CN211480014U - Mounting seat convenient for heat dissipation for semiconductor element - Google Patents
Mounting seat convenient for heat dissipation for semiconductor element Download PDFInfo
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- CN211480014U CN211480014U CN202021613634.1U CN202021613634U CN211480014U CN 211480014 U CN211480014 U CN 211480014U CN 202021613634 U CN202021613634 U CN 202021613634U CN 211480014 U CN211480014 U CN 211480014U
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- heat dissipation
- boss
- connecting rod
- dissipation mechanism
- heat
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Abstract
The utility model relates to a semiconductor heat dissipation mount pad technical field, and disclose a mount pad for semiconductor element convenient to heat dissipation, fixed the pasting in bottom outside of heat dissipation mechanism has the rubber pad, fixed welding in both ends has mount one about heat dissipation mechanism bottom, fixed welding in both ends has mount two around the heat dissipation mechanism bottom, the middle part recess of mount one and mount two is provided with chucking mechanism, the middle part of the bottom surface of heat dissipation mechanism is provided with the semiconductor refrigeration piece, the bottom joint of semiconductor refrigeration piece has radiator unit, radiator unit has the fan through two threaded connection of screw. This mount pad for semiconductor element convenient to heat dissipation is convenient for fix the box of different thickness and be convenient for disassemble and accomodate simultaneously, and the fan through the bottom is arranged the gas of box to around through the middle part because this reaches better gas circulation, and the heat conduction of exhaust heat through heat dissipation mechanism and then discharge through radiator fan to this reaches better radiating effect.
Description
Technical Field
The utility model relates to a semiconductor heat dissipation mount pad technical field specifically is a mount pad for semiconductor element convenient to heat dissipation.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has application in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and for example, a diode is a device made of the semiconductor.
The semiconductor refrigerating sheet, also called thermoelectric refrigerating sheet, is a heat pump, when the direct current passes through a couple formed by connecting two different semiconductor materials in series, the two ends of the couple can respectively absorb heat and release heat, thus realizing the purpose of refrigeration.
A small-size combined refrigerator appears when using to semiconductor refrigeration, refrigerates in a closed box through using the semiconductor refrigeration piece, has better refrigeration effect and portable, and current small-size refrigerator does not have better fixed and heat dissipation in the department of contact with the semiconductor refrigeration piece, can't fix the box of different thickness, and the fixed of current semiconductor refrigeration piece is fixed connection or activity joint simultaneously, does not possess the function of dismantling or sealing.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a semiconductor element uses mount pad convenient to heat dissipation has solved the radiating effect not good with not convenient to detach and do not possess sealed problem.
(II) technical scheme
For the purpose that realizes above-mentioned better heat dissipation and can dismantle and have sealed base, the utility model provides a following technical scheme: the utility model provides a mount pad for semiconductor element convenient to heat dissipation, there is radiator fan at heat dissipation mechanism's top through a screw threaded connection, fixed pasting in heat dissipation mechanism's bottom outside has the rubber pad, fixed welding in both ends has mount one about heat dissipation mechanism bottom, fixed welding in both ends has mount two around the heat dissipation mechanism bottom, the middle part recess of mount one and mount two is provided with chucking mechanism, the middle part of heat dissipation mechanism's bottom surface is provided with the semiconductor refrigeration piece, the bottom joint of semiconductor refrigeration piece has radiator unit, radiator unit has the fan through two threaded connection of screw.
The clamping mechanism comprises a clamping plate, a fixing table II, a dragging boss, a first connecting rod, a second connecting rod, a threaded column, a boss and a fastening threaded table, the middle groove top of the fixing table II is fixedly connected with the fixing table II, the fixing table II is rotatably connected with the fixing table through a pin, the back face of the fixing table is fixedly connected with the front face of the clamping plate, the front face of the clamping plate is provided with the dragging boss, the waist-shaped hole is formed in the left end face and the right end face of the dragging boss, the dragging boss is rotatably connected with the connecting rod through the pin, the first connecting rod is rotatably connected with the second connecting rod through the pin, the second connecting rod is slidably connected in the boss, the top of the second connecting rod is fixedly connected with the threaded column, the top of the threaded column is in threaded connection with the fastening threaded table.
The heat dissipation mechanism comprises plate-type cooling fins, a screw fixing frame and a fixing shell, wherein the plate-type cooling fins are uniformly distributed in the front and back of the middle of a top groove of the fixing shell, and the front and back ends of the top groove of the fixing shell are fixedly connected with the bottom of the screw fixing frame.
Preferably, the middle part of the boss is provided with a square through hole.
Preferably, the heat dissipation assembly comprises strip-shaped heat dissipation fins, cylindrical heat dissipation fins and a heat conduction platform, the strip-shaped heat dissipation fins are distributed at the bottom of the heat conduction platform in an annular array mode, the cylindrical heat dissipation fins are evenly distributed at the middle of the heat conduction platform, and a circular groove is formed in the top of the heat conduction platform.
Preferably, the shape of the clamping plate is J-shaped.
Compared with the prior art, the utility model provides a be convenient for radiating mount pad for semiconductor element possesses following beneficial effect:
1. this mount pad for semiconductor element convenient to heat dissipation drives the screw thread post rebound through rotating fastening screw platform, and then drives two rebound of connecting rod, drives connecting rod one from this and drags the boss for the chucking board rotates under the cooperation of fixed station and fixed station two and reaches the fixed to the bottom from this, carries out the fixed effect that pressure to the rubber pad reaches whole interface simultaneously, is convenient for fix the box of different thickness and is convenient for disassemble and accomodate simultaneously.
2. This be convenient for radiating mount pad for semiconductor element, semiconductor refrigeration piece are carried the heat by the bottom to the top, and the fan through the bottom is arranged the gas of box to around through the middle part because this reaches better gas circulation, and the heat conduction of exhaust heat process heat dissipation mechanism and then discharge through radiator fan to this reaches better radiating effect.
Drawings
FIG. 1 is an exploded view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a front view of the structure of the present invention;
FIG. 4 is a schematic sectional view of the structure of the present invention;
FIG. 5 is a schematic view of the area A in the structure diagram of the present invention;
fig. 6 is a schematic view of the structure of the clamping mechanism of the present invention.
Wherein: 1. a heat radiation fan; 2. a first screw; 3. a heat dissipation mechanism; 301. a plate-type heat sink; 302. a screw fixing frame; 303. fixing the housing; 4. a rubber pad; 5. a chucking mechanism; 501. a chucking plate; 502. a fixed table; 503. a second fixed table; 504. dragging the boss; 505. a first connecting rod; 506. a second connecting rod; 507. a threaded post; 508. a boss; 509. fastening the thread table; 6. a first fixing frame; 7. a second fixing frame; 8. a semiconductor refrigeration sheet; 9. a heat dissipating component; 901. a strip-shaped heat sink; 902. a cylindrical heat sink; 903. a heat conducting stage; 10. a second screw; 11. a fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the utility model provides a semiconductor component mounting base convenient for heat dissipation, the top of a heat dissipation mechanism 3 is connected with a heat dissipation fan 1 through a screw 2, a rubber pad 4 is fixedly adhered on the outer edge of the bottom of the heat dissipation mechanism 3, the heat dissipation mechanism 3 comprises a plate-type heat sink 301, a screw fixing frame 302 and a fixing shell 303, the plate-type heat sink 301 is uniformly distributed on the front and back of the middle part of the top groove of the fixing shell 303, the front and back ends of the top groove of the fixing shell 303 are fixedly connected with the bottom of the screw fixing frame 302, a fixing frame 6 is fixedly welded on the left and right ends of the bottom of the heat dissipation mechanism 3, a fixing frame 7 is fixedly welded on the front and back ends of the bottom of the heat dissipation mechanism 3, a clamping mechanism 5 is arranged on the middle grooves of the fixing frame 6 and the fixing frame 7, the heat dissipation assembly 9 comprises strip-shaped heat dissipation fins 901, cylindrical heat dissipation fins 902 and a heat conduction platform 903, wherein the strip-shaped heat dissipation fins 901 are distributed at the bottom of the heat conduction platform 903 in an annular array mode, the cylindrical heat dissipation fins 902 are uniformly distributed in the middle of the heat conduction platform 903, a circular groove is formed in the top of the heat conduction platform 903, and the heat dissipation assembly 9 is connected with a fan 11 through two screws 10 in a threaded mode.
The clamping mechanism 5 comprises a clamping plate 501, a fixed table 502, a fixed table II 503, a dragging boss 504, a connecting rod I505, a connecting rod II 506, a threaded column 507, a boss 508 and a fastening threaded table 509, the top of a middle groove of the fixed table II 7 is fixedly connected with the fixed table II 503, the fixed table II 503 is rotatably connected with the fixed table 502 through a pin, the back surface of the fixed table 502 is fixedly connected with the front surface of the clamping plate 501, the front surface of the clamping plate 501 is provided with the dragging boss 504, the left end surface and the right end surface of the dragging boss 504 are provided with waist-shaped holes, the dragging boss 504 is rotatably connected with the connecting rod I505 through a pin, the connecting rod I505 is rotatably connected with the connecting rod II 506 through a pin, the connecting rod II 506 is slidably connected in the boss 508, the top of the connecting rod II 506 is fixedly connected with the threaded column 507, the top of the threaded column is in threaded connection with the, the chucking plate 501 has a shape of "J".
When using, carry the heat by the bottom to the top through semiconductor refrigeration piece 8, fan 11 through the bottom arranges the gas of box to all around through the middle part because this reaches better gas circulation, the exhaust heat is through heat conduction of heat dissipation mechanism 3 and then discharge through radiator fan 1 and reach better radiating effect, it drives screw post 507 rebound to drive through rotating fastening screw platform 509, and then drive two 506 rebound of connecting rod, drive connecting rod 505 from this and drag boss 504, make chucking plate 501 rotate under the cooperation of fixed station 502 and two 503 of fixed station and reach the fixing to the bottom from this, carry out the fixed effect that reaches whole interface to the pressure of rubber pad 4 simultaneously, be convenient for to dismantle the box of different thickness and be convenient for and accomodate simultaneously.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A mount pad for semiconductor element convenient to heat dissipation, includes heat dissipation mechanism (3), its characterized in that: the top of the heat dissipation mechanism (3) is connected with a heat dissipation fan (1) through a first screw (2) in a threaded manner, a rubber pad (4) is fixedly pasted on the outer edge of the bottom of the heat dissipation mechanism (3), first fixing frames (6) are fixedly welded at the left end and the right end of the bottom of the heat dissipation mechanism (3), second fixing frames (7) are fixedly welded at the front end and the rear end of the bottom of the heat dissipation mechanism (3), clamping mechanisms (5) are arranged in grooves in the middles of the first fixing frames (6) and the second fixing frames (7), a semiconductor refrigeration sheet (8) is arranged in the middle of the bottom surface of the heat dissipation mechanism (3), a heat dissipation assembly (9) is clamped at the bottom of the semiconductor refrigeration sheet (8), and the heat dissipation assembly (9);
the clamping mechanism (5) comprises a clamping plate (501), a fixed platform (502), a fixed platform II (503), a dragging boss (504), a connecting rod I (505), a connecting rod II (506), a threaded column (507), a boss (508) and a fastening threaded platform (509), wherein the top of a middle groove of the fixed rack II (7) is fixedly connected with the fixed platform II (503), the fixed platform II (503) is rotatably connected with the fixed platform (502) through a pin, the back of the fixed platform (502) is fixedly connected with the front of the clamping plate (501), the front of the clamping plate (501) is provided with the dragging boss (504), the left end face and the right end face of the dragging boss (504) are provided with kidney-shaped holes, the dragging boss (504) is rotatably connected with the connecting rod I (505) through a pin, the connecting rod I (505) is rotatably connected with the connecting rod II (506) through a pin, and the connecting rod II (506) is slidably connected in the boss (, the top of the second connecting rod (506) is fixedly connected with a threaded column (507), the top of the threaded column (507) is in threaded connection with a fastening threaded table, and the top of the boss (508) is fixedly connected to the top of the heat dissipation mechanism (3);
the heat dissipation mechanism (3) comprises plate-type heat dissipation fins (301), a screw fixing frame (302) and a fixing shell (303), the plate-type heat dissipation fins (301) are uniformly distributed in the middle of a top groove of the fixing shell (303) in the front and back directions, and the front end and the back end of the top groove of the fixing shell (303) are fixedly connected with the bottom of the screw fixing frame (302).
2. A heat dissipating mounting base for a semiconductor device according to claim 1, wherein: the middle part of the boss (508) is provided with a square through hole.
3. A heat dissipating mounting base for a semiconductor device according to claim 1, wherein: the radiating assembly (9) comprises strip radiating fins (901), cylindrical radiating fins (902) and a heat conducting table (903), wherein the strip radiating fins (901) are distributed at the bottom of the heat conducting table (903) in an annular array mode, the cylindrical radiating fins (902) are uniformly distributed in the middle of the heat conducting table (903), and a circular groove is formed in the top of the heat conducting table (903).
4. A heat dissipating mounting base for a semiconductor device according to claim 1, wherein: the shape of the clamping plate (501) is J-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021613634.1U CN211480014U (en) | 2020-08-06 | 2020-08-06 | Mounting seat convenient for heat dissipation for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021613634.1U CN211480014U (en) | 2020-08-06 | 2020-08-06 | Mounting seat convenient for heat dissipation for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211480014U true CN211480014U (en) | 2020-09-11 |
Family
ID=72364328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021613634.1U Active CN211480014U (en) | 2020-08-06 | 2020-08-06 | Mounting seat convenient for heat dissipation for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211480014U (en) |
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2020
- 2020-08-06 CN CN202021613634.1U patent/CN211480014U/en active Active
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| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230809 Address after: B405-114, Science and Technology Innovation Headquarters Building, No. 320 Pubin Road, Pukou District, Nanjing City, Jiangsu Province, 210000 Patentee after: Nanjing Lingjie Flight Technology Co.,Ltd. Address before: No.545, 5 / F, building 9, xingzhihui business garden, No.19 Xinghuo Road, Jiangbei new district, Nanjing, Jiangsu Province 210000 Patentee before: Nanjing KaFei Software Technology Co.,Ltd. |