CN216795350U - Multilayer printed PCB circuit board capable of rapidly radiating - Google Patents

Abstract

The utility model discloses a multilayer printed PCB (printed Circuit Board) capable of quickly dissipating heat, which comprises a substrate, wherein a top plate is arranged at the upper part of the substrate, a bottom plate is arranged at the bottom of the substrate, an opening is formed in the upper surface of the top plate, a heat dissipation structure is arranged among the substrate, the top plate and the bottom plate, the heat dissipation structure comprises a first groove, a second groove, a first heat conduction strip and a second heat conduction strip, the first groove is formed in the upper surface of the substrate, the second groove is formed in the lower surface of the substrate, the first heat conduction strip is arranged in the first groove, and the second heat conduction strip is arranged in the second groove. The multilayer printed PCB capable of quickly dissipating heat effectively improves the heat dissipation performance of the PCB in the use process, has an excellent heat conduction effect, enables heat energy to be dissipated more quickly, and prolongs the service life of the PCB.

Description

Multilayer printed PCB circuit board capable of rapidly radiating

Technical Field

The utility model relates to the field of PCB (printed circuit board), in particular to a multilayer printed PCB (printed circuit board) capable of quickly dissipating heat.

Background

The PCB circuit board is also called as a printed circuit board, a support body of an electronic component, plays a role in connecting the electronic component in an electrifying way, and is widely applied to various electronic products, such as intelligent lamps, computers, mobile phones and the like;

however, certain disadvantages exist in the existing multilayer printed PCB during use, and need to be improved, because the PCB needs to bear a plurality of electronic components, each electronic component can generate heat energy during operation, part of the heat energy is dissipated through air, and part of the heat energy is transferred to the PCB, so that the PCB is overheated, and the existing PCB has poor heat dissipation performance, and the heat energy is diffused completely by heat conduction of the material of the PCB, so that the service life of the PCB is easy to be reduced due to overheating.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide a multilayer printed PCB capable of quickly radiating heat, which can effectively solve the problems in the background technology that: the PCB circuit board needs to bear a plurality of electronic components, each electronic component can generate heat energy when working, partial heat energy is radiated through air, partial heat energy is transmitted to the PCB circuit board, the PCB circuit board is overheated, the existing PCB circuit board has poor heat radiation performance, heat energy is diffused completely by heat conduction of materials of the PCB circuit board, and the service life of the PCB circuit board is easy to reduce due to overheating.

In order to achieve the purpose, the utility model adopts the technical scheme that:

the utility model provides a multilayer printed PCB circuit board that can dispel heat fast, includes the base plate, the top plate is installed on the upper portion of base plate, the bottom plate is installed to the bottom of base plate, the trompil has been seted up to the upper surface of top plate, be equipped with heat radiation structure between base plate and top plate and the bottom plate.

As a further scheme of the present invention, the heat dissipation structure includes a first groove, a second groove, a first heat conduction strip, and a second heat conduction strip, the first groove is formed on the upper surface of the substrate, the second groove is formed on the lower surface of the substrate, the first heat conduction strip is installed inside the first groove, and the second heat conduction strip is installed inside the second groove.

As a further aspect of the present invention, the shapes of the first groove, the second groove, the first heat conduction strip, and the second heat conduction strip are all semicircular, and the number of the first groove, the second groove, the first heat conduction strip, and the second heat conduction strip is eight.

As a further scheme of the utility model, the upper surface of the substrate is provided with a heat-clearing groove, and the heat-clearing groove vertically corresponds to the opening.

As a further scheme of the utility model, the heat-clearing grooves and the first grooves are arranged in a T shape, and two ends of each heat-clearing groove are communicated with two adjacent first grooves.

As a further aspect of the present invention, a overheating groove is formed in a central position of an outer surface of the second heat conduction strip, and a diameter of the overheating groove is 1/8 of a diameter of the second heat conduction strip.

Compared with the prior art, the utility model has the following beneficial effects: according to the PCB heat dissipation structure, the heat dissipation structure is arranged, so that the electronic components generate heat energy, part of the heat energy is transmitted to the substrate through the top plate, the heat energy is transmitted to the air through the first heat conduction strips and the second heat conduction strips in the first grooves and the second grooves, and the heat energy exchanges heat with the normal-temperature air in the air, so that the PCB circuit board is cooled and dissipated, the heat dissipation effect of the PCB circuit board is effectively improved, and the service life of the PCB circuit board is prolonged;

through setting up the groove of clearing heat and cooperating the groove of overheating, the trompil can get into the outside air to dispel the heat for first heat conduction strip, and the groove of overheating of second heat conduction strip surface is the vacuole formation between second heat conduction strip and the base plate, makes the heat can give off fast, further increases the heat conductivility of PCB circuit board.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a multilayer PCB capable of dissipating heat rapidly according to the present invention;

FIG. 2 is an exploded view of a multi-layer PCB board with fast heat dissipation according to the present invention;

fig. 3 is an enlarged view of a second heat-conducting strip of a multi-layer PCB capable of dissipating heat rapidly according to the present invention.

In the figure: 1. a substrate; 2. a top layer plate; 3. a bottom layer plate; 4. opening a hole; 5. a heat dissipation structure; 6. a first groove; 7. a second groove; 8. a first heat conducting strip; 9. a second heat conducting strip; 10. a heat-clearing groove; 11. and (4) overheating the tank.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

As shown in fig. 1-3, a multilayer printed PCB circuit board capable of fast heat dissipation includes a substrate 1, a top plate 2 mounted on the upper portion of the substrate 1, a bottom plate 3 mounted on the bottom of the substrate 1, a hole 4 formed on the upper surface of the top plate 2, and a heat dissipation structure 5 disposed between the substrate 1 and the top plate 2 and the bottom plate 3.

In this embodiment, in order to solve the problem of poor heat dissipation of the conventional PCB, the heat dissipation structure 5 is provided, where the heat dissipation structure 5 includes a first groove 6, a second groove 7, a first heat conduction strip 8 and a second heat conduction strip 9, the first groove 6 is disposed on the upper surface of the substrate 1, the second groove 7 is disposed on the lower surface of the substrate 1, the first heat conduction strip 8 is installed inside the first groove 6, and the second heat conduction strip 9 is installed inside the second groove 7, so as to effectively improve the heat dissipation performance of the PCB and prolong the service life of the PCB.

In addition, the shapes of the first groove 6, the second groove 7, the first heat conduction strip 8 and the second heat conduction strip 9 are all semicircular, and the number of the first groove 6, the second groove 7, the first heat conduction strip 8 and the second heat conduction strip 9 is eight.

In this embodiment, the upper surface of the substrate 1 is provided with the heat dissipation groove 10, the heat dissipation groove 10 vertically corresponds to the opening 4, and the heat dissipation groove 10 can be matched with the opening 4 to sufficiently dissipate heat for the electronic component mounted on the opening 4, so that the heat dissipation performance is further improved.

In addition, the heat-clearing grooves 10 and the first grooves 6 are arranged in a T shape, and two ends of each heat-clearing groove 10 are communicated with two adjacent first grooves 6.

In this embodiment, the overheating groove 11 has been seted up to the surface central point of second heat conduction strip 9, and the diameter of overheating groove 11 is 1/8 of second heat conduction strip 9 diameter, and overheating groove 11 is the cavity that forms between second heat conduction strip 9 and the base plate 1 for the heat can give off fast.

When the multilayer printed PCB capable of quickly dissipating heat is used, electronic components are mounted on the upper portion of the top plate 2 in a welding or screw mode, then the whole PCB is mounted on an external device, in the using process, the electronic components generate heat energy, part of the heat energy is transmitted to the substrate 1 through the top plate 2, the heat energy is transmitted to the air through the first heat conduction strips 8 and the second heat conduction strips 9 in the first grooves 6 and the second grooves 7 and exchanges heat with normal-temperature air in the air, so that the PCB is cooled and dissipated, meanwhile, the open holes 4 can enter the outside air to dissipate heat for the first heat conduction strips 8, and the overheating grooves 11 on the outer surfaces of the second heat conduction strips 9 form cavities between the second heat conduction strips 9 and the substrate 1, so that the heat can be dissipated quickly.

According to the utility model, the heat dissipation structure 5 is arranged, the electronic component generates heat energy, part of the heat energy is transmitted to the substrate 1 through the top plate 2, and the heat energy is transmitted to the air through the first heat conduction strips 8 and the second heat conduction strips 9 in the first grooves 6 and the second grooves 7 and exchanges heat with the normal temperature air in the air, so that the PCB circuit board is cooled and dissipated, the heat dissipation effect of the PCB circuit board is effectively improved, and the service life of the PCB circuit board is prolonged; through setting up heat dispersing groove 10 cooperation overheat groove 11, trompil 4 can get into the outside air to dispel the heat for first heat conduction strip 8, and overheat groove 11 of 9 surfaces of second heat conduction strip is vacuole formation between second heat conduction strip 9 and the base plate 1, makes the heat can give off fast, further increases the heat conductivility of PCB circuit board.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (5)

1. The utility model provides a multilayer printed PCB circuit board that can dispel heat fast which characterized in that: including base plate (1), top plate (2) are installed on the upper portion of base plate (1), bottom plate (3) are installed to the bottom of base plate (1), trompil (4) have been seted up to the upper surface of top plate (2), be equipped with heat radiation structure (5) between base plate (1) and top plate (2) and bottom plate (3), heat radiation structure (5) are including first recess (6), second recess (7), first heat conduction strip (8) and second heat conduction strip (9), the upper surface in base plate (1) is seted up in first recess (6), the lower surface in base plate (1) is seted up in second recess (7), the inside in first recess (6) is installed in first heat conduction strip (8), the inside in second recess (7) is installed in second heat conduction strip (9).

2. The multilayer printed PCB circuit board capable of rapidly dissipating heat of claim 1, wherein: the shape of the first groove (6), the second groove (7), the first heat conduction strip (8) and the second heat conduction strip (9) is semicircular, and the number of the first groove (6), the second groove (7), the first heat conduction strip (8) and the second heat conduction strip (9) is eight.

3. The multilayer printed PCB circuit board capable of rapidly dissipating heat of claim 1, wherein: the upper surface of the substrate (1) is provided with a heat-clearing groove (10), and the heat-clearing groove (10) vertically corresponds to the opening (4).

4. A multi-layer printed PCB circuit board capable of dissipating heat rapidly according to claim 3, wherein: the heat-clearing grooves (10) and the first grooves (6) are arranged in a T shape, and two ends of each heat-clearing groove (10) are communicated with the two adjacent first grooves (6).

5. The multilayer printed PCB circuit board capable of rapidly dissipating heat of claim 1, wherein: the central position of the outer surface of the second heat conduction strip (9) is provided with a overheating groove (11), and the diameter of the overheating groove (11) is 1/8 of the diameter of the second heat conduction strip (9).

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