CN213423872U - Computer mainframe that radiating effect is good - Google Patents
Computer mainframe that radiating effect is good Download PDFInfo
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- CN213423872U CN213423872U CN202021952320.4U CN202021952320U CN213423872U CN 213423872 U CN213423872 U CN 213423872U CN 202021952320 U CN202021952320 U CN 202021952320U CN 213423872 U CN213423872 U CN 213423872U
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Abstract
The utility model discloses a computer mainframe box with good heat dissipation effect, which comprises a mainframe box and a water tank, wherein the water tank is fixedly welded at the bottom of the mainframe box, the mainframe box comprises a water cooling device, a dustproof screen frame, a shock-absorbing rubber pad, a semiconductor heat dissipation device and a mainboard chip, a sliding groove is arranged at the top of the mainframe box, the dustproof screen frame is connected in the sliding groove in a sliding way, the shock-absorbing rubber pad is fixedly arranged at the bottom of the mainframe box, the water cooling device is fixedly arranged at one side of the mainframe box, and the electrical input ends of the water pump, the water cooling device and the semiconductor heat dissipation device are electrically connected with an external power supply, the utility model has good heat dissipation effect and convenient dust removal, greatly improves the service life and the performance of the computer, solves the problems that the inside of the mainframe box is more easily infected with dust, the cleaning is very troublesome, is suitable for wide popularization and application.
Description
Technical Field
The utility model relates to a mainframe box heat dissipation technical field, in particular to computer mainframe box that radiating effect is good.
Background
The case is used as a part of computer accessories and has the main function of placing and fixing the computer accessories, thereby having a supporting and protecting function. In addition, the computer case has an important role in shielding electromagnetic radiation. Although not a critical configuration in DIY, using a poor quality chassis tends to short the motherboard to the chassis, making the computer system very unstable.
Patent CN201711256856.5 discloses a computer mainframe that radiating effect is good, including the mainframe box, mainframe box top fixed mounting has the air discharge fan motor, the output shaft of air discharge fan motor rotates through the shaft coupling and is connected with the connecting axle, the bottom fixedly connected with connecting block of connecting axle, the bilateral symmetry of connecting block is provided with the exhaust flabellum, the air inlet fan recess has been seted up to the mainframe box inside, the inside fixed mounting of air inlet fan recess has air inlet fan motor, the output shaft bilateral symmetry of air inlet fan motor is provided with the air inlet flabellum. The outside dust of mainframe box is blocked through the outside protection casing of air discharge fan motor, and air inlet fan motor drives the air inlet flabellum and rotates inside outside air admission mainframe box, increases the inside air flow of meter mainframe box, reduces the inside produced heat of mainframe box, has improved the stability of each parts of mainframe box inside greatly.
The prior art and the above disadvantages: 1. when the existing computer works, a CPU, an internal memory, a hard disk, a power supply and the like generate a large amount of heat, the heat of the CPU is cooled by a fan, and the normal work of equipment is influenced by too high temperature, so that the use effect and the service life of the computer are influenced; 2. more in the current mainframe box of current computer be more install more fans additional, make the mainframe box in be infected with the dust more, it is very troublesome to clear up, the simple external surface of following is cleaned and to be made partial dust enter into quick-witted incasement, influences the operation of inside spare part, and dismantles the clearance to the mainframe box, then need all pull down some spare parts of inside, the clearance is accomplished the back and is loaded onto, can influence the sensitivity of contact between the spare part like this.
SUMMERY OF THE UTILITY MODEL
A primary object of the utility model is to provide a computer mainframe that radiating effect is good, change in can effectively solving the background art mainframe and be infected with the dust, it is very troublesome to clear up, and the not good problem that influences the function of inside spare part of radiating effect.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a computer mainframe box with good heat dissipation effect comprises a mainframe box and a water tank, wherein the bottom of the mainframe box is fixedly welded with the water tank, the mainframe box comprises a water cooling device, a dustproof screen frame, a damping rubber pad, a semiconductor heat dissipation device and a mainboard chip, a sliding groove is formed in the top of the mainframe box, the dustproof screen frame is connected in the sliding groove in a sliding mode, the bottom of the mainframe box is fixedly provided with the damping rubber pad, the water cooling device is fixedly arranged on one side of the mainframe box and comprises a water inlet pipe, a cooling pipe, a water pump and a water outlet pipe, the water inlet pipe is fixedly arranged in the water tank, the cooling pipe is tightly attached to one side of the semiconductor heat dissipation device, one end of the water inlet pipe extends and penetrates through the bottom of the mainframe box to be connected with the cooling pipe, the cooling pipe is fixedly connected to one end of the, just the outlet pipe other end runs through in the mainframe box bottom extends to the water tank, one side of water cooling plant closely laminates on semiconductor heat abstractor, semiconductor heat abstractor leads cold aluminum sheet, semiconductor refrigeration piece, refrigeration chip and heat conduction copper sheet including high, high lead one side of cold aluminum sheet fixed mounting at mainboard chip, the right side of high lead cold aluminum sheet is installed at the semiconductor refrigeration piece, the right side of semiconductor refrigeration piece is installed at the refrigeration chip, the right side fixed mounting of refrigeration chip is on the heat conduction copper sheet, the right side of heat conduction copper sheet closely laminates installation water cooling plant.
Further, ventilation openings are formed in two sides of the main case.
Furthermore, a movable handle is installed on the dustproof screen frame.
Furthermore, the electrical input ends of the water pump, the water cooling device and the semiconductor heat dissipation device are electrically connected with an external power supply.
Further, the shock-absorbing rubber pad is fixedly installed at the top of the main machine box.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model discloses an install water cooling plant and semiconductor device in the mainframe box, when the mainboard chip work generates heat, the semiconductor chip device exchanges the heat on the mainboard chip to semiconductor refrigeration piece and refrigeration chip through high-conductivity cold aluminum sheet, the semiconductor refrigeration piece is a heat transfer tool, when the thermocouple centering that an N type semiconductor material and a P type semiconductor material link up has the electric current to pass through, will produce the heat transfer between both ends, the heat will be shifted to the other end from one end, thereby produce the difference in temperature and form cold and hot end, but the semiconductor self has resistance and will produce the heat when the electric current passes through the semiconductor, thereby can influence the heat transfer, and the heat between two polar plates also can carry out reverse heat transfer through air and semiconductor material self, when cold and hot end reaches certain difference in temperature, the quantity of these two kinds of heat transfers is equal, the heat dissipation structure is efficient, the service life of a computer mainboard chip can be effectively prolonged, and the problems that when an existing computer works, a CPU, a memory, a hard disk, a power supply and the like can generate a large amount of heat, the heat of the CPU is cooled by a fan, the normal work of equipment can be influenced due to too high temperature, and the use effect and the service life of the computer are influenced are solved.
2. The utility model is provided with a sliding groove on the main case, the sliding groove is connected with the dustproof screen frame in a sliding way, and the top of the dustproof screen frame is provided with a movable handle, the movable handle can directly pull out the dustproof screen frame to clean the dustproof screen frame, and a damping rubber pad is arranged in the mainframe box to prevent dust from entering the mainframe box due to the vibration of the machine, the structure is simple, the service life of the device can be effectively prolonged, the problems that more fans are additionally arranged in the existing main case of the existing computer, the main case is easy to be stained with dust, the cleaning is very troublesome, part of dust enters the main case by simply wiping the main case from the outer surface, the operation of internal parts is influenced are solved, when the mainframe box is disassembled and cleaned, some internal parts need to be completely disassembled and then assembled after the cleaning is finished, so that the sensitivity of contact between the parts is affected.
Drawings
Fig. 1 is the utility model discloses a computer mainframe overall structure schematic diagram that radiating effect is good.
Fig. 2 is the utility model relates to a computer mainframe water cooling plant planar structure schematic diagram that the radiating effect is good.
Fig. 3 is the utility model relates to a computer mainframe semiconductor heat abstractor plane structure schematic diagram that the radiating effect is good.
Fig. 4 is the utility model discloses a computer mainframe dust screen planar structure sketch map that the radiating effect is good.
FIG. 5 is the schematic view of the planar structure of the rubber pad of the computer mainframe with good heat dissipation effect
In the figure: 1. a main chassis; 2. a water tank; 3. a vent; 4. a dust-proof screen frame; 5. a motherboard chip; 6. a semiconductor heat sink; 61. a thermally conductive copper sheet; 62. a refrigeration chip; 63. High conductivity cold aluminum sheet; 64. a semiconductor refrigeration sheet; 7. a water cooling device; 71. a water outlet pipe; 72. A water inlet pipe; 73. a water pump; 74. a cooling tube; 8. a shock-absorbing rubber pad; 9. a movable handle; 10. a sliding groove.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-5, a computer mainframe box that radiating effect is good, includes mainframe box 1 and water tank 2, the fixed welding in mainframe box 1 bottom has water tank 2, mainframe box 1 includes water cooling plant 7, dust screen frame 4, shock-absorbing rubber pad 8, semiconductor heat abstractor 6 and mainboard chip 5, sliding tray 10 has been seted up on mainframe box 1 top, sliding connection has dust screen frame 4 in sliding tray 10, mainframe box 1 bottom fixed mounting has shock-absorbing rubber pad 8, water cooling plant 7 fixed mounting is in mainframe box 1 one side, water cooling plant 7 includes inlet tube 72, cooling tube 74, water pump 73 and outlet pipe 71, inlet tube 72 fixed mounting is in water tank 2, inlet tube 72 one end extends and runs through mainframe box 1 bottom and connects cooling tube 74, cooling tube 74 closely laminates in semiconductor heat abstractor 6 one side, the cooling pipe 74 is fixedly connected with one end of a water pump 73, the water pump 73 is fixedly arranged on the shock absorption rubber pad 8, the other end of the water pump 73 is fixedly connected with one end of a water outlet pipe 71, the other end of the water outlet pipe 71 penetrates through the bottom of the main case 1 and extends into the water tank 2, one side of the water cooling device 7 is tightly attached to the semiconductor heat dissipation device 6, the semiconductor heat dissipation device 6 comprises a high-conductivity cold aluminum sheet 63, a semiconductor refrigeration sheet 64, a refrigeration chip 62 and a heat conduction copper sheet 61, the high-conductivity cold-aluminum sheet 63 is fixedly arranged at one side of the mainboard chip 5, the semiconductor refrigeration sheet 64 is arranged at the right side of the high-conductivity cold-aluminum sheet 63, the refrigeration chip 62 is installed on the right side of the semiconductor refrigeration chip 64, the heat conduction copper sheet 61 is fixedly installed on the right side of the refrigeration chip 62, and the water cooling device 7 is closely attached to the right side of the heat conduction copper sheet 61.
In this embodiment (as shown in fig. 1), ventilation openings 3 are provided on both sides of the main cabinet 1.
Wherein, the utility model discloses a be provided with vent 3 on mainframe box 1, dispel the heat in mainframe box 1, use through semiconductor heat abstractor 6, water cooling plant 7 and the cooperation of vent 3, make the radiating effect better.
In this embodiment (as shown in fig. 1 and 4), the dust screen frame 4 is provided with a movable handle 9.
Wherein, the utility model discloses an on demountable installation dust screen frame 4 separation dust fell on mainboard chip 5, semiconductor device 6 and water cooling plant 7, influence the radiating effect, and the activity handle 9 that sets up on this dust screen frame 4 can take dust screen frame 4 out from sliding tray 10, washs, can protect the life of extension machine effectively.
In this embodiment (as shown in fig. 1, 2, and 3), the water pump 73, the water cooling device 7, and the semiconductor heat dissipation device 6 are electrically connected to an external power source.
Wherein, the utility model provides a water pump 73, water cooling plant 7 and semiconductor heat abstractor 6 all provide the electric energy through external power source, can guarantee the stability of equipment operation, and the radiating effect is better.
In this embodiment (as shown in fig. 1 and 5), the cushion rubber pad 8 is fixedly installed on the top of the main cabinet 1.
Wherein, the utility model discloses an installation shock-absorbing rubber pad 8, shock-absorbing rubber pad 8 are installed respectively in 1 top of mainframe box and bottom, can avoid mainframe box 1 because of vibrations effectively, and make the part dust that glues in the dust screen frame drop on mainboard chip 5.
It should be noted that the components are all general standard components or components known by those skilled in the art, and the structure and principle of the components are known by the technical manual or by the conventional experimental method, the utility model is powered on during operation, the main board chip 5, the semiconductor heat dissipation device 6 and the water cooling device 7 in the main case 1 start to operate, the ventilation openings 3 are arranged on the two side surfaces of the main case 1, so that the main case 1 has air circulation to achieve a certain heat dissipation effect, the semiconductor device 6 in the main case 1 comprises a high-conductivity cold aluminum sheet 63, a semiconductor refrigeration sheet 64, a refrigeration chip 62 and a heat conduction copper sheet 61, when the main board chip 5 operates and generates heat, the semiconductor chip device 6 exchanges heat on the main board chip 5 to the semiconductor refrigeration sheet 64 and the refrigeration chip 62 through the high-conductivity cold aluminum sheet 63, the semiconductor refrigeration sheet 64 is a heat transfer tool, when a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material passes through a current, heat transfer is generated between two ends, the heat is transferred from one end to the other end, so that temperature difference is generated to form a cold and hot end, but the semiconductor has a resistor, so that the heat is generated when the current passes through the semiconductor, so that heat transfer is influenced, the heat between two polar plates can be reversely transferred through air and the semiconductor material, when the cold and hot ends reach a certain temperature difference and the two heat transfer amounts are equal, a balance point can be reached, the forward and reverse heat transfer are mutually counteracted, the temperature of the cold and hot ends cannot be continuously changed, in order to reach a lower temperature, the temperature of the hot end can be reduced by adopting a heat dissipation mode and the like, the refrigeration effect is controlled by the refrigeration chip 62, so that the heat is transferred to the heat conducting copper sheet 61, heat conduction copper sheet 61 closely laminates with water cooling tube 74 of water cooling plant 7, the heat passes through cooling tube in the water cooling plant 7 and takes the heat to water tank 2, realize thermal transfer, this heat radiation structure is high-efficient, still be provided with sliding tray 10 on the mainframe box 1, this sliding tray 10 can be dismantled with dustproof mesh frame 4 and be connected, and be provided with movable handle 9 at the top of dustproof mesh frame 4, this movable handle 9 can directly take out dustproof mesh frame 4, wash alone it, and still install rubber gasket 8 in mainframe box 1, avoid the machine vibrations to make the dust get into in mainframe box 1, this simple structure, and can increase the life of equipment effectively.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides a computer mainframe that radiating effect is good, includes mainframe (1) and water tank (2), its characterized in that: the utility model discloses a solar energy water heater, including mainframe box (1), mainframe box (1) bottom fixed welding has water tank (2), mainframe box (1) includes water cooling plant (7), dust screen frame (4), shock-absorbing rubber pad (8), semiconductor heat abstractor (6) and mainboard chip (5), sliding tray (10) have been seted up at mainframe box (1) top, sliding tray (10) sliding connection has dust screen frame (4), mainframe box (1) bottom fixed mounting has shock-absorbing rubber pad (8), one side of water cooling plant (7) fixed mounting in mainframe box (1), water cooling plant (7) include inlet tube (72), cooling tube (74), water pump (73) and outlet pipe (71), inlet tube (72) fixed mounting is in water tank (2), inlet tube (72) one end extends and runs through mainframe box (1) bottom and connects cooling tube (74), cooling tube (74) closely laminate in semiconductor heat abstractor (6) one side, cooling tube (74) fixed connection is in water pump (73) one end, water pump (73) fixed mounting is on shock-absorbing rubber pad (8), water pump (73) other end fixedly connected with outlet pipe (71) one end, just outlet pipe (71) other end runs through mainframe box (1) bottom and extends to in water tank (2), one side of water cooling plant (7) is closely laminated on semiconductor heat abstractor (6), semiconductor heat abstractor (6) are including high cold aluminum sheet (63), semiconductor refrigeration piece (64), refrigeration chip (62) and heat conduction copper sheet (61) of leading, high cold aluminum sheet (63) fixed mounting is in one side of mainboard chip (5) of leading, semiconductor refrigeration piece (64) is installed on the right side of high cold aluminum sheet (63) of leading, refrigeration chip (62) is installed on the right side of semiconductor refrigeration piece (64), the fixed mounting of refrigeration chip (62) has heat conduction copper sheet (61), and the water cooling device (7) is tightly attached to the right side of the heat conduction copper sheet (61).
2. The computer mainframe with good heat dissipation effect according to claim 1, wherein: and ventilation openings (3) are arranged on two sides of the mainframe box (1).
3. The computer mainframe with good heat dissipation effect according to claim 1, wherein: and a movable handle (9) is arranged on the dustproof screen frame (4).
4. The computer mainframe with good heat dissipation effect according to claim 1, wherein: and the electrical input ends of the water pump (73), the water cooling device (7) and the semiconductor heat dissipation device (6) are electrically connected with an external power supply.
5. The computer mainframe with good heat dissipation effect according to claim 1, wherein: the shock-absorbing rubber pad (8) is fixedly arranged at the top of the mainframe box (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021952320.4U CN213423872U (en) | 2020-09-09 | 2020-09-09 | Computer mainframe that radiating effect is good |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021952320.4U CN213423872U (en) | 2020-09-09 | 2020-09-09 | Computer mainframe that radiating effect is good |
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| CN213423872U true CN213423872U (en) | 2021-06-11 |
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| CN202021952320.4U Active CN213423872U (en) | 2020-09-09 | 2020-09-09 | Computer mainframe that radiating effect is good |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113436849A (en) * | 2021-07-04 | 2021-09-24 | 李磊 | High-efficient radiating dry-type transformer |
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2020
- 2020-09-09 CN CN202021952320.4U patent/CN213423872U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113436849A (en) * | 2021-07-04 | 2021-09-24 | 李磊 | High-efficient radiating dry-type transformer |
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