CN210535228U - Display module and display screen - Google Patents

Abstract

The utility model relates to a display module assembly and display screen, display module assembly includes: the lamp beads are arranged on the substrate, an electronic device is arranged on one surface of the substrate, which is far away from the lamp beads, the electronic device is electrically connected with the lamp beads through the substrate, and the radiating fin is arranged at one end, which is far away from the substrate, of the electronic device; the fin includes at least one horizontal heat-conducting layer, and horizontal heat-conducting layer sets up in the one side that the base plate deviates from the lamp pearl. Lamp pearl and electron device on the base plate produce a large amount of heats, lead to local temperature to rise, and horizontal heat-conducting layer is through the horizontal heat conduction characteristic of self, with the heat along the direction conduction that is on a parallel with the base plate, is about to the heat towards the marginal conduction of horizontal heat-conducting layer in order to realize the heat dissipation, has reduced the local temperature that lamp pearl and electron device on the base plate correspond the department, has improved the temperature distribution homogeneity of base plate, has improved display module's life.

Description

Display module and display screen

Technical Field

The utility model relates to a show technical field, especially relate to a display module assembly and display screen.

Background

Along with the continuous development of LED (Light Emitting Diode) display screen technology, in order to improve the resolution ratio of display screen, realize through setting up a large amount of booth apart from LED lamp pearls on single display module assembly, and the circuit components and parts and the control chip of controlling these lamp pearls all set up in the back of display module assembly, because the quantity of LED lamp pearl is great for the electron device and the control chip at the display module assembly back increase.

However, in the normal working process, the LED lamp beads, the electronic device and the control chip will generate a large amount of heat, and the heat conducting property of the PCB (Printed Circuit Board) commonly used for the Circuit Board is poor, and only 0.3W/m.k is present, which can not quickly transfer the heat to the copper-plated layer at the edge, resulting in uneven temperature distribution of the display module, thereby resulting in too high local temperature of the display module and seriously affecting the service life of the display module.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need for a display module and a display screen with simple structure and improved heat transfer rate to the edge.

A display module, comprising: the lamp bead is arranged on the substrate, an electronic device is arranged on one surface of the substrate, which is far away from the lamp bead, the electronic device is electrically connected with the lamp bead through the substrate, and the radiating fin is arranged at one end, which is far away from the substrate, of the electronic device; the fin includes at least one horizontal heat-conducting layer, horizontal heat-conducting layer set up in the base plate deviates from the one side of lamp pearl.

In one embodiment, the heat sink further comprises an insulating layer disposed between the substrate and the transverse thermally conductive layer.

In one embodiment, a projection of the lateral thermally conductive layer on the substrate at least partially overlaps a projection of the insulating layer on the substrate.

In one embodiment, a projection of the lateral thermal conductive layer on the substrate coincides with a projection of the insulating layer on the substrate.

In one embodiment, a heat dissipation layer is disposed between the substrate and the insulating layer, and the heat dissipation layer is disposed at an edge of the substrate.

In one embodiment, a projection of the insulating layer on the substrate at least partially overlaps a projection of the heat dissipation layer on the substrate.

In one embodiment, a heat dissipation column is arranged on one surface of the substrate, which is far away from the lamp bead, a first through hole is formed in the insulating layer, a second through hole is formed in the transverse heat conduction layer, the first through hole and the second through hole are aligned, and the heat dissipation column penetrates through the first through hole and the second through hole.

In one embodiment, the heat sink further includes a radiation layer disposed on a side of the transverse heat conductive layer facing away from the substrate.

In one embodiment, a projection of the radiation layer on the substrate at least partially overlaps a projection of the lateral thermally conductive layer on the substrate.

The utility model provides a display screen, its characterized in that includes box and at least one display module assembly as in any preceding embodiment, display module assembly with the box is connected, just lamp pearl is located the base plate deviates from the one side of box.

In above-mentioned display module assembly and display screen, lamp pearl and electron device produce a large amount of heat conduction to horizontal heat-conducting layer on the base plate, horizontal heat-conducting layer is through the horizontal heat conduction characteristic of self, conduct the heat along the direction that is on a parallel with the base plate, be about to the heat towards the edge conduction of horizontal heat-conducting layer with the realization heat dissipation, avoid the local temperature of base plate to rise, make the heat that lamp pearl and electron device on the base plate correspond the department in time conduct to the edge of horizontal heat-conducting layer in order to scatter and disappear, the local temperature that lamp pearl and electron device on the base plate correspond the department has been reduced, the temperature distribution homogeneity on the base plate has been improved, the life.

Drawings

FIG. 1 is a schematic structural diagram of a display module according to an embodiment;

FIG. 2 is a cross-sectional view taken along A-A of FIG. 1;

FIG. 3 is an enlarged partial schematic view at A1 of FIG. 2;

fig. 4 is an exploded view of a heat sink according to an embodiment.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

For example, a display module includes: the lamp bead is arranged on the substrate, an electronic device is arranged on one surface of the substrate, which is far away from the lamp bead, the electronic device is electrically connected with the lamp bead through the substrate, and the radiating fin is arranged at one end, which is far away from the substrate, of the electronic device; the fin includes at least one horizontal heat-conducting layer, horizontal heat-conducting layer set up in the base plate deviates from the one side of lamp pearl. In above-mentioned display module assembly, lamp pearl and electron device produce a large amount of heat conduction to horizontal heat-conducting layer on the base plate, horizontal heat-conducting layer is through the horizontal heat conduction characteristic of self, conduct the heat along the direction that is on a parallel with the base plate, be about to the marginal conduction of heat towards horizontal heat-conducting layer with the realization heat dissipation, avoid the local temperature of base plate to rise, make the heat that lamp pearl and electron device on the base plate correspond the department in time conduct to the edge of horizontal heat-conducting layer in order to scatter and disappear, the lamp pearl on the base plate and the local temperature that electron device corresponds the department have been reduced, the temperature distribution homogeneity on the base plate has been improved, the service.

Referring to fig. 1, a display module 10 according to an embodiment includes: the LED lamp comprises a substrate 100 and a radiating fin 200, wherein a lamp bead 110 is arranged on the substrate 100, an electronic device 120 is arranged on one surface of the substrate 100, which is far away from the lamp bead 110, the electronic device 120 is electrically connected with the lamp bead 110 through the substrate 100, and the radiating fin 200 is arranged at one end, which is far away from the substrate 100, of the electronic device 120; referring to fig. 3, the heat sink 200 includes a plurality of transverse heat conducting layers 220, and the transverse heat conducting layers 220 are disposed on a surface of the substrate 100 facing away from the lamp beads 110.

In this embodiment, a large amount of heat generated by the lamp beads and the electronic devices on the substrate 100 is conducted to the transverse heat conduction layer 220, the transverse heat conduction layer 220 conducts the heat along the direction parallel to the substrate 100 through the transverse heat conduction characteristic of the transverse heat conduction layer 220, that is, the heat is conducted towards the edge of the transverse heat conduction layer 220 to realize heat dissipation, so that the local temperature of the substrate is prevented from rising, the heat at the corresponding position of the lamp beads 110 and the electronic devices 120 on the substrate 100 is conducted to the edge of the transverse heat conduction layer 220 in time to dissipate, the local temperature at the corresponding position of the lamp beads 110 and the electronic devices 120 on the substrate 100 is reduced, the temperature distribution uniformity on the substrate 100 is improved, and the service life of.

In one embodiment, referring to fig. 2 and 3, the heat sink 200 further includes an insulating layer 210, and the insulating layer 210 is disposed between the substrate 100 and the transverse heat conducting layer 220. In the present embodiment, the insulating layer 210 has thermal conductive and insulating properties, that is, the insulating layer 220 conducts heat on the substrate 100 to the transverse thermal conductive layer 220, and the insulating layer 220 also insulates the electronic devices on the substrate 100 from the outside.

The projection of the lateral thermally conductive layer 220 onto the substrate 100 at least partially overlaps the projection of the insulating layer 210 onto the substrate 100. In this embodiment, the transverse heat conducting layer 220 has a higher transverse heat conductivity coefficient, that is, the transverse heat conducting layer 220 is a heat conducting material having a higher transverse heat conductivity coefficient, and the material of the transverse heat conducting layer 220 includes at least one of graphene, a graphite sheet, a copper foil, an aluminum sheet, and a silica gel sheet. The transverse heat conduction layer 220 has a transverse heat conduction coefficient and a longitudinal heat conduction coefficient, wherein the transverse heat conduction coefficient of the transverse heat conduction layer 220 determines the rate of conducting heat to the edge, that is, the transverse heat conduction coefficient of the transverse heat conduction layer 220 determines the conduction rate of heat in the direction parallel to the substrate 100, for example, the transverse heat conduction layer 220 is made of graphene, the transverse heat conduction coefficient of the transverse heat conduction layer 220 is 1000-5000W/m.K, the longitudinal heat conduction coefficient of the transverse heat conduction layer 220 is 10-30W/m.K, and the thickness of the transverse heat conduction layer 220 is 0.01-0.1 mm; for another example, the material of the transverse heat conduction layer 220 is a graphite sheet, the transverse heat conduction coefficient of the transverse heat conduction layer 220 is 500-2000W/m.k, the longitudinal heat conduction coefficient of the transverse heat conduction layer 220 is 10-30W/m.k, and the thickness of the transverse heat conduction layer 220 is 0.02-0.1 mm; for another example, the material of the transverse heat conduction layer 220 is copper foil, the transverse heat conduction coefficient of the transverse heat conduction layer 220 is 200-500W/m.k, the longitudinal heat conduction coefficient of the transverse heat conduction layer 220 is 200-500W/m.k, and the thickness of the transverse heat conduction layer 220 is 0.02-0.2 mm; for another example, the material of the transverse heat conduction layer 220 is an aluminum sheet, the transverse heat conduction coefficient of the transverse heat conduction layer 220 is 100-300W/m.k, the longitudinal heat conduction coefficient of the transverse heat conduction layer 220 is 100-300W/m.k, and the thickness of the transverse heat conduction layer 220 is 0.02-0.2 mm; for another example, the material of the transverse heat conduction layer 220 is a silicone sheet, the transverse heat conduction coefficient of the transverse heat conduction layer 220 is 2-10W/m.k, the longitudinal heat conduction coefficient of the transverse heat conduction layer 220 is 2-10W/m.k, and the thickness of the transverse heat conduction layer 220 is 0.1-0.2 mm. The transverse heat conduction layer 220 made of the materials has a heat conduction coefficient in the transverse direction or a heat conduction coefficient in the longitudinal direction which is larger than that of a traditional PCB, particularly the transverse heat conduction layer 220 has a high heat conduction efficiency in transverse heat conduction, so that the transverse heat conduction layer 220 quickly transfers heat to the edge, heat at the corresponding position of the lamp bead 110 and the electronic device 120 on the substrate 100 is timely conducted to the edge of the transverse heat conduction layer 220 to be dissipated, the local temperature at the corresponding position of the lamp bead 110 and the electronic device 120 on the substrate 100 is reduced, the temperature distribution uniformity on the substrate 100 is improved, and the service life of the display module is prolonged.

Moreover, the insulating layer 210 is made of an insulating heat-conducting double-sided adhesive tape, the heat conductivity coefficient of the insulating layer 210 is 0.5-10W/m.k, and the insulating layer 210 has heat conducting and insulating properties, that is, the insulating layer 210 not only insulates the electronic device 120 from the outside, but also conducts heat generated by the electronic device 120 to the transverse heat conducting layer 220, so that the heat is dissipated through the edge of the transverse heat conducting layer 220. The transverse heat conduction layer 220 and the insulating layer 210 are in surface-to-surface contact, the contact area between the transverse heat conduction layer 220 and the insulating layer 210 determines the rate at which heat generated by the electronic devices 120 is conducted to the transverse heat conduction layer 220, the projection of the transverse heat conduction layer 220 on the substrate 100 is at least partially overlapped with the projection of the insulating layer 210 on the substrate 100, so that the insulating layer 210 and the transverse heat conduction layer 220 are parallel to each other, and the contact area between the insulating layer 210 and the transverse heat conduction layer 220 is increased, so that heat generated by the electronic devices 120 on the substrate 100 is rapidly conducted to the transverse heat conduction layer 220, thereby facilitating the rapid heat transfer to the edges of the transverse heat conduction layer 220 and dissipating the heat into the air, improving the rate of heat transfer to the edges, and thus making the temperature distribution of the display module uniform, and then reduced the too high probability of local temperature of display module assembly, prolonged display module assembly's life.

In one embodiment, a projection of the lateral thermal conductive layer on the substrate coincides with a projection of the insulating layer on the substrate. In this embodiment, since the transverse heat conduction layer is connected to the insulating layer, and the transverse heat conduction layer and the insulating layer are away from one surface of the insulating layer, that is, the transverse heat conduction layer and the insulating layer are in surface-to-surface contact. The insulating layer is attached to the substrate, absorbs heat generated by the lamp beads and the electronic devices on the substrate and conducts the heat to the transverse heat conduction layer for transverse heat conduction, the heat conduction performance of the insulating layer is determined by the heat conduction coefficient of the insulating layer, the heat conduction coefficient of the insulating layer depends on the material of the insulating layer, and the insulating layer is an insulating heat conduction double-sided adhesive tape, for example; for another example, the insulating layer is made of at least one of silicone, PET (Polyethylene terephthalate), acryl polymer, and glass fiber; for another example, the insulating layer is filled with heat conductive ceramic powder. The heat-conducting property of the insulating layer is superior to that of a traditional PCB, the heat-conducting coefficient of the insulating layer is 0.5-10W/m.K, and the thickness of the insulating layer is 0.02-0.2 mm, so that the insulating layer has high heat-conducting property and is convenient for rapidly conducting heat on the substrate to the transverse heat-conducting layer. Like this, horizontal heat-conducting layer is in projection on the base plate with the insulating layer is in projection coincidence on the base plate has shown horizontal heat-conducting layer with area of contact increase between the insulating layer makes the insulating layer with the heat conduction extremely the speed increase of horizontal heat-conducting layer, thereby makes with heat transfer on the base plate extremely the heat conduction speed of horizontal heat-conducting layer improves, moreover, the use of horizontal heat-conducting layer makes the edge that the heat that lamp pearl on the base plate and electron device correspond the department in time conducts to horizontal heat-conducting layer in order to scatter and disappear, has reduced the local temperature that lamp pearl and electron device on the base plate correspond the department, has improved the temperature distribution homogeneity on the base plate, has improved display module's life.

In one embodiment, referring to fig. 1 to 3, a heat dissipation layer 300 is disposed between the substrate 100 and the insulating layer 210, and the heat dissipation layer 300 is disposed at an edge of the substrate 100. In this embodiment, the heat on the substrate 100 is rapidly absorbed by the insulating layer 210, the transverse heat conduction layer 220 conducts the heat on the insulating layer 210 to the edge of the transverse heat conduction layer through transverse heat conduction along the direction parallel to the substrate 100, and then conducts the heat to the heat dissipation layer 300 through the insulating layer 210, so that the heat on the transverse heat conduction layer 220 is further dissipated by utilizing the characteristic of large heat dissipation area of the heat dissipation layer 300, and the heat dissipation efficiency of the display module is further improved.

In one embodiment, referring to fig. 1 and fig. 2, a projection of the insulating layer 210 on the substrate 100 at least partially overlaps a projection of the heat dissipation layer 300 on the substrate 100. In this embodiment, the heat dissipation layer 300 is located at the edge of the substrate 100, and the heat dissipation layer 300 surrounds the edge of the substrate 100, that is, the length of the heat dissipation layer 300 is equal to the perimeter of the edge of the substrate 100, that is, the shape of the heat dissipation layer 300 is the same as the shape formed by the edge of the substrate 100. Because the insulating layer 210 and the horizontal heat conduction layer 220 are completely overlapped, the heat dissipation layer 300 is located at the edge of the substrate 100, so that the heat dissipation layer 300 is also located at the edge of the insulating layer 210 and the horizontal heat conduction layer 220, the insulating layer 210 and the horizontal heat conduction layer 220 transfer the heat on the substrate 100 to the heat dissipation layer 300, wherein the horizontal heat conduction layer 220 transfers the heat absorbed by the insulating layer 210 located in the middle area of the substrate 100 to the edge position of the horizontal heat conduction layer 220, and the horizontal heat conduction layer 220 has a higher horizontal heat conduction coefficient, so that the heat in the middle area of the substrate 100 is quickly transferred to the edge of the horizontal heat conduction layer 220, then is transferred to the heat dissipation layer 300 through the insulating layer 210, and the heat is quickly dissipated to the external environment through the heat dissipation layer 300. The heat conduction between the heat dissipation layer 300 and the insulating layer 210 is realized by the contact of the two, and the projection of the insulating layer 210 on the substrate 100 at least partially overlaps with the projection of the heat dissipation layer 300 on the substrate 100, which indicates that the insulating layer 210 and the heat dissipation layer 300 have an intersection, i.e. there is a contact between the insulating layer 210 and the heat dissipation layer 300, i.e. there is a partial shadow overlap between the insulating layer 210 and the heat dissipation layer 300 in a direction perpendicular to the substrate 100. Like this, heat on the base plate 100 passes through insulating layer 210 conducts extremely horizontal heat-conducting layer 220, through horizontal heat-conducting layer 220 is to its marginal transfer, the rethread insulating layer 210 conducts extremely the base plate 100 edge on the heat dissipation layer 300, heat dissipation layer 300 scatters and disappears the heat to the external environment in, has improved the speed of heat to marginal transfer, has avoided the heat to be in horizontal heat-conducting layer 220 with the condition of the edge gathering of insulating layer 210 has avoided the too high condition of display module's local temperature, has reduced the local temperature that lamp pearl 110 and electron device 120 on base plate 100 correspond the department promptly, has improved the temperature distribution homogeneity on the base plate 100, has improved display module's life.

In one embodiment, a projection of the heat dissipation layer on the substrate is located within a projection of the insulating layer on the substrate. In this embodiment, the heat dissipation layer with there is the contact between the insulating layer, the heat dissipation layer with area of contact between the insulating layer depends on the area that projection between them overlaps, the heat dissipation layer is in projection on the base plate is located the insulating layer is in the projection on the base plate, has shown the heat dissipation layer with area of contact between the insulating layer reaches the increase, makes the insulating layer with heat conduction efficiency increase between the heat dissipation layer to improve the radiating efficiency, moreover, the use of horizontal heat-conducting layer for the heat that lamp pearl on the base plate and electron device correspond the department in time scatters and disappears through the heat dissipation layer at edge, has reduced the local temperature that lamp pearl and electron device on the base plate correspond the department, has improved the temperature distribution homogeneity on the base plate, has improved display module's life.

In one embodiment, the heat dissipation layer comprises a copper plating layer, so that heat absorbed by the heat dissipation layer is quickly dissipated, and the heat dissipation efficiency is further improved.

In one embodiment, referring to fig. 1 to 3, the heat sink 200 further includes a radiation layer 230, and the radiation layer 230 is disposed on a surface of the transverse heat conduction layer 220 facing away from the insulation layer 210. In this embodiment, the radiation layer 230 is in contact with the transverse heat conduction layer 220, a part of the heat on the transverse heat conduction layer 220 is dissipated to the external environment through the radiation layer 230, and the radiation layer 230 conducts the heat to the external air by radiation, so as to realize the heat exchange between the heat sink 200 and the external air. Wherein the radiation layer 230 has a high emissivity, for example, the radiation layer 230 includes at least one of black ink, nano-carbon, carbon nanotube and graphene. Through a high thermal radiation coefficient material, the heat dissipation efficiency of the radiation layer 230 is improved, and in order to further improve the heat dissipation efficiency, the material of the radiation layer 230 adopts a nano radiation material, that is, the radiation layer 230 is a nano coating with a high thermal radiation coefficient, so that the contact area between the radiation layer 230 and the outside air is increased, thereby increasing the heat exchange efficiency between the radiation layer 230 and the outside air, and improving the heat dissipation efficiency of the heat sink 200, and the heat at the corresponding position of the lamp bead 110 and the electronic device 120 on the substrate 100 is dissipated through the heat dissipation layer 300 at the edge in time by using the transverse heat conduction layer 220, so that the local temperature at the corresponding position of the lamp bead 110 and the electronic device 120 on the substrate 100 is reduced, the temperature distribution uniformity on the substrate 100 is improved, and the service life of the display module is prolonged.

In one embodiment, the emissivity of the radiation layer is 0.85-0.95. In this embodiment, the emissivity of the radiation layer is 0.9, so that the radiation layer with high emissivity improves the heat conduction of the radiation layer to the outside air by radiation, and improves the heat dissipation efficiency of the heat sink.

In one embodiment, referring to fig. 3, a projection of the radiation layer 230 on the substrate 100 at least partially overlaps a projection of the lateral thermal conduction layer 220 on the substrate 100. In this embodiment, the radiation layer 230 is connected to a side of the transverse heat conduction layer 220 facing away from the insulation layer 210, the radiation layer 230 absorbs a portion of heat on the transverse heat conduction layer 220, the transverse heat conduction layer 220 has a transverse heat conduction coefficient and a longitudinal heat conduction coefficient, so that the heat on the transverse heat conduction layer 220 is conducted in a direction parallel to the substrate 100 and in a direction perpendicular to the substrate 100, a portion of the heat on the transverse heat conduction layer 220 is conducted toward the radiation layer 230 in a direction perpendicular to the substrate 100, the radiation layer 230 conducts the portion of heat to the outside air through its own heat radiation property, so that a portion of the heat on the substrate 100 is dissipated to the outside environment through the radiation layer 230, and the heat dissipation efficiency of the heat sink 200 is improved.

In one embodiment, a projection of the radiation layer on the substrate coincides with a projection of the transverse thermally conductive layer on the substrate. In this embodiment, the radiation layer is located on a surface of the transverse heat conduction layer, which is away from the insulating layer, and the radiation layer is in surface contact with the transverse heat conduction layer, that is, one surface of the radiation layer is connected with a surface of the transverse heat conduction layer, which is away from the insulating layer, that is, the radiation layer and the transverse heat conduction layer are in surface-to-surface contact. The contact area between the radiation layer and the transverse heat conduction layer is the heat conduction area between the radiation layer and the transverse heat conduction layer, and the projection of the radiation layer on the substrate is superposed with the projection of the transverse heat conduction layer on the substrate, so that the contact area between the radiation layer and the transverse heat conduction layer is increased, the heat conduction efficiency between the radiation layer and the transverse heat conduction layer is improved, the heat dissipation efficiency of the heat dissipation fins is improved, and the heat dissipation effect of the display module is improved.

In one embodiment, referring to fig. 2, a heat dissipation pillar 130 is disposed on a surface of the substrate 100 away from the lamp bead 110, referring to fig. 4, a first through hole 211 is formed in the insulating layer 210, a second through hole 221 is formed in the transverse heat conduction layer 220, the first through hole 211 is aligned with the second through hole 221, and the heat dissipation pillar 130 is disposed in the first through hole 211 and the second through hole 221 in a penetrating manner. In this embodiment, the heat dissipating stud 130 sequentially passes through the first through hole 211 and the second through hole 221, the surface of the heat dissipating stud 130 abuts against the side wall of the first through hole 211 and the side wall of the second through hole 221, that is, the heat dissipating stud 130 contacts with the insulating layer 210 and the transverse heat conducting layer 220, a part of heat on the insulating layer 210 and a part of heat on the transverse heat conducting layer 220 are conducted to the heat dissipating stud 130, and the heat dissipating stud 130 dissipates the above heat to the external environment and exchanges heat with the external air. Like this, heat dissipation post 130 is as a heat radiation structure, the surface of heat dissipation post 130 respectively with base plate 100 with fin 200 contacts, has increased display module's heat radiating area makes the partial heat that lamp pearl 110 and electron device 120 on the base plate 100 produced passes through heat dissipation post 130 scatters and disappears, thereby makes the radiating efficiency increase of fin 200, moreover, the use of horizontal heat-conducting layer 220 makes the heat that lamp pearl 110 and electron device 120 on the base plate 100 correspond the department in time scatter and disappear through marginal heat dissipation layer 300, has reduced the local temperature that lamp pearl 110 and electron device 120 on base plate 100 correspond the department, has improved the temperature distribution homogeneity on base plate 100, has improved display module's life.

In one embodiment, referring to fig. 1, a display module 10 includes: the LED lamp comprises a substrate 100 and a heat sink 200, wherein a plurality of lamp beads 110 are arranged on the substrate 100, a plurality of electronic devices 120 are arranged on one surface of the substrate 100, which is far away from the lamp beads 110, the electronic devices 120 are electrically connected with the lamp beads 110 through the substrate 100, the heat sink 200 is arranged at one end of the electronic devices 120, which is far away from the substrate 100, a heat dissipation layer 300 is arranged between the substrate 100 and the heat sink 200, and the heat dissipation layer 300 is arranged at the edge of the substrate 100; referring to fig. 2 to 3, the heat sink 200 includes an insulating layer 210, a transverse heat conducting layer 220, and a radiating layer 230, which are sequentially stacked, wherein the insulating layer 210, the transverse heat conducting layer 220, and the radiating layer 230 have the same shape, and the insulating layer 210, the transverse heat conducting layer 220, and the radiating layer 230 are completely attached to each other, that is, the insulating layer 210, the transverse heat conducting layer 220, and the radiating layer 230 are aligned with each other; the insulating layer 210, the transverse heat conduction layer 220 and the radiating layer 230 are connected to one side of the substrate 100 close to the electronic device 120, the transverse heat conduction layer 220 is arranged between the insulating layer 210 and the radiating layer 230, and one side of the insulating layer 210, which is far away from the transverse heat conduction layer 220, is connected to the heat dissipation layer 300; referring to fig. 4, a first through hole 211 is formed in the insulating layer 210, a second through hole 221 is formed in the transverse heat conduction layer 220, a third through hole 231 is formed in the radiation layer 230, the first through hole 211, the second through hole 221 and the third through hole 231 are aligned, and the heat dissipation column 130 penetrates through the first through hole 211, the second through hole 221 and the third through hole 231. The insulating layer 210 has functions of heat conduction and insulation, on one hand, heat on the substrate 100 is conducted to the transverse heat conduction layer 220, on the other hand, the electronic devices 120 on the substrate 100 are isolated, and insulation of the electronic devices 120 on the substrate 100 is improved; the insulating layer 210 is an insulating heat-conducting double-sided adhesive tape, the heat conductivity coefficient is 1.6W/m.K, and the thickness is 0.1 mm; the transverse heat conduction layer 220 consists of four graphite sheets, the transverse heat conduction coefficient is 600W/m.K, the longitudinal heat conduction coefficient is 20W/m.K, and the thickness is 0.1 mm; the radiation layer 230 is a nano carbon coating, the thermal emissivity is 0.9, and the thickness is 10 μm; the heat dissipation layer 300 is a copper plated layer. In this way, the heat sink 200 quickly transfers heat generated by the lamp beads 110 and the electronic devices 120 on the heat sink layer 300 at the edge positions through the transverse heat conduction layer 220, and quickly dissipates the heat through the metal copper on the heat sink layer, so that the probability that the temperatures of the positions of the lamp beads 110 and the electronic devices 120 on the substrate 100 are too high is reduced, the temperature distribution on the substrate 100 is uniform, and particularly, the difference between the temperature of the position of the electronic devices 120 on the substrate 100 and the ambient temperature of the substrate 100 is reduced, for example, from the maximum temperature difference of 13 ℃ to 4 ℃, so that the temperature uniformity of the substrate 100 is improved. Moreover, the maximum temperature of the substrate 100 is reduced by 4-5 ℃ and the average temperature is reduced by 3-4 ℃ due to the heat dissipation effect of the heat dissipation sheet 200.

In one embodiment, a display screen is provided, including box and at least one display module assembly as in any one of the above-mentioned embodiments, the display module assembly with the box is connected, and the lamp pearl is located the base plate deviates from the one side of box.

In above-mentioned display screen, lamp pearl and the electron device on the base plate produce a large amount of heats, lead to the local temperature of base plate to rise, the insulating layer conducts the heat on the base plate to horizontal heat-conducting layer, horizontal heat-conducting layer is through the horizontal heat conduction characteristic of self, conduct the heat along the direction that is on a parallel with the base plate, be about to the marginal conduction of heat towards horizontal heat-conducting layer, later the heat dispels the heat through setting up in the marginal heat dissipation layer of base plate, make the heat that lamp pearl and electron device on the base plate correspond the department in time scatter and disappear through the marginal heat dissipation layer, the local temperature that lamp pearl and electron device on the base plate correspond the department has been reduced, the temperature distribution homogeneity on the base plate has been improved, the service life of display module.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A display module, comprising: the lamp bead is arranged on the substrate, an electronic device is arranged on one surface of the substrate, which is far away from the lamp bead, the electronic device is electrically connected with the lamp bead through the substrate, and the radiating fin is arranged at one end, which is far away from the substrate, of the electronic device;

the fin includes at least one horizontal heat-conducting layer, horizontal heat-conducting layer set up in the base plate deviates from the one side of lamp pearl.

2. The display module of claim 1, wherein the heat sink further comprises an insulating layer disposed between the substrate and the transverse thermally conductive layer.

3. The display module of claim 2, wherein a projection of the transverse thermally conductive layer onto the substrate at least partially overlaps a projection of the insulating layer onto the substrate.

4. The display module of claim 3, wherein a projection of the transverse thermally conductive layer onto the substrate coincides with a projection of the insulating layer onto the substrate.

5. The display module of claim 2, wherein a heat dissipation layer is disposed between the substrate and the insulating layer, the heat dissipation layer being disposed at an edge of the substrate.

6. The display module of claim 5, wherein a projection of the insulating layer on the substrate at least partially overlaps a projection of the heat dissipation layer on the substrate.

7. The display module assembly of claim 2, wherein a heat dissipation post is disposed on a surface of the substrate facing away from the lamp bead, the insulating layer defines a first through hole, the transverse heat conduction layer defines a second through hole, the first through hole and the second through hole are aligned, and the heat dissipation post is disposed through the first through hole and the second through hole.

8. The display module of claim 1, wherein the heat sink further comprises a radiation layer disposed on a side of the lateral thermally conductive layer facing away from the substrate.

9. A display module according to claim 8, characterized in that the projection of the radiation layer onto the substrate at least partially overlaps with the projection of the transverse heat conducting layer onto the substrate.

10. A display screen, characterized in that, includes box and at least one display module assembly as in any one of claims 1 to 9, the display module assembly with the box is connected, and the lamp pearl is located the base plate deviates from the one side of box.

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