CN211240568U - Electronic equipment heat abstractor - Google Patents
Electronic equipment heat abstractor Download PDFInfo
- Publication number
- CN211240568U CN211240568U CN201921293502.2U CN201921293502U CN211240568U CN 211240568 U CN211240568 U CN 211240568U CN 201921293502 U CN201921293502 U CN 201921293502U CN 211240568 U CN211240568 U CN 211240568U
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- China
- Prior art keywords
- heat
- heat conduction
- column
- heat dissipation
- heat conducting
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- 238000001816 cooling Methods 0.000 claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000000428 dust Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 2
- 230000030279 gene silencing Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation device for electronic equipment, in particular to the technical field of heat dissipation equipment, which comprises a heat conduction mechanism; the heat conduction mechanism comprises an outer shell, a heat conduction cavity is arranged inside the outer shell, a heat dissipation groove is formed in the bottom of the heat conduction cavity, a placing groove is formed in the top of the heat conduction cavity, a first heat conduction column is arranged inside the heat conduction cavity, a positioning cylinder is arranged on the outer side of the first heat conduction column, a second heat conduction column is arranged on the top of the first heat conduction column, a spring is sleeved on the outer side of the second heat conduction column, a bearing block is arranged on the top of the second heat conduction column, and the first heat conduction column and the second heat conduction column are made of copper materials. The utility model discloses a set up heat conduction mechanism, cool off through spiral cooling tube, the radiating rate and the radiating efficiency of the effectual increase condensate of spiral cooling tube carry out effectual heat transfer to electronic equipment then, improve cooling rate, promote cooling efficiency, can carry out the automatic transfer conduction to the temperature as required, reduce energy resource consumption.
Description
Technical Field
The utility model relates to a heat dissipation equipment technical field, more specifically say, this utility relates to an electronic equipment heat abstractor.
Background
As is known, high temperature is a big enemy of electronic products, which not only causes unstable operation of electronic components and devices, shortens service life, but also may cause burning of some components.
The invention patent of patent application publication No. CN107318249A discloses a heat dissipation device for electronic equipment, which belongs to the field of electronic product equipment and comprises a bottom plate and a top cover, wherein the top cover is provided with an exhaust fan device, the exhaust fan device comprises a fan frame and a fan blade device, the fan frame is fixed on the side surface of the top cover through bolts, the fan blade device is fixed inside the fan frame, the side surface of the top cover is provided with a ventilation window, the upper surface of the bottom plate is provided with a flow plate in a sparse way, the lower surface of the flow plate is fixedly connected with the upper surface of the bottom plate, the middle part of the bottom plate is provided with three silencing columns, the silencing columns are fixedly connected with the upper surface of the bottom plate, the upper surface of the bottom plate is provided with a micro refrigerator, the micro refrigerator is detachably connected with the bottom plate, the upper surface of the bottom plate is provided with a first support, and a second drying box is arranged on the second supporting plate. The heat dissipation device for the electronic equipment can quickly dissipate heat and realize uniform heat dissipation.
However, in actual use, there are still many disadvantages, for example, in the way that the whole electronic device is cooled by the cold air produced by the micro refrigerator and the electronic device is cooled by using air as a medium, the cooling speed is slow, the cooling efficiency is low and the consumption is large.
SUMMERY OF THE UTILITY MODEL
The utility model overcomes the deficiencies in the prior art, the technical problem who solves is: through setting up heat conduction mechanism, cool off through spiral cooling tube, the radiating rate and the radiating efficiency of the effectual increase condensate of spiral cooling tube carry out effectual heat transfer to electronic equipment then, improve cooling rate, promote cooling efficiency, can carry out the automatic transfer conduction to the temperature as required, reduce energy resource consumption to solve the problem that proposes in the above-mentioned background art.
In order to solve the technical problem, the utility model discloses a technical scheme be: a heat sink for electronic equipment comprises a heat conducting mechanism;
the heat conduction mechanism comprises an outer shell, a heat conduction cavity is arranged inside the outer shell, a heat dissipation groove is formed in the bottom of the heat conduction cavity, a placement groove is formed in the top of the heat conduction cavity, a first heat conduction column is arranged inside the heat conduction cavity, a positioning cylinder is arranged on the outer side of the first heat conduction column, a second heat conduction column is arranged on the top of the first heat conduction column, a spring is sleeved on the outer side of the second heat conduction column, a bearing block is arranged on the top of the second heat conduction column, the first heat conduction column and the second heat conduction column are made of copper materials, the bearing block is made of heat conduction silica gel materials, a computer water cooling pump is arranged on one side of the outer shell, a condensate conveying pipe is arranged at the input end of the computer water cooling pump, a condensate output pipe is arranged at the output end of the computer water cooling pump.
In a preferred embodiment, the inner wall of the placing groove is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a heat dissipation opening, and a filter screen is arranged on one side of the heat dissipation opening.
In a preferred embodiment, an exhaust fan is arranged inside the heat dissipation port, and the number of the heat dissipation mechanisms is two.
In a preferred embodiment, an exhaust fan is arranged inside the heat dissipation opening, the first heat conduction column penetrates through the heat conduction cavity and extends to the inside of the placing groove, and the top end of the spring is fixedly connected with the second heat conduction column.
In a preferred embodiment, the bottom end of the spring is fixedly connected with the inner wall of the positioning barrel, and the cross section of the bearing block is trapezoidal.
In a preferred embodiment, the condensate feeding pipe and the spiral radiating pipe both penetrate through the outer shell and extend to the interior of the heat conducting cavity.
Compared with the prior art, the utility model following beneficial effect has:
1. by arranging the heat conduction mechanism, the heat dissipation and cooling are carried out through the spiral radiating pipe, the spiral radiating pipe effectively increases the radiating speed and the radiating efficiency of the condensate, and then the electronic equipment is effectively subjected to heat transfer, so that the cooling speed is increased, the cooling efficiency is improved, the temperature can be automatically transferred and conducted as required, and the energy consumption is reduced;
2. through setting up heat dissipation mechanism, the filter screen filters circulation air, avoids the dust to enter into electronic equipment inside, dispels the heat to first heat conduction post and second heat conduction post simultaneously, further promotes electronic equipment cooling speed.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings:
fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a side view of the present invention.
Fig. 3 is a plan view of the present invention.
Fig. 4 is a perspective view of the positioning cylinder of the present invention.
Fig. 5 is a schematic view of a partial structure of the portion a in fig. 1 according to the present invention.
The reference signs are: the heat dissipation device comprises a heat conduction mechanism 1, a shell 2, a heat conduction cavity 3, a heat dissipation groove 4, a placement groove 5, a first heat conduction column 6, a positioning cylinder 7, a second heat conduction column 8, a spring 9, a bearing block 10, a computer water cooling pump 11, a condensate conveying pipe 12, a condensate output pipe 13, a spiral heat dissipation pipe 14, condensate 15, a heat dissipation mechanism 16, a heat dissipation port 17, a filter screen 18 and an exhaust fan 19.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
A heat dissipating apparatus for electronic devices as shown in fig. 1 to 5 comprises a heat conducting mechanism 1;
the heat conducting mechanism 1 comprises a shell 2, a heat conducting cavity 3 is arranged in the shell 2, a heat radiating groove 4 is arranged at the bottom of the heat conducting cavity 3, a placing groove 5 is arranged at the top of the heat conducting cavity 3, a first heat conducting column 6 is arranged in the heat conducting cavity 3, a positioning cylinder 7 is arranged on the outer side of the first heat conducting column 6, a second heat conducting column 8 is arranged at the top of the first heat conducting column 6, a spring 9 is sleeved on the outer side of the second heat conducting column 8, a bearing block 10 is arranged at the top of the second heat conducting column 8, the first heat conducting column 6 and the second heat conducting column 8 are both made of copper materials, the bearing block 10 is made of heat conducting silica gel materials, a computer water cooling pump 11 is arranged on one side of the shell 2, a condensate conveying pipe 12 is arranged at the input end of the computer water cooling pump 11, a condensate output pipe 13 is arranged at the output end of the, the interior of the heat conduction cavity 3 is provided with condensate 15.
The first heat conduction column 6 penetrates through the heat conduction cavity 3 and extends into the placing groove 5, and the top end of the spring 9 is fixedly connected with the second heat conduction column 8;
the bottom end of the spring 9 is fixedly connected with the inner wall of the positioning cylinder 7, and the cross section of the bearing block 10 is trapezoidal;
the condensate feeding pipe 12 and the spiral radiating pipe 14 penetrate through the shell 2 and extend to the inside of the heat conducting cavity 3.
The implementation mode is specifically as follows: the heating position of the electronic equipment is placed on a bearing block 10 at the top of a shell 2, the bearing block 10 is contacted with the heating position, the bearing block 10 made of a heat-conducting silica gel material absorbs heat at the heating position of the electronic equipment, the bearing block 10 with the trapezoidal cross section shape increases the heat absorption speed and improves the placing stability, then the bearing block 10 drives a second heat-conducting column 8 to slide in a positioning cylinder 7, a spring 9 retracts to enable the second heat-conducting column 8 to be contacted with a first heat-conducting column 6, the heat is conducted to the inside of a heat-conducting cavity 3 through the second heat-conducting column 8 made of a copper material and the first heat-conducting column 6, condensate 15 in the heat-conducting cavity 3 absorbs heat of the first heat-conducting column 6, a computer water-cooling pump 11 is started, and the computer water-cooling pump 11 circularly conveys the condensate 15 in the heat-conducting cavity 3 to a condensate output pipe 13 through a condensate conveying pipe 12, afterwards, the cooling of dispelling the heat through spiral radiating pipe 14, the effectual radiating rate and the radiating efficiency that increases condensate 15 of spiral radiating pipe 14 carry out effectual heat transfer to electronic equipment then, improve cooling rate, promote cooling efficiency, can carry out the automatic conduction that shifts to the temperature as required, reduce energy resource consumption.
The heat dissipation device for electronic equipment shown in fig. 5 further comprises a heat dissipation mechanism 16, wherein the heat dissipation mechanism 16 is arranged on the inner wall of the placement groove 5, the heat dissipation mechanism 16 comprises a heat dissipation opening 17, and a filter screen 18 is arranged on one side of the heat dissipation opening 17;
an exhaust fan 19 is arranged in the heat dissipation port 17, and the number of the heat dissipation mechanisms 16 is two.
The implementation mode is specifically as follows: open air discharge fan 19 simultaneously, two air discharge fans 19 circulate the inside air of standing groove 5, and filter screen 18 filters the circulation air, avoids the dust to enter into electronic equipment inside, dispels the heat to first heat conduction post 6 and second heat conduction post 8 simultaneously, further promotes electronic equipment cooling speed.
This practical theory of operation:
referring to the attached drawings 1-5 of the specification, by arranging the heat conduction mechanism 1, the spiral radiating pipe 14 is used for radiating and cooling, the spiral radiating pipe 14 effectively increases the radiating speed and the radiating efficiency of the condensate 15, and then the electronic equipment is effectively subjected to heat transfer, so that the cooling speed is increased, the cooling efficiency is improved, the temperature can be automatically transferred and conducted as required, and the energy consumption is reduced;
referring to the attached drawing 5 of the specification, by providing the heat dissipation mechanism 16, the filter screen 18 filters the air flowing through, so as to prevent dust from entering the electronic device, and meanwhile, the first heat conduction column 6 and the second heat conduction column 8 are cooled, so that the cooling speed of the electronic device is further increased.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (6)
1. The utility model provides an electronic equipment heat abstractor which characterized in that: comprises a heat conduction mechanism (1);
the heat conducting mechanism (1) comprises a shell (2), a heat conducting cavity (3) is arranged inside the shell (2), a heat radiating groove (4) is formed in the bottom of the heat conducting cavity (3), a placing groove (5) is formed in the top of the heat conducting cavity (3), a first heat conducting column (6) is arranged inside the heat conducting cavity (3), a positioning cylinder (7) is arranged on the outer side of the first heat conducting column (6), a second heat conducting column (8) is arranged on the top of the first heat conducting column (6), a spring (9) is sleeved on the outer side of the second heat conducting column (8), a bearing block (10) is arranged on the top of the second heat conducting column (8), the first heat conducting column (6) and the second heat conducting column (8) are both made of copper materials, the bearing block (10) is made of heat conducting silica gel materials, a computer water cooling pump (11) is arranged on one side of the shell (2), a condensate conveying pipe (12) is arranged at the input end, the computer water-cooling pump (11) output end is equipped with condensate output tube (13), condensate output tube (13) one end is equipped with spiral cooling tube (14), heat conduction chamber (3) inside is equipped with condensate (15).
2. The heat dissipation device of claim 1, wherein: the inner wall of the placing groove (5) is provided with a heat dissipation mechanism (16), the heat dissipation mechanism (16) comprises a heat dissipation opening (17), and a filter screen (18) is arranged on one side of the heat dissipation opening (17).
3. The heat dissipation device of claim 2, wherein: an exhaust fan (19) is arranged in the heat dissipation opening (17), and the number of the heat dissipation mechanisms (16) is two.
4. The heat dissipation device of claim 1, wherein: the first heat conduction column (6) penetrates through the heat conduction cavity (3) and extends to the inside of the placing groove (5), and the top end of the spring (9) is fixedly connected with the second heat conduction column (8).
5. The heat dissipation device of claim 1, wherein: the bottom end of the spring (9) is fixedly connected with the inner wall of the positioning cylinder (7), and the cross section of the bearing block (10) is trapezoidal.
6. The heat dissipation device of claim 1, wherein: the condensate conveying pipe (12) and the spiral radiating pipe (14) penetrate through the shell (2) and extend to the interior of the heat conducting cavity (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921293502.2U CN211240568U (en) | 2019-08-12 | 2019-08-12 | Electronic equipment heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921293502.2U CN211240568U (en) | 2019-08-12 | 2019-08-12 | Electronic equipment heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211240568U true CN211240568U (en) | 2020-08-11 |
Family
ID=71917431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921293502.2U Expired - Fee Related CN211240568U (en) | 2019-08-12 | 2019-08-12 | Electronic equipment heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211240568U (en) |
-
2019
- 2019-08-12 CN CN201921293502.2U patent/CN211240568U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200811 |