CN210956318U - High-efficiency heat dissipation resistor - Google Patents
High-efficiency heat dissipation resistor Download PDFInfo
- Publication number
- CN210956318U CN210956318U CN202020090498.6U CN202020090498U CN210956318U CN 210956318 U CN210956318 U CN 210956318U CN 202020090498 U CN202020090498 U CN 202020090498U CN 210956318 U CN210956318 U CN 210956318U
- Authority
- CN
- China
- Prior art keywords
- mounting groove
- resistor
- casing
- resistors
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000005057 refrigeration Methods 0.000 claims description 13
- 238000009423 ventilation Methods 0.000 claims description 6
- 230000006978 adaptation Effects 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 8
- 230000008859 change Effects 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-efficiency heat dissipation resistor, which comprises two resistors, wherein the two resistors are fixedly arranged between two L-shaped supporting plates, two ends of the two resistors respectively penetrate through the outer walls of the two L-shaped supporting plates, the outer parts of the two resistors are respectively provided with an upper shell and a lower shell which are mutually matched, a first mounting groove is arranged in the upper shell, a second mounting groove with the same structure as the first mounting groove is arranged in the lower shell, the first mounting groove and the first second mounting groove are internally provided with water bag components respectively, the top of the first second mounting groove is correspondingly fixed with two pairs of supporting columns, a supporting seat is connected between the top of each pair of supporting columns, two supporting seats are connected with two L-shaped supporting plates respectively, and a fastening screw is connected between each two supporting seats and each L-shaped supporting plate, first mounting hole has been seted up in the both sides outer wall correspondence of casing down, the utility model discloses the characteristics of utensil radiating efficiency height and be convenient for installation and change.
Description
Technical Field
The utility model relates to a resistor technical field specifically is a high efficiency heat dissipation resistor.
Background
Resistors are commonly and directly referred to as resistances in daily life. The resistor is a current limiting element, and after the resistor is connected in a circuit, the resistance value of the resistor is fixed, generally two pins, and the resistor can limit the current passing through a branch connected with the resistor. The variable resistor is called a fixed resistor, and the variable resistor is called a potentiometer or a variable resistor. Ideally the resistor is linear, i.e. the instantaneous current through the resistor is proportional to the applied instantaneous voltage.
The resistor can generate heat by itself in the working process, the existing resistor has low heat dissipation efficiency, only a single heat dissipation mode is usually adopted, and the heat dissipation effect is poor by only utilizing a single mode such as a vent hole or a radiating fin; meanwhile, the existing resistor is complicated to install and disassemble, and cannot be installed and replaced quickly.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high efficiency heat dissipation resistor to solve the problem that proposes among the above-mentioned background art.
In order to solve the technical problem, the utility model provides a following technical scheme: a high-efficiency heat dissipation resistor comprises two resistors, wherein the two resistors are fixedly arranged between two L-shaped supporting plates, two ends of each resistor respectively penetrate through the outer walls of the two L-shaped supporting plates, an upper shell and a lower shell which are matched with each other are respectively arranged outside the two resistors, a first mounting groove is formed in the upper shell, a second mounting groove which is identical to the first mounting groove in structure is formed in the lower shell, water bag assemblies are respectively mounted in the first mounting groove and the first second mounting groove, two pairs of supporting columns are correspondingly fixed at the tops of the first and second mounting grooves, a supporting seat is respectively connected between the tops of the two pairs of supporting columns, a fastening screw is respectively connected between the two supporting seats and the two L-shaped supporting plates, first mounting holes are correspondingly formed in the outer walls of two sides of the lower shell, second mounting holes are correspondingly formed in the outer walls of two sides of the upper shell, second cooling fins are arranged in the two first mounting holes and the two second mounting holes, and first cooling fins are fixed at the top of the upper shell and the bottom of the lower shell respectively.
Further, the water pocket subassembly is including filling up the water pocket of water, the fixed frame with first mounting groove and first second mounting groove looks adaptation has been cup jointed to the outside of water pocket, the water pocket is kept away from one side bonding of resistor is fixed with a plurality of semiconductor refrigeration pieces, each the refrigeration end of semiconductor refrigeration piece is pressed close to the water pocket outer wall.
Furthermore, one end of the water bag is provided with a water guide pipe, and an end cover is arranged at the port of the water guide pipe.
Furthermore, a plurality of positioning columns are respectively fixed on two sides of the bottom of the upper shell, and a plurality of positioning holes corresponding to the positioning columns are formed in two sides of the top of the lower shell.
Furthermore, a plurality of first connecting seats are arranged on the outer walls of two sides of the top of the lower shell, a plurality of second connecting seats corresponding to the first connecting seats are arranged on the outer walls of two sides of the bottom of the upper shell, and the corresponding first connecting seats and the corresponding second connecting seats are fixed through bolts.
Further, go up the casing with a plurality of ventilation holes have all been seted up to the both sides outer wall of casing down, just go up the top of casing and square hole has all been seted up to the bottom of casing down.
Compared with the prior art, the utility model discloses the beneficial effect who reaches is: the utility model discloses, through being provided with subassembly such as water pocket subassembly, first fin, second fin, be used for carrying out the heat dissipation work, absorb the heat of resistor through the water pocket, continue to cool down the water through the semiconductor refrigeration piece, be convenient for the water to continue to absorb the heat, the heat that the resistor produced can also be conducted to first fin and second fin and dispel the heat, and further improve the resistor radiating efficiency through a plurality of ventilation holes; through being provided with last casing that can the high-speed fit and casing down, conveniently install the resistor on the supporting seat of casing down, the supporting seat passes through fastening screw high-speed fit with the L type backup pad that is used for fixed resistor, realizes quick installation and the change to the resistor.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
In the drawings:
FIG. 1 is an overall exploded view of the present invention;
fig. 2 is a schematic diagram of the resistor installation of the present invention;
FIG. 3 is a schematic view of the water bladder assembly of the present invention;
FIG. 4 is a schematic structural view of the water bag assembly of the present invention;
fig. 5 is a schematic view of the installation of the semiconductor refrigeration sheet of the present invention;
fig. 6 is a schematic view of the overall structure of the present invention;
fig. 7 is a schematic structural view of the upper shell of the present invention;
in the figure: 1. a lower housing; 11. a support pillar; 12. a supporting seat; 13. a first mounting groove; 14. a first mounting hole; 15. positioning holes; 16. a first connecting seat; 2. an upper housing; 21. a positioning column; 22. a second mounting groove; 23. a second mounting hole; 24. a second connecting seat; 3. a water bladder assembly; 31. a water bladder; 32. a fixing frame; 4. a first heat sink; 5. a second heat sink; 6. a resistor; 61. an L-shaped support plate; 7. fastening screws; 8. a square hole; 9. semiconductor refrigeration piece.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a technical solution: a high-efficiency heat dissipation resistor comprises two resistors, wherein the two resistors 6 are fixedly arranged between two L-shaped supporting plates 61, two ends of each resistor 6 respectively penetrate through the outer walls of the two L-shaped supporting plates 61, an upper shell 2 and a lower shell 1 which are matched with each other are respectively arranged outside the two resistors 6, a first mounting groove 13 is arranged inside the upper shell 2, a second mounting groove 22 which has the same structure as the first mounting groove 13 is arranged inside the lower shell 1, water bag components 3 are respectively arranged inside the first mounting groove 13 and the first mounting groove 22, two pairs of supporting columns 11 are correspondingly fixed at the top of the first mounting groove 22, a supporting seat 12 is respectively connected between the tops of the two pairs of supporting columns 11, a fastening screw 7 is respectively connected between the two supporting seats 12 and the two L-shaped supporting plates 61, first mounting holes 14 are correspondingly formed in the outer walls on two sides of the lower shell 1, second mounting holes 23 are correspondingly formed in the outer walls on two sides of the upper shell, the second cooling fins 5 are mounted inside the two first mounting holes 14 and the two second mounting holes 23, and the first cooling fins 4 are fixed at the top of the upper shell 2 and the bottom of the lower shell 1 respectively.
Set up the screw hole with fastening screw looks adaptation on supporting seat 12 and the L type backup pad 61, be convenient for supporting seat 12 and L type backup pad 61 snap-on fit, the convenient quick installation and the change to resistor 6.
One end of the water bag 31 is provided with a water guide pipe, and an end cover is arranged at the port of the water guide pipe, so that water injection and drainage work of the water bag 31 are facilitated.
A plurality of positioning columns 21 are respectively fixed on two sides of the bottom of the upper shell 2, and a plurality of positioning holes 15 corresponding to the positioning columns 21 are formed in two sides of the top of the lower shell 1, so that the upper shell 2 and the lower shell 1 can be conveniently matched and connected.
The top both sides outer wall of casing 1 is equipped with a plurality of first connecting seats 16 down, goes up the bottom both sides outer wall of casing 2 and is equipped with a plurality ofly and each first connecting seat 16 corresponding second connecting seat 24, and passes through the bolt fastening between corresponding first connecting seat 16 and the second connecting seat 24, reaches casing 2 and lower casing 1's fast fit through the bolted connection mode and is connected.
Go up casing 2 and casing 1's both sides outer wall down and all seted up a plurality of ventilation holes, and go up casing 2's top and casing 1's bottom down and all seted up square hole 8, further improve ventilation cooling effect through a plurality of ventilation holes, effectively strengthen this resistor 6's radiating efficiency. The semiconductor refrigerating sheet 9 is arranged in the square hole 8, so that heat generated by the operation of the semiconductor refrigerating sheet 9 is transferred to the first radiating sheet 4 conveniently.
When the resistor 6 works, heat generated by heating of the resistor 6 is absorbed through the water bag assembly 3, the water in the water bag 31 is cooled through the plurality of semiconductor refrigerating sheets 9, the heat generated by heating of the resistor 6 is quickly absorbed by the water, meanwhile, the heat generated by working of the semiconductor refrigerating sheets 9 can be transmitted to the second radiating sheet 5, the heat generated by the resistor 6 can be transmitted to the first radiating sheet 4 and the second radiating sheet 5 for heat dissipation, the two sides of the upper shell 2 and the lower shell 1 are provided with the plurality of vent holes, and the heat dissipation efficiency of the resistor 6 is further improved; this resistor 6 is convenient for install and change, when changing its installation, can connect and dismantle last casing 2 and lower casing 1 fast through a plurality of bolts, can carry out high-speed match and separation to L type backup pad 61 and supporting seat 12 fast through fastening screw 7, and then realize having strengthened the practicality to the quick installation and the change of resistor 6.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A high efficiency heat dissipating resistor comprising two resistors (6), characterized in that: two resistors (6) are fixedly arranged between two L-shaped supporting plates (61), two ends of each resistor (6) are equally divided to respectively penetrate through two outer walls of the L-shaped supporting plates (61), two upper shells (2) and lower shells (1) which are matched with each other are respectively arranged outside the resistors (6), a first mounting groove (13) is arranged inside each upper shell (2), a second mounting groove (22) which is the same as the first mounting groove (13) in structure is arranged inside each lower shell (1), water sac assemblies (3) are respectively arranged inside each first mounting groove (13) and each first second mounting groove (22), two pairs of supporting columns (11) are correspondingly fixed at the tops of the first mounting grooves (22), a supporting seat (12) is respectively connected between the tops of the two pairs of supporting columns (11), and two fastening screws (7) are respectively connected between each supporting seat (12) and the two L-shaped supporting plates (61), first mounting hole (14) have been seted up to the both sides outer wall correspondence of casing (1) down, go up the both sides outer wall correspondence of casing (2) and seted up second mounting hole (23), two first mounting hole (14) and two second fin (5) are all installed to the inside of second mounting hole (23), go up the top of casing (2) and the bottom of casing (1) is fixed with first fin (4) respectively down.
2. A high efficiency heat dissipating resistor (6) as claimed in claim 1, wherein: the water bag subassembly (3) is including filling up water bag (31) of water, the fixed frame (32) of first mounting groove (13) and first second mounting groove (22) looks adaptation has been cup jointed to the outside of water bag (31), keep away from water bag (31) one side bonding of resistor (6) is fixed with a plurality of semiconductor refrigeration pieces (9), each the refrigeration end of semiconductor refrigeration piece (9) is pressed close to water bag (31) outer wall.
3. A high efficiency heat dissipating resistor (6) as claimed in claim 2, wherein: one end of the water bag (31) is provided with a water guide pipe, and an end cover is arranged at the port of the water guide pipe.
4. A high efficiency heat dissipating resistor (6) as claimed in claim 1, wherein: a plurality of positioning columns (21) are respectively fixed on two sides of the bottom of the upper shell (2), and a plurality of positioning holes (15) corresponding to the positioning columns (21) are formed in two sides of the top of the lower shell (1).
5. A high efficiency heat dissipating resistor (6) as claimed in claim 1, wherein: the outer walls of two sides of the top of the lower shell (1) are provided with a plurality of first connecting seats (16), the outer walls of two sides of the bottom of the upper shell (2) are provided with a plurality of second connecting seats (24) corresponding to the first connecting seats (16), and the corresponding first connecting seats (16) and the corresponding second connecting seats (24) are fixed through bolts.
6. A high efficiency heat dissipating resistor (6) as claimed in claim 1, wherein: go up casing (2) with a plurality of ventilation holes have all been seted up to the both sides outer wall of casing (1) down, just go up the top of casing (2) and square hole (8) have all been seted up to the bottom of casing (1) down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020090498.6U CN210956318U (en) | 2020-01-15 | 2020-01-15 | High-efficiency heat dissipation resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020090498.6U CN210956318U (en) | 2020-01-15 | 2020-01-15 | High-efficiency heat dissipation resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210956318U true CN210956318U (en) | 2020-07-07 |
Family
ID=71380858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020090498.6U Expired - Fee Related CN210956318U (en) | 2020-01-15 | 2020-01-15 | High-efficiency heat dissipation resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210956318U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112038024A (en) * | 2020-08-26 | 2020-12-04 | 周晓燕 | Double-resistor-core resistor |
| CN112420294A (en) * | 2020-12-01 | 2021-02-26 | 辰硕电子(九江)有限公司 | Supporting protection component of high-voltage piezoresistor |
-
2020
- 2020-01-15 CN CN202020090498.6U patent/CN210956318U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112038024A (en) * | 2020-08-26 | 2020-12-04 | 周晓燕 | Double-resistor-core resistor |
| CN112420294A (en) * | 2020-12-01 | 2021-02-26 | 辰硕电子(九江)有限公司 | Supporting protection component of high-voltage piezoresistor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210956318U (en) | High-efficiency heat dissipation resistor | |
| CN101500398A (en) | Heat radiation structure for motor driver | |
| CN105101752A (en) | Charger heat dissipation device | |
| CN209281303U (en) | A kind of passive heat dissipation type cabinet of compact liquid cooling active soaking | |
| CN206131406U (en) | Air conditioner radiator | |
| CN210769284U (en) | Water pump shell capable of dissipating heat easily | |
| CN213423872U (en) | Computer mainframe that radiating effect is good | |
| CN212227142U (en) | High-efficient heat abstractor of integrated kitchen | |
| CN213185726U (en) | Do benefit to radiating spindle motor | |
| CN216922468U (en) | Heat radiation structure for automobile water pump | |
| CN221240670U (en) | Heat dissipation cover plate of scooter controller | |
| CN213016881U (en) | Cooling fan convenient to installation | |
| CN214960706U (en) | Laminated bus assembly with heat dissipation function | |
| CN210958127U (en) | Dustproof constant-current step-down power supply | |
| CN219891803U (en) | Singlechip development experiment board | |
| CN213811838U (en) | Intelligent control radiator of easily installing | |
| CN218385232U (en) | High-power field effect transistor | |
| CN217334068U (en) | Power semiconductor module with heat-conducting silica gel sheet | |
| CN214256961U (en) | Water cooling plate of motor controller and motor controller | |
| CN212839318U (en) | Automobile gearbox with heat dissipation device | |
| CN220985921U (en) | Heat dissipation type circuit board | |
| CN219388107U (en) | Heat dissipation base for air compressor | |
| CN216773343U (en) | Equipment heat dissipation heat sink in high performance battery course of working | |
| CN211480014U (en) | Mounting seat convenient for heat dissipation for semiconductor element | |
| CN218218071U (en) | Be used for miniature data center IT equipment rack |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200707 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |