CN210327283U - Refrigeration structure for high-speed motor - Google Patents
Refrigeration structure for high-speed motor Download PDFInfo
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- CN210327283U CN210327283U CN201921438554.4U CN201921438554U CN210327283U CN 210327283 U CN210327283 U CN 210327283U CN 201921438554 U CN201921438554 U CN 201921438554U CN 210327283 U CN210327283 U CN 210327283U
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- radiating
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims description 21
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 25
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model provides a refrigeration structure for high-speed motor, include: the semiconductor refrigerating sheet is provided with a front surface and a back surface; the front side is a cold end and is used for being attached to a shell of the high-speed motor, and the back side is a hot end; one surface of the radiating fin is connected with the reverse surface of the semiconductor refrigerating fin, the other surface of the radiating fin is provided with a plurality of arc-shaped radiating fins, and a radiating channel is formed between every two adjacent radiating fins; the fan is connected to the middle position of the radiating fin, and an inlet is communicated with the radiating channel; the refrigeration structure of the utility model can rapidly transfer the heat generated by the high-speed motor out of the motor shell through the semiconductor refrigeration sheet, and then the heat is dissipated to the outside through the fan; and the heat dissipation channel formed by the arc-shaped heat dissipation fins can enable wind flowing at the hot end of the semiconductor refrigeration sheet to be turbine-shaped, so that the flow speed of the wind is improved, the heat dissipation efficiency is improved, and the heat dissipation efficiency of the motor is further improved.
Description
Technical Field
The utility model relates to a motor heat dissipation equipment technical field, concretely relates to refrigeration structure for high-speed motor.
Background
High speed motors are generally motors with a rotational speed of more than 10000 r/min. Because of high rotating speed, the motor has high power density and much smaller volume than a motor with ordinary power, thereby effectively saving materials. Nowadays, as the mechanical industry develops faster and faster, the rotating speed of the high-speed motor is gradually increased, and the generated heat is larger and larger during work.
The existing motor heat dissipation modes comprise forced air cooling and water cooling. The forced air cooling heat dissipation mode is convenient to use, but the heat dissipation efficiency is not high; the water-cooling heat dissipation mode has better cooling effect, is suitable for the heavy-load work of the motor, but has higher use cost and is inconvenient.
Therefore, a new heat dissipation structure different from the conventional heat dissipation structure is required to be designed for heat dissipation of a high-speed motor, especially for the high-speed motor applied in a vacuum environment.
SUMMERY OF THE UTILITY MODEL
Therefore, the to-be-solved technical problem of the utility model lies in overcoming the high-speed motor under being applied to vacuum environment among the prior art, does not have suitable heat radiation structure's defect to a refrigeration structure for high-speed motor that has compromise radiating effect and convenience of use is provided.
In order to solve the technical problem, the utility model provides a refrigeration structure for high-speed motor, include:
the semiconductor refrigerating sheet is provided with a front surface and a back surface; the front side is a cold end and is used for being attached to a shell of the high-speed motor, and the back side is a hot end;
one surface of the radiating fin is connected with the reverse surface of the semiconductor refrigerating fin, the other surface of the radiating fin is provided with a plurality of arc-shaped radiating fins, and a radiating channel is formed between every two adjacent radiating fins;
and the fan is connected to the middle position of the radiating fin, and an inlet is communicated with the radiating channel.
Preferably, the fan is embedded in the heat dissipation fin with a space between the inlet and the heat dissipation fin.
Preferably, the outlet of the fan is flush with the heat dissipation fins.
As a preferred scheme, the semiconductor refrigeration piece is of a rectangular structure.
As a preferable scheme, heat-conducting silicone grease is arranged between the semiconductor refrigeration sheet and the radiating sheet.
As a preferable scheme, a heat insulation gasket is arranged on the outer ring of the side wall of the semiconductor refrigeration sheet.
Preferably, the heat insulating gasket completely covers the heat sink.
Preferably, the heat insulating gasket and the heat radiating fin are both circular.
The utility model discloses technical scheme has following advantage:
1. the refrigeration structure provided by the utility model can rapidly transfer the heat generated by the high-speed motor out of the motor shell through the semiconductor refrigeration sheet, and then the heat is dissipated to the outside through the fan; and the heat dissipation channel formed by the arc-shaped heat dissipation fins can enable wind flowing at the hot end of the semiconductor refrigeration sheet to be turbine-shaped, so that the flow speed of the wind is improved, the heat dissipation efficiency is improved, and the heat dissipation efficiency of the motor is further improved.
2. The utility model provides a refrigeration structure, the thermal-insulated packing ring that sets up in the lateral wall outer lane of semiconductor refrigeration piece can completely cut off the hot junction and the cold junction of semiconductor refrigeration piece to avoid the temperature in hot junction to flow the cold junction, guarantee the refrigeration effect of semiconductor refrigeration piece.
3. The utility model provides a refrigeration structure, thermal-insulated packing ring covers on the fin completely to can completely cut off between fin and motor casing, on avoiding the temperature on the fin to transmit motor casing, guarantee the radiating effect of motor.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic perspective view of a refrigeration structure according to an embodiment of the present invention.
Fig. 2 is a schematic rear perspective view of fig. 1.
Fig. 3 is a schematic perspective view of a portion of a heat sink hidden therein.
Description of reference numerals:
1. a fan; 2. heat dissipation fins; 3. a heat sink; 4. a semiconductor refrigeration sheet; 5. a heat insulating gasket.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
The present embodiment provides a specific implementation of a refrigeration structure, as shown in fig. 1 and fig. 2, including: fan 1, heat radiation fin 2, heat radiation fin 3 and semiconductor refrigeration piece 4. The fan 1 adopts an axial flow fan 1 and is embedded in the heat dissipation fins 2, the outlet of the fan 1 is flush with the outer edges of the heat dissipation fins 2, and the inlet is spaced from the heat dissipation fins 3. The heat dissipation fins 2 are arc-shaped and have a plurality of pieces, and form a scroll shape around the fan 1. The radiating fin 3 is attached to the other edge of the radiating fin 2, and the other surface of the radiating fin 3 is connected with the hot end of the semiconductor refrigerating fin 4 through heat-conducting silicone grease. The cold end of the semiconductor refrigeration sheet 4 is used for being attached to the shell of the high-speed motor.
As shown in fig. 2, a heat insulating gasket 5 is arranged around the side wall of the outer ring of the semiconductor refrigeration sheet 4, and the heat radiating sheet 3 is completely covered by the heat insulating gasket 5, so that the hot end and the cold end of the semiconductor refrigeration sheet 4 are isolated, the heat radiating sheet 3 and the high-speed motor are isolated, and the heat radiating effect of the high-speed motor is ensured.
As shown in fig. 3, the space between the inlet of the fan 1 and the heat sink 3 is used for the external air to enter the fan 1 from the space. And, by the action of the heat radiation fins 2, the wind at the interval flows like a turbine, so that the wind speed is higher.
The cooling fin 3 and the heat insulation gasket 5 are both circular and correspond to the shape of the end part of the shell of the high-speed motor, and the cooling structure and the high-speed motor can form a whole with a regular shape after being arranged on the high-speed motor.
The semiconductor refrigerating plate 4 is a cooling device composed of semiconductors, and when direct current passes through a couple formed by connecting two different semiconductor materials in series, the aim of refrigeration can be achieved by absorbing heat and releasing heat at two ends of the couple respectively by using the Peltier effect of the semiconductor materials.
In principle, the semiconductor cooling plate 4 is a heat transfer means. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end.
The fan 1 and the radiating fins 3 mainly function to radiate heat from the hot end of the semiconductor refrigerating fin 4. The temperature difference between the cold end and the hot end of the semiconductor refrigerating sheet 4 can reach 40-65 degrees, and if the temperature of the hot end is reduced in an active heat dissipation mode, the temperature of the cold end can be correspondingly reduced, so that the lower temperature is reached.
As an alternative, the fan 1 may be a centrifugal fan 1, with the inlet aligned with the outer edge of the cooling fins 2 and the outlet aligned with the cooling channel formed by the cooling fins 2. When the fan 1 is started, air enters the fan 1 from the inlet and impacts the heat sink 3, and then flows out toward the heat sink channel under the action of centrifugal force, so that heat on the heat sink 3 is taken away.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.
Claims (8)
1. Refrigeration structure for a high-speed electric motor, characterized in that it comprises:
the semiconductor refrigeration piece (4) is provided with a front surface and a back surface; the front side is a cold end and is used for being attached to a shell of the high-speed motor, and the back side is a hot end;
one surface of the radiating fin (3) is connected with the reverse surface of the semiconductor refrigerating fin (4), the other surface is provided with a plurality of arc-shaped radiating fins (2), and a radiating channel is formed between every two adjacent radiating fins (2);
and the fan (1) is connected to the middle position of the radiating fin (2), and an inlet is communicated with the radiating channel.
2. A cooling structure, as in claim 1, characterized in that the fan (1) is embedded in the cooling fin (2) with a spacing between its inlet and the cooling fin (3).
3. A cooling structure according to claim 2, characterized in that the outlet of the fan (1) is flush with the radiator fin (2).
4. A cooling structure, according to claim 1, characterized in that said semiconductor chilling plates (4) are of rectangular configuration.
5. A cooling structure according to claim 1, characterized in that a heat-conducting silicone grease is provided between the semiconductor cooling fins (4) and the heat sink (3).
6. A cooling structure according to claim 1, characterized in that the side wall of the semiconductor cooling plate (4) is provided with a heat insulating gasket (5) on the outside.
7. A cold structure according to claim 6, wherein the insulating gasket (5) completely covers the fins (3).
8. A cold structure according to claim 7, wherein the insulating gasket (5) and the fins (3) are both circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921438554.4U CN210327283U (en) | 2019-08-30 | 2019-08-30 | Refrigeration structure for high-speed motor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921438554.4U CN210327283U (en) | 2019-08-30 | 2019-08-30 | Refrigeration structure for high-speed motor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210327283U true CN210327283U (en) | 2020-04-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921438554.4U Active CN210327283U (en) | 2019-08-30 | 2019-08-30 | Refrigeration structure for high-speed motor |
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| CN (1) | CN210327283U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112333992A (en) * | 2020-11-23 | 2021-02-05 | Oppo广东移动通信有限公司 | Electronic device |
| CN113364205A (en) * | 2021-07-02 | 2021-09-07 | 湖北欧阳华俊专用汽车有限公司 | Quick radiating electricity generation dolly |
-
2019
- 2019-08-30 CN CN201921438554.4U patent/CN210327283U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112333992A (en) * | 2020-11-23 | 2021-02-05 | Oppo广东移动通信有限公司 | Electronic device |
| CN112333992B (en) * | 2020-11-23 | 2023-07-14 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN113364205A (en) * | 2021-07-02 | 2021-09-07 | 湖北欧阳华俊专用汽车有限公司 | Quick radiating electricity generation dolly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210330 Address after: Room 820, 8th Floor, Building 1, 13 Guocheng Road, Shunqing District, Nanchong City, Sichuan Province Patentee after: Zhongke Jiuwei Technology Co.,Ltd. Address before: 637000 Duofu Industrial Park, Xichong County, Nanchong City, Sichuan Province Patentee before: SICHUAN JIUTIAN VACUUM TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: Room 820, 8th Floor, Building 1, 13 Guocheng Road, Shunqing District, Nanchong City, Sichuan Province Patentee after: Zhongke Jiuwei Technology Co.,Ltd. Country or region after: China Address before: Room 820, 8th Floor, Building 1, 13 Guocheng Road, Shunqing District, Nanchong City, Sichuan Province Patentee before: Zhongke Jiuwei Technology Co.,Ltd. Country or region before: China |
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| CP03 | Change of name, title or address |