CN212062430U

CN212062430U - Chip module and electronic equipment

Info

Publication number: CN212062430U
Application number: CN202020926963.5U
Authority: CN
Inventors: 崔中秋; 沈志杰; 刘路路; 姜迪; 王腾
Original assignee: Suzhou Duogan Technology Co ltd
Current assignee: Suzhou Duogan Technology Co ltd
Priority date: 2020-05-27
Filing date: 2020-05-27
Publication date: 2020-12-01
Anticipated expiration: 2030-05-27

Abstract

The application discloses a chip module and an electronic device, wherein the chip module comprises a BT substrate; the flexible circuit board is positioned above the BT substrate and electrically connected with the BT substrate, and is provided with a first opening; and the chip is arranged in the first opening of the flexible circuit board and is electrically connected with the BT substrate. The whole thickness of the chip module is reduced.

Description

Chip module and electronic equipment

Technical Field

The application relates to the technical field, in particular to a chip module and an electronic device.

Background

Along with the development of applications such as mobile payment, the intelligent degree of terminal products is constantly improved, and the integration level inside mobile terminals such as smart phones is higher and higher, and the requirement on the volume of chip modules in the mobile terminals is also stricter and stricter. While ensuring the functions of the chip module, the terminal system needs a thinner chip module to deal with a smaller and smaller design space inside the terminal.

Traditional chip module that adopts Surface Mounting Technology (SMT) requires not highly to the thickness of finished product, and whole chip module's structure includes the stiffening plate, is fixed in PCB circuit board on stiffening plate surface and paste adorn in the chip on PCB circuit board surface, the whole thickness of module depends on the gross thickness of chip, PCB board, solder and stiffening plate.

In order to satisfy the demand of intelligent terminal to ultra-thin module, need carry out further improvement to current chip module to reduce the thickness of chip module.

SUMMERY OF THE UTILITY MODEL

In view of this, the present application provides a chip module and an electronic device to solve the problem of the conventional chip module having a large thickness.

The application provides a chip module, includes: a BT substrate; the flexible circuit board is positioned above the BT substrate and electrically connected with the BT substrate, and is provided with a first opening; and the chip is arranged in the first opening of the flexible circuit board and is electrically connected with the BT substrate.

Optionally, a pad is formed on the front surface of the chip, a part of the surface of the BT substrate is exposed from the first opening of the flexible circuit board, and the chip is flip-chip bonded to the surface of the BT substrate, so that an electrical connection is formed between the pad and the BT substrate.

Optionally, the flexible circuit board is fixed on the surface of the BT substrate through an adhesive layer.

Optionally, the flexible circuit board and the BT substrate are electrically connected through a conductive structure, and the conductive structure penetrates through the flexible circuit board and the conductive structure of the BT substrate and simultaneously connects the flexible circuit board with an electrical connection line in the BT substrate.

Optionally, the BT substrate has a second opening; the front surface of the chip faces the BT substrate, the middle area of the front surface of the chip is higher than the edge area, the edge area is fixed on the surface of the BT substrate at the edge of the second opening, and the middle area is positioned in the second opening.

Optionally, a pad is formed in an edge region of the front surface of the chip, and the chip is flip-chip bonded to the surface of the BT substrate, so that an electrical connection is formed between the pad and the BT substrate.

Optionally, the pad includes a conductive pillar, or the chip includes any one of a wafer-level chip scale package chip or a ball grid array package chip.

Optionally, the shape of the first opening is the same as the shape of the chip.

The technical scheme of the utility model an electronic equipment is provided, include: a chip module as claimed in any one of the preceding claims.

The utility model discloses a chip module sets up the chip in flexible circuit board's opening, has reduced the whole thickness of chip module. And the BT substrate is used as a supporting structure of the chip module, the chip is arranged on the surface of the BT substrate, mechanical support of the BT substrate is obtained, and meanwhile, more electric signal transmission channels can be built between the BT substrate and the chip. And the flexible circuit board is used for connecting the BT substrate and an external circuit, provides flexible connection for the module and an external element, and has higher flexibility.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of a chip module according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of a chip module according to an embodiment of the present invention;

fig. 3 is a schematic top view of a chip module according to an embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of a chip module according to an embodiment of the present invention.

Detailed Description

As described in the background art, the chip module adopting the SMT technology in the prior art has a large thickness, and cannot meet the requirements of the intelligent terminal on the ultrathin chip module.

Please refer to fig. 1, which is a schematic structural diagram of a chip module. The chip module 10 comprises a BT substrate 11, a BT substrate 12 located on the surface of the flexible circuit board 11, and a chip 14 flip-chip bonded on the surface of the BT substrate 12, wherein the chip 14 is electrically connected with the BT substrate 12 through a solder 13. The BT substrate 12 has a greater stiffness and can provide rigid support instead of a stiffener, and the BT substrate 12 has a greater trace density inside and can provide more signals to the chip 14. In the thickness direction of the chip module, the chip 14, the BT substrate 12, and the flexible circuit board 11 are stacked, and the overall thickness depends on the total thickness of each portion. Although the whole thickness of the chip module can be reduced by adopting the thinner BT substrate, the improvement effect is limited, and the requirement of the current intelligent equipment on the ultrathin chip module can not be met.

On the basis, the inventor provides a novel chip module, and the thickness of the chip module is further reduced. The technical solutions in the embodiments of the present application are clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. The following embodiments and their technical features may be combined with each other without conflict.

Please refer to fig. 2 and fig. 3, which are schematic structural diagrams of a chip module according to an embodiment of the present invention. Wherein fig. 2 is a cross-sectional view; fig. 3 is a schematic top view.

In this embodiment, the chip module 100 includes: BT substrate 101, flexible circuit board 102, and chip 103.

The BT substrate 101 is made of BT resin glass fiber as a main material, and is made of Bismaleimide (BMI) and triazine as main resin components, and epoxy resin, polyphenylene ether resin (PPE), allyl compound, or the like is added as a modification component, so that the formed thermosetting resin has high heat resistance and a low thermal expansion coefficient at high temperature, and can ensure that the warping degree of the whole chip module is small, and provide stable and reliable mechanical strength support for the whole chip module. The BT substrate 101 has an electrical connection line inside and an electrical connection terminal on the surface as a connection point between the internal electrical connection line and an external circuit.

The flexible circuit board 102 is located above the BT substrate 101, and an electrical connection is formed between the flexible circuit board 102 and the BT substrate 101, so that an electrical connection is formed between an electrical connection line inside the BT substrate 101 and an electrical connection line of the flexible circuit board 102, so as to perform electrical signal transmission between the flexible circuit board 102 and the BT substrate 101.

In this embodiment, the flexible circuit board 102 is directly fixed on the surface of the BT substrate 101, and the flexible circuit board 102 and the BT substrate 101 are fixed by an adhesive layer. An opening 1021 in the flexible circuit board 102 exposes a portion of the surface and electrical connection end of the BT substrate 101. The adhesive layer is made of an insulating material.

The flexible circuit board 102 and the BT substrate 101 may be electrically connected by a conductive structure. Specifically, the conductive structure penetrates through the flexible circuit board 102 and the BT substrate 101, and the conductive structure simultaneously connects the electrical connection lines in the flexible circuit board 102 and the BT substrate 101, so as to realize the electrical connection between the flexible circuit board 102 and the BT substrate 101.

The chip 103 is disposed in the opening 1021 of the flexible circuit board 102, and is electrically connected to the BT substrate 101. The chip 103 is located in the opening 1021, generally, the thickness of the chip 103 is greater than that of the flexible circuit board 102, and the chip 103 is located in the opening 1021, so that the flexible circuit board 102 no longer occupies the entire thickness of the chip module 100. The chip 103 may be a chip with various functions. In some embodiments, the chip 103 is a sensing chip, including an image sensing chip, a pressure sensing chip, and the like; in some embodiments, the chip 103 may also be a processor chip, such as an ISP chip, a DSP chip, or a CPU chip.

And taking the surface of one side on which the bonding pads are formed as the front surface of the chip 103, wherein the front surface of the chip 103 faces the BT substrate 101, the chip is flip-chip bonded on the surface of the BT substrate 101, and the bonding pads on the surface of the chip 103 are electrically connected with the electrical connection ends on the surface of the BT substrate 101. Specifically, the pad on the surface of the chip 103 is soldered to the electrical connection end surface on the surface of the BT substrate 101 by solder 1031. The bonding pad of the chip 103 may have a conductive bump (bump) structure; alternatively, the chip 103 may be a WLCSP (wafer level chip scale package) packaged chip, or a conventional BGA (ball grid array) packaged chip, which can be fixed to the surface of the BT substrate 101 by flip-chip bonding.

Since the width and pitch of the electrical connection lines in the BT substrate 101 are small, for example, about 20 μm, the routing density per unit area is higher than that of the conventional flexible circuit board and hard circuit board. When the chip 103 is directly connected to the BT substrate 101, the BT substrate 101 can provide a larger number of signals to the chip 103, so that a high-performance chip, such as an Application (AP) chip, having a higher requirement on the number of signals can be adapted. Furthermore, the BT substrate 101 has high strength and can provide a good rigid support function for the chip 103.

The BT substrate 101 and the flexible circuit board 102 are electrically connected, and electrical signal transmission is formed between the flexible circuit board 102 and other electronic components outside the chip module. Due to the flexible characteristic of the flexible circuit board 102, connection with other electronic components can be formed through more connection modes, and installation in electronic equipment with different spatial layouts is facilitated.

The shape of the opening 1021 is the same as the shape of the chip 103. In this embodiment, the chip 103 is rectangular, the opening 1021 is also rectangular, and distances between positions at the edge of the chip 103 and positions at the edge of the opening 1021 are the same, so that uniformity of stress distribution at the positions of the chip module can be improved, and reliability of the chip module structure can be improved. In other embodiments, the shape of the opening 1021 may be different from the shape of the chip 103. The size of the opening 1021 is slightly larger than that of the chip 103 to accommodate the chip 103, and the size of the opening 1021 may be designed reasonably according to the requirement, which is not limited herein.

In summary, in the chip module in the above embodiments, the chip is disposed in the opening of the flexible circuit board, so that the overall thickness of the chip module is reduced. And the BT substrate is used as a supporting structure of the chip module, the chip is arranged on the surface of the BT substrate, mechanical support of the BT substrate is obtained, and meanwhile, more electric signal transmission channels can be built between the BT substrate and the chip. And the flexible circuit board is used for connecting the BT substrate and an external circuit, provides flexible connection for the module and an external element, and has higher flexibility.

Please refer to fig. 4, which is a schematic structural diagram of a chip module according to another embodiment of the present invention.

In this embodiment, the chip module 300 includes: chip 303, flexible circuit board 302, and BT substrate 301. The flexible circuit board 302 has a first opening 3021, and the BT substrate has a second opening 3011.

The middle region of the front surface of the chip 303 is higher than the edge region, and the bonding pad of the front surface of the chip 303 is formed in the edge region. The front surface of the chip 303 faces the BT substrate 301, and is located in the first opening 3021, the middle region of the front surface of the chip 303 is located in the second opening 3011, and the edge region of the front surface of the chip 303 is fixed to the surface of the BT substrate 301 at the edge of the second opening 3011. The chip 303 is flip-chip bonded to the surface of the BT substrate 301, and the pads and the BT substrate 301 are fixed by solder 3031 to form an electrical connection.

The size of the second opening 3011 is smaller than the size of the chip 303 and slightly larger than the size of the central region of the front surface of the chip 202, so that the edge of the chip 303 can be fixed to the surface of the BT substrate 301, and the chip 303 is suspended. Moreover, since the second opening 3011 has a small size, the BT substrate 301 can still provide a good rigid mechanical support, so that the whole chip module structure can still be kept stable.

Since a part of the thickness of the chip 303 is further located in the second opening 3011, the overall thickness of the whole chip module can be further reduced.

In other specific embodiments, other substrates, such as a circuit board or a supporting board, may also be disposed below the BT substrate or between the flexible circuit board and the BT substrate. Openings for accommodating chips can also be correspondingly arranged in the substrate.

An embodiment of the utility model also provides an electronic equipment, including the chip module in the above-mentioned embodiment. The electronic equipment can be mobile terminals such as mobile phones and tablet computers, and can also be wearable equipment such as bracelets and smart watches. Because the thickness of the chip module is smaller, the occupied internal space of the electronic equipment is smaller, the space layout of internal devices of the electronic equipment is facilitated, and the overall thickness of the electronic equipment is reduced.

That is, the above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all equivalent structures or equivalent flow transformations made by using the contents of the specification and the drawings, such as mutual combination of technical features between various embodiments, or direct or indirect application to other related technical fields, are included in the scope of the present application.

Claims

1. A chip module, comprising:

a BT substrate;

the flexible circuit board is positioned above the BT substrate and electrically connected with the BT substrate, and is provided with a first opening;

and the chip is arranged in the first opening of the flexible circuit board and is electrically connected with the BT substrate.

2. The chip module according to claim 1, wherein the front surface of the chip is formed with a pad, the first opening of the flexible circuit board exposes a portion of the surface of the BT substrate, and the chip is flip-chip bonded to the surface of the BT substrate to form an electrical connection with the BT substrate through the pad.

3. The chip module according to claim 1, wherein the flexible circuit board is fixed on the BT substrate surface by an adhesive layer.

4. The chip module according to claim 1, wherein the flexible circuit board and the BT substrate are electrically connected by a conductive structure, the conductive structure penetrates through the flexible circuit board and the conductive structure of the BT substrate, and simultaneously connects the flexible circuit board with an electrical connection line in the BT substrate.

5. The chip module according to claim 1, wherein the BT substrate has a second opening; the front surface of the chip faces the BT substrate, the middle area of the front surface of the chip is higher than the edge area, the edge area is fixed on the surface of the BT substrate at the edge of the second opening, and the middle area is positioned in the second opening.

6. The chip module according to claim 5, wherein a pad is formed in an edge region of the front surface of the chip, and the chip is flip-chip bonded to the surface of the BT substrate, so that an electrical connection is formed between the pad and the BT substrate.

7. The chip module according to claim 2 or 6, wherein the bonding pad comprises a conductive post; or the chip comprises any one of a wafer level chip scale package chip or a ball grid array package chip.

8. The chip module according to claim 1, wherein the first opening has a shape identical to a shape of the chip.

9. An electronic device, comprising:

the chip module according to one of claims 1 to 8.