CN210103765U

CN210103765U - Infrared laser cutting device for cutting glass

Info

Publication number: CN210103765U
Application number: CN201920146570.XU
Authority: CN
Inventors: 曾帅; 段光前; 程锋; 黄树平; 童杰
Original assignee: Jiangsu Precedent Laser Technology Co Ltd
Current assignee: Jiangsu Precedent Laser Technology Co Ltd
Priority date: 2019-01-29
Filing date: 2019-01-29
Publication date: 2020-02-21
Anticipated expiration: 2029-01-29

Abstract

The utility model provides an infrared laser cutting device for cutting glass, including infrared laser generator, beam expander subassembly, reflector assembly and be used for making laser beam form the long burnt dark cutting head of long burnt dark facula, the laser that infrared laser generator sent gets into through the reflection of reflector assembly after the beam expander subassembly expands the back and jets out perpendicularly to waiting to cut on the glass. The utility model discloses a through infrared laser, cooperation long burnt dark cutting head utilizes the crack control method to carry out glass's cutting to utilize the dark cutting head of long burnt to form the dark facula of long burnt, make the crackle of glass upper and lower surface cut on same perpendicular do not have the tapering, and the crackle produces the precision and can reach the micron level, overcome the not high problem of current infrared laser cutting glass precision.

Description

Infrared laser cutting device for cutting glass

Technical Field

The utility model belongs to the technical field of laser cutting equipment, concretely relates to infrared laser cutting device for cutting glass.

Background

The glass as a brittle material has the advantages of good transparency, high mechanical strength, uniform texture, smooth surface, corrosion resistance and the like, and is widely applied to industrial and agricultural production and scientific research. Particularly, with the rapid development of IT industry in recent years, high-tech electronic products such as Liquid Crystal Displays (LCDs) and Plasma Displays (PDPs) have come into operation, and are widely used in high-definition wall-mounted televisions, notebook computers, monitors, and communication devices. The glass needs to be cut during the manufacturing process of these displays, and the requirements on the quality and efficiency of the glass cutting are increasing. The conventional method is to scribe with a diamond or hard metal wheel and then mechanically break the glass. In recent years, the application of laser technology in glass cutting is more and more, and CO is mainly used₂Laser glass cutting, picosecond/femtosecond laser cutting glass, fiber/YAG laser cutting glass, and the like.

However, the conventional diamond cutting method easily causes the generation of cutting powder splash and microcrack and even the breakage of materials, influences strength and functions, has low surface quality of a cutting edge, needs secondary processing, particularly has complex curve cutting process, has poor cutting quality, needs further grinding and polishing, greatly increases processing cost and is very time-consuming.

The picosecond/femtosecond laser cuts glass, linear and special-shaped glass can be cut based on the nonlinear absorption of the picosecond/femtosecond laser in the glass, and the main problems are that the picosecond/femtosecond laser is expensive and the strength of the cut glass is reduced.

CO₂Laser glass cutting, based on the crack control method, glass absorbs laser on the surface, the cutting section is bright, the strength is high, but water spraying is needed in the cutting process, the glass is polluted, the glass cutting method is mainly applied to linear cutting of the glass, the efficiency is low when the glass is cut in an anisotropic manner, and the precision is not easy to control.

The optical fiber/YAG laser cutting glass is based on a crack control method, the glass absorbs laser, the cutting section is a bright surface, the strength is high, but the focusing light spot is large, the focal depth is short, the light spot acting on the glass is large in the transverse and longitudinal ranges, and the glass can generate cracks in the whole focusing light spot range under the action of laser heat and internal stress, so that the cutting precision is not high, and meanwhile, the upper surface and the lower surface of the crack are not on the same vertical plane, namely, the cutting crack has taper.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the problem that the cutting precision is not high because cracks are easily generated in the whole focusing facula range in the existing optical fiber/YAG laser cutting glass process.

Therefore, the utility model provides an infrared laser cutting device for cutting glass, include infrared laser generator, beam expander subassembly, reflector assembly and be used for making laser beam form the long focal depth cutting head of long focal depth facula, laser that infrared laser generator sent gets into the long focal depth cutting head and jets out perpendicularly to waiting to cut glass through the reflector assembly reflection after beam expander subassembly expands.

Further, the infrared laser generator is a semiconductor laser, a fiber laser or a YAG laser.

Furthermore, the long-focus deep cutting head comprises a focusing light assembly for generating a Bessel light beam, a conical surface is arranged at the laser emergent end of the focusing light assembly, an annular arched convex surface or a Fresnel surface equivalent to the annular arched convex surface is arranged at the laser incident end, so that an annular light field distribution is formed at the section where the beam and the conical surface arranged at the laser emergent end are initially intersected through the incident laser beam, and the approximate Bessel light beam is formed after the incident laser beam is emitted through the conical surface arranged at the laser emergent end.

Further, beam-expanding lens subassembly includes beam-expanding lens and the chassis that is used for fixed beam-expanding lens, the both ends of chassis are connected with infrared laser generator's light outgoing end and reflector assembly's light incident end respectively, just beam-expanding lens's axis with infrared laser generator's light exit port coaxial setting.

Furthermore, the reflector assembly comprises a reflector and a fixing seat for fixing the reflector, and two ends of the fixing seat are respectively connected with the light emergent end of the beam expander assembly and the light incident end of the long-focus deep cutting head.

Further, the incident angle of the light rays of the reflector component is 45 degrees.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model provides an infrared laser cutting device for cutting glass passes through infrared laser, cooperates the dark cutting head of tele, utilizes the crackle control method, carries out glass's cutting to utilize the dark cutting head of tele to form the dark facula of tele, make the crackle of glass upper and lower surface cut on same perpendicular do not have the tapering, and the crackle produces the precision and can reach micron level, has overcome the not high problem of current infrared laser cutting glass precision.

The present invention will be described in further detail with reference to the accompanying drawings.

Drawings

FIG. 1 is a schematic diagram of the optical path transmission structure of the infrared laser cutting device for cutting glass according to the present invention;

fig. 2 is a schematic structural diagram of the focusing light assembly of the medium-and-long-focal-depth cutting head of the present invention.

Description of reference numerals: 1. an infrared laser generator; 2. a beam expander assembly; 3. a mirror assembly; 4. a long depth of focus cutting head; 5. glass to be cut; 6. a focusing light assembly; 7. an arched convex surface; 8. a conical surface.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

As shown in fig. 1, the present embodiment provides an infrared laser cutting device for cutting glass, which includes an infrared laser generator 1, a beam expander assembly 2, a reflector assembly 3, and a long focal depth cutting head 4 for forming a long focal depth spot from a laser beam, wherein the long focal depth cutting head 4 can compress the laser beam to a diffraction limit to form a small focused spot, and has a very long focal depth, the focused spot is a concentric circle with a large central main pole in a focal depth range, laser emitted by the infrared laser generator 1 is expanded by the beam expander assembly 2, reflected by the reflector assembly 3 into the long focal depth cutting head 4, and vertically emitted onto a glass 5 to be cut, the glass 5 to be cut is volume-absorbed by the laser, and meanwhile, energy at the central main pole of the spot is most concentrated, energy density is maximum, and the internal temperature of the glass 5 to be cut sharply rises under the action of the laser, and a large pressure stress is generated inside the glass, the pressure stress can not lead the glass 5 to be cut to be cracked, along with the movement of the laser beam, a temperature gradient exists on the moving track of the laser beam, the temperature gradient causes the generation of thermal stress, when the thermal stress reaches a certain critical value, the glass 5 to be cut can generate cracks at the center of a focusing light spot, along with the movement of the working platform, the cracks can expand along with the moving track, thereby the cutting of the glass is realized, the focusing light spot has a very long focal depth, the cracks on the upper surface and the lower surface can be enabled to be on the same vertical surface, and the cutting has no taper. The infrared laser generator is a semiconductor laser, a fiber laser or a YAG laser, and the wavelength range of the infrared laser generator is 808-1342 nm.

An embodiment of the refinement, said long depth of focus cutting head may be a bessel cutting head, also may be a filamentation (filamention) cutting head; when the long-focus-depth cutting head is a bessel cutting head, the cutting head comprises a focusing light assembly for generating bessel beams, as shown in fig. 2, a laser emergent end of the focusing light assembly 6 is provided with a conical surface 8, a laser incident end is provided with an annular arched convex surface 7 or a fresnel surface type equivalent to the annular arched convex surface 7, so that the incident laser beams are transmitted to form an annular light field distribution at the section where the beams and the conical surface 8 arranged at the laser emergent end are initially intersected, and the beams are emitted through the conical surface 8 arranged at the laser emergent end to form approximate bessel beams. Because the spot diameter of the central main maximum position of the Bessel beam formed by the long-focus-depth cutting head is very small and only about 2-3 um, when cracks are generated on the glass, the cracks can be generated only in the central main maximum spot diameter formed by the glass, so that the crack generation precision can reach the micron level, and the cutting precision is improved. And when the extended depth of focus cutting head is a filamentation cutting head, it may be a device that includes one or more optical elements having aberrations to focus the laser beam to produce a continuous laser filament on the glass 5 to be cut.

Beam expanding lens subassembly 2 includes beam expanding lens and the chassis that is used for fixed beam expanding lens, the both ends of chassis are connected with infrared laser generator 1's light outgoing end and reflector assembly 3's light incident end respectively, just beam expanding lens's axis with infrared laser generator 1's light outgoing port coaxial setting. The reflector component 3 comprises a reflector and a fixing seat used for fixing the reflector, the reflector is a plane lens and provides a platform for the turning of a laser beam light path, and two ends of the fixing seat are respectively connected with a light emergent end of the beam expander component 2 and a light incident end of the long-focus deep cutting head 4. Optimally, in order to ensure the coaxiality of the actual emergent ray of the long-focus-depth cutting head 4 and the axis of the focusing light assembly in the long-focus-depth cutting head 4, the ray incidence angle of the reflector assembly 3 is 45 degrees.

To sum up, the utility model provides a this kind of an infrared laser cutting device for cutting glass passes through infrared laser, cooperates the dark cutting head of tele, utilizes the crackle control method to carry out glass's cutting to utilize the dark cutting head of tele to form the dark facula of tele, make the crackle of glass upper and lower surface cut on same perpendicular have not the tapering, and the crackle produces the precision and can reach the micron level, has overcome the not high problem of current infrared laser cutting glass precision.

The above examples are merely illustrative of the present invention and do not limit the scope of the present invention, and all designs identical or similar to the present invention are within the scope of the present invention.

Claims

1. An infrared laser cutting device for cutting glass, characterized in that: the laser beam cutting device comprises an infrared laser generator, a beam expanding assembly, a reflector assembly and a long focal depth cutting head used for enabling a laser beam to form a long focal depth light spot, wherein laser emitted by the infrared laser generator is expanded by the beam expanding assembly and then enters the long focal depth cutting head through reflection of the reflector assembly to be vertically ejected to glass to be cut.

2. The infrared laser cutting apparatus for cutting glass as set forth in claim 1, wherein: the infrared laser generator is a semiconductor laser, a fiber laser or a YAG laser.

3. The infrared laser cutting apparatus for cutting glass as set forth in claim 1, wherein: the long-focus deep cutting head comprises a focusing light assembly used for generating a Bessel light beam, a conical surface is arranged at a laser emergent end of the focusing light assembly, an annular arched convex surface or a Fresnel surface equivalent to the annular arched convex surface is arranged at a laser incident end, so that an annular light field distribution is formed at the section where the beam and the conical surface arranged at the laser emergent end are initially intersected, and the incident laser beam is emitted through the conical surface arranged at the laser emergent end to form an approximate Bessel light beam.

4. The infrared laser cutting apparatus for cutting glass as set forth in claim 1, wherein: the beam expanding lens assembly comprises a beam expanding lens and a shell frame used for fixing the beam expanding lens, wherein two ends of the shell frame are respectively connected with a light emergent end of the infrared laser generator and a light incident end of the reflector assembly, and the axis of the beam expanding lens is coaxial with a light emergent port of the infrared laser generator.

5. The infrared laser cutting apparatus for cutting glass as set forth in claim 1, wherein: the reflector component comprises a reflector and a fixing seat used for fixing the reflector, and two ends of the fixing seat are respectively connected with a light ray emergent end of the beam expander component and a light ray incident end of the long focal depth cutting head.

6. The infrared laser cutting apparatus for cutting glass as set forth in claim 1, wherein: the mirror assembly has a light incident angle of 45 °.