CN211277945U - Semi-automatic piece device that falls based on no wax polishing technology - Google Patents
Semi-automatic piece device that falls based on no wax polishing technology Download PDFInfo
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- CN211277945U CN211277945U CN201922213221.8U CN201922213221U CN211277945U CN 211277945 U CN211277945 U CN 211277945U CN 201922213221 U CN201922213221 U CN 201922213221U CN 211277945 U CN211277945 U CN 211277945U
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- cylinder
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- 238000005498 polishing Methods 0.000 title claims abstract description 29
- 238000005516 engineering process Methods 0.000 title claims abstract description 9
- 238000010862 gear shaping Methods 0.000 claims abstract description 17
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 14
- 239000010959 steel Substances 0.000 claims abstract description 14
- 239000000919 ceramic Substances 0.000 claims description 32
- 238000007517 polishing process Methods 0.000 claims description 13
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 210000001503 joint Anatomy 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model provides a semi-automatic piece device down based on wax-free polishing technology, including frock shell and lift bracket, open frock shell one side has vertical rectangular hole, the frock shell in the rectangular hole outside is vertical installs electric jar and linear guide, lift bracket's drive end connection electric steel, and the joint is on linear guide, lift bracket is connected through first cylinder with the jacking board front end, lift bracket rotates with the jacking board rear end to be connected, install on the jacking board and insert the pinion rack, be equipped with electric steel slip table on the pinion rack board, the gear shaping is connected to electric steel slip table, connect the tray through the second cylinder in the jacking board top, the tray upper surface central point puts and installs central disc, and the roller is installed to the edge. The utility model discloses a beneficial effect is: realize semi-automatic piece down through the device, use the squirt to replace the staff to carry out the lower piece of no wax polished section simultaneously, avoid the polished section surface granularity that the piece caused under the hand to increase, rub drawbacks such as wound rate increase.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor manufacturing and specifically relates to a semi-automatic piece device down based on no wax polishing technology is related to.
Background
In the field of semiconductor silicon wafer manufacturing, silicon wafer granularity and surface scratches are one of important quality problems, and directly concern whether a polished wafer can be used for subsequent production and use. In the prior art, the blanking of wax-free polished wafers is manually completed, an operator pushes out a blanking vehicle loaded with polished wafers, washes the surface of a silicon wafer, pinches a polished wafer reference surface by using fingers, takes the polished wafers off a ceramic disk polishing pad, and then puts the polished wafers on a ramp of an existing wafer unloader to complete wafer unloading.
After the subsequent inspection of the wax-free polished wafer after manual wafer discharge, the granularity of the reference surface of the wax-free polished wafer is obviously increased, and the condition of scratching a silicon wafer exists, so that the product quality of the wax-free polished wafer is influenced.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model aims at providing a semi-automatic piece device down based on no wax polishing technology, the contact of staff and silicon chip is avoided in the use of piece in-process down to avoid the silicon chip to rub and hinder, improve product quality.
In order to achieve the above purpose, the technical scheme of the utility model is realized like this:
a semi-automatic sheet discharging device based on a wax-free polishing process comprises a tool shell and a lifting bracket, wherein a vertical strip hole is formed in one side of the tool shell, an electric cylinder and a linear guide rail are installed in the vertical direction of the tool shell outside the strip hole, the driving end of the lifting bracket is driven by the electric cylinder to move up and down along the linear guide rail, a first air cylinder which is vertically arranged is installed at the front end of the upper surface of the lifting bracket, the upper end of the first air cylinder is installed on a lifting plate, the rear end of the lifting bracket is rotationally connected with the rear end of the lifting plate, the left side and the right side of the upper surface of the lifting plate are both connected with a vertically upward toothed plate, two upper surfaces of the toothed plate are both provided with electric steel sliding tables which are both connected with a toothed bar through sliding blocks, the lifting plate is connected with a tray which is located on the upper side of the lifting plate through a second air cylinder, and a central disc is installed at the, the edge is installed with the roller, the tray front end is installed and is linked up the ramp, the ceramic dish is placed to the gear shaping upper surface, the center disc is located the ceramic dish under, link up ramp edge contact ceramic dish edge.
Further, the rollers are multiple, and the distances from the rollers to the center of the central disk are equal and equal to the radius of the ceramic disk.
Furthermore, the second cylinder fixed end is connected at the center of the jacking plate and is arranged, and the second cylinder telescopic end is connected with the tray.
Furthermore, the rear end of the upper surface of the lifting bracket and the rear end of the lower surface of the jacking plate are both connected with shaft seats, and the shaft seats are connected on the same shaft, so that the lifting bracket is rotatably connected with the rear end of the jacking plate.
Furthermore, the gear shaping is U type.
Furthermore, a plurality of linear bearings which are uniformly distributed are arranged on the upper surface of the jacking plate, and the linear bearings penetrate through the tray.
Furthermore, the drive end of the lifting bracket is provided with a sliding block and a lead screw connecting block, the lifting bracket is connected to the linear guide rail through the sliding block in a clamped mode, and the lifting bracket is connected to the outer side of the electric cylinder in a sleeved mode through the lead screw connecting block, so that the lifting bracket moves up and down along the linear guide rail.
Further, a polishing pad is placed on the ceramic disc, a plurality of polishing sheet grooves are formed in the polishing pad, and a groove hole is formed in the edge position of each polishing sheet groove.
Compared with the prior art, a semi-automatic piece device down based on no wax polishing technology have following advantage:
the utility model relates to a semi-automatic piece device down based on no wax polishing technology uses the squirt to replace the staff to carry out the lower piece of no wax polishing piece, adopts the low discharge squirt, lets rivers as the carrier of no wax polishing piece to when avoiding the man to hand piece down, silicon chip surface granularity that staff and silicon chip contact caused increases, scratches drawbacks such as rate increase, effectively improves product quality, satisfies the product quality demand.
Drawings
The accompanying drawings, which form a part hereof, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without undue limitation. In the drawings:
fig. 1 is a front view of a semi-automatic sheet feeding device based on a wax-free polishing process according to an embodiment of the present invention;
fig. 2 is an external schematic view of a semi-automatic wafer feeding device based on a wax-free polishing process according to an embodiment of the present invention;
FIG. 3 is an external view of the lower tool;
fig. 4 is a top view of a semi-automatic wafer feeding device based on a wax-free polishing process according to an embodiment of the present invention;
fig. 5 is a schematic view of the interior of the lower tool.
Description of reference numerals:
1-blanking vehicle; 2-slice feeding machine; 3-an electric cylinder; 4-lifting the bracket; 5-linear guide rail; 6-a ceramic disc; 7-a polishing pad; 8-piece basket; 9-lower piece ramp; 10-a first cylinder; 11-shaft seat; 12-a toothed plate; 13-a jacking plate; 14-gear shaping; 15-engaging the ramp; 16-a roller; 17-a tray; 18-linear bearings; 19-a central disc; 20-electric steel slipway; 21-second cylinder.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
As shown in fig. 1 to 5, a semi-automatic sheet feeding device based on a wax-free polishing process comprises a tool housing and a lifting bracket 4, wherein a vertical strip hole is formed in one side of the tool housing, an electric cylinder 3 and a linear guide rail 5 are installed in the vertical direction of the tool housing outside the strip hole, a driving end of the lifting bracket 4 is driven by the electric cylinder 3 to move up and down along the linear guide rail 5, a first air cylinder 10 which is vertically arranged is installed at the front end of the upper surface of the lifting bracket 4, the upper end of the first air cylinder 10 is installed on a lifting plate 13, the rear end of the lifting bracket 4 is rotatably connected with the rear end of the lifting plate 13, the left side and the right side of the upper surface of the lifting plate 13 are both connected with vertically upward toothed plates 12, two upper surfaces of the toothed plates 12 are both provided with electric steel sliding tables 20, the two electric steel sliding tables 20 are both connected with a toothed plate 14 through a sliding block, the lifting plate 13 is connected with a tray 17 which is located on the upper side of the lifting plate, the ceramic tray is characterized in that a central disk 19 is installed in the center of the upper surface of the tray 17, rollers 16 are installed at the edges of the central disk, a connecting ramp 15 is installed at the front end of the tray 17, the ceramic tray 6 is placed on the upper surface of the gear shaping 14, the central disk 19 is located right below the ceramic tray 6, and the edge of the connecting ramp 15 contacts the edge of the ceramic tray 6.
There are a plurality of said rollers 16, the plurality of said rollers 16 being equidistant from the center of the central disc 19 and equal to the radius of the ceramic disc 6.
The fixed end of the second cylinder 21 is connected to the center of the jacking plate 13, and the telescopic end of the second cylinder 21 is connected with the tray 17.
The rear end of the upper surface of the lifting bracket 4 and the rear end of the lower surface of the jacking plate 13 are both connected with shaft seats 11, and the shaft seats 11 are connected on the same shaft, so that the lifting bracket 4 is rotatably connected with the rear end of the jacking plate 13.
The gear shaping 14 is U-shaped.
The upper surface of the jacking plate 13 is provided with a plurality of linear bearings 18 which are uniformly distributed, and the linear bearings 18 penetrate through the tray 17.
The drive end of lifting bracket 4 is equipped with slider and lead screw connecting block, lifting bracket 4 passes through the slider joint on linear guide 5, and cup joints in 3 outsides of electric jar through the lead screw connecting block, makes lifting bracket 4 follow linear guide 5 up-and-down motion.
A polishing pad 7 is placed on the ceramic disc 6, a plurality of polishing sheet grooves are formed in the polishing pad 7, and groove holes are formed in the edge positions of the polishing sheet grooves.
A semi-automatic piece device of unloading based on wax-free polishing technology locates 2 front ends of piece machine down, and the device uses PLC to control, and first cylinder 10 model is WGN51-80-50-Y-2, and second cylinder 21 model is WGN51-63-50-Y-2, and electric steel slip table 20 model is BCA16-03-500-P, and the model of electric cylinder 3 is MSMF102L1H6M, and the working process is as follows:
1. manually pushing the wax-free polishing process equipment blanking cart 1 to the butt joint position of the semi-automatic blanking device;
2, the PLC controls the electric cylinder 3 to drive the lifting bracket 4 and the tool above the lifting bracket to move up and down, and when the lifting bracket moves to a position where the gear shaping 14 can be in butt joint with the ceramic disc 6 on the blanking car 1, the lifting bracket stops moving;
3, the PLC controls a sliding block of an electric steel sliding table 20 on the toothed plate 12 to drive the gear shaping 14 to extend towards the blanking cart 1, and the gear shaping 14 is inserted between the ceramic disc 6 and a carrier of the blanking cart 1 along the lower surface of the ceramic disc 6;
4. when the ceramic disc 6 is completely positioned above the gear shaping 14, the gear shaping 14 retracts to the initial position;
5. the second cylinder 21 jacks up the tray 17 and the upper part tooling until the central disc 19 contacts the bottom surface of the ceramic disc 6 and jacks up the tray on the gear shaping 14, at the moment, the outer surface of each roller 16 contacts the edge of the ceramic disc 6, the edge of the ceramic disc 6 contacts the connecting ramp 15, and the rollers 16 and the connecting ramps 15 simultaneously clamp the ceramic disc 6 in the middle so as not to move left and right;
6. the piston rod of the first cylinder 10 extends out to enable the jacking plate 13 and the upper tool thereof to incline, and when the ceramic disc 6 and the connecting ramp 15 incline to be butted with the lower ramp 9 of the sheet feeder 2 and the inclination angles are the same, the first cylinder 10 stops rising;
7. manually rotating the ceramic disc 6 to enable the grooves of the polishing sheets to sequentially reach the lower piece ramp 9, injecting water into the groove holes by using a water gun, enabling the water to flow to the bottom of the ceramic disc 6, enabling the polishing sheets to flow out of the grooves of the polishing sheets along with the water flow, and inserting the polishing sheets into the sheet basket 8 through the connecting ramp 15 and the lower piece ramp 9;
8. the first cylinder 10 is reset, the second cylinder 21 is reset, the ceramic disc 6 after being discharged returns to the gear shaping 14, and the electric steel sliding table 20 drives the gear shaping 14 to place the ceramic disc 6 back to the discharging vehicle 1;
9. the electric steel belt drives the lifting bracket 4 and the tool above the lifting bracket to move up and down, and the electric steel belt sequentially carries the rest ceramic discs 6 to get off.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a semi-automatic piece device that falls based on no wax polishing technology which characterized in that: the lifting mechanism comprises a tool shell and a lifting bracket, wherein a vertical strip hole is formed in one side of the tool shell, an electric cylinder and a linear guide rail are installed in the vertical direction of the tool shell outside the strip hole, a driving end of the lifting bracket moves up and down along the linear guide rail under the driving of the electric cylinder, a first vertically-arranged air cylinder is installed at the front end of the upper surface of the lifting bracket, the upper end of the first air cylinder is installed on a lifting plate, the rear end of the lifting bracket is rotatably connected with the rear end of the lifting plate, the left side and the right side of the upper surface of the lifting plate are both connected with a vertically-upward toothed plate, two electric steel sliding tables are arranged on the upper surface of the toothed plate, the two electric steel sliding tables are both connected with a gear shaping through a sliding block, the lifting plate is connected with a tray positioned on the upper side of the lifting plate through a second air cylinder, a central disc is installed at the central position of the upper surface, a ceramic disc is placed on the upper surface of the gear shaping, the central disc is located right below the ceramic disc, and the edge of the connecting ramp contacts with the edge of the ceramic disc.
2. The semi-automatic wafer feeding device based on the wax-free polishing process as claimed in claim 1, wherein: the rollers are multiple, and the distances from the rollers to the center of the central disk are equal and equal to the radius of the ceramic disk.
3. The semi-automatic wafer feeding device based on the wax-free polishing process as claimed in claim 1, wherein: the second cylinder stiff end is connected and is set up at the jacking board center, the flexible end connection tray of second cylinder.
4. The semi-automatic wafer feeding device based on the wax-free polishing process as claimed in claim 1, wherein: the rear end of the upper surface of the lifting bracket and the rear end of the lower surface of the jacking plate are both connected with shaft seats, and the shaft seats are connected on the same shaft, so that the lifting bracket is rotatably connected with the rear end of the jacking plate.
5. The semi-automatic wafer feeding device based on the wax-free polishing process as claimed in claim 1, wherein: the gear shaping is U type.
6. The semi-automatic wafer feeding device based on the wax-free polishing process as claimed in claim 1, wherein: the upper surface of the jacking plate is provided with a plurality of linear bearings which are uniformly distributed, and the linear bearings penetrate through the tray.
7. The semi-automatic wafer feeding device based on the wax-free polishing process as claimed in claim 1, wherein: the drive end of the lifting bracket is provided with a sliding block and a lead screw connecting block, the lifting bracket is connected to the linear guide rail through the sliding block in a clamped mode, and the lifting bracket is connected to the outer side of the electric cylinder in a sleeved mode through the lead screw connecting block, so that the lifting bracket moves up and down along the linear guide rail.
8. The semi-automatic wafer feeding device based on the wax-free polishing process as claimed in claim 1, wherein: the polishing pad is placed on the ceramic disc, a plurality of polishing sheet grooves are formed in the polishing pad, and groove holes are formed in the edge positions of the polishing sheet grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922213221.8U CN211277945U (en) | 2019-12-11 | 2019-12-11 | Semi-automatic piece device that falls based on no wax polishing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922213221.8U CN211277945U (en) | 2019-12-11 | 2019-12-11 | Semi-automatic piece device that falls based on no wax polishing technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211277945U true CN211277945U (en) | 2020-08-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922213221.8U Active CN211277945U (en) | 2019-12-11 | 2019-12-11 | Semi-automatic piece device that falls based on no wax polishing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211277945U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110815039A (en) * | 2019-12-11 | 2020-02-21 | 中环领先半导体材料有限公司 | Semi-automatic piece device that falls based on no wax polishing technology |
| CN112357814A (en) * | 2020-10-24 | 2021-02-12 | 上海汇像信息技术有限公司 | Filter disc conveying device and conveying method |
-
2019
- 2019-12-11 CN CN201922213221.8U patent/CN211277945U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110815039A (en) * | 2019-12-11 | 2020-02-21 | 中环领先半导体材料有限公司 | Semi-automatic piece device that falls based on no wax polishing technology |
| CN112357814A (en) * | 2020-10-24 | 2021-02-12 | 上海汇像信息技术有限公司 | Filter disc conveying device and conveying method |
| CN112357814B (en) * | 2020-10-24 | 2023-10-10 | 上海汇像信息技术有限公司 | Filter disc conveying device and conveying method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address |