CN211599576U

CN211599576U - Electronic expansion valve

Info

Publication number: CN211599576U
Application number: CN202020180745.1U
Authority: CN
Inventors: 詹少军; 徐冠军; 姚坚
Original assignee: Zhejiang DunAn Hetian Metal Co Ltd
Current assignee: Zhejiang DunAn Hetian Metal Co Ltd
Priority date: 2020-02-18
Filing date: 2020-02-18
Publication date: 2020-09-29
Anticipated expiration: 2030-02-18

Abstract

The utility model provides an electronic expansion valve, this electronic expansion valve includes: a housing having a mounting hole; the valve seat core comprises a press mounting section and a guide section which are mutually connected, the press mounting section is in interference fit with the mounting hole, and the guide section is positioned outside the mounting hole; the connecting pipe is sleeved on the guide section, the end wall of the connecting pipe is abutted to the shell, and a welding material cavity is formed among the shell, the valve seat core and the connecting pipe. Through the technical scheme that this application provided, can solve the poor problem of valve seat core and casing axiality among the prior art.

Description

Electronic expansion valve

Technical Field

The utility model relates to an electronic expansion valve technical field particularly, relates to an electronic expansion valve.

Background

Generally, an electronic expansion valve includes a housing, a valve core assembly and a valve seat core, wherein the valve core assembly and the valve seat core are both disposed in the housing, a valve port is disposed on the valve seat core, and the valve core assembly is used for controlling the opening and closing of the valve port. Wherein, be provided with the mounting hole on the casing, the disk seat core wears to establish in the mounting hole and with the loose cooperation of mounting hole, and the connecting pipe cover is established on the disk seat core.

In the prior art, in order to assemble the valve seat core, the shell and the connecting pipe, the valve seat core and the shell are firstly welded and positioned in a laser spot welding mode, then the connecting pipe is sleeved on the valve seat core, the welding ring is sleeved outside the connecting pipe, and finally the valve seat core, the shell and the connecting pipe are welded and fixed in a furnace welding mode.

However, since the valve seat core is loosely fitted to the mounting hole, it is difficult to ensure the coaxiality of the valve seat core and the housing when spot welding the valve seat core and the housing, which affects the performance of the device. Therefore, the valve seat core and the shell have poor coaxiality in the prior art.

SUMMERY OF THE UTILITY MODEL

The utility model provides an electronic expansion valve to solve the poor problem of valve seat core and casing axiality among the prior art.

The utility model provides an electronic expansion valve, electronic expansion valve includes: a housing having a mounting hole; the valve seat core comprises a press mounting section and a guide section which are mutually connected, the press mounting section is in interference fit with the mounting hole, and the guide section is positioned outside the mounting hole; the connecting pipe is sleeved on the guide section, the end wall of the connecting pipe is abutted to the shell, and a welding material cavity is formed among the shell, the valve seat core and the connecting pipe.

Further, the diameter of the guide section is smaller than or equal to that of the press-fitting section.

Further, the space among the guide section, the shell and the connecting pipe forms a solder cavity.

Furthermore, a first chamfer is arranged between the press-fitting section and the guide section, and a welding material cavity is formed among the first chamfer, the shell and the connecting pipe at intervals.

Furthermore, one end of the connecting pipe, which is connected with the guide section, is provided with a second chamfer, and a welding material cavity is formed among the second chamfer, the shell and the valve seat core at intervals.

Furthermore, one end, facing the connecting pipe, of the hole wall of the mounting hole is provided with a third chamfer, and a welding material cavity is formed among the third chamfer, the valve seat core and the connecting pipe at intervals.

Furthermore, a solder presetting part is arranged between the inner wall of the connecting pipe and the outer side wall of the guide section and used for placing solder.

Further, an accommodating groove is formed in the outer side wall of the guide section, the accommodating groove is annularly arranged along the circumferential direction of the guide section, and the accommodating groove forms a solder presetting portion.

Further, the valve seat core further comprises a limiting boss, the limiting boss is arranged at one end, far away from the guide section, of the press mounting section, and the limiting boss is annularly arranged along the circumferential direction of the valve seat core.

Further, the housing includes a sleeve and a valve body connected to each other, and the mounting hole is provided in the valve body.

Use the technical scheme of the utility model, this electronic expansion valve include casing, disk seat core and connecting pipe, and the casing has the mounting hole, and the disk seat core includes interconnect's pressure equipment section and direction section, pressure equipment section and mounting hole interference fit, and the direction section is located the mounting hole outside. Through establishing the connecting pipe cover on the guide section, make the end wall and the casing looks butt of connecting pipe, have the solder cavity between casing, disk seat core and the connecting pipe three, utilize the solder to fill the solder cavity, can accomplish casing, disk seat core and connecting pipe three's connection, because pressure equipment section and mounting hole interference fit, need not to utilize the mode of spot welding to fix a position the disk seat core, can guarantee the axiality of disk seat core and casing.

Drawings

The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of an electronic expansion valve according to an embodiment of the present invention;

FIG. 2 shows a partial enlarged view at A in FIG. 1;

FIG. 3 shows a schematic view of the valve seat insert of FIG. 1;

FIG. 4 shows an exploded view of the valve seat core and valve body of FIG. 1;

FIG. 5 shows an assembly view of the valve seat core, valve body and connecting tube of FIG. 1;

fig. 6 is a partial enlarged view of a solder cavity of an electronic expansion valve according to an embodiment of the present invention;

fig. 7 is a partial enlarged view of a solder cavity of an electronic expansion valve provided in the second embodiment of the present invention;

fig. 8 shows a partial enlarged view of a solder cavity of an electronic expansion valve provided in a third embodiment of the present invention;

fig. 9 is a partial enlarged view of a solder cavity of an electronic expansion valve according to a fourth embodiment of the present invention;

fig. 10 shows a partial enlarged view of a solder cavity of an electronic expansion valve provided in the fifth embodiment of the present invention;

fig. 11 shows a partial enlarged view of a solder cavity of an electronic expansion valve according to an embodiment of the present invention.

Wherein the figures include the following reference numerals:

10. a housing; 11. mounting holes; 12. a third chamfer; 13. a sleeve; 14. a valve body;

20. a valve seat core; 21. a press mounting section; 22. a guide section; 221. accommodating grooves; 23. a first chamfer; 24. a limiting boss;

30. a connecting pipe; 31. a second chamfer;

40. a solder cavity.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1 to 11, an embodiment of the present invention provides an electronic expansion valve, which includes a housing 10, a valve seat core 20 and a connecting pipe 30. The housing 10 has a mounting hole 11, and the valve seat core 20 is inserted into the mounting hole 11. Specifically, the valve seat core 20 includes a press-fitting section 21 and a guide section 22 that are connected to each other, the press-fitting section 21 is in interference fit with the mounting hole 11, and the guide section 22 is located outside the mounting hole 11. Through press-fitting section 21 and mounting hole 11 interference fit, need not to adopt other modes to fix a position, can guarantee the axiality of valve seat core 20 and casing 10. In this embodiment, the connecting tube 30 is sleeved on the guiding section 22, the end wall of the connecting tube 30 abuts against the housing 10, a solder cavity 40 is formed among the housing 10, the valve seat core 20 and the connecting tube 30, and solder can be gathered in the solder cavity 40 by furnace welding, so that the housing 10, the valve seat core 20 and the connecting tube 30 can be fixedly connected.

The electronic expansion valve provided by the embodiment is applied, the press-fitting section 21 of the valve seat core 20 is arranged in the mounting hole 11 in an interference penetrating manner, the coaxiality of the valve seat core 20 and the shell 10 can be ensured, the welding material cavity 40 is formed among the shell 10, the valve seat core 20 and the connecting pipe 30, the shell 10, the valve seat core 20 and the connecting pipe 30 can be fixedly connected in a furnace welding mode, laser spot welding can be reduced, the electronic expansion valve has the advantage of simple process, and the cost can be reduced.

Wherein, the diameter of the guide section 22 is smaller than or equal to that of the press-fitting section 21. In this embodiment, the diameter of the guide section 22 is smaller than the diameter of the press-fitting section 21. The guide section 22 may serve as a guide when inserting the valve seat core 20 into the mounting hole 11, thereby facilitating assembly. In other embodiments, the diameter of the guide section 22 may be set equal to the diameter of the press-fitting section 21.

As shown in fig. 6, the space between the guide section 22, the housing 10 and the connection pipe 30 forms a solder chamber 40. Wherein, a step structure is arranged between the guide section 22 and the press-fitting section 21, the press-fitting section 21 is in interference fit with the mounting hole 11, and a space is arranged between the guide section 22 and the inner wall of the mounting hole 11 and between the end wall of the connecting pipe 30 and the press-fitting section 21, and the space forms a solder cavity 40.

As shown in fig. 2 to 5, a solder preset portion for placing solder is provided between the inner wall of the connection pipe 30 and the outer side wall of the guide section 22. Wherein, the solder pre-arrangement may be disposed on the inner wall of the connection pipe 30, or on the outer sidewall of the guide section 22, or on both the inner wall of the connection pipe 30 and the outer sidewall of the guide section 22. In other embodiments, solder may be placed on the outer wall of the connector tube 30 in a position that does not interfere with the alignment of the poppet 20 with the housing 10 by press fitting in cooperation with the solder cavity 40. In this embodiment, the solder presets are used to place solder rings.

In the present embodiment, since the solder is disposed inside the connection pipe 30, when the connection pipe 30 is soldered, whether the solder leaks from between the connection pipe 30 and the housing 10 is observed outside the connection pipe 30, so that the soldering quality can be accurately determined, and the detection by the staff is facilitated. Moreover, the judgment of the welding quality is not limited by the pipe type of the connection pipe 30, and can be used for judging the bent pipe. Since less solder is accumulated outside the connecting pipe 30 after soldering, positioning and press fitting after the device can be effectively ensured.

In the present embodiment, the solder pre-set portion is provided on the guide section 22. Wherein, the solder presetting part can be arranged in the middle of the guide section 22, and also can be arranged at the two ends of the guide section 22. By providing the solder preset portion on the guide section 22, it is convenient to process the solder preset portion, and the processing cost can be reduced.

As shown in fig. 3, a receiving groove 221 is provided on an outer side wall of the guide section 22, the receiving groove 221 is annularly provided along a circumferential direction of the guide section 22, and the receiving groove 221 forms a solder pre-set portion. Specifically, the accommodating groove 221 may be disposed in the middle of the guide section 22, or disposed at both ends of the guide section 22, and the accommodating groove 221 is disposed to facilitate processing. In this embodiment, the receiving groove 221 is located at an end of the guide section 22 remote from the press-fitting section 21. With the adoption of the structure, the accommodating groove 221 can be formed only by turning one end of the guide section 22, which is far away from the press-fitting section 21, so that the processing cost can be further reduced, and the solder can be conveniently placed.

In this embodiment, the valve seat core 20 further includes a limiting boss 24, the limiting boss 24 is disposed at an end of the press-fitting section 21 away from the guide section 22, the limiting boss 24 is annularly disposed along a circumferential direction of the valve seat core 20, and the limiting boss 24 is used for limiting a position of the valve seat core 20 in the mounting hole 11.

Wherein the housing 10 includes a sleeve 13 and a valve body 14 connected to each other, and the mounting hole 11 is provided on the valve body 14. The casing 10 is divided into the sleeve 13 and the valve body 14, so that the assembly is facilitated, and the assembly efficiency can be improved.

In this embodiment, the electronic expansion valve further includes a valve core assembly, the valve core assembly is disposed in the housing 10, a valve port is disposed on the valve seat core 20, and the valve core assembly is used for controlling the opening and closing of the valve port.

As shown in fig. 7, a second embodiment of the present invention provides an electronic expansion valve, which is different from the first embodiment in that a first chamfer 23 is provided between the press-fitting section 21 and the guiding section 22, and a solder cavity 40 is formed at an interval between the first chamfer 23, the housing 10 and the connecting pipe 30. Specifically, the first chamfer 23 has a space with the inner wall of the mounting hole 11 and the end wall of the connecting tube 30, which space forms a solder cavity 40.

As shown in fig. 8, a third embodiment of the present invention provides an electronic expansion valve, and the third embodiment differs from the first embodiment in that, in the third embodiment, one end of the connecting pipe 30 connected to the guide section 22 has a second chamfer 31, and the space between the second chamfer 31, the housing 10 and the valve seat core 20 forms a solder cavity 40. By providing the second chamfer 31 on the connecting pipe 30, the volume of the solder cavity 40 can be increased, the welding is facilitated, and the welding strength can be enhanced.

As shown in fig. 9, a fourth embodiment of the present invention provides an electronic expansion valve, which is different from the second embodiment in that in the fourth embodiment, one end of the connecting pipe 30 connected to the guide section 22 has a second chamfer 31, and the space between the second chamfer 31, the housing 10 and the valve seat core 20 forms a solder cavity 40. By providing the second chamfer 31 on the connecting pipe 30, the volume of the solder cavity 40 can be increased, the welding is facilitated, and the welding strength can be enhanced.

As shown in fig. 10, a fifth embodiment of the present invention provides an electronic expansion valve, which is different from the first embodiment in that in the fifth embodiment, one end of the hole wall of the mounting hole 11 facing the connecting pipe 30 has a third chamfer 12, and the space between the third chamfer 12, the valve seat core 20 and the connecting pipe 30 forms a solder cavity 40. Through set up third chamfer 12 on the pore wall of mounting hole 11, can increase the volume in solder cavity 40, be convenient for weld, can strengthen welding strength.

As shown in fig. 11, a sixth embodiment of the present invention provides an electronic expansion valve, which is different from the second embodiment in that in the sixth embodiment, one end of the hole wall of the mounting hole 11 facing the connecting pipe 30 has a third chamfer 12, and the space between the third chamfer 12, the valve seat core 20 and the connecting pipe 30 forms a solder cavity 40. Through set up third chamfer 12 on the pore wall of mounting hole 11, can increase the volume in solder cavity 40, be convenient for weld, can strengthen welding strength.

The implementation of the solder cavity 40 is not limited to the above embodiments, and the specific structure thereof can be adapted according to the actual situation. For example, the solder chamber 40 can be formed by providing only the third chamfer 12 on the wall of the mounting hole 11 so that the press-fitting section 21 and the guide section 22 have the same diameter and by utilizing the interval between the third chamfer 12, the valve seat core 20 and the connecting pipe 30.

When the device is assembled, the device is inverted, the solder is placed on the upper end of the valve seat core 20, and after the solder melts, the connecting tube 30 expands much to form a weld due to the difference in thermal expansion coefficient between the connecting tube 30 and the valve seat core 20, so that the solder flows down into the solder cavity 40 under gravity and capillary attraction.

The device provided by the embodiment has the following beneficial effects:

(1) the valve seat core 20 is in interference fit with the shell 10, so that the coaxiality of the valve seat core 20 and the shell 10 can be ensured;

(2) laser spot welding can be reduced, the process is simple, and the cost can be reduced;

(3) by placing the solder inside, it is possible to recognize the quality of soldering by observing whether or not the solder leaks from between the connection pipe 30 and the case 10 outside the connection pipe 30, and the process is more reliable.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An electronic expansion valve, comprising:

a housing (10) having a mounting hole (11);

the valve seat core (20) comprises a press-fitting section (21) and a guide section (22) which are connected with each other, the press-fitting section (21) is in interference fit with the mounting hole (11), and the guide section (22) is located on the outer side of the mounting hole (11);

the connecting pipe (30) is sleeved on the guide section (22), the end wall of the connecting pipe (30) is abutted to the shell (10), and a welding material cavity (40) is formed among the shell (10), the valve seat core (20) and the connecting pipe (30).

2. An electronic expansion valve according to claim 1, wherein the diameter of the guide section (22) is smaller than or equal to the diameter of the press-fitting section (21).

3. An electronic expansion valve according to claim 2, wherein the spacing between the guide section (22), the housing (10) and the connecting tube (30) forms the solder chamber (40).

4. An electronic expansion valve according to claim 2, wherein a first chamfer (23) is provided between the press-fitting section (21) and the guide section (22), and the space between the first chamfer (23), the housing (10) and the connecting tube (30) forms the solder cavity (40).

5. An electronic expansion valve according to claim 1, wherein the end of the connecting tube (30) connected to the guide section (22) has a second chamfer (31), and the space between the second chamfer (31), the housing (10) and the valve seat core (20) forms the solder chamber (40).

6. An electronic expansion valve according to any of claims 1 to 5, wherein the wall of the mounting hole (11) at its end facing the connecting tube (30) has a third chamfer (12), the space between the third chamfer (12), the valve seat core (20) and the connecting tube (30) forming the solder chamber (40).

7. An electronic expansion valve according to claim 1, wherein a solder pre-placement is provided between the inner wall of the connection tube (30) and the outer side wall of the guide section (22), the solder pre-placement being for placing solder.

8. An electronic expansion valve according to claim 7, wherein a receiving groove (221) is provided on an outer side wall of the guide section (22), the receiving groove (221) being annularly arranged along a circumferential direction of the guide section (22), the receiving groove (221) forming the solder pre-portion.

9. An electronic expansion valve according to claim 1, wherein the valve seat core (20) further comprises a limit boss (24), the limit boss (24) is disposed at an end of the press-fitting section (21) away from the guide section (22), and the limit boss (24) is annularly disposed along a circumferential direction of the valve seat core (20).

10. An electronic expansion valve according to claim 1, wherein the housing (10) comprises a sleeve (13) and a valve body (14) connected to each other, the mounting hole (11) being provided in the valve body (14).