CN114466511A - Multi-substrate power supply micro-module design method - Google Patents
Multi-substrate power supply micro-module design method Download PDFInfo
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- CN114466511A CN114466511A CN202210289644.1A CN202210289644A CN114466511A CN 114466511 A CN114466511 A CN 114466511A CN 202210289644 A CN202210289644 A CN 202210289644A CN 114466511 A CN114466511 A CN 114466511A
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- 239000000758 substrate Substances 0.000 title claims abstract description 177
- 238000013461 design Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 claims description 3
- 230000008054 signal transmission Effects 0.000 claims description 3
- 230000005670 electromagnetic radiation Effects 0.000 abstract description 6
- 238000003475 lamination Methods 0.000 abstract description 6
- 238000010030 laminating Methods 0.000 abstract description 4
- 230000008878 coupling Effects 0.000 abstract description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- 230000010354 integration Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000012938 design process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention relates to a design method of a multi-substrate power supply micromodule, which utilizes a lamination design concept, and greatly reduces the occupied area of electronic components on a substrate by vertically placing internal devices, adding an auxiliary substrate and laminating the components, and comprises the following steps: s1: providing a power supply micro-module main control substrate; s2: the auxiliary substrate loop is connected with the ground between the main control substrate and the auxiliary substrate; s3: wherein the auxiliary substrate is connected with a resistance-capacitance circuit and an auxiliary substrate circuit through a device vertical clamp; s4: after the auxiliary substrate is provided with the device, checking the welding error; s5: and when the mode of selecting the reverse buckle is used, the other end of the device is installed on the main control substrate to complete the substrate assembly. According to the multi-substrate power supply micromodule design method, the vertical design of the circuit is adopted, the planar single-dimensional electromagnetic radiation is decomposed into the spatial multi-dimensional electromagnetic radiation, and the electromagnetic coupling between the power supply module and the application circuit board can be effectively reduced.
Description
Technical Field
The invention relates to the field of power supply micromodule plastic package processes, in particular to a design method of a multi-substrate power supply micromodule.
Background
Along with the continuous improvement of the integration level, the requirement on the power module is higher and higher, the trend is miniaturization, high voltage, large current, low noise and high integration level, and the problem that how to reduce the occupied area of the power module on a PCB is in urgent need of solution. In general, the structural sizes of devices such as inductors, main control chips, resistors, capacitors and the like are difficult to compress, and other technical approaches are needed to complete the ideal design. In the power supply micromodule integration process, along with the continuous improvement of the integration level, how to integrate more components in a limited space is very important to realize better working performance.
Disclosure of Invention
In order to solve the technical problems, the design method of the multi-substrate power supply micromodule provided by the invention utilizes a lamination design concept, and greatly reduces the occupied area of electronic components on a substrate by vertically placing internal devices, adding an auxiliary substrate and laminating the components, and comprises the following steps:
step S1: providing a power supply micro-module main control substrate, wherein a magnetic component and an auxiliary substrate loop are connected to the main control substrate through pins;
step S2: the auxiliary substrate loop is connected with the ground between the main control substrate and the auxiliary substrate;
step S3: wherein the auxiliary substrate is connected with a resistance-capacitance circuit and an auxiliary substrate circuit through a device vertical clamp;
step S4: after the auxiliary substrate is provided with the devices, the welding errors at the bottom of each device are checked, and whether the next reverse buckling installation is carried out is judged;
step S5: and when the mode of selecting the reverse buckle is used, the other end of the device is installed on the main control substrate to complete the substrate assembly.
In an embodiment of the invention, the multi-substrate power supply micromodule comprises a power supply micromodule main control substrate, a magnetic component plastically packaged in the power supply micromodule, a power supply micromodule auxiliary substrate, an auxiliary substrate loop and a resistance-capacitance of an auxiliary electronic component plastically packaged in the power supply micromodule, wherein the main control substrate and the auxiliary substrate are vertically placed and welded through the resistance-capacitance, and are vertically connected with signal transmission between an upper layer of substrate and a lower layer of substrate, or are parallelly placed and welded between the main control substrate and the auxiliary substrate, so that the use value of the device can be fully utilized, the signal conversion between the upper layer of substrate and the lower layer of substrate is reduced, the reliability of the module is also improved, the plastic packaging volume of the power supply micromodule is reduced, and the residual space in the power supply micromodule can be fully utilized.
In one embodiment of the invention, the auxiliary substrate assembly integrates a resistance-capacitance circuit and an auxiliary substrate circuit, which can be connected by normal welding or vertical welding, and the assembly between the auxiliary substrate assembly and the main control substrate is fully considered in the whole welding assembly process.
In an embodiment of the invention, a matched bonding pad connecting metal sheet is arranged at the joint of the main control substrate and the auxiliary substrate, so that data communication can be effectively realized, and normal work between the main control substrate and the auxiliary substrate is ensured.
In an embodiment of the invention, the auxiliary substrate may also be designed as a double-layer substrate, and a plurality of resistors and capacitors are simultaneously welded on two sides of the auxiliary substrate to reduce the volume of the module plastic package.
Compared with the prior art, the technical scheme of the invention has the following advantages: according to the multi-substrate power supply micromodule design method, in the power supply micromodule packaging process, a multi-substrate packaging processing technology is applied, the internal space of a module can be effectively applied, the thickness of a substrate during lamination design is fully considered in the design process and is smaller than the thickness of module plastic package; the new design does not increase the height of the module by reducing the size of the bottom substrate.
The loop area should be minimized during the circuit layout process to reduce the influence of the auxiliary substrate on various parameters of the power module. The auxiliary substrate and the main control substrate can be connected through a three-dimensional bonding pad of a device, so that the design of circuit switching, PCB wiring and the like is reduced; the vertical design of the circuit resolves planar single-dimensional electromagnetic radiation into spatial multi-dimensional electromagnetic radiation, and can effectively reduce electromagnetic coupling between the power module and the application circuit board.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference will now be made in detail to the present disclosure, examples of which are illustrated in the accompanying drawings.
FIG. 1 is a schematic diagram of a conventional simple substrate three-dimensional model;
FIG. 2 is a schematic diagram of a parallel auxiliary substrate integrated design method according to the present invention;
FIG. 3 is a schematic diagram of the design method for integration of a complex vertical assist substrate according to the present invention;
FIG. 4 is a schematic diagram of a simple vertical assist substrate integration design method according to the present invention.
As shown in the figure, 1, a main control substrate, 2, a magnetic component, 3, an auxiliary substrate, 4, a resistance-capacitance, 5 and an auxiliary substrate loop.
Detailed Description
The embodiment provides a design method of a multi-substrate power supply micromodule, which utilizes a lamination design concept, greatly reduces the occupied area of an electronic component on a substrate by vertically placing an internal device, adding an auxiliary substrate and laminating the component, and comprises the following steps:
step S1: providing a power supply micro-module main control substrate 1, wherein the main control substrate 1 is connected with a magnetic component 2 and an auxiliary substrate loop 5 through pins;
step S2: the auxiliary substrate circuit 5 is connected to the ground between the main control substrate 1 and the auxiliary substrate 3;
step S3: wherein the auxiliary substrate 3 is connected with a resistance-capacitance circuit 4 and an auxiliary substrate loop 5 through a device vertical clamp;
step S4: after the auxiliary substrate 3 is provided with the devices, the welding errors at the bottoms of the devices are checked, and the errors are calculated according to different products to judge whether the next inverted installation is carried out;
step S5: when the reverse manner is selected, the other end of the device is mounted on the main control substrate 1 to complete the substrate assembly.
The design idea mainly utilizes a lamination design concept, and the method comprises the steps of vertically placing internal devices, adding an auxiliary substrate, designing a substrate connecting loop, laminating components and the like, so that the occupied area of electronic components on the substrate is greatly reduced, and a new design idea is provided for the higher integration level of a power supply micro-module; the design method mainly comprises the steps of designing the auxiliary substrate according to available space inside the module and compared with a conventional model shown in figure 1 on the basis of not influencing basic performance parameters of an internal circuit, and determining the placement mode of the auxiliary substrate according to the internal circuit of the module, the size of the substrate and the size of the power supply micromodule capable of being plastically packaged.
The multi-substrate power supply micromodule comprises a power supply micromodule main control substrate 1, a magnetic component 2, a power supply micromodule auxiliary substrate 3, an auxiliary substrate loop 5 and a resistance-capacitance 4 of a module internal plastic package auxiliary electronic component, wherein the main control substrate 1 and the auxiliary substrate 3 are vertically placed and welded through the resistance-capacitance 4 and are vertically connected with each other, and signal transmission between an upper layer substrate and a lower layer substrate is vertically connected, or the main control substrate 1 and the auxiliary substrate 3 are parallelly placed and welded, so that the use value of devices can be fully utilized, the signal conversion between the upper layer substrate and the lower layer substrate is reduced, the reliability of the module is also improved, the plastic package volume of the power supply micromodule is reduced, and the residual space in the power supply micromodule can be fully utilized.
In the process of selecting a vertical auxiliary substrate to improve the integration level of the power supply micromodule, a proper device is selected at first, the auxiliary substrate 3 is designed, the key point is that a butt joint part between two substrates is designed to design an auxiliary substrate loop 5 according to the actual circuit principle, in order to reduce the size of the plastic package, the plastic package takes a side welding pad at the welding part at the side edge of the component as a main connecting point, the component can be placed transversely or vertically, and the selected basis is mainly according to the connection relation between the components, the number of the devices between pins and the like.
After the circuit of the substrate is analyzed, when the integration level is improved by selecting the parallel substrate shown in the attached drawing 2, the parallel auxiliary substrate 3 is integrated in the power supply micro module, the substrate and the main control substrate 1 in the module form a parallel structure, and the substrate can be paved with various signal lines under the condition that the space allows, but the key point of the main consideration in the design process is that the substrate can be effectively connected with the main control substrate 1. The circuit on the auxiliary substrate 3 needs to be designed first, and taking the simplest lap joint ground plane as an example, only one kind of ground plane and the corresponding bonding pad of each device need to be designed on the auxiliary substrate 3.
As shown in fig. 4, the auxiliary substrate 3 is assembled with a resistor-capacitor 4 and an auxiliary substrate loop 5, which can be connected by normal soldering or vertical soldering.
Firstly, a ground loop 5 needs to be designed at a proper position to connect the ground between the main control substrate and the auxiliary substrate; and secondly, reasonably arranging the connecting bonding pads on the auxiliary substrate according to the packaging form and the device type of the device resistor-capacitor 4. The components on the auxiliary substrate 3 can be normally welded or vertically welded; the upper layer of parallel substrate and the lower layer of parallel substrate are vertically connected by the capacitor device, so that the use value of the device can be fully utilized, the connecting line between the upper layer of substrate and the lower layer of substrate is reduced, and the reliability of the module is improved; when the auxiliary substrate is perpendicular to the main control substrate, data line communication can be achieved through connection between the devices.
In the same mounting process flow, when a vertical auxiliary substrate is constructed in the module, the device and the auxiliary substrate are integrated, and after the inspection error is acceptable, the whole auxiliary substrate and the main control substrate are assembled. The vertical auxiliary substrate is used for reducing the integrated area on the main control substrate, mainly takes a ground wire laying layer as a main part, and can be properly distributed with other circuits according to the actual condition of the circuits.
As shown in fig. 3, the auxiliary substrate 3 may also be designed as a double-layer substrate, and a plurality of resistors and capacitors 4 are welded on two sides of the auxiliary substrate 3 at the same time to reduce the plastic package volume of the module.
In the power supply micromodule packaging process, a multi-substrate packaging processing technology is applied, the internal space of the module can be effectively applied, and the thickness of the substrate when the lamination is designed is fully considered in the design process and is smaller than the thickness of the module plastic package; the new design does not increase the height of the module by reducing the size of the bottom substrate.
The loop area should be minimized during the circuit layout process to reduce the influence of the auxiliary substrate on various parameters of the power module. The auxiliary substrate and the main control substrate can be connected through a three-dimensional bonding pad of a device, so that the design of circuit switching, PCB wiring and the like is reduced; the vertical design of the circuit resolves planar single-dimensional electromagnetic radiation into spatial multi-dimensional electromagnetic radiation, and can effectively reduce electromagnetic coupling between the power module and the application circuit board.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Various other modifications and alterations will occur to those skilled in the art upon reading the foregoing description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the spirit or scope of the invention.
Claims (5)
1. The utility model provides a many base plates power micromodule design method, design method utilize the stromatolite design theory, through with inside device vertical placement, add auxiliary substrate, components and parts stromatolite mode, reduced the shared area of electronic components on the base plate greatly, its characterized in that includes following step:
step S1: providing a power supply micro-module main control substrate (1), wherein the main control substrate (1) is connected with a magnetic component (2) and an auxiliary substrate loop (5) through pins;
step S2: the auxiliary substrate loop (5) is connected with the ground between the main control substrate (1) and the auxiliary substrate (3);
step S3: wherein the auxiliary substrate (3) is connected with a resistance-capacitance circuit (4) and an auxiliary substrate loop (5) through a device vertical clamp;
step S4: after the auxiliary substrate (3) is provided with the devices, the welding errors at the bottom of each device are checked, and whether the next step of back-off installation is carried out is judged;
step S5: and when the mode of back-off is selected, the other end of the device is installed on the main control substrate (1) to complete substrate assembly.
2. The design method of the multi-substrate power supply micromodule according to claim 1, characterized in that: the multi-substrate power supply micromodule comprises a power supply micromodule main control substrate (1), a magnetic component (2) of the internal plastic package of the power supply micromodule, a power supply micromodule auxiliary substrate (3), an auxiliary substrate loop (5) and a resistance-capacitance (4) of the internal plastic package auxiliary electronic component of the module, wherein the main control substrate (1) and the auxiliary substrate (3) are perpendicularly welded through the resistance-capacitance (4), the upper layer of substrate and the lower layer of substrate are perpendicularly connected, signal transmission is achieved between the upper layer of substrate and the lower layer of substrate, or welding is achieved between the main control substrate (1) and the auxiliary substrate (3) in a parallel mode.
3. The design method of the multi-substrate power supply micromodule according to claim 2, characterized in that: and a resistance-capacitance circuit (4) and an auxiliary substrate loop (5) are assembled and integrated on the auxiliary substrate (3), and can be connected by normal welding or vertical welding.
4. The design method of the multi-substrate power supply micromodule according to claim 2, characterized in that: the main control substrate (1) and auxiliary substrate (3) junction be equipped with supporting pad and connect the sheetmetal, can effectively realize the data UNICOM, guarantee that the work is normal between main control substrate (1) and auxiliary substrate (3).
5. The design method of the multi-substrate power supply micromodule according to claim 2, characterized in that: the auxiliary substrate (3) can also be designed into a double-layer substrate, and a plurality of resistance-capacitance devices (4) are welded on two sides of the auxiliary substrate (3) simultaneously so as to reduce the plastic package volume of the module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210289644.1A CN114466511A (en) | 2022-03-23 | 2022-03-23 | Multi-substrate power supply micro-module design method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210289644.1A CN114466511A (en) | 2022-03-23 | 2022-03-23 | Multi-substrate power supply micro-module design method |
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| CN114466511A true CN114466511A (en) | 2022-05-10 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070082136A (en) * | 2006-02-15 | 2007-08-21 | 삼성전자주식회사 | Semiconductor module having auxiliary substrate |
| JP2011044558A (en) * | 2009-08-20 | 2011-03-03 | Panasonic Electric Works Co Ltd | Circuit module and method of manufacturing the same |
| CN106783837A (en) * | 2017-01-20 | 2017-05-31 | 北京元六鸿远电子科技股份有限公司 | A kind of LRC modular constructions |
| CN109921628A (en) * | 2019-03-22 | 2019-06-21 | 上海科世达-华阳汽车电器有限公司 | A kind of power module, power supply device and automobile |
| CN211508893U (en) * | 2020-04-02 | 2020-09-15 | 北京英博新能源有限公司 | Power supply |
| US11083089B1 (en) * | 2020-03-11 | 2021-08-03 | Analog Devices International Unlimited Company | Integrated device package |
-
2022
- 2022-03-23 CN CN202210289644.1A patent/CN114466511A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20070082136A (en) * | 2006-02-15 | 2007-08-21 | 삼성전자주식회사 | Semiconductor module having auxiliary substrate |
| JP2011044558A (en) * | 2009-08-20 | 2011-03-03 | Panasonic Electric Works Co Ltd | Circuit module and method of manufacturing the same |
| CN106783837A (en) * | 2017-01-20 | 2017-05-31 | 北京元六鸿远电子科技股份有限公司 | A kind of LRC modular constructions |
| CN109921628A (en) * | 2019-03-22 | 2019-06-21 | 上海科世达-华阳汽车电器有限公司 | A kind of power module, power supply device and automobile |
| US11083089B1 (en) * | 2020-03-11 | 2021-08-03 | Analog Devices International Unlimited Company | Integrated device package |
| CN211508893U (en) * | 2020-04-02 | 2020-09-15 | 北京英博新能源有限公司 | Power supply |
Non-Patent Citations (1)
| Title |
|---|
| 陈滔 等;: "全桥DC/DC电源模块三维组装技术研究", 测控技术, vol. 39, no. 09, 15 May 2020 (2020-05-15), pages 55 - 59 * |
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