CN211125638U - 芯片模块封装结构 - Google Patents
芯片模块封装结构 Download PDFInfo
- Publication number
- CN211125638U CN211125638U CN201921680927.9U CN201921680927U CN211125638U CN 211125638 U CN211125638 U CN 211125638U CN 201921680927 U CN201921680927 U CN 201921680927U CN 211125638 U CN211125638 U CN 211125638U
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit layer
- carrier
- circuit
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Wire Bonding (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921680927.9U CN211125638U (zh) | 2019-10-09 | 2019-10-09 | 芯片模块封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921680927.9U CN211125638U (zh) | 2019-10-09 | 2019-10-09 | 芯片模块封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN211125638U true CN211125638U (zh) | 2020-07-28 |
Family
ID=71698227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921680927.9U Active CN211125638U (zh) | 2019-10-09 | 2019-10-09 | 芯片模块封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN211125638U (zh) |
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2019
- 2019-10-09 CN CN201921680927.9U patent/CN211125638U/zh active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210723 Address after: E502b, Taiwan Science and technology enterprise cultivation center, No. 88, Xiangxing Road, Xiamen Torch (Xiang'an) Industrial Zone, Xiamen, Fujian Patentee after: XIAMEN MSSB TECHNOLOGY Co.,Ltd. Address before: E502b, Taiwan Science and technology enterprise cultivation center, No. 88, Xiangxing Road, Xiamen Torch (Xiang'an) Industrial Zone, Xiamen, Fujian Patentee before: XIAMEN MSSB TECHNOLOGY Co.,Ltd. Patentee before: Aflash Technology, Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: E502B, Taiwan Science and Technology Enterprise Development Center, No. 88 Xiangxing Road, Xiamen Torch (Xiang'an) Industrial Zone, Xiamen, Fujian Province, 361101 Patentee after: Jingwang Semiconductor (Xiamen) Co.,Ltd. Address before: E502B, Taiwan Science and Technology Enterprise Development Center, No. 88 Xiangxing Road, Xiamen Torch (Xiang'an) Industrial Zone, Xiamen, Fujian Province, 361101 Patentee before: XIAMEN MSSB TECHNOLOGY CO.,LTD. |
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CP01 | Change in the name or title of a patent holder |