CN113339510B

CN113339510B - Electronic expansion valve

Info

Publication number: CN113339510B
Application number: CN202010100335.6A
Authority: CN
Inventors: 詹少军; 徐冠军; 姚坚
Original assignee: Zhejiang DunAn Hetian Metal Co Ltd
Current assignee: Zhejiang DunAn Hetian Metal Co Ltd
Priority date: 2020-02-18
Filing date: 2020-02-18
Publication date: 2023-06-30
Anticipated expiration: 2040-02-18
Also published as: CN113339510A

Abstract

The present invention provides an electronic expansion valve, comprising: the shell is provided with a bottom wall, and the bottom wall is provided with an inner side, an outer side and a mounting hole penetrating through the inner side and the outer side; the valve seat core comprises a press-fit section and a guide section which are connected with each other, the press-fit section is in interference fit with the mounting hole, and the guide section is positioned on the outer side of the bottom wall; the connecting pipe is sleeved on the guide section; a solder preset part, which is arranged near the outer side of the bottom wall and is used for placing solder; the solder channel is arranged between the press-fit section and the mounting hole, a first solder cavity is arranged between the valve seat core and the shell, the first solder cavity is arranged close to the inner side of the bottom wall, one end of the solder channel is communicated with the solder preset part, and the other end of the solder channel is communicated with the first solder cavity. Through the technical scheme that this application provided, can solve disk seat core among the prior art and casing axiality poor, the complex scheduling problem of technology.

Description

Electronic expansion valve

Technical Field

The invention relates to the technical field of electronic expansion valves, in particular to an electronic expansion valve.

Background

Generally, an electronic expansion valve includes a housing, a valve core assembly, and a valve seat core, where the valve core assembly and the valve seat core are both disposed in the housing, and the valve seat core is provided with a valve port, and the valve core assembly is used for controlling opening and closing of the valve port. Wherein, be provided with the mounting hole on the casing, the disk seat core wears to establish in the mounting hole and loose with the mounting hole, and the connecting tube cover is established on the disk seat core.

In the prior art, in order to assemble valve seat core, casing and connecting pipe three, utilize the mode of laser spot welding to weld valve seat core and casing to fix a position at first, then establish the connecting pipe box on valve seat core to with weld the ring cover and establish outside the connecting pipe, carry out welded fastening to valve seat core, casing and connecting pipe through the mode of stove welding at last.

However, since the valve seat core and the mount Kong Songpei are mounted, it is difficult to ensure the coaxiality of the valve seat core and the housing when spot welding the valve seat core and the housing, which affects the performance of the device. Therefore, the prior art has the problems of poor coaxiality between the valve seat core and the shell, complex process and the like.

Disclosure of Invention

The invention provides an electronic expansion valve, which aims to solve the problems of poor coaxiality between a valve seat core and a shell, complex process and the like in the prior art.

The invention provides an electronic expansion valve, which comprises: the shell is provided with a bottom wall, and the bottom wall is provided with an inner side, an outer side and a mounting hole penetrating through the inner side and the outer side; the valve seat core comprises a press-fit section and a guide section which are connected with each other, the press-fit section is in interference fit with the mounting hole, and the guide section is positioned on the outer side of the bottom wall; the connecting pipe is sleeved on the guide section; a solder preset part, which is arranged near the outer side of the bottom wall and is used for placing solder; the solder channel is arranged between the press-fit section and the mounting hole, a first solder cavity is arranged between the valve seat core and the shell, the first solder cavity is arranged close to the inner side of the bottom wall, one end of the solder channel is communicated with the solder preset part, and the other end of the solder channel is communicated with the first solder cavity.

Further, a solder channel is provided on the press-fit section and/or within the mounting hole.

Further, a circulation groove is formed in the press-fit section, one end of the circulation groove is communicated with the solder preset portion, the other end of the circulation groove is communicated with the first solder cavity, and the circulation groove forms a solder channel.

Further, an annular groove is formed in the inner wall of the mounting hole, the annular groove is arranged close to the inner side of the bottom wall, and a first solder cavity is formed between the annular groove and the valve seat core.

Further, the end wall of the connecting pipe is abutted against the shell, a second solder cavity is formed among the shell, the valve seat core and the connecting pipe, one end of the second solder cavity is communicated with the solder preset part, and the other end of the second solder cavity is communicated with the solder channel.

Further, the diameter of the guide section is smaller than or equal to the diameter of the press-fit section.

Further, the space among the guide section, the shell and the connecting pipe forms a second solder cavity.

Further, a first chamfer is arranged between the press-fit section and the guide section, and a second solder cavity is formed by the first chamfer, the shell and the connecting pipe at intervals.

Further, one end of the connecting pipe connected with the guide section is provided with a second chamfer, and a second solder cavity is formed by the second chamfer, the shell and the valve seat core at intervals.

Further, one end of the hole wall of the mounting hole facing the connecting pipe is provided with a third chamfer, and a second solder cavity is formed by the third chamfer, the valve seat core and the interval between the connecting pipe.

Further, the solder preset is located between the inner wall of the connecting tube and the outer side wall of the guide section.

Further, an accommodating groove is formed in the outer side wall of the guide section, the accommodating groove is annularly arranged along the circumferential direction of the guide section, and the accommodating groove forms a solder preset part.

By applying the technical scheme of the invention, the electronic expansion valve comprises a shell, a valve seat core, a connecting pipe, a solder preset part and a solder channel. The shell is provided with a bottom wall, the bottom wall is provided with an inner side, an outer side and a mounting hole penetrating through the inner side and the outer side, the solder presetting part is arranged close to the outer side of the bottom wall, and the first solder cavity is arranged close to the inner side of the bottom wall. Specifically, the disk seat core includes interconnect's pressure equipment section and direction section, and the direction section is located the outside of diapire, and the connecting tube cover is established on the direction section, through with pressure equipment section and mounting hole interference fit, need not to utilize the mode of spot welding to fix a position the disk seat core, can guarantee the axiality of disk seat core and casing, simplify processing technology. Through setting up the solder passageway between pressure equipment section and mounting hole, make the one end and the solder presetting portion intercommunication of solder passageway, make the other end and the first solder chamber intercommunication of solder passageway, utilize the solder passageway can be simultaneously with the inboard and outside of diapire respectively with disk seat core welded fastening, can promote welding strength.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention. In the drawings:

fig. 1 shows a schematic structural diagram of an electronic expansion valve according to an embodiment of the present invention;

FIG. 2 shows a partial enlarged view at A in FIG. 1;

FIG. 3 shows a schematic structural view of the valve seat core of FIG. 1;

FIG. 4 shows a further schematic structural view of the valve seat core of FIG. 1;

FIG. 5 shows an assembly view of the valve seat core, valve body and connecting tube of FIG. 1;

FIG. 6 shows a partial enlarged view of a solder cavity of an electronic expansion valve provided in accordance with an embodiment of the present invention;

fig. 7 shows a partial enlarged view of a solder cavity of an electronic expansion valve according to a second embodiment of the present invention;

fig. 8 shows a partial enlarged view at a solder chamber of an electronic expansion valve provided in accordance with a third embodiment of the present invention;

fig. 9 shows a partial enlarged view at a solder chamber of an electronic expansion valve provided in accordance with a fourth embodiment of the present invention;

fig. 10 is a partial enlarged view of a solder chamber of an electronic expansion valve according to a fifth embodiment of the present invention;

FIG. 11 is a partially enlarged view of a solder chamber of an electronic expansion valve according to a sixth embodiment of the present invention;

fig. 12 shows a schematic structural view of the valve body of fig. 1.

Wherein the above figures include the following reference numerals:

10. a housing; 11. a mounting hole; 111. an annular groove; 12. a third chamfer; 13. a sleeve; 14. a valve body;

20. a valve seat core; 21. a press-fitting section; 211. a flow channel; 22. a guide section; 221. a receiving groove; 23. a first chamfer; 24. a limit boss;

30. a connecting pipe; 31. a second chamfer;

40. a second solder cavity; 50. a solder preset part; 60. a solder channel; 70. a first solder cavity.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

As shown in fig. 1 to 11, the first embodiment of the present invention provides an electronic expansion valve including a housing 10, a valve seat core 20, a connection pipe 30, a solder pre-set portion 50, and a solder passage 60. The housing 10 has a bottom wall with an inner side and an outer side and a mounting hole 11 penetrating the inner side and the outer side. In this embodiment, the inner side of the bottom wall is disposed corresponding to the inside of the electronic expansion valve, and the outer side of the bottom wall is disposed corresponding to the outside. Specifically, the valve seat core 20 includes a press-fitting section 21 and a guiding section 22 that are connected to each other, and the press-fitting section 21 is in interference fit with the mounting hole 11, so that the positioning connection between the valve seat core 20 and the housing 10 can be realized, and the coaxiality between the valve seat core 20 and the housing 10 can be ensured. In this embodiment, the guide section 22 is located at the outer side of the bottom wall, and the connecting pipe 30 is sleeved on the guide section 22. Wherein, the solder presetting portion 50 is arranged near the outer side of the bottom wall, the solder presetting portion 50 is used for placing solder, a first solder cavity 70 is arranged between the valve seat core 20 and the shell 10, and the first solder cavity 70 is arranged near the inner side of the bottom wall. By disposing the solder passage 60 between the press-fit section 21 and the mounting hole 11 such that one end of the solder passage 60 communicates with the solder pre-set portion 50 and the other end of the solder passage 60 communicates with the first solder chamber 70, solder can enter the first solder chamber 70 through the solder passage 60 to weld-fix the valve seat core 20 at both the inside and outside of the bottom wall, and the weld strength can be improved.

By using the electronic expansion valve provided by the embodiment, the press-fit section 21 is in interference fit with the mounting hole 11, and the valve seat core is positioned in a spot welding mode, so that the positioning connection of the valve seat core 20 and the shell 10 can be realized, the coaxiality of the valve seat core 20 and the shell 10 can be ensured, and the processing technology is simplified. By providing the solder passage 60 between the press-fit section 21 and the mounting hole 11, solder can enter the first solder chamber 70 through the solder passage 60, and the inner side and the outer side of the bottom wall can be welded and fixed with the valve seat core 20, respectively, and the welding strength can be improved. Also, since the first solder chamber 70 is provided near the inner side of the bottom wall, the first solder chamber 70 can also be used to identify the quality of the welding of the valve seat core 20 to the housing 10.

Wherein the solder channels 60 may be provided on the press-fit section 21, or within the mounting holes 11, or on both the press-fit section 21 and the mounting holes 11. In the present embodiment, the solder channels 60 are provided on the press-fit section 21, so that the processing of the solder channels 60 is facilitated. Wherein the solder passage 60 may be a flow groove or a flow hole, or a separately provided communication pipe is provided between the press-fit section 21 and the mounting hole 11, and communication between the solder pre-set portion 50 and the first solder chamber 70 is achieved by the communication pipe. In other embodiments, saw-tooth notches may be provided in the mounting hole 11, with which the solder channels 60 are formed.

As shown in fig. 3 and 4, the press-fit section 21 is provided with a circulation groove 211, one end of the circulation groove 211 communicates with the solder preset portion 50, the other end of the circulation groove 211 communicates with the first solder chamber 70, and the circulation groove 211 forms the solder passage 60. The structure of the flow channel 211 is convenient for processing, and can reduce cost. In the present embodiment, the flow grooves 211 are milled-edge grooves.

As shown in fig. 2 and 12, an annular groove 111 is provided on the inner wall of the mounting hole 11, the annular groove 111 is provided near the inner side of the bottom wall, and a first solder chamber 70 is formed between the annular groove 111 and the valve seat core 20, so that the first solder chamber 70 is easily processed.

In the present embodiment, the end wall of the connecting tube 30 abuts against the housing 10, and a second solder cavity 40 is provided between the housing 10, the valve seat core 20 and the connecting tube 30, one end of the second solder cavity 40 communicates with the solder preset portion 50, and the other end of the second solder cavity 40 communicates with the solder passage 60. Wherein the second solder cavity 40 is a transition region through which solder flows. The fixed connection of the shell 10, the valve seat core 20 and the connecting pipe 30 can be realized by using a furnace welding mode, so that laser spot welding can be reduced, the process is simple, and the cost can be reduced.

Wherein the diameter of the guiding section 22 is smaller than or equal to the diameter of the press-fit section 21. The guide section 22 can serve as a guide when the valve seat core 20 is inserted into the mounting hole 11, facilitating assembly. In the present embodiment, the diameter of the guide section 22 is smaller than the diameter of the press-fit section 21.

As shown in fig. 6, the space between the guide section 22, the housing 10, and the connection pipe 30 forms a second solder cavity 40. The guide section 22 and the press-fitting section 21 have a step structure, the press-fitting section 21 is in interference fit with the mounting hole 11, and a space is formed between the guide section 22 and the inner wall of the mounting hole 11 and between the end wall of the connecting pipe 30 and the press-fitting section 21, and the space forms a second solder cavity 40.

Wherein the solder pre-set portion 50 is located between the inner wall of the connection tube 30 and the outer side wall of the guide section 22. Wherein the solder preset portion may be provided on the inner wall of the connection pipe 30, or on the outer side wall of the guide section 22, or on both the inner wall of the connection pipe 30 and the outer side wall of the guide section 22. In other embodiments, the solder may be sleeved on the outer wall of the connecting tube 30, and the positioning of the solder does not affect the coaxiality of the valve seat core 20 and the housing 10 by using the press fit, the first solder cavity 70 and the second solder cavity 40 to cooperate. In the present embodiment, the solder pre-set portion 50 is used for placing a solder ring.

In the present embodiment, since the solder is provided inside the connection pipe 30, when the connection pipe 30 is welded, the welding quality can be accurately judged by observing whether or not the solder leaks from between the connection pipe 30 and the housing 10 outside the connection pipe 30, so that it is convenient for the staff to detect. The determination of the welding quality is not limited by the pipe shape of the connecting pipe 30, and can be used for determining the bent pipe. Since less solder is deposited on the outside of the connection tube 30 after soldering, positioning and press-fitting after the device can be effectively ensured.

In the present embodiment, the solder preset portion is provided on the guide section 22. The solder preset portion may be disposed in the middle of the guide section 22, or may be disposed at both ends of the guide section 22. By providing the solder preset portion on the guide section 22, the processing of the solder preset portion is facilitated, and the processing cost can be reduced.

As shown in fig. 3, the outer side wall of the guide section 22 is provided with a receiving groove 221, the receiving groove 221 is provided in a ring shape along the circumferential direction of the guide section 22, and the receiving groove 221 forms a solder preset portion. Specifically, the receiving groove 221 may be provided at the middle of the guide section 22, or may be provided at both ends of the guide section 22, and the provision of the receiving groove 221 has an advantage of convenience in processing. In the present embodiment, the receiving groove 221 is located at an end of the guide section 22 remote from the press-fit section 21. With the above structure, the accommodating groove 221 can be formed by turning only one end of the guide section 22 far away from the press-fitting section 21, so that the processing cost can be further reduced, and the solder can be conveniently placed.

In this embodiment, the valve seat core 20 further includes a limiting boss 24, the limiting boss 24 is disposed at one end of the press-fit section 21 away from the guiding section 22, the limiting boss 24 is disposed annularly along the circumference of the valve seat core 20, and the limiting boss 24 is used for limiting the position of the valve seat core 20 in the mounting hole 11. The limiting boss 24 is disposed in the annular groove 111, and a first solder cavity 70 is formed between the annular groove 111 and the limiting boss 24.

Wherein the housing 10 includes a sleeve 13 and a valve body 14 connected to each other, and the mounting hole 11 is provided on the valve body 14. The casing 10 is detachably provided as the sleeve 13 and the valve body 14 for easy assembly, and the assembly efficiency can be improved.

In this embodiment, the electronic expansion valve further includes a valve core assembly disposed in the housing 10, and a valve port is disposed on the valve seat core 20, and the valve core assembly is used for controlling the opening and closing of the valve port.

As shown in fig. 7, the second embodiment of the present invention provides an electronic expansion valve, which is different from the first embodiment in that in the second embodiment, a first chamfer 23 is provided between the press-fit section 21 and the guide section 22, and a second solder cavity 40 is formed by the first chamfer 23, the housing 10 and the space between the connecting pipes 30. Specifically, the first chamfer 23 has a space with the inner wall of the mounting hole 11 and the end wall of the connection pipe 30, which forms the second solder cavity 40.

As shown in fig. 8, the third embodiment of the present invention provides an electronic expansion valve, which is different from the first embodiment in that in the third embodiment, one end of the connecting pipe 30 connected to the guide section 22 has a second chamfer 31, and a second solder cavity 40 is formed by the interval between the second chamfer 31, the housing 10 and the valve seat core 20. By providing the second chamfer 31 on the connection pipe 30, the volume of the second solder chamber 40 can be increased, the soldering can be facilitated, and the soldering strength can be enhanced.

As shown in fig. 9, the fourth embodiment of the present invention provides an electronic expansion valve, which is different from the second embodiment in that in the fourth embodiment, one end of the connecting pipe 30 connected to the guiding section 22 has a second chamfer 31, and a second solder cavity 40 is formed by the space between the second chamfer 31, the housing 10 and the valve seat core 20. By providing the second chamfer 31 on the connection pipe 30, the volume of the second solder chamber 40 can be increased, the soldering can be facilitated, and the soldering strength can be enhanced.

As shown in fig. 10, the fifth embodiment of the present invention provides an electronic expansion valve, which is different from the first embodiment in that in the fifth embodiment, a third chamfer 12 is provided at an end of a hole wall of the mounting hole 11 facing the connecting pipe 30, and a second solder cavity 40 is formed by a space between the third chamfer 12, the valve seat core 20 and the connecting pipe 30. By providing the third chamfer 12 on the wall of the mounting hole 11, the volume of the second solder chamber 40 can be increased, the soldering can be facilitated, and the soldering strength can be enhanced.

As shown in fig. 11, the sixth embodiment of the present invention provides an electronic expansion valve, which is different from the second embodiment in that in the sixth embodiment, the hole wall of the mounting hole 11 has a third chamfer 12 at one end facing the connecting pipe 30, and the space between the third chamfer 12, the valve seat core 20 and the connecting pipe 30 forms a second solder cavity 40. By providing the third chamfer 12 on the wall of the mounting hole 11, the volume of the second solder chamber 40 can be increased, the soldering can be facilitated, and the soldering strength can be enhanced.

The implementation of the second solder cavity 40 is not limited to the above embodiment, and its specific structure may be adaptively adjusted according to practical situations. For example, the second solder chamber 40 can be formed by providing the third chamfer 12 only on the wall of the mounting hole 11 so that the diameters of the press-fit section 21 and the guide section 22 are the same, and using the intervals between the third chamfer 12, the valve seat core 20, and the connection pipe 30.

When the device is assembled, the device is inverted, the built-in solder is arranged at the upper end of the valve seat core 20, and after the solder is melted, the solder flows into the second solder cavity 40 and the first solder cavity 70 in sequence under the gravity and capillary attraction due to the fact that the thermal expansion coefficients of the connecting pipe 30 and the valve seat core 20 are different and the connecting pipe 30 is expanded to form a welding line.

The device provided by the embodiment has the following beneficial effects:

(1) The valve seat core 20 is in interference fit with the shell 10, so that coaxiality of the valve seat core 20 and the shell 10 can be ensured;

(2) The solder channel 60 is arranged between the press-fitting section 21 and the mounting hole 11, so that the inner side and the outer side of the bottom wall can be welded and fixed with the valve seat core 20 respectively, and the welding strength can be improved;

(3) The laser spot welding can be reduced, the process is simple, and the cost can be reduced;

(4) By incorporating the solder, whether or not the solder leaks from between the connection pipe 30 and the case 10 can be observed outside the connection pipe 30, and the quality of the solder can be recognized, and the process is more reliable.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

In the description of the present invention, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present invention; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present invention.

The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An electronic expansion valve, characterized in that it comprises:

a housing (10), the housing (10) having a bottom wall with an inner side and an outer side and a mounting hole (11) penetrating the inner side and the outer side;

the valve seat core (20), the valve seat core (20) comprises a press-fit section (21) and a guide section (22) which are connected with each other, the press-fit section (21) is in interference fit with the mounting hole (11), and the guide section (22) is positioned on the outer side of the bottom wall;

the connecting pipe (30) is sleeved on the guide section (22);

a solder preset portion (50), wherein the solder preset portion (50) is arranged close to the outer side of the bottom wall, the solder preset portion (50) is used for placing solder, and the solder preset portion (50) is positioned between the inner wall of the connecting pipe (30) and the outer side wall of the guide section (22);

a solder passage (60) provided between the press-fit section (21) and the mounting hole (11), a first solder chamber (70) being provided between the valve seat core (20) and the housing (10), the first solder chamber (70) being provided near the inner side of the bottom wall, one end of the solder passage (60) being in communication with the solder preset portion (50), the other end of the solder passage (60) being in communication with the first solder chamber (70);

the end wall of the connecting pipe (30) is abutted to the shell (10), a second solder cavity (40) is formed among the shell (10), the valve seat core (20) and the connecting pipe (30), one end of the second solder cavity (40) is communicated with the solder preset part (50), and the other end of the second solder cavity (40) is communicated with the solder channel (60).

2. Electronic expansion valve according to claim 1, characterized in that the solder channels (60) are provided on the press-fit section (21) and/or in the mounting hole (11).

3. The electronic expansion valve according to claim 2, wherein a circulation groove (211) is provided on the press-fit section (21), one end of the circulation groove (211) communicates with the solder preset portion (50), the other end of the circulation groove (211) communicates with the first solder chamber (70), and the circulation groove (211) forms the solder passage (60).

4. Electronic expansion valve according to claim 1, characterized in that an annular groove (111) is provided on the inner wall of the mounting hole (11), the annular groove (111) being provided close to the inner side of the bottom wall, the first solder cavity (70) being formed between the annular groove (111) and the valve seat core (20).

5. Electronic expansion valve according to claim 1, characterized in that the diameter of the guiding section (22) is smaller than or equal to the diameter of the press-fit section (21).

6. Electronic expansion valve according to claim 5, characterized in that the spacing between the guide section (22), the housing (10) and the connecting tube (30) forms the second solder cavity (40).

7. Electronic expansion valve according to claim 5, characterized in that a first chamfer (23) is provided between the press-fit section (21) and the guide section (22), the space between the first chamfer (23), the housing (10) and the connecting tube (30) forming the second solder cavity (40).

8. Electronic expansion valve according to claim 1, characterized in that the end of the connecting tube (30) connected to the guide section (22) has a second chamfer (31), the spacing between the second chamfer (31), the housing (10) and the valve seat core (20) forming the second solder cavity (40).

9. Electronic expansion valve according to any of claims 1 to 8, characterized in that the end of the wall of the mounting hole (11) facing the connecting pipe (30) is provided with a third chamfer (12), the space between the third chamfer (12), the valve seat core (20) and the connecting pipe (30) forming the second solder cavity (40).

10. The electronic expansion valve according to claim 1, characterized in that an accommodation groove (221) is provided on an outer side wall of the guide section (22), the accommodation groove (221) being provided annularly along a circumference of the guide section (22), the accommodation groove (221) forming the solder pre-set portion (50).