CN210805766U - Chip module and electronic equipment - Google Patents
Chip module and electronic equipment Download PDFInfo
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- CN210805766U CN210805766U CN201922495952.6U CN201922495952U CN210805766U CN 210805766 U CN210805766 U CN 210805766U CN 201922495952 U CN201922495952 U CN 201922495952U CN 210805766 U CN210805766 U CN 210805766U
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Abstract
The utility model discloses a chip module and electronic equipment. Wherein, this chip module includes: a substrate; the chip is arranged on one surface of the substrate and is electrically connected with the substrate; and the antenna structure and the chip are positioned on the same side of the substrate, and the antenna structure is electrically connected with the substrate and the chip. The utility model discloses aim at reducing the inductance of the ground point of antenna, improve the signal transmission quality of antenna.
Description
Technical Field
The utility model relates to a chip technical field, in particular to chip module and electronic equipment.
Background
Under the drive of the social demands of intellectualization, portability, high speed and long standby time, modern consumer electronic products are developed towards high integration, miniaturization, no cable and low power consumption. When the chip integrates the antenna structure, the antenna structure and the chip are connected to external circuits respectively to realize their respective functions. However, when the GND (ground point) of the antenna is connected to an external circuit, the inductance of the circuit is large. The signal transmission quality of the antenna is reduced because the antenna signal transmission is lost due to the large inductance.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a chip module, aim at reducing the inductance of the ground point of antenna, improve the signal transmission quality of antenna.
In order to achieve the above object, the utility model provides a chip module includes:
a substrate;
the chip is arranged on one surface of the substrate and is electrically connected with the substrate; and
the antenna structure and the chip are positioned on the same side of the substrate, and the antenna structure is electrically connected with the substrate and the chip.
In an embodiment of the present invention, the antenna structure includes:
the antenna body is arranged on the surface of the chip, which is far away from the substrate;
the first welding wire electrically connects the antenna body and the substrate; and
and the second welding wire is used for grounding and electrically connecting the antenna body and the chip.
In an embodiment of the present invention, the antenna body is provided with a first feeding portion and a second feeding portion, the first feeding portion and the second feeding portion are both communicated with an internal circuit of the antenna body, the substrate is provided with a first bonding pad, one end of the first bonding wire is fixedly connected to the first feeding portion, and the other end of the first bonding wire is connected to the first bonding pad;
one end of the second welding wire is connected with the second feed portion, and the other end of the second welding wire is fixedly connected with the chip.
In an embodiment of the present invention, the antenna body is formed with a yielding space, the chip has a connection end, the connection end is exposed to the yielding space, at least part of the first bonding wire stretches into the yielding space, and will the second feeding portion is electrically connected to the connection end.
In an embodiment of the present invention, the chip module includes a width direction, and the first feeding portion and the second feeding portion are located on the same side of the width direction.
In an embodiment of the present invention, the chip module further includes an encapsulation layer, the encapsulation layer is disposed on the surface of the substrate, and covers the antenna body, the first bonding wire and the second bonding wire.
In an embodiment of the present invention, the chip module further includes a bonding layer, the bonding layer is disposed between the antenna structure and the chip, and the antenna structure is fixedly connected to the chip.
The utility model discloses an in the embodiment, the antenna body still includes the matching circuit line, the encapsulated layer shows at least part the matching circuit line, the chip module still includes electronic components, electronic components with matching circuit line electric connection.
In an embodiment of the present invention, the material of the encapsulation layer includes an insulating material;
and/or the material of the first bonding wire and the second bonding wire comprises a conductive material.
The utility model also provides an electronic device, which comprises a chip module, wherein the chip module comprises a substrate; the chip is arranged on one surface of the substrate and is electrically connected with the substrate; and the antenna structure and the chip are positioned on the same side of the substrate, and the antenna structure is electrically connected with the substrate and the chip.
The utility model discloses technical scheme is through setting up and base plate electric connection's chip at the base plate to set up antenna structure, again with antenna structure respectively with base plate and chip electric connection, wafer/chip (chip) is a miniaturized mode to circuit (mainly including semiconductor equipment, also including passive subassembly etc.) in the electronics, and often makes on the semiconductor wafer surface. These include two types, one is an integrated circuit manufactured with a circuit on the surface of a semiconductor chip, which is also called a thin-film (thin-film) integrated circuit. Another type of thick-film integrated circuit (thick-film) is a miniaturized circuit formed by a separate semiconductor device and a passive component integrated on a substrate or a circuit board. The thin film integrated circuit and the miniaturized circuit generally have good grounding design and have the advantage of small grounding inductance. Therefore, after the antenna structure is electrically connected with the chip, the grounding inductance of the antenna structure can be reduced, and the signal transmission quality of the antenna is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of the chip module according to the present invention.
The reference numbers illustrate:
the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The present application provides a chip module 100, which aims to reduce the ground inductance of the antenna structure 30 and improve the signal transmission quality of the antenna in the chip module 100. The chip module 100 can be applied to an electronic device, and it can be understood that the electronic device can be, but is not limited to, a mobile phone, a tablet computer, a Personal Digital Assistant (PDA), an electronic book reader, an MP3 (motion Picture experts compressed standard Audio Layer III) player, an MP4 (motion Picture experts compressed standard Audio Layer 4) player, a notebook computer, a car computer, a set-top box, an intelligent tv, a wearable device, a navigator, a handheld game console, etc.
The specific structure of the chip module 100 of the present application is described below in a manner that the portion of the chip module 100 for connecting with an external circuit board is disposed on a horizontal plane:
referring to fig. 1, in some embodiments of the chip module 100 of the present invention, the chip module 100 includes:
a substrate 10;
the chip 20 is arranged on one surface of the substrate 10, and is electrically connected with the substrate 10; and
the antenna structure 30, the antenna structure 30 and the chip 20 are located on the same side of the substrate 10, and the antenna structure 30 is electrically connected to the substrate 10 and the chip 20.
In one embodiment, the substrate 10 may be a printed circuit board, and the material thereof may be FR4 epoxy resin board. Or the substrate 10 is a combination of a printed circuit board and a flexible circuit board, and the number of circuit layers can be a single layer, a double layer or a multilayer.
In one embodiment, the chip 20 may be a Quad Flat No-lead package (QFN) type package, one of QFN (Quad Flat No-lead package) and surface mount package (smt) type package. The package is a pin-free package, is square or rectangular, a large-area exposed bonding pad is arranged at the center of the bottom of the package and used for conducting heat, and a conductive bonding pad for realizing electrical connection is arranged around the periphery of the package surrounding the large bonding pad. QFN packages provide excellent electrical performance because they do not have gull-wing leads, as do their fanciful package formats, they have short conductive paths between their inner leads and pads, and low self-inductance and wiring resistance within the package. Therefore, the antenna structure 30 electrically connected with the chip 20 is ensured to have lower grounding inductance, and the signal transmission quality of the antenna structure 30 is improved.
In one embodiment, the antenna structure 30 is a redistribution layer. The Redistribution layer is an RDL layer (Redistribution layer ), and the RDL layer can have a grounding function when bearing high current, and one side bearing low current also has a grounding function, so that the protection against noise interference is improved, and the performance of the device is improved.
The utility model discloses technical scheme is through setting up chip 20 with base plate 10 electric connection at base plate 10 to set up antenna structure 30, again with antenna structure 30 respectively with base plate 10 and chip 20 electric connection, wafer/chip 20(chip) is a miniaturized mode to circuit (mainly including semiconductor equipment, also including passive subassembly etc.) in the electronics, and often makes on the semiconductor wafer surface. These include two types, one is an integrated circuit which is manufactured with a circuit on the surface of the semiconductor chip 20 and is also called a thin-film (thin-film) integrated circuit. Another type of thick-film integrated circuit (thick-film) is a miniaturized circuit formed by a discrete semiconductor device and a passive component integrated on a substrate or a circuit board. The thin film integrated circuit and the miniaturized circuit generally have good grounding design and have the advantage of small grounding inductance. Therefore, after the antenna structure 30 is electrically connected to the chip 20, the ground inductance of the antenna structure 30 can be reduced, and the signal transmission quality of the antenna can be improved.
Referring to fig. 1, in some embodiments of the present application, the antenna structure 30 includes:
the antenna body 31, the antenna body 31 is arranged on the surface of the chip 20 departing from the substrate 10;
a first bonding wire 32, wherein the first bonding wire 32 electrically connects the antenna body 31 and the substrate 10; and
and a second bonding wire 33, wherein the second bonding wire 33 is used for grounding and electrically connecting the antenna body 31 and the chip 20. The process of wire bonding is simple, the cost of the device is low, and the antenna body 31 can be electrically connected to the substrate 10 and the chip 20, so that the chip module 100 can work normally while integrating a plurality of electronic components 50. It is understood that the first bonding wire 32 and the second bonding wire 33 may be made of conductive materials, and specifically, gold, silver, copper, or alloy materials or other metal materials may be used as long as the electrical connection between the components is well ensured. The antenna body 31 is arranged on the surface of the chip 20 away from the substrate 10, so that on one hand, the occupied volume of the chip module 100 in the horizontal direction can be reduced, and more electronic components 50 can be arranged on the chip module 100 in the horizontal direction; on the other hand, since the antenna structure 30 is stacked on the chip 20, when the antenna structure 30 is electrically connected to the chip 20 through the second bonding wire 33, the connection length of the second bonding wire 33 is shortened, so that the signal flow path is shortened, and the quality of signal transmission is improved.
Referring to fig. 1, in some embodiments of the present invention, the antenna body 31 is provided with a first feeding portion 311 and a second feeding portion 312, the first feeding portion 311 and the second feeding portion 312 are both communicated with an internal circuit of the antenna body 31, the substrate 10 is provided with a first bonding pad 11, one end of the first bonding wire 32 is fixedly connected to the first feeding portion 311, and the other end is connected to the first bonding pad 11;
one end of the second bonding wire 33 is connected to the second feeding portion 312, and the other end is fixedly connected to the chip 20. In this embodiment, the first feeding portion 311 and the second feeding portion 312 are electrically connected to the first bonding pad 11, so that the connection area between the two ends of the first bonding wire 32 and the second bonding wire 33 is increased, the stability of bonding wire connection is improved, and the signal transmission quality of the antenna structure 30 is ensured.
In some embodiments of the present invention, the antenna body 31 is formed with a yielding space 313, the chip 20 has a connection end 21, the connection end 21 is exposed in the yielding space 313, at least a portion of the first bonding wire 32 extends into the yielding space 313, and the second feeding portion 312 is electrically connected to the connection end 21. In this embodiment, the abdicating space 313 is provided to expose the connecting end 21, so that the second bonding wire 33 can be provided to electrically connect the connecting end 21 and the substrate 10, the process of the wire bonding connection is simple, the setting cost is low, the connection length of the second bonding wire 33 can be shortened, and the signal transmission distance is increased.
In an embodiment of the present invention, the chip module 100 includes a width direction, and the first feeding portion 311 and the second feeding portion 312 are located on the same side of the width direction. The arrangement makes the first feeding portion 311 and the second feeding portion 312 closer to each other, so that the adjustment of the stations is convenient for manufacturing, and the manufacturing efficiency of the antenna body 31 is improved. In an embodiment, in order to prevent the first feeding portion 311 and the second feeding portion 312 from forming continuous tin during the manufacturing process, a blocking wall transversely crossing between the first feeding portion 311 and the second feeding portion 312 may be provided, so as to prevent the continuous tin.
In an embodiment of the present invention, the chip module 100 further includes an encapsulation layer 40, the encapsulation layer 40 is disposed on the surface of the substrate 10, and covers the antenna body 31, the first bonding wire 32, and the second bonding wire 33. The package layer 40 is disposed to fix the components of the chip module 100 to each other, and to ensure the working stability of the chip module 100 and prevent external interference. Since the bonding wires are suspended, the package layer 40 can further improve the stability of the bonding wires and the stability of the internal circuit of the chip module 100. It is understood that the encapsulation layer 40 is made of an insulating material, so that the internal circuits can be insulated from each other, and the normal operation of the chip module 100 can be ensured.
The chip module 100 further includes a glue layer, the glue layer is disposed between the antenna structure 30 and the chip 20, and the antenna body 31 is fixedly connected to the chip 20. In this embodiment, the chip 20 of the chip module 100 and the antenna structure 30 may be fixedly connected by a glue, so that the structure of the chip module 100 is stable, and the signal transmission stability of the antenna structure 30 is ensured.
In an embodiment of the present invention, the antenna body 31 further includes a matching circuit line, the encapsulation layer 40 exposes at least part of the matching circuit line, the chip module 100 further includes an electronic component 50, the electronic component 50 and the matching circuit line electrically connected. The matching signal line is disposed so that a part of the electronic component 50 can be electrically connected to the antenna body 31, thereby further improving the functionality of the antenna structure 30.
Referring to fig. 1, in some embodiments of the present invention, a plurality of second pads 12 are further disposed on a surface of the substrate 10 away from the chip 20, and the second pads 12 are spaced along an outer edge of the substrate 10. The second pads 12 can increase the connection area between the substrate 10 and an external circuit, thereby facilitating tin-climbing or other processing processes and improving the connection stability between the chip module 100 and the external circuit.
The utility model discloses still provide an electronic equipment, this electronic equipment includes chip module 100, and the concrete structure of this chip module 100 refers to above-mentioned embodiment, because this electronic equipment has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.
The above is only the optional embodiment of the present invention, and not therefore the scope of the present invention is limited, all under the inventive concept, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. A chip module, comprising:
a substrate;
the chip is arranged on one surface of the substrate and is electrically connected with the substrate; and
the antenna structure and the chip are positioned on the same side of the substrate, and the antenna structure is electrically connected with the substrate and the chip.
2. The chip module of claim 1, wherein the antenna structure comprises:
the antenna body is arranged on the surface of the chip, which is far away from the substrate;
the first welding wire electrically connects the antenna body and the substrate; and
and the second welding wire is used for grounding and electrically connecting the antenna body and the chip.
3. The chip module according to claim 2, wherein the antenna body is provided with a first feeding portion and a second feeding portion, the first feeding portion and the second feeding portion are both communicated with an internal circuit of the antenna body, the substrate is provided with a first bonding pad, one end of the first bonding wire is fixedly connected with the first feeding portion, and the other end of the first bonding wire is connected with the first bonding pad;
one end of the second welding wire is connected with the second feed portion, and the other end of the second welding wire is fixedly connected with the chip.
4. The chip module according to claim 3, wherein the antenna body forms an abdicating space, the chip has a connection end exposed in the abdicating space, at least a portion of the first bonding wire extends into the abdicating space and electrically connects the second feeding portion with the connection end.
5. The chip module of claim 3, wherein the chip module is defined to include a width direction, and the first feed portion and the second feed portion are located on a same side of the width direction.
6. The chip module according to any one of claims 2 to 5, further comprising an encapsulation layer disposed on the surface of the substrate and covering the antenna body, the first bonding wires and the second bonding wires.
7. The chip module according to any one of claims 2 to 5, wherein the chip module further comprises a glue layer, the glue layer is disposed between the antenna structure and the chip and fixedly connects the antenna body and the chip.
8. The chip module according to claim 6, wherein the antenna body further comprises a matching circuit line, the encapsulation layer exposes at least a portion of the matching circuit line, and the chip module further comprises an electronic component electrically connected to the matching circuit line.
9. The chip module as recited in claim 6, wherein the material of the encapsulation layer comprises an insulating material;
and/or the material of the first bonding wire and the second bonding wire comprises a conductive material.
10. An electronic device, comprising a chip module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922495952.6U CN210805766U (en) | 2019-12-31 | 2019-12-31 | Chip module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922495952.6U CN210805766U (en) | 2019-12-31 | 2019-12-31 | Chip module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210805766U true CN210805766U (en) | 2020-06-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922495952.6U Active CN210805766U (en) | 2019-12-31 | 2019-12-31 | Chip module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210805766U (en) |
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2019
- 2019-12-31 CN CN201922495952.6U patent/CN210805766U/en active Active
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