CN216700755U

CN216700755U - Heat radiation fin and radiator

Info

Publication number: CN216700755U
Application number: CN202122809639.2U
Authority: CN
Inventors: 单景华
Original assignee: Shenzhen Yuandesheng Digital Technology Co ltd
Current assignee: Shenzhen Yuandesheng Digital Technology Co ltd
Priority date: 2021-11-16
Filing date: 2021-11-16
Publication date: 2022-06-07
Anticipated expiration: 2031-11-16

Abstract

The utility model relates to the technical field of radiators, in particular to a radiating fin and a radiator. Compared with the prior art that the extension lengths of all the radiating fins are consistent, the radiating area and the radiating volume of the radiating fin positioned in the first radiating area are larger, and the radiating efficiency of the radiating fin is improved. The radiating fin of the utility model increases the radiating area by prolonging the radiating fins in the limited radiating space, so the internal space of the radiator can be more fully utilized, therefore, the radiator carrying the radiating fin of the utility model has higher radiating efficiency and excellent user experience.

Description

Heat radiation fin and radiator

Technical Field

The utility model relates to the field of radiators, in particular to a radiating fin and a radiator.

Background

In order to accelerate the heat dissipation of electronic products, heat sinks capable of being mounted on the electronic products are available in the market.

However, the heat dissipation area of the heat dissipation fins inside the existing heat sink is small, and the heat dissipation fins cannot fully utilize the internal space of the heat sink, so that the heat dissipation efficiency is low.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the embodiments of the present invention is to provide a heat sink and a heat sink, so as to solve the problem of low heat dissipation efficiency caused by the fact that the heat sink has a small heat dissipation area and the heat sink cannot fully utilize the internal space of the heat sink.

In a first aspect, an embodiment of the present invention provides a heat dissipation fin, including: the radiating fins are arranged around the same circle center so as to form a fin ring, extend towards the direction far away from the circle center, and are mutually spaced so as to form a radiating flow channel between any two radiating fins; the fin ring is provided with a first heat dissipation area and a second heat dissipation area which are sequentially arranged along the circumferential direction of the fin ring, and the extension length of the heat dissipation sheet located in the first heat dissipation area is greater than that of the heat dissipation sheet located in the second heat dissipation area.

Furthermore, the fin ring is also provided with a third heat dissipation area and a fourth heat dissipation area which are sequentially arranged along the circumferential direction of the fin ring, and the first heat dissipation area, the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area are sequentially connected end to end; the first heat dissipation area and the third heat dissipation area are arranged oppositely, and the extension length of the heat dissipation fins positioned in the first heat dissipation area and the third heat dissipation area is greater than that of the heat dissipation fins positioned in the second heat dissipation area and the fourth heat dissipation area.

Furthermore, the first heat dissipation area is provided with a head area, a middle area and a tail area which are sequentially arranged along the circumferential direction of the fin ring, the extension lengths of the heat dissipation fins positioned in the head area and the tail area are greater than the extension length of the heat dissipation fins positioned in the middle area, and a clearance gap is formed on one side, away from the circle center, of the heat dissipation fins positioned in the middle area.

Further, still include coupling assembling, it includes the go-between, the go-between connect to be located first radiating area, the second radiating area, the third radiating area with the fin in fourth radiating area, and be located the side of heat dissipation runner.

Further, the connection assembly further includes: the first connecting rib is connected to one side of the radiating fin positioned in the first radiating area, is arranged at an interval with the connecting ring, and is positioned in the direction of the connecting ring away from the circle center; and the second connecting ribs are connected to the heat dissipation fins positioned in the third heat dissipation area, arranged at intervals with the connecting ring and positioned in the direction in which the connecting ring is far away from the circle center.

Further, the first connecting rib and the second connecting rib are arranged at intervals with the connecting ring, so that air outlets communicated with the heat dissipation flow channel are formed between the first connecting rib and the connecting ring and between the second connecting rib and the connecting ring.

In a second aspect, an embodiment of the present invention further provides a heat sink, including: a housing; a heat sink assembly including heat fins mounted inside the housing, the heat fins being the heat fins of the first aspect; and the mounting component is connected with the shell and is used for installing an external electronic product on one side of the shell.

Furthermore, the heat dissipation assembly further comprises a rectangular heat conducting fin, the heat dissipation fins are connected with the rectangular heat conducting fin, and the heat dissipation fins located in the first heat dissipation area are arranged in the length direction of the rectangular heat conducting fin.

Further, the heat dissipation assembly further includes: the semiconductor refrigeration piece is arranged in the shell and comprises a heat absorption surface and a heat release surface which are arranged in a reverse manner, and the heat release surface is connected with one surface of the rectangular heat conduction piece, which is back to the heat dissipation fins; and the heat conducting fins are arranged on the shell, one surface of each heat conducting fin is exposed out of the shell, and the other surface of each heat conducting fin is connected with the heat absorbing surface.

Furthermore, through holes are formed in the other side of the shell and the peripheral surface adjacent to the other side of the shell.

The utility model has the beneficial effects that: compared with the prior art that the extension lengths of all the radiating fins are consistent as shown in the attached drawing 4, the radiating area and the radiating volume of the radiating fin positioned in the first radiating area are larger, and the radiating efficiency of the radiating fin is improved. The radiating fin of the utility model increases the radiating area by prolonging the radiating fins in the limited radiating space, so the internal space of the radiator can be more fully utilized, therefore, the radiator carrying the radiating fin of the utility model has higher radiating efficiency and excellent user experience.

Drawings

The following detailed description of embodiments of the utility model will be made with reference to the accompanying drawings and examples, in which:

fig. 1 is a schematic structural diagram of a heat dissipation fin according to an embodiment of the present invention;

fig. 2 is a schematic structural view of the heat sink fin shown in fig. 1 at another angle;

fig. 3 is a schematic view of another angle of the heat sink shown in fig. 1;

fig. 4 is a schematic structural view of a prior art heat sink fin;

FIG. 5 is a schematic structural diagram of a portion of a heat sink provided in an embodiment of the present invention;

FIG. 6 is a schematic view of a portion of the A position of FIG. 1;

fig. 7 is a schematic structural diagram of a heat sink provided in an embodiment of the present invention;

FIG. 8 is an exploded view of a heat sink provided by an embodiment of the present invention;

the figures are numbered:

1. heat dissipation fins; 11. a fin ring; 111. a heat sink; 112. a heat dissipation flow channel; 1121. an air outlet; 113. a first heat dissipation area; 1131. a head region; 1132. a middle region; 1133. a tail region; 1134. avoiding a gap; 114. a second heat dissipation area; 115. a third heat dissipation area; 116. a fourth heat dissipation zone; 117. a fan mounting groove; 12. a connecting assembly; 121. a connecting ring; 122. a first connecting rib; 123. a second connecting rib; 2. a heat sink; 21. a housing; 211. a through hole; 22. a heat dissipating component; 221. a heat radiation fan; 222. a semiconductor refrigeration sheet; 223. a rectangular heat-conducting fin; 224. a heat conductive sheet; 23. mounting the component; 24. and a charging port.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

The embodiment of the present invention provides a heat sink 1, as shown in fig. 1-3, the heat sink 1 includes a plurality of heat sinks 111, the plurality of heat sinks 111 are disposed around a same center of circle, so as to form a fin coil 11, the heat sinks 111 extend in a direction away from the center of circle, and the plurality of heat sinks 111 are spaced apart from each other, so as to form a heat sink flow channel 112 between any two heat sinks 111. The fin coil 11 has a first heat dissipation area 113 and a second heat dissipation area 114 sequentially arranged along the circumferential direction thereof, and the extension length of the heat dissipation fins 111 located in the first heat dissipation area 113 is greater than the extension length of the heat dissipation fins 111 located in the second heat dissipation area 114.

In the heat dissipation fin 1 of the present embodiment, the extension length of the heat dissipation plate 111 located in the first heat dissipation region 113 is greater than the extension length of the heat dissipation plate 111 located in the second heat dissipation region 114, compared to the prior art that the extension lengths of all the heat dissipation plates 111 shown in fig. 4 are the same, the heat dissipation area and the heat dissipation volume of the heat dissipation plate 111 located in the first heat dissipation region 113 of the present embodiment are larger, and the heat dissipation efficiency of the heat dissipation fin 1 is improved. Since the heat radiation fin 1 of the present embodiment increases the heat radiation area by extending the heat radiation fins 111 in a limited heat radiation space, the internal space of the heat sink 2 can be more fully utilized, and thus the heat sink 2 having the heat radiation fin 1 of the present embodiment mounted thereon has higher heat radiation efficiency. If the heat dissipation fin 1 of the present embodiment is applied to the heat sink 2 of the mobile phone, because the length and the width of the heat sink 2 are not consistent, the first heat dissipation area 113 can be disposed at the position of the heat sink 2 in the length direction, so that the heat dissipation fin 1 can fully utilize the inner space of the heat sink 2 to improve the heat dissipation efficiency of the whole heat sink 2, and the user experience is excellent.

The heat dissipation principle of the utility model is as follows: a heat dissipation flow channel 112 is formed between the two heat dissipation fins 111, the heat dissipation fins 111 can exchange heat with air in the heat dissipation flow channel 112, so that the temperature of the heat dissipation fins 111 is reduced, the air after heat exchange flows out along the heat dissipation flow channel 112, and along with the outflow of the air after heat exchange, new air flows into the heat dissipation flow channel 112 again and continues to exchange heat with the heat dissipation fins 111, so that the heat dissipation fins 111 can dissipate heat continuously.

In an embodiment, as shown in fig. 1-2, the fin ring 11 further has a third heat dissipation region 115 and a fourth heat dissipation region 116 sequentially disposed along the circumferential direction thereof. The first heat dissipation area 113, the second heat dissipation area 114, the third heat dissipation area 115, and the fourth heat dissipation area 116 are sequentially connected end to end. The first heat dissipation area 113 and the third heat dissipation area 115 are disposed opposite to each other, and the extension lengths of the heat dissipation fins 111 located in the first heat dissipation area 113 and the third heat dissipation area 115 are greater than the extension lengths of the heat dissipation fins 111 located in the second heat dissipation area 114 and the fourth heat dissipation area 116.

In the heat dissipation fin 1 of the present embodiment, the extension length of the heat dissipation fins 111 located in the first heat dissipation region and the third heat dissipation region 115 is greater than the extension length of the heat dissipation fins 111 located in the second heat dissipation region 114 and the fourth heat dissipation region 116, so as to further increase the heat dissipation area and the heat dissipation volume of the heat dissipation fin 1, thereby more fully utilizing the internal space of the heat sink 2, and thus, the heat dissipation efficiency of the heat sink 2 carrying the heat dissipation fin 1 of the present embodiment can be further improved, and the user experience is better.

In a specific embodiment, as shown in fig. 1, 2, 3 and 5, the first heat dissipation region 113 has a head region 1131, a middle region 1132 and a tail region 1133 sequentially arranged along the circumferential direction of the fin coil 11. The extension lengths of the fins 111 located in the head region 1131 and the tail region 1133 are greater than the extension length of the fins 111 located in the middle region 1132, so that clearance gaps 1134 are formed on the sides of the fins 111 located in the middle region 1132, which are far away from the center of the circle.

Specifically, since the heat sink 2 may be equipped with the heat radiation fan 221 in addition to the heat radiation fins 1, and with parts requiring power consumption such as the semiconductor heat radiation sheet 111 and the indicator lamp, the charging port 24 needs to be installed inside the heat sink 2. In order to improve the heat dissipation efficiency of the heat sink 1 to the maximum extent without changing the overall size of the heat sink 2, in this embodiment, the extension lengths of the heat dissipation fins 111 located in the head region 1131 and the tail region 1133 are greater than the extension length of the heat dissipation fin 111 located in the middle region 1132, so that the clearance gap 1134 is formed on one side of the heat dissipation fin 111 located in the middle region 1132, which is away from the center of the circle, and the charge port 24 is only installed at the clearance gap 1134, so that the heat dissipation efficiency of the heat sink 1 can be improved to the maximum extent without changing the overall size of the heat sink 2.

In an embodiment, as shown in fig. 1-2, the heat dissipating fin 1 further includes a connecting component 12, the connecting component 12 includes a connecting ring 121, and the connecting ring 121 connects the heat dissipating fins 111 located in the first heat dissipating region 113, the second heat dissipating region 114, the third heat dissipating region 115 and the fourth heat dissipating region 116 and is located at a side of the heat dissipating flow channel 112.

Specifically, the connection ring 121 can connect all the heat sinks 111, so that the heat sinks 111 have a connection relationship, the structural strength of the heat sink 1 is enhanced, and the heat sink 111 is not scattered lightly, so that the heat sink 1 can be more easily transported and assembled according to the embodiment.

In addition, since the connection ring 121 and the heat sink 111 have a connection relationship, the connection ring 121 can also participate in heat dissipation, thereby further improving the heat dissipation efficiency of the heat dissipating fin 1.

In a particular embodiment, as shown in fig. 1-2, the connection assembly 12 further includes: the first connecting rib 122 and the second connecting rib 123. The first connection rib 122 is connected to one side of the heat sink 111 located at the first heat dissipation region 113, is spaced apart from the connection ring 121, and is located in a direction in which the connection ring 121 is away from the center of the circle. The second connection rib 123 is connected to the heat sink 111 at the third heat dissipation area 115, is spaced apart from the connection ring 121, and is located in a direction away from the center of the circle of the connection ring 121.

Specifically, the extension lengths of the heat dissipation fins 111 located in the first heat dissipation region 113 and the third heat dissipation region 115 are greater than the extension lengths of the heat dissipation fins 111 located in the second heat dissipation region 114 and the fourth heat dissipation region 116. Therefore, the ends of the heat dissipation fins 111 of the first heat dissipation area 113 and the third heat dissipation area 115, which are far away from the center of the circle, are far away from the connection ring 121, and the structural strength of the ends is poor, so that the ends are prone to shaking and even breaking. In order to enhance the structural strength of the end, the present embodiment provides the first connecting rib 122 and the second connecting rib 123, wherein the first connecting rib 122 connects the heat dissipation fins 111 located at the first heat dissipation area 113, and the first connecting rib 122 is located in the direction away from the center of the circle of the connection ring 121. The second connection rib 123 connects the heat dissipation fins 111 located at the third heat dissipation area 115, and the second connection rib 123 is located in a direction away from the center of the circle of the connection ring 121.

In addition, since the first connecting rib 122 and the heat sink 111 located in the first heat dissipation area 113 have a connection relationship, and the second connecting rib 123 and the heat sink 111 located in the third heat dissipation area 115 have a connection relationship, the first connecting rib 122 and the second connecting rib 123 can also participate in heat dissipation, thereby further improving the heat dissipation efficiency of the heat dissipation fin 1.

In an embodiment, as shown in fig. 1, 2 and 6, the first connecting rib 122 and the second connecting rib 123 are spaced apart from the connection ring 121, so that an air outlet 1121 communicating with the heat dissipation flow channel 112 is formed between the first connecting rib 122 and the connection ring 121 and between the second connecting rib 123 and the connection ring 121.

Through the embodiment, the heat dissipation channels 112 located in the first heat dissipation area 113 and the third heat dissipation area 115 not only can exhaust air from the end away from the center of the circle, but also can exhaust air from the air outlet 1121, so that the speed of air circulation in the heat dissipation channels 112 is effectively increased, and the heat dissipation efficiency of the heat dissipation fins 1 is further improved.

In a specific embodiment, as shown in fig. 1-3, the heat sink 111 has a gap with the center of the circle, so that a fan mounting groove 117 is formed in the middle of the fin coil 11.

Specifically, the heat dissipation efficiency of the heat sink 2 can be further improved by using the heat dissipation fan 221 to cooperate with the heat dissipation fins 1 for heat dissipation. For this purpose, in the present embodiment, the fan mounting groove 117 is formed in the middle of the fin 11, and the heat dissipation fan 221 in the heat sink 2 is mounted in the fan mounting groove 117, so that when the heat dissipation fan 221 rotates, not only the fresh air is sent into the heat dissipation flow channel 112, but also the air after heat exchange is accelerated to flow out from the heat dissipation flow channel 112, thereby improving the heat dissipation efficiency of the heat sink 2.

In an embodiment, as shown in fig. 1-3, the extending direction of the fins 111 is arranged to form an angle with the radial direction of the circle, and the angle is greater than or equal to 120 ° and less than or equal to 160 °.

Specifically, the rotation of the heat dissipation fan 221 drives the new air to flow along a predetermined direction, and the flow direction has a larger included angle with the radial direction of the circle, rather than being parallel. If the extending direction of the heat dissipating fins 111 is parallel to the radial direction, both the wind resistance and the wind noise of the heat sink 2 are large, and the heat dissipating efficiency is also very low. In order to make the new air enter the heat dissipation flow channel 112 more easily, the purpose of reducing wind resistance and wind noise is achieved. In this embodiment, an included angle between the extending direction of the heat sink 111 and the radial direction of the circle is set, and the included angle is greater than or equal to 120 ° and less than or equal to 160 °.

It should be noted that the new air generated by the cooling fans 221 with different models, sizes and powers will travel in different tracks, so the included angle is limited to 120 ° or more and 160 ° or less in this embodiment, and those skilled in the art can adjust the included angle within this range as needed.

As shown in fig. 1 to 3, by extending the extension length of the heat sink 111 located in the first heat dissipation area 113 to be greater than the extension length of the heat sink 111 located in the second heat dissipation area 114, compared with the prior art in which the extension lengths of all the heat sinks 111 shown in fig. 4 are the same, the heat dissipation area and the heat dissipation volume of the heat sink 111 located in the first heat dissipation area 113 according to the present invention are larger, and the heat dissipation efficiency of the heat sink 1 is improved. Because the radiating fin 1 of the utility model increases the radiating area by prolonging the radiating fins 111 in the limited radiating space, the internal space of the radiator 2 can be more fully utilized, and therefore, the radiator 2 carrying the radiating fin 1 of the utility model has higher radiating efficiency and excellent user experience.

The present invention also provides a heat sink 2, as shown in fig. 7-8, the heat sink 2 includes a housing 21, a heat dissipating component 22, and a mounting component 23. The heat sink 22 includes a heat sink 1 disposed inside the housing 21, and the heat sink 1 is the heat sink 1 mentioned in the above embodiments. The mounting component 23 is connected to the housing 21, and the mounting component 23 is used for mounting an external electronic product on one side of the housing.

By implementing the embodiment, the heat dissipation area and the heat dissipation volume of the heat dissipation fins 1 are increased, so that the heat dissipation fins 1 can more fully utilize the internal space of the heat sink 2, the heat sink 2 has higher heat dissipation efficiency, and the user experience is excellent.

Specifically, the mounting assembly 23 may be connected to an external electronic product through embodiments of suction, clamping, and the like, which are not limited herein and can be adapted by those skilled in the art.

In an embodiment, as shown in fig. 7-8, the heat dissipation assembly 22 further includes a rectangular heat conduction sheet 223, the heat dissipation fin 1 is connected to the rectangular heat conduction sheet 223, and the heat dissipation plate 111 located at the first heat dissipation region 113 is disposed in a length direction of the rectangular heat conduction sheet 223.

Specifically, in the present embodiment, the heat dissipation fins 111 located in the first heat dissipation area 113 are disposed in the length direction of the rectangular heat conduction fin 223, so that the heat dissipation fins located in the first heat dissipation area 113 can fully utilize the space in the length direction of the rectangular heat conduction fin 223, and the heat sink 2 has higher heat dissipation efficiency and excellent user experience.

In a particular embodiment, as shown in fig. 7-8, the heat dissipation assembly 22 further includes a semiconductor cooling fin 222 and a heat conducting fin 224. The semiconductor cooling plate 222 is disposed inside the housing 21, and the semiconductor cooling plate 222 includes a heat absorbing surface (not shown) and a heat releasing surface (not shown) opposite to each other, and the heat releasing surface is connected to a surface of the rectangular heat conducting plate 223 opposite to the heat dissipating fin 1. The heat conducting fin 224 is disposed on the casing 21, and one side thereof is exposed out of the casing 21, and the other side thereof is connected to the heat absorbing surface.

In order to quickly transfer the heat of the electronic product to the heat dissipation fin 1, the present embodiment is provided with a rectangular heat conduction plate 223, a semiconductor cooling plate 222, and a heat conduction plate 224. The heat conducting sheet 224 can transfer heat generated by the electronic product to the heat absorbing surface of the semiconductor cooling sheet 222, the heat releasing surface can release heat absorbed by the heat absorbing surface to the rectangular heat conducting sheet 223, and the rectangular heat conducting sheet 223 transfers heat to the heat dissipating fin 1.

Specifically, the semiconductor cooling plate 222 mentioned in the present embodiment is a heat transfer tool. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end.

In a specific embodiment, as shown in fig. 7-8, the heat sink 2 further includes a charging port 24, the heat dissipation assembly 22 further includes a heat dissipation fan 221, and the specific arrangement and beneficial effects of the charging port 24 and the heat dissipation fan 221 are also mentioned in the above embodiments, which are not described herein again.

In the embodiment, the other side of the housing 21 and the circumference adjacent to the other side of the housing 21 are provided with through holes 211.

Specifically, the through-holes 211 enable the inside of the case 21 to communicate with the outside, discharge hot air inside the case 21 to the outside, and let cold air from the outside enter the inside of the case 21, so that the heat sink 2 has higher heat dissipation efficiency. The through holes 211 on the other side of the housing 21 are mainly used for air intake, and the through holes 211 on the peripheral surface are mainly used for air outtake.

It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations should fall within the scope of the appended claims.

Claims

1. A cooling fin, comprising:

the radiating fins are arranged around the same circle center so as to form a fin ring, extend towards the direction far away from the circle center, and are spaced from each other so as to form a radiating flow channel between any two radiating fins;

the fin ring is provided with a first heat dissipation area and a second heat dissipation area which are sequentially arranged along the circumferential direction of the fin ring, and the extension length of the heat dissipation sheet located in the first heat dissipation area is greater than that of the heat dissipation sheet located in the second heat dissipation area.

2. The finstock of claim 1, wherein: the fin ring is also provided with a third heat dissipation area and a fourth heat dissipation area which are sequentially arranged along the circumferential direction of the fin ring, and the first heat dissipation area, the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area are sequentially connected end to end;

the first heat dissipation area and the third heat dissipation area are arranged oppositely, and the extension lengths of the heat dissipation fins positioned in the first heat dissipation area and the third heat dissipation area are larger than the extension lengths of the heat dissipation fins positioned in the second heat dissipation area and the fourth heat dissipation area.

3. The finstock of claim 1 or 2, wherein: the first heat dissipation area is provided with a head area, a middle area and a tail area which are sequentially arranged along the circumferential direction of the fin ring, the extension lengths of the heat dissipation fins which are positioned in the head area and the tail area are greater than the extension lengths of the heat dissipation fins which are positioned in the middle area, and a clearance gap is formed on one side, away from the circle center, of the heat dissipation fins which are positioned in the middle area.

4. The finstock of claim 2, wherein: the heat dissipation flow channel is characterized by further comprising a connecting assembly which comprises a connecting ring, wherein the connecting ring is connected with the radiating fins and located on the side of the heat dissipation flow channel, and the radiating fins are located in the first heat dissipation area, the second heat dissipation area, the third heat dissipation area and the fourth heat dissipation area.

5. The finstock of claim 4, wherein the connection assembly further comprises:

the first connecting rib is connected to one side of the radiating fin positioned in the first radiating area, is arranged at an interval with the connecting ring, and is positioned in the direction of the connecting ring away from the circle center;

and the second connecting ribs are connected to the heat dissipation fins positioned in the third heat dissipation area, arranged at intervals with the connecting ring and positioned in the direction in which the connecting ring is far away from the circle center.

6. The finstock of claim 5, wherein: the first connecting ribs and the second connecting ribs are arranged at intervals with the connecting ring, so that air outlets communicated with the heat dissipation flow channel are formed between the first connecting ribs and the connecting ring and between the second connecting ribs and the connecting ring.

7. A heat sink, comprising:

a housing;

a heat sink assembly comprising heat fins disposed inside the housing, the heat fins being as claimed in any one of claims 1 to 6;

and the mounting component is connected with the shell and is used for installing an external electronic product on one side of the shell.

8. The heat sink of claim 7, wherein: the heat dissipation assembly further comprises a rectangular heat conducting fin, the heat dissipation fins are connected with the rectangular heat conducting fin, and the heat dissipation fins located in the first heat dissipation area are arranged in the length direction of the rectangular heat conducting fin.

9. The heat sink of claim 8, wherein the heat dissipation assembly further comprises:

the semiconductor refrigeration piece is arranged in the shell and comprises a heat absorption surface and a heat release surface which are arranged in a reverse manner, and the heat release surface is connected with one surface of the rectangular heat conduction piece, which is back to the heat dissipation fins;

and the heat conducting fins are arranged on the shell, one surface of each heat conducting fin is exposed out of the shell, and the other surface of each heat conducting fin is connected with the heat absorbing surface.

10. The heat sink according to any one of claims 7-9, wherein: through holes are arranged on the other side of the shell and the peripheral surface adjacent to the other side of the shell.