CN209861243U - Novel heat dissipation circuit board - Google Patents
Novel heat dissipation circuit board Download PDFInfo
- Publication number
- CN209861243U CN209861243U CN201821892856.4U CN201821892856U CN209861243U CN 209861243 U CN209861243 U CN 209861243U CN 201821892856 U CN201821892856 U CN 201821892856U CN 209861243 U CN209861243 U CN 209861243U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- copper plate
- board body
- red copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a novel heat dissipation circuit board in the technical field of heat dissipation circuit boards, which comprises a circuit board body, wherein the bottom of the circuit board body is provided with a first fan through a screw, the left side of the circuit board body is connected with a supporting seat, the top of the right side of the supporting seat is hinged with a red copper plate, the top of the circuit board body is uniformly welded with an electronic element, the heat dissipation circuit board is covered with the red copper plate on the surface of the electronic element for heat conduction, the heat conduction coefficient is high, the heat dissipation capability is strong, a heat conduction silica gel sheet is arranged between the red copper plate and the electronic element for filling the gap between the red copper plate and the electronic element and conducting heat, the heat dissipation effect of the red copper plate is improved, the red copper plate is fixed with the circuit board through a buckle, the disassembly is easier, the circuit board, the heat dissipation effect is good because the heat dissipation can be simultaneously performed on the top and the bottom of the circuit board.
Description
Technical Field
The utility model relates to a heat dissipation circuit board technical field specifically is a novel heat dissipation circuit board.
Background
The electric energy that the circuit board consumed during operation, for example, radio frequency power amplifier, the FPGA chip, power class product, except useful work, most conversion gives off into the heat, the heat that all kinds of electronic component produced, make inside temperature rise rapidly, if not in time give off this heat, equipment can continue to heat up, the device will be because of overheated inefficacy, electronic equipment's reliability will descend, and common circuit board adopts passive mode heat dissipation, the radiating effect is not good, the radiating device is through a large amount of fix with screws on the circuit board, it is comparatively not troublesome to install and dismantle, be not convenient for overhaul.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a novel heat dissipation circuit board to solve the common circuit board that proposes in the above-mentioned background art and adopt the passive mode heat dissipation, the radiating effect is not good, and the heat dissipation device is through a large amount of fix with screw on the circuit board, and the installation is dismantled comparatively not troublesome, the problem of the difficult access to maintenance.
In order to achieve the above object, the utility model provides a following technical scheme: a novel heat dissipation circuit board comprises a circuit board body, wherein a first fan is installed at the bottom of the circuit board body through a screw, a supporting seat is connected to the left side of the circuit board body, a red copper plate is hinged to the top of the right side of the supporting seat, electronic elements are uniformly welded on the top of the circuit board body, heat dissipation fins are welded on the top of the red copper plate, a heat conduction silica gel sheet is bonded to the bottom of the red copper plate, the bottom of the heat conduction silica gel sheet is in contact with the top of the electronic elements, an elastic buckle and a base are connected to the right side of the top of the circuit board body, the base is located on the right side of the elastic buckle, a stop block is connected to the top of the left side of the elastic buckle, the bottom of the stop block is in contact with the right side of the top of the red copper plate, a cooling jacket is fixed to, the right side of second fan is connected with the left side of cooling jacket, the surface of circuit board body has evenly seted up the ventilation hole, the even welding of inner chamber of cooling jacket has the fin.
Preferably, the first fan and the second fan are both axial fans.
Preferably, the elastic buckle is an engineering plastic elastic buckle.
Preferably, the fins are red copper fins.
Compared with the prior art, the beneficial effects of the utility model are that: this heat dissipation circuit board, cover the copper plate heat conduction on the electronic component surface, its heat conduction coefficient is high, the heat-sinking capability is strong, be equipped with heat conduction silica gel piece between copper plate and the electronic component, gap and heat conduction between copper plate and the electronic component can be filled, the radiating effect of copper plate has been improved, the copper plate passes through the buckle and is fixed with the circuit board, it is comparatively easy to dismantle, be convenient for overhaul the circuit board, dispel the heat to the copper plate through blowing cold wind, can cool down the cooling to the electronic component fast, can be simultaneously to the top and the bottom heat dissipation of circuit board, the radiating effect is good.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a top view of the circuit board body of the present invention;
fig. 3 is a right side view of the cooling jacket of the present invention.
In the figure: the circuit board comprises a circuit board body 1, a first fan 2, a support base 3, a copper plate 4, an electronic element 5, a heat dissipation fin 6, a heat conduction silica gel sheet 7, an elastic buckle 8, a base 9, a stop block 10, a cooling jacket 11, a semiconductor refrigeration sheet 12, a second fan 13, a vent hole 14 and a fin 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a novel heat dissipation circuit board comprises a circuit board body 1, wherein a first fan 2 is installed at the bottom of the circuit board body 1 through a screw, a supporting seat 3 is connected to the left side of the circuit board body 1, a red copper plate 4 is hinged to the top of the right side of the supporting seat 3, an electronic element 5 is uniformly welded at the top of the circuit board body 1, heat dissipation fins 6 are welded at the top of the red copper plate 4, a heat conduction silica gel sheet 7 is bonded at the bottom of the red copper plate 4, the bottom of the heat conduction silica gel sheet 7 is in contact with the top of the electronic element 5, an elastic buckle 8 and a base 9 are connected to the right side of the top of the circuit board body 1, the base 9 is positioned on the right side of the elastic buckle 8, a stop block 10 is connected to the top of the left side of the elastic buckle 8, the bottom of the stop block 10 is in, the top of cooling jacket 11 is connected with semiconductor refrigeration piece 12, there is second fan 13 base 9's top left side through the screw mounting, the right side of second fan 13 is connected with the left side of cooling jacket 11, ventilation hole 14 has evenly been seted up on the surface of circuit board body 1, the even welding of inner chamber of cooling jacket 11 has fin 15.
Wherein, first fan 2 and second fan 13 are axial fan, can promote the air and flow with the same direction of axle, elasticity buckle 8 is engineering plastics elasticity buckle, and insulating nature is good, fin 15 is the red copper fin, and the heat conduction is effectual.
The working principle is as follows: the left end of the copper plate 4 is hinged on the supporting seat 3, the right end is fixed on the upper part of the electronic element 5 through the stop block 10 on the elastic buckle 8, the elastic buckle 8 is pushed outwards to separate the right end of the top of the copper plate 4 from the stop block 10, at the moment, the copper plate 4 can be opened, the electronic element 5 on the top of the circuit board body 1 is convenient to overhaul, the heat-conducting silicon sheet 7 is arranged between the copper plate 4 and the electronic element 5, the gap between the copper plate 4 and the electronic element 5 can be filled and the heat can be conducted, the heat generated by the electronic element 5 is transmitted to the copper plate 4 and the heat-radiating fins 6 connected on the copper plate 4 through the heat-conducting silicon sheet 7, the semiconductor refrigerating sheet 12 is a cooling device composed of semiconductors, the type TEC1-03103 is selected, after the power supply is switched on and the semiconductor refrigerating sheet 12 is switched on, the semiconductor refrigerating sheet 12 cools the cooling sleeve 11, the air that is located the inner chamber of cooling jacket 11 is cooled down by the inner wall of cooling jacket 11 and fin 15 and forms cold air, open second fan 13, can take out the cold air of cooling jacket 11 inner chamber and blow to heat radiation fins 6's surface, dispel the heat to it, first fan 2 is installed in the bottom of circuit board body 1, open first fan 2 back, first fan 2 can blow outside air to the bottom of circuit board body 1, dispel the heat to its bottom, some air can enter into the top of circuit board body 1 and the region that heat conduction silica gel sheet 7 constitutes by ventilation hole 14, accelerate the air flow between the electronic component 5 that is located this region, and then take away the partial heat that its produced, through the top and the bottom heat dissipation to the circuit board simultaneously, the radiating effect of circuit board has been improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a novel heat dissipation circuit board, includes circuit board body (1), its characterized in that: the novel LED lamp is characterized in that a first fan (2) is installed at the bottom of the circuit board body (1) through a screw, a supporting seat (3) is connected to the left side of the circuit board body (1), a red copper plate (4) is hinged to the top of the right side of the supporting seat (3), an electronic element (5) is uniformly welded to the top of the circuit board body (1), heat dissipation fins (6) are welded to the top of the red copper plate (4), a heat conduction silica gel sheet (7) is bonded to the bottom of the red copper plate (4), the bottom of the heat conduction silica gel sheet (7) is in contact with the top of the electronic element (5), an elastic buckle (8) and a base (9) are connected to the right side of the top of the circuit board body (1), the base (9) is located on the right side of the elastic buckle (8), a stop block (10) is connected to the top of the left side of the elastic, the top of base (9) is fixed with cooling jacket (11) through the screw, the top of cooling jacket (11) is connected with semiconductor refrigeration piece (12), there is second fan (13) in the top left side of base (9) through the screw mounting, the right side of second fan (13) is connected with the left side of cooling jacket (11), ventilation hole (14) have evenly been seted up on the surface of circuit board body (1), the even welding of inner chamber of cooling jacket (11) has fin (15).
2. The novel heat dissipation circuit board of claim 1, wherein: the first fan (2) and the second fan (13) are both axial flow fans.
3. The novel heat dissipation circuit board of claim 1, wherein: the elastic buckle (8) is an engineering plastic elastic buckle.
4. The novel heat dissipation circuit board of claim 1, wherein: the fins (15) are red copper fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821892856.4U CN209861243U (en) | 2018-11-16 | 2018-11-16 | Novel heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821892856.4U CN209861243U (en) | 2018-11-16 | 2018-11-16 | Novel heat dissipation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209861243U true CN209861243U (en) | 2019-12-27 |
Family
ID=68928238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821892856.4U Active CN209861243U (en) | 2018-11-16 | 2018-11-16 | Novel heat dissipation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209861243U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111308174A (en) * | 2020-02-27 | 2020-06-19 | 广东电网有限责任公司 | Knife switch current display visualization system |
| CN113889734A (en) * | 2021-12-06 | 2022-01-04 | 南京华脉科技股份有限公司 | Adjustable power divider |
-
2018
- 2018-11-16 CN CN201821892856.4U patent/CN209861243U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111308174A (en) * | 2020-02-27 | 2020-06-19 | 广东电网有限责任公司 | Knife switch current display visualization system |
| CN113889734A (en) * | 2021-12-06 | 2022-01-04 | 南京华脉科技股份有限公司 | Adjustable power divider |
| CN113889734B (en) * | 2021-12-06 | 2022-02-08 | 南京华脉科技股份有限公司 | Adjustable power divider |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202085437U (en) | Variable-frequency air conditioner heat radiator | |
| CN108807313B (en) | Microelectronic device heat dissipation device | |
| CN209861243U (en) | Novel heat dissipation circuit board | |
| CN207994912U (en) | Electric and electronic power cabinet | |
| CN108922874B (en) | Heat radiator for system integrated circuit board | |
| CN104703440A (en) | Electronic refrigeration type equipment cabinet with intelligent temperature control function | |
| CN109979896B (en) | Brand-new IGBT module | |
| CN202353034U (en) | Semiconductor refrigerating and cooling device of sealing type power distribution cabinet | |
| CN217274934U (en) | IGBT module cooling device | |
| CN212648815U (en) | Power distribution cabinet with rapid heat dissipation function | |
| CN211090376U (en) | Cooling system and air conditioner | |
| CN111385933B (en) | Microwave heating equipment | |
| CN113055757A (en) | Switch system based on intelligent network operation and maintenance detection | |
| CN112769050A (en) | High-efficient heat dissipation high-voltage board | |
| CN214846537U (en) | Heat dissipation case capable of reducing air inlet temperature | |
| CN218721979U (en) | Outdoor refrigerating and heating unit | |
| CN217605132U (en) | Temperature difference type power supply wireless sensor for high-temperature equipment | |
| CN210537216U (en) | Circuit board cooling device | |
| CN219893691U (en) | Heat abstractor for microelectronic components and parts | |
| CN211630069U (en) | High-voltage frequency converter with high-efficient heat dissipation function | |
| CN219742470U (en) | Circulation heat abstractor for intelligent coffee machine | |
| CN213659400U (en) | Computer chip heat abstractor | |
| CN215418151U (en) | Chip COB with shell through hole convection heat radiation structure | |
| CN215722999U (en) | Radiator of automobile high beam LED lamp | |
| CN216873449U (en) | TEC temperature control assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |