of an upper die driving motor fixed on the motor fixing platform is connected with the upper die heating platform through a lifting support; the upper die tool is fixed below the upper die heating platform; the lower die tool is fixed on the die pressing lower die platform; and the die pressing film is flatly paved on the lower die tool. Adsorbing an un-encapsulated material below the upper die tool, injecting glue on the die pressing film after preheating, and controlling the upper die tool and the lower die tool to be pressed; and finally, after the glue is cured, lifting the upper die tool to complete the packaging of the LED display unit. The utility model discloses can effectual solution unit plate surface homogeneity and thickness uniformity problem.

Description

A encapsulation moulding press for COB encapsulation LED display element

Technical Field

The utility model belongs to the technical field of high density LED display screen encapsulation, a encapsulation moulding press that is used for COB to encapsulate little interval LED display element is related to.

Background

COB packaging small-spacing LED display unit is characterized in that an LED light-emitting chip is fixed on a circuit board and is controlled to emit light through a drive IC, the surface of the LED display unit is usually protected through epoxy resin, and the epoxy resin has the functions of collision prevention, moisture prevention, static prevention, corrosion prevention and the like.

The epoxy resin is liquid glue, is filled on the driving circuit board with the LED light-emitting chip, and is in an irregular shape after being solidified. Because of the extremely high flatness required of LED display units, there are several processing modalities currently in the industry, one in the form of machining and the other in the form of molding presses. The mechanical processing mode has the advantages of easy realization, low production efficiency and low precision, the mode of the mould press has the advantages of high precision of the packaging module, good surface consistency and difficult realization, and because of the characteristics of the liquid glue, the defects of bubbles, cavities, uneven thickness and the like are easily generated in the pressing process.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to provide a packaging moulding press for COB encapsulation LED display element, this moulding press can make full use of membrane surface's uniformity promote display element surface uniformity.

In order to solve the technical problem, the packaging molding press for COB packaging LED display units comprises a compression molding assembly; the compression molding assembly comprises a machine base, a plurality of upper die moving guide columns, an upper die driving motor, a motor fixing platform, a lifting support, an upper die heating platform, an upper die tool with a vacuum adsorption function, a lower die tool and a compression molding lower die platform; the upper die moving guide column is fixed on the machine base, the lower part of the upper die moving guide column is fixedly connected with the die pressing lower die platform, and the upper part of the upper die moving guide column is fixedly connected with the motor fixing platform; the upper die heating platform is positioned between the motor fixing platform and the die pressing lower die platform, the upper die driving motor is fixedly installed on the motor fixing platform, and an output shaft of the upper die driving motor is connected with the upper die heating platform through the lifting support; the upper die tool is fixed below the upper die heating platform; the lower die tool is fixed on the die pressing lower die platform; and the die pressing film is flatly paved on the lower die tool.

The non-sealing material can be adsorbed below the upper die tool, and is preheated through the upper die heating platform; then pouring glue on the mould pressing film, and controlling the upper mould tool and the lower mould tool to be pressed; and finally, after the glue is cured, lifting the upper die tool to complete the packaging of the LED display unit.

Furthermore, the utility model can also comprise a film conveying system; the film conveying system comprises a driving wheel bracket, a film discharging motor, a driving wheel, a driven wheel, an expansion bracket, an expansion wheel and a die pressing film roll; the movable wheel bracket and the expansion bracket are fixed on the machine base, the film outlet motor, the driving wheel and the driven wheel are arranged on the movable wheel bracket, and the expansion wheel is arranged on the expansion bracket; the mould pressing film roll is arranged on the expansion wheel, and one side of the mould pressing film roll is wound on the driving wheel; the driven wheel is positioned above the driving wheel and compresses the molded film; the mould pressing film part is positioned on the upper surface of the lower mould tool; the glue injection needle of the glue injection system is positioned above the mould pressing film.

A plurality of through holes are distributed at the position of the upper die heating platform close to the edge, and a plurality of upper die moving guide columns respectively penetrate through the through holes; the lifting support consists of a connecting platform with a screw hole in the middle and a plurality of connecting rods; an output shaft of the upper die driving motor is in threaded connection with the connecting platform through a lead screw; the connecting platform is connected with the upper die heating platform through the connecting rod, and the upper die driving motor can drive the upper die heating platform to move up and down along the upper die moving guide post through the lifting support.

The upper die tooling is connected to the lower surface of the upper die heating platform through screws.

The lower edge of the upper die tool is integrally connected with a plurality of positioning columns; when the upper die tool with the non-sealing material is pressed with the lower die tool, the bottom of the positioning column is clamped in the corresponding hole position of the lower die tool, so that the positioning effect is achieved, and the thickness of the glue layer is controlled.

Furthermore, the utility model can also comprise a feeding component; the feeding assembly comprises a conveying motor, a feeding and discharging platform, a conveying track, a lifting platform and a conveying platform; the conveying motor is fixed on one side of the conveying track; the transmission platform is connected with the transmission track, and an output shaft of the transmission motor is connected with the transmission platform and can drive the transmission platform to move along the transmission track; the lifting platform is arranged on the conveying platform, and the feeding and discharging platform is arranged on the lifting platform; under the drive of the conveying motor, the feeding and discharging platform can move to a position between the upper die tool and the lower die tool along with the conveying platform.

Furthermore, the utility model can also comprise a material sucking component; the material sucking component comprises a stand column, a material sucking X guide rail, a material sucking Z shaft, a right-angle rotating motor, a material A sucking head, a material B sucking head, a material box A and a material box B; two upright posts are fixed on the machine base; the material sucking X guide rail is fixed on the two upright posts; the material sucking Z guide rail is connected with the material sucking X guide rail and can horizontally move along the material sucking X guide rail; the material suction Z shaft is connected with the material suction Z guide rail and can move up and down along the material suction Z guide rail; the right-angle rotary motor is arranged at the bottom of the material sucking Z shaft, an output shaft of the right-angle rotary motor is connected with the material sucking head A and the material sucking head B, the material sucking head A and the material sucking head B are perpendicular to each other, and the right-angle rotary motor can drive the material sucking head A and the material sucking head B to rotate so that the material sucking head A or the material sucking head B faces downwards; the material box A and the material box B are fixed on the machine base and are positioned on one side of the conveying track; the material sucking Z axis can move to the upper part of the material feeding and discharging platform and the upper part of the material box A or the material box B.

Furthermore, the utility model can also comprise a glue injection component; the glue injection assembly comprises a glue injection three-dimensional displacement mechanism, a glue injection moving frame and a glue injection system; one end of the glue injection moving frame is connected with the three-dimensional displacement mechanism, and the glue injection system is installed and fixed at the other end of the glue injection moving frame; the glue injection system can move to the upper part of the lower die tool along with the glue injection moving frame.

The three-dimensional displacement mechanism comprises a glue injection X-direction guide rail, a glue injection Y-direction guide rail and a glue injection Z-direction guide rail; the glue injection X-direction guide rail is fixed on the machine base; the glue injection Y-direction guide rail is arranged on the glue injection X-direction guide rail and can move along the glue injection X-direction guide rail; the glue injection Z-direction guide rail is arranged on the glue injection Y-direction guide rail and can move along the glue injection Y-direction guide rail; one end of the glue injection moving frame is connected with the glue injection Z-direction guide rail and can move along the glue injection Z-direction guide rail.

The technical effects are as follows:

the to-be-solved difficulty of the utility model is the difficult pressfitting problem of liquid glue. The uniformity of the surface of the film in the molding process can effectively solve the problems of uniformity and thickness uniformity of the surface of the unit plate. The consistency of the surface of the display unit can be ensured through the film conveying system and the tool positioning columns, and the surface effect of the display unit plate of the product is improved. Production automation can be realized through the common cooperation of compression molding subassembly, feed subassembly, inhale material subassembly, injecting glue subassembly, membrane conveying system.

The utility model discloses the main application field is the encapsulation of LED display element, and the non-encapsulating material is the display element semi-manufactured goods after welding luminescent chip and drive IC to the circuit board in advance, uses the moulding press with above-mentioned semi-manufactured goods at the even glue film of its surface encapsulation one deck, makes it become the display element finished product. The glue layer is made of epoxy resin, the uniformity of the surface thickness of the glue layer can be controlled below 0.02 after packaging is finished, and the surface of the glue layer has no obvious uneven defects. The adhesive layer has higher hardness and has the functions of preventing collision, moisture, static electricity and the like.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a perspective view of the present invention.

FIG. 2 is a left side view of the present invention

Fig. 3 to 7 are perspective views of the present invention.

Fig. 8 is a partially enlarged view a of fig. 7.

Fig. 9 is a partially enlarged view B of fig. 7.

Fig. 10 is a schematic view of the work preparation position of the present invention.

Detailed Description

In order to make the technical problem, technical scheme and effect that the utility model solved present clearer, it is right to combine the attached drawing and implement the example below the utility model discloses further detailed description proceeds. It should be understood that the embodiments described herein are exemplary and are to be considered in all respects as illustrative and not restrictive.

The utility model discloses a encapsulation moulding press for COB encapsulation LED display element includes the compression molding subassembly, and the material subassembly is inhaled to the feed subassembly, injecting glue subassembly, membrane conveying system.

As shown in fig. 1, 2 and 3, the compression molding assembly includes a machine base 101, 4 upper mold moving guide posts 102, an upper mold driving motor 103, a motor fixing platform 104, a lifting support 105, an upper mold heating platform 106, an upper mold tool 107, a lower mold tool 108, a mold pressing lower mold platform 109 and a tool positioning post 110; the upper die moving guide column 102 is fixed on the machine base 101, the lower part of the upper die moving guide column is fixedly connected with the die pressing lower die platform 109, and the upper part of the upper die moving guide column is fixedly connected with the motor fixing platform 104; four through holes are distributed at the position of the upper die heating platform 106 close to the edge, and the four upper die moving guide columns 102 are respectively penetrated through the four through holes; the upper die driving motor 103 is fixedly arranged on the motor fixing platform 104; the lifting bracket 105 is composed of a connecting platform 105-2 with a screw hole in the middle and four connecting rods 105-3; an output shaft of the upper die driving motor 103 is in threaded connection with the connecting platform 105-2 through a lead screw 105-1; the connecting platform 105-2 is connected with the upper die heating platform 106 through four connecting rods 105-3; the upper die driving motor 103 can drive the upper die heating platform 106 to move up and down along the upper die moving guide column 102 through the lifting support 105; the upper die tool 107 is fixed below the upper die heating platform 106 through screw connection; the four positioning columns 110 are integrally connected to the lower surface of the upper die tooling 107, and when the upper die tooling 107 with an unsealed material is pressed against the lower die tooling 108, the bottoms of the positioning columns 110 are clamped in corresponding hole positions of the lower die tooling 108, so that the positioning function is achieved, and the thickness of the glue layer is controlled. The lower die tool 108 is fixed on the die pressing lower die platform 109; the upper die tool 107 corresponds to the lower die tool 108 in position; the upper die tool 107 is provided with an air flow channel which can be communicated with a vacuum pump, has a vacuum adsorption function, and the vacuum negative pressure value can reach 0.8Mpa and above after vacuum adsorption.

As shown in fig. 4, the feeding assembly comprises a conveying motor 201, a feeding and discharging platform 202, a conveying track 203, a lifting platform 204 and a conveying platform 205; the conveying motor 201 is fixedly arranged on a conveying track 203; the transmission platform 205 is connected with the transmission rail 203, the output shaft of the transmission motor 201 is connected with the transmission platform 205, and the transmission platform 205 can be driven to move along the transmission rail 203; the lifting platform 204 is disposed on the transfer platform 205, and the feeding and discharging platform 202 is disposed on the lifting platform 204.

As shown in fig. 4 and 5, the suction assembly includes a column 301, a suction X guide 302, a suction Z guide 303, a suction Z shaft 304, a right-angle rotary motor 305, an a material suction head 306, a B material suction head 307, an a material box 308, and a B material box 309; two upright posts 301 are fixed on the machine base 101; a material sucking X guide rail 302 is fixed on the two upright posts 301; the material sucking Z guide rail 303 is connected with the material sucking X guide rail 302 and can horizontally move along the material sucking X guide rail 302; the material suction Z shaft 304 is connected with the material suction Z guide rail 303 and can move up and down along the material suction Z guide rail 303; the right-angle rotary motor 305 is installed at the bottom of the material sucking Z shaft 304, the output shaft of the right-angle rotary motor is perpendicular to the material A sucker 306 and the material B sucker 307, and the material A sucker 306 and the material B sucker 307 are perpendicular to each other, and the right-angle rotary motor 305 can drive the material A sucker 306 and the material B sucker 307 to rotate so that the material A sucker 306 or the material B sucker 307 faces downwards; downward facing magazine or infeed/outfeed platform 202; the A material box 308 and the B material box 309 are fixed on the machine base 101 and positioned at one side of the transfer track 203; the suction Z-axis 304 can be moved over the infeed and outfeed platform 202 and over the A magazine 308 or the B magazine 309.

As shown in fig. 6, the glue injection assembly includes a three-dimensional displacement mechanism for injecting glue, a moving frame 411 for injecting glue, and a glue injection system 421; the glue injection three-dimensional displacement mechanism comprises a glue injection X-direction guide rail 401, a glue injection Y-direction guide rail 402 and a glue injection Z-direction guide rail 403; the glue injection X-direction guide rail is fixed on the machine base 101; the glue injection Y-direction guide rail is arranged on the glue injection X-direction guide rail and can move along the glue injection X-direction guide rail; the glue injection Z-direction guide rail is arranged on the glue injection Y-direction guide rail and can move along the glue injection Y-direction guide rail; one end of the glue injection moving frame 411 is connected with the glue injection Z-direction guide rail and can move along the glue injection Z-direction guide rail, and the glue injection system 421 is installed and fixed at the other end of the glue injection moving frame 411; the glue injection system 421 adopts a conventional pin injection structure, and includes a pressure extrusion device, a needle tube, and a glue injection needle.

As shown in fig. 7-9, the film conveying system comprises a movable wheel bracket 501, a film discharging motor 502, a driving wheel 503, a driven wheel 504, an expansion bracket 505, an expansion wheel 506, a molded film roll 507 and a molded film 508; a movable wheel bracket 501 and an expansion bracket 505 are fixed on the machine base 101, a film outlet motor 502, a driving wheel 503 and a driven wheel 504 are arranged on the movable wheel bracket 501, and an expansion wheel 506 is arranged on the expansion bracket 505; the molded film roll 507 is mounted on the tension wheel 506, and one side of the molded film 508 is wound on the driving wheel 503; the driven wheel 504 is positioned above the driving wheel 503 and presses the molded film 508; the part of the molded film 508 is positioned on the upper surface of the lower die tool 108; the glue injection needle of the glue injection system 421 is located above the molded film.

The position of the various components before the die press is activated is shown in figure 1.

The utility model discloses a theory of operation:

a compression molding assembly: the upper die driving motor 103 drives the upper die heating platform 106 and the upper die tooling 107 to move along the upper die moving guide column 102 through the screw rod 105-1 and the lifting support 105; the upper die heating platform 106 has a heating function, and the heating range of the upper die heating platform is adjusted at any temperature of 0-200 ℃; the upper die tool 107 has a vacuum adsorption function, and the vacuum negative pressure value after vacuum adsorption can reach 0.8Mpa and above.

The material sucking component: the main functions are to place the material to be encapsulated above the feeding and discharging platform 202 and to place the encapsulated material into the magazine.

A feeding assembly: the main function is to convey the material to be encapsulated to the lower part of the upper die tool 107; the conveying motor 201 can drive the feeding and discharging platform 202 to move along the conveying track 203, the conveying platform 205 is moved to the lower side, and the to-be-sealed material is adsorbed on the upper die tool through the cooperation of the vacuum suction force of the upper die tool and the lifting platform.

The film conveying system has the main function of finishing film conveying once every time when sealing glue.

The main function of the glue injection assembly is to inject epoxy resin, the main function of the glue injection three-dimensional displacement mechanism is to accurately control the glue injection position, and the glue injection position is located above the molded film.

When no non-encapsulating material is on the feeding and discharging platform 202, a material suction head (e.g., material A suction head 306) at the lower end of the material suction Z-axis 304 sucks a non-encapsulating material to place the non-encapsulating material on the feeding and discharging platform 202; when the material sealed with the glue is arranged above the feeding and discharging platform 202, the material A suction head 306 sucks a material which is not sealed with the glue and then rotates for 90 degrees through the right-angle rotating motor 305, the material A suction head moves to the upper part of the feeding and discharging platform 202, and the material B suction head 307 sucks the material sealed with the glue and then rotates for 90 degrees; the material a tip 306 places the extracted unsealed material over the feeding and discharging platform 202.

When the non-encapsulating material is arranged above the feeding and discharging platform 202, the non-encapsulating material is conveyed to the lower part of the upper die tool 107 through the conveying platform 205, the lifting platform 204 jacks up the non-encapsulating material, the upper die tool 107 is opened to be vacuumized, and the non-encapsulating material is adsorbed onto the upper die tool 107. The upper die tooling 107 is in direct contact with the lower surface of the upper die heating platform 106. The upper mold heating platen 106 is preheated to a specified temperature before starting up. The transfer platform 205 returns to the home position. The film conveying system completes one-time film conveying. The glue injection assembly moves the needle tube filled with the epoxy resin glue to the position below the non-encapsulated material and above the mold pressing film 108, and then a proper amount of epoxy resin glue is injected. And after the glue is injected, the glue injection system returns to the initial position. The upper die tool 107 with the non-encapsulated material and the lower die tool 108 are pressed together by the upper die driving motor 103 and the upper die moving guide column 102. After a period of time, the epoxy resin glue is cured, and the upper die tooling 107 is driven to the initial position by the upper die driving motor 103 and the upper die moving guide column 102. The feeding and discharging platform 202 moves to a designated position through the conveying motor 201 and the conveying rail 203, the lifting platform 204 is lifted, and the upper die tooling 107 is turned off. The infeed and outfeed platform 202 receives the taped material and transports it to its initial position.

Claims

1. A packaging molding press for COB packaging LED display units is characterized by comprising a compression molding assembly and a molding film; the compression molding assembly comprises a machine base (101), a plurality of upper mold moving guide columns (102), an upper mold driving motor (103), a motor fixing platform (104), a lifting support (105), an upper mold heating platform (106), an upper mold tool (107) with a vacuum adsorption function, a lower mold tool (108) and a compression molding lower mold platform (109); the upper die moving guide column (102) is fixed on the machine base (101), the lower part of the upper die moving guide column is fixedly connected with the die pressing lower die platform (109), and the upper part of the upper die moving guide column is fixedly connected with the motor fixing platform (104); the upper die heating platform (106) is positioned between the motor fixing platform (104) and the die pressing lower die platform (109), the upper die driving motor (103) is fixedly installed on the motor fixing platform (104), and an output shaft of the upper die driving motor (103) is connected with the upper die heating platform (106) through the lifting support (105); an upper die tool (107) is fixed below the upper die heating platform (106); the lower die tool (108) is fixed on the die pressing lower die platform (109); and a mould pressing film (508) is paved on the lower mould tool (108).

2. The encapsulating die press for COB encapsulated LED display units of claim 1, further comprising a film transport system; the film conveying system comprises a driving wheel bracket (501), a film discharging motor (502), a driving wheel (503), a driven wheel (504), an expansion bracket (505), an expansion wheel (506) and a mould pressing film roll (507); a movable wheel bracket (501) and an expansion bracket (505) are fixed on a machine base (101), a film outlet motor (502), a driving wheel (503) and a driven wheel (504) are arranged on the movable wheel bracket (501), and an expansion wheel (506) is arranged on the expansion bracket (505); the mould pressing film roll (507) is arranged on the expanding wheel (506), and one side of the mould pressing film (508) is rolled on the driving wheel (503); the driven wheel (504) is positioned above the driving wheel (503) and presses the molded film (508); the part of the mould pressing film (508) is positioned on the upper surface of the lower mould tool (108); the glue injection needle of the glue injection system (421) is positioned above the mould pressing film (508).

3. The encapsulating die press for COB encapsulated LED display units according to claim 1, characterised in that the upper die heating platform (106) has a plurality of through holes distributed near the edge, through which the plurality of upper die moving guide posts (102) pass, respectively; the lifting support (105) is composed of a connecting platform (105-2) with a screw hole in the middle and a plurality of connecting rods (105-3); an output shaft of the upper die driving motor (103) is in threaded connection with the connecting platform (105-2) through a lead screw (105-1); the connecting platform (105-2) is connected with the upper die heating platform (106) through a connecting rod (105-3), and the upper die driving motor (103) can drive the upper die heating platform (106) to move up and down along the upper die moving guide column (102) through the lifting support (105).

4. The encapsulating die press for COB encapsulated LED display units according to claim 1, characterized in that the lower edge of the upper die tooling (107) is integrally connected with a plurality of positioning posts (110); when the upper die tool (107) with the non-encapsulated material is pressed with the lower die tool (108), the bottom of the positioning column (110) is clamped in the corresponding hole position of the lower die tool (108).

5. The encapsulating die press for COB encapsulated LED display units of claim 1, further comprising a feed assembly; the feeding assembly comprises a conveying motor (201), a feeding and discharging platform (202), a conveying track (203), a lifting platform (204) and a conveying platform (205); the conveying motor (201) is fixed on one side of the conveying track (203); the transmission platform (205) is connected with the transmission track (203), the output shaft of the transmission motor (201) is connected with the transmission platform (205), and the transmission platform (205) can be driven to move along the transmission track (203); the lifting platform (204) is arranged on the conveying platform (205), and the feeding and discharging platform (202) is arranged on the lifting platform (204); under the drive of the conveying motor (201), the feeding and discharging platform (202) can move to a position between the upper die tool (107) and the lower die tool (108) along with the conveying platform (205).

6. The encapsulating die press for COB encapsulated LED display units according to claim 1 or 5, further comprising a suction assembly; the material sucking component comprises a vertical column (301), a material sucking X guide rail (302), a material sucking Z guide rail (303), a material sucking Z shaft (304), a right-angle rotating motor (305), an A material sucking head (306), a B material sucking head (307), an A material box (308) and a B material box (309); two upright posts (301) are fixed on a machine base (101); the material suction X guide rail (302) is fixed on the two upright posts (301); the material sucking Z guide rail (303) is connected with the material sucking X guide rail (302) and can horizontally move along the material sucking X guide rail (302); the material suction Z shaft (304) is connected with the material suction Z guide rail (303) and can move up and down along the material suction Z guide rail (303); the right-angle rotary motor (305) is arranged at the bottom of the material suction Z shaft (304), the output shaft of the right-angle rotary motor is connected with the material A suction head (306) and the material B suction head (307), the material A suction head (306) and the material B suction head (307) are perpendicular to each other, and the right-angle rotary motor (305) can drive the material A suction head (306) and the material B suction head (307) to rotate so that the material A suction head (306) or the material B suction head (307) faces downwards; the A material box (308) and the B material box (309) are fixed on the machine base (101) and are positioned on one side of the conveying track (203); the suction Z-axis (304) can be moved above the infeed/outfeed platform (202) and above the A magazine (308) or the B magazine (309).

7. The encapsulating die press for COB encapsulated LED display units of claim 1, further comprising a glue injection assembly; the glue injection assembly comprises a glue injection three-dimensional displacement mechanism, a glue injection moving frame (411) and a glue injection system (421); one end of the glue injection moving frame (411) is connected with the three-dimensional displacement mechanism, and the glue injection system (421) is fixedly arranged at the other end of the glue injection moving frame (411); the glue injection system (421) can move to the upper part of the lower die tool (108) along with the glue injection moving frame (411).

8. The encapsulating die press for COB encapsulated LED display units according to claim 7, characterized in that the three-dimensional displacement mechanism comprises a glue injection X-direction guide rail (401), a glue injection Y-direction guide rail (402), a glue injection Z-direction guide rail (403); the glue injection X-direction guide rail is fixed on a machine base (101); the glue injection Y-direction guide rail is arranged on the glue injection X-direction guide rail and can move along the glue injection X-direction guide rail; the glue injection Z-direction guide rail is arranged on the glue injection Y-direction guide rail and can move along the glue injection Y-direction guide rail; one end of the glue injection moving frame (411) is connected with the glue injection Z-direction guide rail and can move along the glue injection Z-direction guide rail.